A photolithography exposure layout positioning device

Abstract

This utility model relates to the field of photolithography exposure technology and discloses a photolithography exposure layout positioning device, which solves the problems mentioned in the background art. It includes a chip placement stage, sliding components on both sides of the chip placement stage, photolithography exposure elements on the sliding components, and a fluid cooling pipe at the bottom of the chip placement stage. The fluid cooling pipe is laid along the chip placement stage and has an output end and an input end, both of which are connected to a cooling box. A pump body is provided at the connection between the cooling box and the input end. This utility model can significantly reduce the impact of thermal deformation on positioning accuracy, improve the stability of the exposure process, reduce equipment downtime and maintenance costs caused by thermal deformation, and maintain high-precision positioning.

Description

Technical Field

[0001] This utility model belongs to the field of photolithography exposure technology, specifically a photolithography exposure layout positioning device. Background Technology

[0002] In semiconductor manufacturing, photolithography is the core process for defining integrated circuit patterns. Its positioning accuracy directly determines the performance and yield of the device. Existing photolithography exposure positioning devices project the pattern of the photomask onto the wafer surface coated with photoresist through high-precision sensors, motor drive platforms and complex control systems.

[0003] However, during the exposure process, the heat generated by the light source and the frictional heat generated by the moving mechanical parts can cause thermal deformation of the wafer stage (or chip placement stage), which in turn leads to positioning errors. This problem is particularly prominent in advanced processes (such as nodes below 7nm). To address this, we propose a photolithography exposure layout positioning device. Utility Model Content

[0004] To address the problems raised in the background art, this utility model provides the following technical solution: a photolithography exposure layout positioning device, including a chip placement stage, sliding components arranged on both sides of the chip placement stage, photolithography exposure elements arranged on the sliding components, a fluid cooling pipe arranged at the bottom of the chip placement stage, the fluid cooling pipe being laid along the chip placement stage, the fluid cooling pipe having an output end and an input end, both the output end and the input end being connected to a cooling box, and a pump body being arranged at the connection between the cooling box and the input end.

[0005] Preferably, the sliding assembly includes a guide plate, with sliding wheels provided above and below the guide plate. The sliding wheels have grooves that can slide along the edge of the guide plate. Through the cooperation of the guide plate and the sliding wheels, the photolithography exposure element can be moved smoothly, improving the positioning accuracy. The groove design enhances the stability of the sliding assembly and reduces the impact of mechanical vibration on the exposure accuracy.

[0006] Preferably, each of the two sets of sliding components is provided with a connecting plate, and a guide rail is provided between the two connecting plates. A sliding component is slidably provided on the guide rail. A motor is provided on one side of the connecting plate, and the output end of the motor passes through the connecting plate and is connected to the guide rail. The automatic positioning of the photolithography exposure element is realized through the guide rail and the sliding component driven by the motor.

[0007] Preferably, the chip placement stage is equipped with an electric telescopic rod, the other end of which is connected to a connecting plate.

[0008] Preferably, a temperature sensor is provided on the chip placement stage. The temperature sensor probe is connected to the placement surface of the chip placement stage, and the temperature sensor is electrically connected to the cooling box. The temperature sensor monitors the thermal deformation of the chip placement stage in real time, providing data support for thermal compensation.

[0009] Preferably, the chip placement stage is made of silicon carbide ceramic or microcrystalline glass. By selecting a low CTE material, the thermal deformation of the chip placement stage is significantly reduced, and the positioning accuracy is improved.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] During operation, the chip to be exposed is first placed on the chip placement stage, ensuring close contact between the chip and the placement surface. The cooling tank and pump are activated, allowing coolant to circulate in the fluid cooling pipes to pre-cool the chip placement stage. Temperature sensors monitor the temperature of the chip placement stage in real time to ensure it remains stable. The sliding wheel on the sliding assembly is pushed along the guide plate by an electric telescopic rod to initially adjust the position of the photolithography exposure element. The motor drives the guide rail to move the sliding component and the photolithography exposure element to the approximate exposure position, aligning the chip surface with the focal plane of the photolithography exposure element. The light source in the photolithography exposure element is activated, projecting the pattern on the mask onto the chip surface. The coolant circulates at high speed in the fluid cooling pipes, quickly removing the heat generated during exposure and reducing thermal deformation. After exposure, the light source in the photolithography exposure element is turned off, the cooling tank and pump stop working, and the coolant circulation stops. The exposed chip is then removed from the chip placement stage and proceeds to the next process step. This process significantly reduces the impact of thermal deformation on positioning accuracy, improves the stability of the exposure process, reduces equipment downtime and maintenance costs caused by thermal deformation, and maintains high-precision positioning. Attached Figure Description

[0012] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0013] Figure 1 This is a front view of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the structure of this utility model from below;

[0015] In the diagram: 1. Chip placement stage; 2. Sliding assembly; 3. Photolithography exposure element; 4. Guide plate; 5. Sliding wheel; 6. Connecting plate; 7. Guide rail; 8. Sliding component; 9. Motor; 10. Electric telescopic rod; 11. Fluid cooling pipe; 12. Cooling box; 13. Pump body; 14. Temperature sensor. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0017] Depend on Figure 1-2 The present invention includes a chip placement stage 1, with sliding components 2 on both sides of the chip placement stage 1, and photolithography exposure elements 3 on the sliding components 2. A fluid cooling pipe 11 is provided at the bottom of the chip placement stage 1, and the fluid cooling pipe 11 is laid along the chip placement stage 1. The fluid cooling pipe 11 has an output end and an input end, and both the output end and the input end are connected to a cooling box 12. A pump body 13 is provided at the connection between the cooling box 12 and the input end.

[0018] The sliding assembly 2 includes a guide plate 4, with sliding wheels 5 on both the top and bottom of the guide plate 4. The sliding wheels 5 have grooves that can slide along the edge of the guide plate 4. Through the cooperation of the guide plate 4 and the sliding wheels 5, the photolithography exposure element 3 can be moved smoothly, improving the positioning accuracy. The groove design enhances the stability of the sliding assembly 2 and reduces the impact of mechanical vibration on the exposure accuracy.

[0019] Both sets of sliding components 2 are equipped with connecting plates 6, and guide rails 7 are provided between the two connecting plates 6. Sliding elements 8 are slidably provided on the guide rails 7. A motor 9 is provided on one side of the connecting plate 6. The output end of the motor 9 passes through the connecting plate 6 and is connected to the guide rail 7. The automatic positioning of the photolithography exposure element is realized through the guide rail and sliding elements driven by the motor.

[0020] The chip placement stage 1 is equipped with an electric telescopic rod 10, and the other end of the electric telescopic rod 10 is connected to the connecting plate 6.

[0021] A temperature sensor 14 is installed on the chip placement stage 1. The probe of the temperature sensor 14 is connected to the placement surface of the chip placement stage 1. The temperature sensor 14 is electrically connected to the cooling box 12. The temperature sensor 14 monitors the thermal deformation of the chip placement stage 1 in real time and provides data support for thermal compensation.

[0022] The chip placement stage 1 is made of silicon carbide ceramic or microcrystalline glass. By selecting low CTE materials, the thermal deformation of the chip placement stage is significantly reduced, and the positioning accuracy is improved.

[0023] Working principle: During operation, the chip wafer to be exposed is first placed on the chip placement stage 1, ensuring close contact between the chip and the placement surface. The cooling box 12 and pump 13 are started, causing the coolant to circulate in the fluid cooling pipe 11 to pre-cool the chip placement stage 1. The temperature sensor 14 monitors the temperature of the chip placement stage in real time to ensure it is in a stable state. The sliding wheel 5 on the sliding assembly 2 is pushed by the electric telescopic rod 10 to slide along the guide plate 4, initially adjusting the position of the photolithography exposure element 3. The motor 9 drives the guide rail 7 to move, moving the sliding member 8 and the photolithography exposure element 3 to the approximate exposure position, so that the chip surface is in close contact with the focal plane of the photolithography exposure element 3. Alignment is achieved when the light source in the photolithography exposure element 3, such as ultraviolet or extreme ultraviolet light, is activated to project the pattern on the mask onto the chip surface. The coolant circulates at high speed in the fluid cooling pipe 11 to quickly remove the heat generated during exposure and reduce thermal deformation. After exposure is complete, the light source in the photolithography exposure element 3 is turned off, the cooling box 12 and the pump 13 stop working, the coolant stops circulating, and the exposed chip is removed from the chip placement stage 1 to proceed to the next process step, such as development and etching. This significantly reduces the impact of thermal deformation on positioning accuracy, improves the stability of the exposure process, reduces equipment downtime and maintenance costs caused by thermal deformation, and maintains high-precision positioning.

[0024] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A lithographic exposure layout positioning device comprising a chip placement table (1), characterized in that: The chip placement stage (1) is provided with sliding components (2) on both sides, and photolithography exposure elements (3) are provided on the sliding components (2). A fluid cooling pipe (11) is provided at the bottom of the chip placement stage (1). The fluid cooling pipe (11) is laid along the chip placement stage (1). The fluid cooling pipe (11) has an output end and an input end. Both the output end and the input end are connected to the cooling box (12). A pump body (13) is provided at the connection between the cooling box (12) and the input end.

2. A lithographic exposure layout positioning apparatus according to claim 1, characterized in that: The sliding component (2) includes a guide plate (4), and the guide plate (4) is provided with sliding wheels (5) on both the top and bottom. The sliding wheels (5) have grooves, and the grooves can slide along the edge of the guide plate (4).

3. A lithographic exposure layout positioning apparatus according to claim 2, wherein: Both sets of sliding components (2) are provided with connecting plates (6), and a guide rail (7) is provided between the two connecting plates (6). A sliding member (8) is slidably provided on the guide rail (7). A motor (9) is provided on one side of the connecting plate (6), and the output end of the motor (9) passes through the connecting plate (6) and is connected to the guide rail (7).

4. A lithographic exposure layout positioning apparatus according to claim 3, wherein: The chip placement platform (1) is equipped with an electric telescopic rod (10), and the other end of the electric telescopic rod (10) is connected to the connecting plate (6).

5. A lithographic exposure layout positioning apparatus according to claim 4, wherein: A temperature sensor (14) is provided on the chip placement stage (1), and the probe of the temperature sensor (14) is connected to the placement surface of the chip placement stage (1).

6. A lithographic exposure layout positioning apparatus according to claim 5, wherein: The chip placement stage (1) is made of silicon carbide ceramic or microcrystalline glass.

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