Internet of Things gateway with multi-communication fusion and intelligent topology construction functions

Abstract

The utility model discloses an Internet of Things gateway with multiple communication fusion and intelligent topology construction functions, and relates to the technical field of gateways. An Internet of Things gateway with multiple communication fusion and intelligent topology construction functions comprises a display screen, a shell, a top mainboard, a middle mainboard and a bottom mainboard, the display screen is embedded in the middle of the upper portion of the shell, the display screen is electrically connected with the top mainboard, the middle mainboard and the bottom mainboard, and the top mainboard, the middle mainboard and the bottom mainboard are arranged in the shell. An overvoltage, overcurrent, overload and surge protection circuit is built in the gateway, all-around safety protection is provided for equipment, communication modes of Wi-Fi, Bluetooth, 4G, LoRa, Zigbee, Thread, Ethernet and the like can be flexibly switched by the gateway through multi-communication technology fusion, communication requirements of equipment in different scenes are met, a sensor network of an automatic mesh topology structure is constructed, and when a node fails or signal interference occurs, the communication mode of the equipment in different scenes can be automatically switched. And data can be automatically forwarded through other nodes, so that the network reliability and fault tolerance are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of gateway technology, and specifically to an Internet of Things (IoT) gateway with multi-communication fusion and intelligent topology construction functions. Background Technology

[0002] In recent years, IoT technology has developed rapidly, with various IoT devices emerging and being widely used in multiple fields. The massive scale of these devices has placed more stringent demands on the interconnection between devices and the efficient transmission and management of data.

[0003] The demands for IoT communication technologies vary across different application areas. In smart home scenarios, users expect to control various smart devices such as smart lights, smart door locks, and smart appliances anytime, anywhere using mobile phones and other terminal devices. This requires stable and high-speed short-range communication technologies as support. In the field of smart agriculture, due to the vast area of ​​farmland and the dispersed distribution of equipment, it is necessary to monitor environmental parameters such as soil moisture, temperature, and light intensity in large areas of farmland in real time. Therefore, long-range and low-power communication technologies have become a necessity. In industrial automation scenarios, not only is it required that devices can transmit data in real time and accurately, but it also needs to have high reliability and stability to ensure the normal operation of the production process.

[0004] Furthermore, as IoT applications become increasingly complex and diverse, the performance requirements for sensor networks are also rising. Industry 4.0 emphasizes the intelligent and automated production processes, which necessitates sensor networks capable of collecting massive amounts of data such as equipment status and production parameters in real time, and accurately feeding back control commands to the executing devices. However, traditional sensor networks, which mostly employ unidirectional transmission and simple topologies, cannot meet this requirement.

[0005] Limited functionality and poor integration: Most existing gateway devices only support one or a few communication technologies, unable to simultaneously support multiple communication methods such as Wi-Fi, Bluetooth, 4G, and LoRa. This necessitates deploying multiple gateways of different types to meet the communication needs of various devices in practical applications, increasing system construction costs and management complexity. Furthermore, their data processing and analysis capabilities are limited, mostly performing only data forwarding, making it difficult to filter, aggregate, analyze, and preprocess large amounts of real-time data, thus failing to provide valuable information to upper-layer applications.

[0006] Significant performance bottlenecks exist: In terms of data transmission rate, when connecting a large number of devices and transmitting data frequently, gateways are prone to insufficient bandwidth and transmission latency. In smart homes, if multiple smart devices are controlled simultaneously, control commands may not respond promptly. Network stability is also poor, greatly affected by environmental factors (such as electromagnetic interference and signal obstruction). In complex environments such as factories and underground parking lots, signals are easily interrupted by interference, affecting normal device communication. Furthermore, the limited concurrent connection capacity of gateways makes it difficult to support large-scale IoT device access, restricting the expansion of IoT systems.

[0007] Lack of intelligent decision-making capabilities: Most existing gateways lack intelligent decision-making capabilities, failing to dynamically adjust configurations and policies based on network conditions, device status, and business needs. For example, during network congestion, they cannot automatically optimize data transmission paths and priorities, leading to delays in critical data transmission and impacting normal business operations. Furthermore, they cannot promptly detect and take effective measures in the event of device failure, reducing system reliability and stability. Summary of the Invention

[0008] The purpose of this invention is to provide an IoT gateway with multi-communication fusion and intelligent topology construction functions, which solves the problems of traditional sensor networks that mostly adopt unidirectional transmission and simple topology structures, have limited functions, poor integration, prominent performance bottlenecks, and lack of intelligent decision-making capabilities.

[0009] To achieve the above objectives, the present invention provides the following technical solution:

[0010] An IoT gateway with multi-communication convergence and intelligent topology construction functions includes a display screen, a housing, a top motherboard, a middle motherboard, and a bottom motherboard. The display screen is embedded in the middle of the upper part of the housing and is electrically connected to the top motherboard, the middle motherboard, and the bottom motherboard. The top motherboard, the middle motherboard, and the bottom motherboard are disposed inside the housing. The top motherboard is located at the upper part of the housing. The lower part of the top motherboard is connected to the middle motherboard, and the lower part of the middle motherboard is connected to the bottom motherboard.

[0011] The top-level motherboard includes a GPS core board, a 4G core board, a Lora and Zigbee core board, a CPU core board, a wired communication core board, and control buttons. The GPS core board, 4G core board, Lora and Zigbee core board, CPU core board, and wired communication core board are arranged horizontally from left to right in the center of the top-level motherboard. Several control buttons are arranged on the front of the top-level motherboard.

[0012] The intermediate motherboard includes a GPS antenna interface, a Lora / Zigbee antenna interface, a Lora host antenna interface, a WiFi / Bluetooth antenna interface, and an RTC battery. The rear of the intermediate motherboard is arranged horizontally from left to right with the GPS antenna interface, Lora / Zigbee antenna interface, Lora host antenna interface, and WiFi / Bluetooth antenna interface in sequence. The RTC battery is located on the right side of the center of the intermediate motherboard.

[0013] The bottom motherboard includes a 485 communication module, a relay module, a USB debugging and USB hub module, a power module, a bottom motherboard CPU, a debugging interface, a PMC data communication connector, a 485 communication interface, a relay interface, a wired communication interface, and a TYPE-C data interface. The 485 communication module, relay module, USB debugging and USB hub module, and power module are arranged horizontally from left to right at the center of the bottom motherboard. The bottom motherboard CPU is located behind the 485 communication module and the relay module. The debugging interface is located behind the power module. The PMC data communication connector is located on the right side of the power module. The 485 communication interface, relay interface, wired communication interface, and TYPE-C data interface are arranged horizontally from left to right at the front of the bottom motherboard.

[0014] Furthermore, the housing includes a top outer shell, an upper waterproof gasket, a housing body, a bottom waterproof gasket, and a bottom outer shell. The lower part of the top outer shell is connected to the housing body, and the upper waterproof gasket is provided between the top outer shell and the housing body. The lower part of the housing body is connected to the bottom outer shell, and the bottom waterproof gasket is provided between the housing body and the bottom outer shell.

[0015] Furthermore, the upper end of the control button extends out of the upper part of the housing.

[0016] Furthermore, the CPU core board and the bottom motherboard CPU are equipped with an automated mesh topology primary module.

[0017] The GPS core board, 4G core board, LoRa and Zigbee core boards, wired communication core board, 485 communication module, relay module, USB debugging and USB HUB module are equipped with an automated mesh topology secondary module.

[0018] The automated mesh topology primary module within the CPU core board is electrically connected to the automated mesh topology secondary modules within the GPS core board, 4G core board, LoRa and Zigbee core boards, and wired communication core board.

[0019] The automated mesh topology primary module within the bottom motherboard CPU is electrically connected to the automated mesh topology secondary module within the 485 communication module, relay module, USB debugging module, and USB HUB module.

[0020] The automated mesh topology primary module and the automated mesh topology secondary module are electrically connected.

[0021] The beneficial effects of this invention are as follows: This application integrates multiple communication technologies, leveraging the powerful processing capabilities and rich interfaces of the ESP32, and meticulously designs the hardware circuit to highly integrate various wireless communication modules such as Wi-Fi, Bluetooth, 4G, LoRa, GPS, Zigbee, and Thread. By optimizing the electrical connections and signal interactions between modules, it ensures stable operation of each communication module and minimizes mutual interference, enabling a single gateway device to support multiple communication methods. This breaks the limitation of traditional gateways that can only adapt to a single or a few communication technologies, meeting the communication needs of different scenarios and devices. Simultaneously, a new Ethernet interface is added to support wired network connections, further expanding network access methods and meeting the needs of scenarios with extremely high network stability requirements, such as industrial automation control centers, where wired networks can ensure low latency and high reliability of data transmission. Optimized sensor network: Automated mesh topology construction, based on star and tree topology sensor networks, constructs an automated mesh topology structure, in which any node can transmit data through multiple parent nodes. Each node only records information about its own parent node, eliminating the need to maintain complex routing tables, thus significantly reducing network complexity and management costs. Furthermore, each node and its child nodes form a two-level tree network. This hierarchical structure not only simplifies data forwarding paths but also reduces the number of hops for data packets within the network, thereby improving data transmission efficiency. This patented product incorporates multiple sensors and multiple RS-485 ports, and can directly form nodes, achieving a combined node and gateway function, further enhancing the convenience and efficiency of sensor network construction.

[0022] Hardware Functionality Expansion: In addition to the core functions mentioned above, this patented product supports a display that shows basic information such as resolution, allowing users to intuitively understand the device status and parameter settings. It also possesses powerful self-monitoring capabilities, able to read information such as motherboard operating temperature and humidity, as well as input voltage. By monitoring these key hardware parameters in real time, it helps to promptly detect potential device malfunctions, such as overheating of the motherboard which may indicate a heat dissipation problem, allowing for early maintenance. Furthermore, it provides data for optimizing device performance, such as dynamically adjusting the operating frequency based on CPU temperature to ensure stable and efficient operation.

[0023] Safety Protection Mechanisms: Built-in overvoltage, overcurrent, overload, and surge protection circuits provide comprehensive safety protection for the equipment. In complex electrical environments, such as industrial sites with frequent power grid fluctuations, these protection circuits effectively prevent damage to the equipment caused by abnormal voltage increases, excessive current, overload operation, or surge impacts. They also provide some lightning protection, ensuring hardware safety, extending equipment lifespan, and guaranteeing the long-term stable operation of the IoT system. Furthermore, the 485 interface supports programmable terminating resistor access, allowing flexible adjustment of interface electrical characteristics according to actual communication needs, improving communication reliability, and reducing signal reflection and interference. This is particularly suitable for long-distance, multi-node 485 bus communication scenarios.

[0024] Communication Flexibility and Efficiency: Through the integration of multiple communication technologies, the gateway can flexibly switch between communication methods such as Wi-Fi, Bluetooth, 4G, LoRa, Zigbee, Thread, and Ethernet to meet the communication needs of devices in different scenarios. In smart home scenarios, Wi-Fi is used for short-range, high-speed devices, Bluetooth for low-power, short-range devices, 4G for remote data interaction, and LoRa for long-range, low-power sensors, achieving seamless interconnection between devices, improving the communication efficiency and stability of the IoT system, and reducing data transmission delays or interruptions caused by incompatible communication technologies.

[0025] High reliability and fault tolerance: By constructing an automated mesh topology sensor network, data can be automatically forwarded through other nodes in the event of node failure or signal interference, greatly improving network reliability and fault tolerance. In industrial environments, equipment is often subjected to electromagnetic interference, and traditional topology networks are easily affected. However, this patented technology can ensure stable data transmission and guarantee the normal operation of production monitoring and management systems.

[0026] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0027] Figure 1 This is an exploded view of the overall structure according to an embodiment of the present invention.

[0028] Figure 2 This is a schematic diagram of the overall structure of an embodiment of the present invention.

[0029] Figure 3 for Figure 1 Front view of the motherboard structure of component 3.

[0030] Figure 4 for Figure 1 Diagram of the back panel structure of component 3.

[0031] Figure 5 for Figure 1 The overall motherboard circuit board diagram of component 3.

[0032] Figure 6 for Figure 1 Overall framework diagram of the motherboard for component 3.

[0033] Figure 7 for Figure 1 A structural diagram of the middle component 35 and the LED light section.

[0034] Figure 8 for Figure 1 Partial schematic diagram of component 33.

[0035] Figure 9 This is a schematic diagram illustrating the principle of converting full-duplex communication to half-duplex communication according to an embodiment of the present invention.

[0036] Figure 10 for Figure 1 Partial schematic diagrams of components 30, 31, and 32.

[0037] Figure 11 for Figure 1 Schematic diagram of component 35 and SIM card section.

[0038] Figure 12 for Figure 1 Schematic diagram of part 34 of the middle component.

[0039] Figure 13 for Figure 1 Partial schematic diagram of the front-end Type-C of component 3.

[0040] Figure 14 for Figure 1 The front core plate structure diagram of component 33.

[0041] Figure 15 for Figure 1 Schematic diagram of the core board of component 33.

[0042] Figure 16 for Figure 1 Front view of component 31.

[0043] Figure 17 for Figure 1 Rear structural diagram of component 31.

[0044] Figure 18 for Figure 1 Frame diagram of component 31.

[0045] Figure 19 for Figure 1 Schematic diagram of component 31 (Air780EG).

[0046] Figure 20 for Figure 1 Schematic diagram of component 31 (Air780E).

[0047] Figure 21 for Figure 1 Schematic diagram of the antenna section of component 31.

[0048] Figure 22 for Figure 1 Schematic diagram of the SIM card portion of component 31.

[0049] Figure 23 for Figure 1 Schematic diagram of the LED and button components of component 31.

[0050] Figure 24 for Figure 1 Front view of component 32.

[0051] Figure 25 for Figure 1 Rear structural diagram of component 32.

[0052] Figure 26 for Figure 1 Schematic diagram of component 32.

[0053] Figure 27 for Figure 1 Schematic diagram of the SX1261 / 2 part of component 32.

[0054] Figure 28 for Figure 1 Front view of component 30.

[0055] Figure 29 for Figure 1 Schematic diagram of component 30.

[0056] Figure 30 for Figure 1 Front view of component 54.

[0057] Figure 31 for Figure 1 Schematic diagram of component 54.

[0058] Figure 32 for Figure 1 Front view of component 34.

[0059] Figure 33 for Figure 1 Schematic diagram of component 34.

[0060] Explanation of reference numerals in the attached diagram: 1. Display screen; 2. Housing; 3. Top motherboard; 4. Middle motherboard; 5. Bottom motherboard; 20. Top outer shell; 21. Upper waterproof gasket; 22. Main body of the outer shell; 23. Bottom waterproof gasket; 24. Bottom outer shell; 30. GPS core board; 31. 4G core board; 32. Lora and Zigbee core boards; 33. CPU core board; 34. Wired communication core board; 35. Control buttons; 40. GPS antenna interface; 41. Lora / Zigbee antenna interface; 42. Lora host antenna interface; 43. WiFi / Bluetooth antenna interface; 44. RTC battery; 50. 485 communication module; 51. Relay module; 52. USB debugging and USB HUB module; 53. Power module; 54. Bottom motherboard CPU; 55. Debugging interface; 56. PMC data communication connector; 57. 485 communication interface; 58. Relay interface; 59. Wired communication interface; 60. TYPE-C data interface. Detailed Implementation

[0061] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, the technical features involved in the different embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0062] Please see Figure 1According to a preferred embodiment of this application, an IoT gateway with multi-communication fusion and intelligent topology construction functions is characterized in that it includes a display screen 1, a housing 2, a top motherboard 3, a middle motherboard 4, and a bottom motherboard 5. The display screen 1 is embedded in the middle of the upper part of the housing 2. The display screen 1 is electrically connected to the top motherboard 3, the middle motherboard 4, and the bottom motherboard 5. The housing 2 is provided with the top motherboard 3, the middle motherboard 4, and the bottom motherboard 5. The top motherboard 3 is located at the upper part of the housing 2. The lower part of the top motherboard 3 is connected to the middle motherboard 4, and the lower part of the middle motherboard 4 is connected to the bottom motherboard 5.

[0063] The top motherboard 3 includes a GPS core board 30, a 4G core board 31, a Lora and Zigbee core board 32, a CPU core board 33, a wired communication core board 34, and control buttons 35. The top motherboard 3 has the GPS core board 30, 4G core board 31, Lora and Zigbee core board 32, CPU core board 33, and wired communication core board 34 arranged horizontally from left to right in the center. The front of the top motherboard 3 has several control buttons 35.

[0064] The middle motherboard 4 includes a GPS antenna interface 40, a Lora / Zigbee antenna interface 41, a Lora host antenna interface 42, a WiFi / Bluetooth antenna interface 43, and an RTC battery 44. The rear of the middle motherboard 4 is arranged horizontally from left to right with the following components: GPS antenna interface 40, Lora / Zigbee antenna interface 41, Lora host antenna interface 42, and WiFi / Bluetooth antenna interface 43. The RTC battery 44 is located on the right side of the center of the middle motherboard 4.

[0065] The bottom motherboard 5 includes a 485 communication module 50, a relay module 51, a USB debugging and USB hub module 52, a power module 53, a bottom motherboard CPU 54, a debugging interface 55, a PMC data communication connector 56, a 485 communication interface 57, a relay interface 58, a wired communication interface 59, and a TYPE-C data interface 60. The bottom motherboard 5 has the 485 communication module 50, relay module 51, USB debugging and USB hub module 52, and power module 53 arranged horizontally from left to right at its center. The bottom motherboard CPU 54 is located behind the 485 communication module 50 and relay module 51. The debugging interface 55 is located behind the power module 53. The PMC data communication connector 56 is located on the right side of the power module 53. The bottom motherboard 5 has the 485 communication interface 57, relay interface 58, wired communication interface 59, and TYPE-C data interface 60 arranged horizontally from left to right at its front.

[0066] The housing 2 includes a top outer shell 20, an upper waterproof rubber ring 21, a housing body 22, a bottom waterproof rubber ring 23, and a bottom outer shell 24. The lower part of the top outer shell 20 is connected to the housing body 22, and the upper waterproof rubber ring 21 is provided between the top outer shell 20 and the housing body 22. The lower part of the housing body 22 is connected to the bottom outer shell 24, and the bottom waterproof rubber ring 23 is provided between the housing body 22 and the bottom outer shell 24.

[0067] The upper end of the control button 35 protrudes from the upper part of the housing 2.

[0068] The CPU core board 33 and the bottom motherboard CPU54 contain an automated mesh topology primary module.

[0069] The GPS core board 30, 4G core board 31, LoRa and Zigbee core board 32, wired communication core board 34, 485 communication module 50, relay module 51, and USB debugging and USB HUB module 52 all contain an automated mesh topology secondary module.

[0070] The automated mesh topology primary module within the CPU core board 33 is electrically connected to the automated mesh topology secondary modules within the GPS core board 30, 4G core board 31, LoRa and Zigbee core boards 32, and wired communication core board 34.

[0071] The automated mesh topology primary module within the CPU54 on the bottom motherboard is electrically connected to the automated mesh topology secondary module within the 485 communication module 50, relay module 51, and USB debugging and USB HUB module 52.

[0072] There is an electrical connection between the automated mesh topology primary module and the automated mesh topology secondary module.

[0073] The 4G core board 31 has a SIM card slot at the rear.

[0074] The front of the control button 35 has three Type-C ports.

[0075] The 4G core board 31 can be either Air780EG or Air780E, and in this embodiment of the invention, it is Air780EG.

[0076] In summary, this invention provides an IoT gateway with multi-communication fusion and intelligent topology construction capabilities. This device integrates multiple communication technologies, leveraging the powerful processing capabilities and rich interfaces of the ESP32 microcontroller. Through meticulously designed hardware circuitry, it highly integrates various wireless communication modules such as Wi-Fi, Bluetooth, 4G, LoRa, GPS, Zigbee, and Thread. By optimizing the electrical connections and signal interactions between modules, it ensures stable operation and minimizes mutual interference, enabling a single gateway device to support multiple communication methods. This breaks the limitations of traditional gateways that can only adapt to a single or limited number of communication technologies, meeting the communication needs of different scenarios and devices. Furthermore, the addition of an Ethernet interface supports wired network connections, further expanding network access methods and meeting the needs of scenarios with extremely high network stability requirements, such as industrial automation control centers, where wired networks can ensure low latency and high reliability of data transmission. Optimized sensor network: Automated mesh topology construction, based on star and tree topology sensor networks, constructs an automated mesh topology structure. In this structure, any node can transmit data through multiple parent nodes. Each node only records information about its own parent node, eliminating the need to maintain complex routing tables, thus significantly reducing network complexity and management costs. Furthermore, each node and its child nodes form a two-level tree network. This hierarchical structure not only simplifies data forwarding paths but also reduces the number of hops for data packets within the network, thereby improving data transmission efficiency. This patented product incorporates multiple sensors and multiple RS-485 ports, and can directly form nodes, achieving a combined node and gateway function, further enhancing the convenience and efficiency of sensor network construction.

[0077] Hardware Functionality Expansion: In addition to the core functions mentioned above, this patented product supports a display that shows basic information such as resolution, allowing users to intuitively understand the device status and parameter settings. It also possesses powerful self-monitoring capabilities, able to read information such as motherboard operating temperature and humidity, as well as input voltage. By monitoring these key hardware parameters in real time, it helps to promptly detect potential device malfunctions, such as overheating of the motherboard which may indicate a heat dissipation problem, allowing for early maintenance. Furthermore, it provides data for optimizing device performance, such as dynamically adjusting the operating frequency based on CPU temperature to ensure stable and efficient operation.

[0078] Safety Protection Mechanisms: Built-in overvoltage, overcurrent, overload, and surge protection circuits provide comprehensive safety protection for the equipment. In complex electrical environments, such as industrial sites with frequent power grid fluctuations, these protection circuits effectively prevent damage to the equipment caused by abnormal voltage increases, excessive current, overload operation, or surge impacts. They also provide some lightning protection, ensuring hardware safety, extending equipment lifespan, and guaranteeing the long-term stable operation of the IoT system. Furthermore, the 485 interface supports programmable terminating resistor access, allowing flexible adjustment of interface electrical characteristics according to actual communication needs, improving communication reliability, and reducing signal reflection and interference. This is particularly suitable for long-distance, multi-node 485 bus communication scenarios.

[0079] Communication Flexibility and Efficiency: Through the integration of multiple communication technologies, the gateway can flexibly switch between communication methods such as Wi-Fi, Bluetooth, 4G, LoRa, Zigbee, Thread, and Ethernet to meet the communication needs of devices in different scenarios. In smart home scenarios, Wi-Fi is used for short-range, high-speed devices, Bluetooth for low-power, short-range devices, 4G for remote data interaction, and LoRa for long-range, low-power sensors, achieving seamless interconnection between devices, improving the communication efficiency and stability of the IoT system, and reducing data transmission delays or interruptions caused by incompatible communication technologies.

[0080] High reliability and fault tolerance: By constructing an automated mesh topology sensor network, data can be automatically forwarded through other nodes in the event of node failure or signal interference, greatly improving network reliability and fault tolerance. In industrial environments, equipment is often subjected to electromagnetic interference, and traditional topology networks are easily affected. However, this patented technology can ensure stable data transmission and guarantee the normal operation of production monitoring and management systems.

[0081] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. An Internet of Things gateway with multi-element communication fusion and intelligent topology construction function, characterized in that, The device includes a display screen (1), a housing (2), a top motherboard (3), a middle motherboard (4), and a bottom motherboard (5). The display screen (1) is fitted into the middle of the upper part of the housing (2). The display screen (1) is electrically connected to the top motherboard (3), the middle motherboard (4), and the bottom motherboard (5). The top motherboard (3), the middle motherboard (4), and the bottom motherboard (5) are provided inside the housing (2). The top motherboard (3) is located at the upper part of the inside of the housing (2). The lower part of the top motherboard (3) is connected to the middle motherboard (4), and the lower part of the middle motherboard (4) is connected to the bottom motherboard (5). The top-level motherboard (3) includes a GPS core board (30), a 4G core board (31), a Lora and Zigbee core board (32), a CPU core board (33), a wired communication core board (34), and control buttons (35). The top-level motherboard (3) is arranged horizontally from left to right with the GPS core board (30), 4G core board (31), Lora and Zigbee core board (32), CPU core board (33), and wired communication core board (34) arranged in sequence. The front of the top-level motherboard (3) is provided with several control buttons (35). The intermediate motherboard (4) includes a GPS antenna interface (40), a Lora / Zigbee antenna interface (41), a Lora host antenna interface (42), a WiFi / Bluetooth antenna interface (43), and an RTC battery (44). The rear part of the intermediate motherboard (4) is provided with the GPS antenna interface (40), the Lora / Zigbee antenna interface (41), the Lora host antenna interface (42), and the WiFi / Bluetooth antenna interface (43) in a horizontal order from left to right. The RTC battery (44) is provided on the right side of the center of the intermediate motherboard (4). The bottom motherboard (5) includes a 485 communication module (50), a relay module (51), a USB debugging and USB hub module (52), a power module (53), a bottom motherboard CPU (54), a debugging interface (55), a PMC data communication connector (56), a 485 communication interface (57), a relay interface (58), a wired communication interface (59), and a TYPE-C data interface (60). The 485 communication module (50), the relay module (51), and the USB debugging interface are arranged horizontally from left to right at the center of the bottom motherboard (5). The bottom motherboard CPU (54) is located on the rear side of the 485 communication module (50) and the relay module (51), and the debugging interface (55) is located on the rear side of the power module (53). The PMC data communication connector (56) is located on the right side of the power module (53). The 485 communication interface (57), the relay interface (58), the wired communication interface (59), and the TYPE-C data interface (60) are arranged horizontally from left to right on the front of the bottom motherboard (5).

2. The Internet of Things gateway with multi-element communication fusion and intelligent topology construction function according to claim 1, characterized in that, The housing (2) includes a top outer shell (20), an upper waterproof rubber ring (21), a housing body (22), a bottom waterproof rubber ring (23), and a bottom outer shell (24). The lower part of the top outer shell (20) is connected to the housing body (22). The upper waterproof rubber ring (21) is provided between the top outer shell (20) and the housing body (22). The lower part of the housing body (22) is connected to the bottom outer shell (24). The bottom waterproof rubber ring (23) is provided between the housing body (22) and the bottom outer shell (24).

3. The Internet of Things gateway with multi-element communication fusion and intelligent topology construction function according to claim 1, characterized in that, The upper end of the control button (35) extends through the upper part of the housing (2).

4. An IoT gateway with multi-communication fusion and intelligent topology construction functions as described in claim 1, characterized in that, The CPU core board (33) and the bottom motherboard CPU (54) are equipped with an automated mesh topology primary module. The GPS core board (30), 4G core board (31), Lora and Zigbee core board (32), wired communication core board (34), 485 communication module (50), relay module (51), USB debugging and USBHUB module (52) are equipped with an automated mesh topology secondary module. The automated mesh topology primary module in the CPU core board (33) is electrically connected to the automated mesh topology secondary module in the GPS core board (30), 4G core board (31), Lora and Zigbee core board (32), and wired communication core board (34). The automated mesh topology primary module within the bottom motherboard CPU (54) is electrically connected to the automated mesh topology secondary module within the 485 communication module (50), relay module (51), USB debugging and USBHUB module (52). The automated mesh topology primary module and the automated mesh topology secondary module are electrically connected.

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