Microstrip waveguide conversion device

Abstract

The utility model discloses a microstrip waveguide conversion device, which comprises a PCB (printed circuit board) and a waveguide piece arranged on the PCB, and is characterized in that the PCB comprises a microstrip line layer, and the microstrip line layer is provided with a microstrip signal line and a microstrip installation area; a waveguide groove is formed in the bottom of the waveguide piece, a groove opening of the waveguide groove faces the microstrip line layer, and a ridge waveguide is arranged on one side of the waveguide groove; the waveguide piece is provided with a waveguide port communicated with the waveguide groove; the microstrip installation area and the bottom end face of the waveguide piece are fixedly connected to form an integrated structure, and one end of the microstrip signal line and the ridge waveguide are fixedly connected to form an integrated structure. According to the utility model, the waveguide piece can be integrated on the PCB, a third-party fixing assembly is not needed for installation and fixation, the overall structure is simple, the processing difficulty is low, the size is small, the signal transmission is stable, and the signal coupling efficiency is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of antenna communication technology, and in particular to a microstrip waveguide conversion device. Background Technology

[0002] Currently, in high-frequency applications, microstrip lines suffer from relatively high transmission loss, impacting signal transmission efficiency. Waveguide structures, on the other hand, exhibit significantly lower transmission loss and higher power handling capabilities at high frequencies, making them an ideal choice for high-frequency signal transmission. Waveguides are typically implemented using metallic structures, offering excellent electromagnetic shielding and low-loss performance.

[0003] In practical applications, microstrip-to-waveguide switching is a key technology for achieving effective coupling of radio frequency signals from the chip to the waveguide system. However, traditional microstrip-to-waveguide switching methods typically employ a separate PCB and metal waveguide structure. During construction, the PCB and metal waveguide components require additional fixing components for mounting and securing, pressing the metal waveguide onto the PCB to achieve signal contact. However, the contact surface between the PCB and the metal waveguide is susceptible to processing and installation errors, leading to unstable signal contact and reduced signal coupling efficiency. Secondly, the separate structure requires additional connection interfaces and support structures, increasing the overall antenna system size, hindering the design and promotion of miniaturized antennas, and resulting in high production costs. Furthermore, the separate PCB and metal structure require separate fabrication and precision assembly, which not only increases manufacturing difficulty but also significantly raises production costs. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a microstrip waveguide conversion device that can integrate waveguide components on a PCB board without the need for third-party fixing components for installation and fixation. The overall structure is simple, the processing difficulty is low, the size is small, and the signal transmission is stable, effectively improving the signal coupling efficiency.

[0005] To address the aforementioned technical problems, this utility model provides a microstrip waveguide conversion device, comprising a PCB board and a waveguide component mounted on the PCB board. The PCB board includes a microstrip line layer, on which a microstrip signal line and a microstrip mounting area are provided. The bottom of the waveguide component has a waveguide groove, the groove opening of which faces the microstrip line layer, and a ridge waveguide is provided on one side of the waveguide groove. The waveguide component has a waveguide port communicating with the waveguide groove. The microstrip mounting area is fixedly connected to the bottom end face of the waveguide component to form an integral structure, and one end of the microstrip signal line is fixedly connected to the ridge waveguide to form an integral structure.

[0006] As an improvement to the above solution, the microstrip mounting area is welded to the bottom end face of the waveguide, and one end of the microstrip signal line is welded to the ridge waveguide.

[0007] As an improvement to the above scheme, the waveguide groove has an opening on the side away from the waveguide port, and the ridge waveguide is provided at the opening. The sidewalls on both sides of the ridge waveguide are respectively separated from the corresponding inner sidewalls of the waveguide groove.

[0008] As an improvement to the above solution, the PCB board further includes a dielectric layer and a ground layer, the dielectric layer being located between the microstrip line layer and the ground layer; the microstrip mounting area includes a metal mounting plate, and a plurality of ground connection posts are spaced apart at one end of the metal mounting plate facing the dielectric layer, the ground connection posts passing through the dielectric layer and connecting to the ground layer.

[0009] As an improvement to the above solution, the ground connection post is located in the inner region of the metal mounting plate, and the outer region of the metal mounting plate is a soldering region; or the ground connection post is located in the outer region of the metal mounting plate, and the inner region of the metal mounting plate is a soldering region.

[0010] As an improvement to the above scheme, the ridge waveguide includes multiple stepped sections with progressively decreasing heights. The step closest to the microstrip signal line is a signal connection step, which is welded to one end of the microstrip signal line.

[0011] As an improvement to the above scheme, the signal connection step portion of the ridge waveguide extends outward beyond the waveguide groove.

[0012] As an improvement to the above scheme, the entire ridge waveguide is disposed within the waveguide groove.

[0013] As an improvement to the above solution, the waveguide port is disposed on the upper part of the waveguide component, and the axial direction of the waveguide port is perpendicular to the signal transmission direction of the microstrip signal line.

[0014] As an improvement to the above scheme, the waveguide port is disposed at the bottom of the waveguide and located on the side opposite to the ridge waveguide. The waveguide port and the waveguide groove form a through groove, and the axial direction of the waveguide port is parallel to the signal transmission direction of the microstrip signal line.

[0015] The beneficial effects of implementing this utility model are as follows:

[0016] This invention enables the waveguide to be integrated into a single structure by fixing the microstrip mounting area of ​​the PCB board to the bottom end face of the waveguide and fixing one end of the microstrip signal line to the ridge waveguide. This allows the waveguide to be integrated onto the PCB board with fixed and electrical connections between the two components, eliminating the need for third-party fixing components. The overall structure is simple, easy to manufacture, small in size, and low in cost, making it suitable for miniaturized antenna applications. Furthermore, the solder-fixed connection ensures stable signal transmission and effectively improves signal coupling efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the first embodiment of the microstrip waveguide conversion device of this utility model;

[0018] Figure 2 yes Figure 1 A schematic diagram of the exploded structure of a microstrip waveguide conversion device;

[0019] Figure 3 yes Figure 1 A schematic diagram of the waveguide component;

[0020] Figure 4 yes Figure 1 A cross-sectional schematic diagram of a microstrip waveguide conversion device;

[0021] Figure 5 This is a schematic diagram of the structure of the second embodiment of the microstrip waveguide conversion device of this utility model;

[0022] Figure 6 yes Figure 5 A schematic diagram of the waveguide component. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the invention, and should not be construed as limiting the invention. Furthermore, it should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0024] In this document, references to "embodiment" or "implementation" mean that a particular feature, component, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0025] like Figures 1 to 3 As shown, this utility model provides a structural schematic diagram of a first embodiment of a microstrip waveguide conversion device, which includes a PCB board 1 and a waveguide component 2 mounted on the PCB board 1. The PCB board 1 includes a microstrip line layer 3, on which microstrip signal lines 31 and microstrip mounting areas 32 are provided. The microstrip signal lines 31 are connected to an external antenna processor to realize electromagnetic wave signal transmission and reception. The microstrip mounting areas 32 are used for electrical fixation to the metal waveguide component 2. The bottom of the waveguide component 2 is provided with a waveguide groove 21, the groove opening 22 of the waveguide groove 21 faces the microstrip line layer 3, and a ridge waveguide 23 is provided on one side of the waveguide groove 21; the waveguide component 2 is provided with a waveguide port 24 communicating with the waveguide groove 21.

[0026] In this embodiment, the microstrip mounting area 32 and the bottom end face of the waveguide 2 are fixed together by solder 6, and one end of the microstrip signal line 31 is fixed together with the ridge waveguide 23 by solder 6. This enables a fixed connection and electrical connection between the two, meaning that the waveguide 2 can be integrated on the PCB board 1 without the need for third-party fixing components for installation and fixation, and without the need for precision machining of the signal contact surface between the two. The overall structure is simple, the processing difficulty is low, the size is small, and the cost is low. It can be adapted to use with external antenna devices and is suitable for miniaturized antenna applications. Moreover, the fixed connection by solder ensures stable signal transmission and effectively improves signal coupling efficiency.

[0027] Specifically, such as Figures 2 to 4 As shown, the PCB board 1 also includes a dielectric layer 4 and a ground layer 5. The dielectric layer 4 is located between the microstrip layer 3 and the ground layer 5. The microstrip mounting area 32 includes a metal mounting plate 321. Multiple ground connection posts 322 are spaced apart at one end of the metal mounting plate 321 facing the dielectric layer 4. The ground connection posts 322 pass through the dielectric layer 4 and connect to the ground layer 5. Each ground connection post 322 has a through-hole 323. When the waveguide 2 is soldered onto the metal mounting plate 321 using solder 6, the waveguide 2, the ground connection posts 322, and the ground layer 5 form a waveguide space. The waveguide 2 is electrically connected to the ground layer 5 through the metal ground connection posts 322, which helps prevent leakage of radio frequency signals within the microstrip waveguide conversion device and improves signal transmission stability. In other embodiments, the ground connection posts 322 may also be solid structures.

[0028] In this embodiment, the ground connection post 322 is located on the inner side of the metal mounting plate 321, while the outer side of the metal mounting plate 321 is a solder area used to fix the waveguide 2 to the PCB. This embodiment improves assembly stability and reduces signal leakage through soldering, thereby enhancing signal transmission stability between the two components. In other embodiments, the ground connection post can be located on the outer side of the metal mounting plate, with the inner side of the metal mounting plate serving as the solder area.

[0029] Furthermore, such as Figures 2 to 3 As shown, the waveguide groove 21 has an opening 25 on the side away from the waveguide port 24, and a ridge waveguide 23 is provided at the opening 25. Gaps are left between the sidewalls of the ridge waveguide 23 and the corresponding inner sidewalls of the waveguide groove 21. At this time, the bottom surfaces of the three sides surrounding the waveguide groove 21 are welded and fixed to a metal mounting plate 321 with a matching shape to ensure the connection between the waveguide component 2 and the PCB board 1 and the stability of signal transmission. In this embodiment, the ridge waveguide 23 can be connected to the microstrip signal line 31 to realize the transition from waveguide to microstrip planar circuit, thereby achieving bidirectional conversion between the microstrip signal line 31 and the waveguide component 2. Electromagnetic wave signals can be input from the microstrip signal line 31 and output from the waveguide port 24, or input from the waveguide port 24 and output from the microstrip signal line 31.

[0030] Furthermore, the ridge waveguide 23 includes multiple stepped sections 231 with progressively decreasing heights, i.e., impedance matching steps. The step 231 of the ridge waveguide 23 closest to the microstrip signal line 31 is the signal connection step 232, which is welded to one end of the microstrip signal line 31. The conversion structure from the microstrip signal line 31 to the ridge waveguide 23 reduces energy loss caused by signal reflection and mode mismatch, making the transmission efficiency of the conversion structure close to the theoretical value. This allows the signal to be transmitted efficiently from the microstrip signal line 31 to the waveguide 2, maximizing signal power retention and making it suitable for high-frequency applications such as millimeter waves. The signal connection step 232 of the ridge waveguide 23 extends outward beyond the waveguide groove 21, reducing processing difficulty and steps, and improving processing efficiency.

[0031] In other embodiments, the entire ridge waveguide 23 can also be disposed within the waveguide groove 21, that is, the outermost signal connection step 232 is also located within the waveguide groove 21, thereby reducing the volume of the waveguide component 2 and the overall microstrip waveguide conversion device. However, the processing difficulty and procedures are also increased accordingly. The specific choice can be made according to actual needs.

[0032] Preferably, such as Figures 1 to 3As shown, the waveguide port 24 is disposed on the upper part of the waveguide 2. The axial direction of the waveguide port 24 is perpendicular to the signal transmission direction of the microstrip signal line 31, and correspondingly, the waveguide port 24 is also perpendicular to the waveguide groove 21. When the waveguide port 24 in this orientation is used in conjunction with external antenna devices, the lateral length of the overall antenna system can be reduced, thereby reducing the lateral volume and cost of the overall antenna system, making it suitable for antenna applications with limited lateral space. The waveguide port 24 and the waveguide groove 21 have the same diameter.

[0033] like Figures 5 to 6 As shown, this utility model provides a structural schematic diagram of a second embodiment of a microstrip waveguide conversion device. This embodiment is similar to... Figures 1 to 4 Unlike the first embodiment shown, the waveguide port 24 is located at the bottom of the waveguide 2 and on the opposite side to the ridge waveguide 23. The waveguide port 24 and the waveguide groove 21 form a through groove, and the axial direction of the waveguide port 24 is parallel to the signal transmission direction of the microstrip signal line 31. Correspondingly, the bottom sides of the waveguide 2 are welded and fixed to corresponding metal mounting pieces 321 to ensure the connection between the waveguide 2 and the PCB board 1 and the stability of signal transmission. When the waveguide port 24 in this orientation is used in conjunction with external antenna devices, the longitudinal length of the overall antenna system can be reduced, thereby reducing the longitudinal volume and cost of the overall antenna system, making it suitable for antenna application environments with limited longitudinal space.

[0034] In summary, the microstrip mounting area and the bottom end face of the waveguide are fixedly connected to form an integral structure, and one end of the microstrip signal line is fixedly connected to the ridge waveguide to form an integral structure. This allows the waveguide to be integrated on the PCB board, with fixed and electrical connections between the two. No third-party fixing components are required for installation and fixation, and no precision machining of the signal contact surface between the two is required. The overall structure is simple, easy to manufacture, small in size, and low in cost, making it suitable for miniaturized antenna applications. Moreover, the fixed connection via solder ensures stable signal transmission and effectively improves signal coupling efficiency.

[0035] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

Claims

1. A microstrip waveguide conversion device, characterized in that, The device includes a PCB board and waveguides mounted on the PCB board. The PCB board includes a microstrip line layer, on which microstrip signal lines and microstrip mounting areas are provided. The bottom of the waveguide is provided with a waveguide groove, the groove opening faces the microstrip line layer, and a ridge waveguide is provided on one side of the waveguide groove; The waveguide component is provided with a waveguide port that communicates with the waveguide groove; The microstrip mounting area is fixedly connected to the bottom end face of the waveguide to form an integral structure, and one end of the microstrip signal line is fixedly connected to the ridge waveguide to form an integral structure.

2. The microstrip waveguide transition device of claim 1, wherein, The microstrip mounting area is welded to the bottom end face of the waveguide, and one end of the microstrip signal line is welded to the ridge waveguide.

3. The microstrip waveguide conversion device of claim 1, wherein, The waveguide groove has an opening on the side away from the waveguide port, and the ridge waveguide is provided at the opening. The sidewalls on both sides of the ridge waveguide are respectively separated from the corresponding inner sidewalls of the waveguide groove.

4. The microstrip waveguide transition device of claim 2, wherein, The PCB board also includes a dielectric layer and a ground layer, with the dielectric layer located between the microstrip line layer and the ground layer; The microstrip mounting area includes a metal mounting plate, and a plurality of ground connection posts are spaced apart at one end of the metal mounting plate facing the dielectric layer. The ground connection posts pass through the dielectric layer and connect to the ground layer.

5. The microstrip waveguide conversion device of claim 4, wherein, The grounding connection post is located in the inner area of ​​the metal mounting plate, and the outer area of ​​the metal mounting plate is the solder area; Alternatively, the ground connection post may be located in the outer region of the metal mounting plate, and the inner region of the metal mounting plate may be a soldering area.

6. The microstrip waveguide transition device of claim 2, wherein, The ridge waveguide includes multiple stepped sections with progressively decreasing heights. The step closest to the microstrip signal line is a signal connection step, which is welded to one end of the microstrip signal line.

7. The microstrip waveguide conversion device of claim 6, wherein, The signal connection step of the ridge waveguide extends outward beyond the waveguide groove.

8. The microstrip waveguide conversion device of claim 6, wherein, The entire ridge waveguide is disposed within the waveguide groove.

9. The microstrip waveguide conversion device of any one of claims 1 to 8, wherein, The waveguide port is located on the upper part of the waveguide component, and the axial direction of the waveguide port is perpendicular to the signal transmission direction of the microstrip signal line.

10. The microstrip waveguide conversion device of any one of claims 1 to 8, wherein, The waveguide port is located at the bottom of the waveguide and on the opposite side to the ridge waveguide. The waveguide port and the waveguide groove form a through groove. The axial direction of the waveguide port is parallel to the signal transmission direction of the microstrip signal line.

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