Intelligent monitoring alarm device for coking high-risk area

Abstract

The utility model discloses an intelligent monitoring alarm device for a coking high-risk area. The intelligent monitoring and alarming device for the coking high-risk area is provided for solving the problem that a monitoring device for the coking high-risk area cannot achieve real-time intelligent monitoring. The device comprises an explosion-proof box (8), and an ARM processor module (1), a temperature sensor module (2), a vibration sensor module (3), a gas sensor module (4), an alarm module (5), a LoRaWAN wireless remote transmission module (6) and a power supply module (7) which are arranged in the explosion-proof box (8), the ARM processor module (1) is connected with the temperature sensor module (2), the vibration sensor module (3), the gas alarm module (4), the alarm module (5) and the LoRaWAN wireless remote transmission module (6); the power supply module (7) supplies power to the whole system. The system can monitor environmental data of a coking process high-risk area in real time.

Description

Technical Field

[0001] This utility model relates to an intelligent monitoring and alarm device for high-risk areas of coking. Background Technology

[0002] Coking, as a core component of modern heavy industry, carries immeasurable strategic value. This process relies on advanced high-temperature pyrolysis technology (typically in the 950-1100℃ range) to transform carbon-rich resources such as coal and petroleum coke into a high-value-added product system through anaerobic pyrolysis, including high-quality metallurgical coke, clean coke oven gas, and specialty coal tar products. This energy and material conversion hub not only provides a crucial reducing agent for steelmaking (coke accounts for over 85%), but also supports the stable operation of coal chemical industry, fine chemical synthesis, and distributed energy systems, making it a fundamental process akin to "industrial vitamins."

[0003] However, its complex technological characteristics give rise to a multi-dimensional safety risk matrix: the high-speed operation of the crushing equipment creates a mechanical injury hazard zone; the high-temperature and high-pressure gas transmission pipeline network has a risk of leakage due to hidden cracks (historical data shows a leakage probability of approximately 0.3% / km•year); intermittent coal charging operations may induce instantaneous overpressure explosions at the furnace top; uncontrolled temperature of the dry quenching circulating gas will exceed the tolerance limits of the equipment materials; and high-concentration CO and H2S mixed gas poses a deadly poisoning threat. These risks have coupled evolutionary characteristics. If the risks are not mitigated in a timely manner through intelligent devices such as infrared thermal imaging monitoring and combustible gas alarm systems (standards stipulate a response time of <15 seconds), a chain reaction of disasters may be triggered, causing major production safety accidents.

[0004] It is worth noting that the physical isolation requirements of high-risk process sections (GB / T 39786-2021 stipulates that control rooms must maintain a safe distance of 25 meters) objectively create monitoring blind spots. Existing solutions are transforming towards intelligent solutions: by deploying high-temperature resistant robotic inspection systems, fiber optic temperature sensor networks, and digital twin prediction models, a collaborative monitoring system of "human-machine-environment" is being built. However, to ensure personnel safety, workers should stay as far away as possible from high-risk areas in coking, which makes real-time monitoring of the coking production process difficult.

[0005] Therefore, this invention designs an intelligent monitoring and alarm device for high-risk coking areas. It monitors real-time data from the site using temperature, vibration, and smoke sensors, and transmits the data wirelessly to a monitoring center over long distances via LoRaWAN. This enables real-time intelligent monitoring of high-risk coking areas, reducing the occurrence of safety accidents. Considering the application environment, the device is equipped with an explosion-proof casing and uses wireless transmission, eliminating the need for wiring and allowing for flexible installation. Summary of the Invention

[0006] The purpose of this invention is to solve the problem that monitoring devices in high-risk coking areas cannot achieve real-time intelligent monitoring, and to provide an intelligent monitoring and alarm device for high-risk coking areas.

[0007] The above objectives are achieved through the following technical solutions:

[0008] An intelligent monitoring and alarm device for high-risk coking areas comprises an explosion-proof box, and an ARM processor module, a temperature sensor module, a vibration sensor module, a gas sensor module, an alarm module, a LoRaWAN wireless remote transmission module, and a power supply module installed inside the explosion-proof box.

[0009] The NST_OUT signal input / output terminal of the ARM processor module is connected to the corresponding signal input / output terminal of the temperature sensor module; the MSA_SDA, MSA_INT1, and MSA_SCL signal input / output terminals of the ARM processor module are connected to the corresponding signal input / output terminals of the vibration sensor module; the OM_DOUT and OM_AOUT signal input / output terminals of the ARM processor module are connected to the corresponding signal input / output terminals of the gas alarm module; the ALARM_OUT signal input / output terminal of the ARM processor module is connected to the corresponding signal input / output terminal of the alarm module; the LORA_XTB, LORA_XTA, LORA_DIO2, LORA_DIO1, LORA_BUSY, LORA_RESET_N, LORA_MISO, LORA_MOSI, LORA_SCK, and LORA_NSS signal input / output terminals of the ARM processor module are connected to the corresponding signal input / output terminals of the LoRaWAN wireless remote transmission module; the power supply module converts the 24V external power supply to 3.3V to provide power for the entire system.

[0010] Furthermore, the ARM processor module includes a microcontroller STM32F107VCT6, a JTAG boundary scan test interface, a header 5X2 pin connector, and an LD1.

[0011] A crystal oscillator X2 is connected between the PC14-OSC32_IN and PC15-OSC32_OUT interfaces of the STM32F107VCT6 microcontroller. Capacitors C1 and C2 are connected to the two ends of crystal oscillator X2, with the other ends of C1 and C2 grounded. The PA8 port of the STM32F107VCT6 microcontroller is connected to NST_Vout; the PA13 port is connected to TMS; the PA14 port is connected to TCK; and the PB1 port is connected to system. Run the command: Connect the PB2 port of the STM32F107VCT6 microcontroller to resistor R3, and connect R3 to ground; connect the PB7 port of the STM32F107VCT6 microcontroller to OM_DOUT, and connect the PB8 port to OM_AOUT; connect the PC0 port of the STM32F107VCT6 microcontroller to ALARM_OUT; connect the PD0 port of the STM32F107VCT6 microcontroller to MSA_INT1, and connect the PD1 port of the STM32F107VCT6 microcontroller to MSA_INT1. _SCL, the PD2 port of the STM32F107VCT6 microcontroller is connected to SDA; the PE0 port of the STM32F107VCT6 microcontroller is connected to LORA_NSS; the PE1 port of the STM32F107VCT6 microcontroller is connected to LORA_SCK; the PE2 port of the STM32F107VCT6 microcontroller is connected to LORA_MOSI; the PE3 port of the STM32F107VCT6 microcontroller is connected to LORA_MISO; the ST microcontroller... The PE4 port of the STM32F107VCT6 is connected to LORA_RESET_N; the PE5 port of the STM32F107VCT6 is connected to LORA_BUSY; the PE6 port of the STM32F107VCT6 is connected to LORA_DIO1; the PE7 port of the STM32F107VCT6 is connected to LORA_DIO2; and the PE8 port of the STM32F107VCT6 is connected to LORA_XTA. The PE9 port of the STM32F107VCT6 is connected to LORA_XTB; the OSC_IN port of the STM32F107VCT6 is grounded through capacitor C10, and the OSC_OUT port of the STM32F107VCT6 is grounded through capacitor C11. A crystal oscillator X1 is placed between capacitors C10 and C11, and the OSC_OUT port is connected to the crystal oscillator X1 and capacitor C11 through resistor R12; the NRST port of the STM32F107VCT6 is connected to switch S1 and one end of resistor R2 respectively. The other end of switch S1 is grounded, and the other end of resistor R2 is connected to the power supply. Resistor C12 is connected in parallel with switch S1;The BOOT10 interface of the STM32F107VCT6 microcontroller is connected to resistor R4. Resistor R4 is connected to jumper JP2, which is also connected to ground and power supply.

[0012] Furthermore, the gas sensor module includes:

[0013] Power and signal link section:

[0014] Resistor R1 acts as a current-limiting resistor, connecting the VCC power supply and the positive terminal of LED_D1 to form an indicator circuit; LED_D1 is connected in series with pin 1 of the collector of NPN transistor M_Q2 through its cathode to form a light signal output branch.

[0015] Transistor control network section:

[0016] M_Q2 adopts a common-emitter amplifier configuration. The base pin 2 is connected to the output pin 1 of the operational amplifier U1 through resistor R2; the emitter pin 3 is directly grounded; the collector junction and the LED form a current path; capacitor C1 is connected in parallel between the base of M_Q2 and ground to achieve high-frequency noise bypass.

[0017] Operational amplifier U1 circuit section:

[0018] The AD8041 forms the core amplification unit. The non-inverting input pin 3 establishes a virtual ground bias through the R3-R4 voltage divider network; the inverting input pin 2 receives the QM_DOUT signal; the output pin 6 drives the base of the transistor through R2; R3 participates in the bias voltage divider of U1 and also serves as the feedback element of U2A.

[0019] Operational amplifier U2A circuit section:

[0020] The AD8041 is used to construct a feedback system. The output pin 1 of the AD8041 is fed back to the inverting input pin 2 through R3 to form a closed-loop amplification. The non-inverting input pin 3 is connected to the QM_AOUT signal source. The power supply pin 8 is connected to VCC, and the ground pin 4 is connected to the ground.

[0021] Furthermore, in the vibration sensor module, pin 1 of the MSA311 chip is reserved; pin 2 of the SDA chip is connected to the SDA bus; pins 3, 4, 5 (INT1), and 6 (NC) are directly grounded, and pin 5 (INT1) is connected to MSA_INT1; pin 7 (analog ground VDD) is grounded; pins 8, 9 (GND), 10, and 11 (NC) are grounded, and pin 12 (SCL) is connected to the SCL bus.

[0022] The positive terminal of capacitor C1 is connected to VCC, and the negative terminal is grounded.

[0023] Pull-up configuration for pin 2 SDA: Independent 4.7kΩ resistor R2 connected to VCC.

[0024] Furthermore, in the temperature sensor module,

[0025] On chip U1, port 1 (VDD) is directly connected to the power supply VCC to provide the chip's operating voltage; port 2 (Vout) is connected to the input of R1; the output of R1 is connected to the output node NST_Vout and capacitor C2, with the other end of capacitor C2 grounded; port 3 (GND) is grounded.

[0026] The positive terminal of capacitor C1 is connected to the VCC power supply, and the negative terminal of capacitor C1 is grounded.

[0027] Furthermore, in the LoRaWAN wireless remote transmission module,

[0028] Pin 1 (VDD_IN) and pin 24 are connected in parallel for power supply. Pin 1 (VDD_IN) is connected to a 3V3 power supply and grounded through capacitor C3. Pin 1 (VDD_IN) is connected to the power supply through inductor L1 and decoupled and filtered through multiple capacitors.

[0029] Pin 2 (GND), pin 5 (GND), pin 8 (GND), and pin 20 (GND) are grounded;

[0030] Pin 3, LORA_XTA, is connected to the LORA_XTA signal;

[0031] Pin 4, LORA_XTB, is connected to the LORA_XTB signal;

[0032] Pin 5 (GND) is connected to capacitors C4 and C19;

[0033] Pin 6, DIO3, is connected to GND;

[0034] Pin 7, VREG, is connected to the power supply via inductor L1;

[0035] Pin 8, GND, is connected to the power supply via capacitor C19 and inductor L1;

[0036] Pin 9, DCC_SW, is connected to the power supply through inductors L2 and L1.

[0037] Pin 10 (VBAT) and pin 11 (VBAT_IO) are connected to the power supply and grounded through capacitor 18.

[0038] Connect pin 12 DIO2 to LORA_DIO2;

[0039] Pin 13, DIO1, is connected to LORA_DIO1;

[0040] Pin 14 BUSY is connected to LORA_BUSY;

[0041] Pin 15, NRESET, is connected to LORA_RESET_N;

[0042] The 16-pin MISO connector is linked to LORA_MISO.

[0043] Pin 17 MOSI is connected to LORA_MOSI;

[0044] Pin 18 SCK is connected to LORA_SCK;

[0045] Pin 19 NSS is connected to LORA_NSS;

[0046] Pin 20 is grounded (GND).

[0047] Pin 21, RFI_P, is connected to capacitor C19 via capacitor C4;

[0048] Pin 22 RFI_N is connected to LORA_RFN, and inductor L4 is connected between pin 22 RFI_N and pin 21.

[0049] Pin 23 RFO is connected to LORA_RFO, and pin 23 RFO is connected to pin 24, capacitor C1 and capacitor C2 through inductor L3. The other ends of capacitors C1 and C2 are grounded.

[0050] On the grounding line of capacitor 18, capacitor C7 is also connected through capacitor C6. The other end of capacitor C7 is connected to pin 5 RFC of chip U9. The line between the other end of capacitor C7 and pin 5 RFC is connected to pin 6 CTRL of chip U9 through resistor R1. The line between resistor R1 and pin 6 CTRL is grounded through capacitor C8. Pin 1 RF1 of chip U9 is connected to LORA_RFO through capacitor C13, inductor L6, inductor L7, and capacitor C10. Pin 2 GND of chip U9 is connected to capacitor C10 through capacitor C11. Pin 3 RF2 of chip U9 is connected to LORA_RFN through capacitor C17. Capacitor C14 is connected in parallel between pin 1 RF1 and pin 2 GND of chip U9. Capacitor C16 is connected in parallel between pin 2 GND and pin 3 RF2 of chip U9. RFIO1 is connected in parallel to capacitor C5. Capacitor C5 and inductor L5 are connected in parallel to capacitor C6.

[0051] Furthermore, in the aforementioned alarm circuit,

[0052] The collector of transistor Q1 is connected to ALARM_OUT through resistor Res3; the emitter of transistor Q1 is connected to interface 1 of speaker U12, and interface 2 of speaker U12 is grounded; the base of transistor Q1 is connected to a 3V3 power supply.

[0053] Furthermore, in the circuit of the power module,

[0054] Pin SV of chip U2 is connected to pin 1 of CN1 through chip U1.

[0055] Pin 2 (SG) of chip U2 is connected to pins 2 and 3 of CN1.

[0056] A capacitor C1 and a diode Z1 are connected in parallel between pin 1 (SV) and pin 2 (SG) of chip U2, and pin 2 of chip U1 is connected to pin 2 (SG) of chip U2.

[0057] Pins 4 (CG1), 5 (CG2), and 6 (CG3) of chip U2 are connected in parallel and then grounded.

[0058] Pin CV of chip U2 is connected to the power supply, and capacitor C2 is connected in parallel between pin CV of chip U2 and pins CG1, CG2, and CG3.

[0059] Chip U3 is placed between the power supply and C2. The input terminal of chip U3 receives the filtered input voltage through C3 and C4 connected in parallel, and the output terminal of chip U3 is further filtered through C5 and C6 connected in parallel.

[0060] The chip U1 model is ZEN056V130A24LS;

[0061] The chip U2 model is BNX002-01;

[0062] The chip U3 model is LD1086D2M33. Beneficial effects

[0063] 1. This invention enables real-time monitoring of environmental data in high-risk areas of the coking process. It utilizes a LoRaWAN long-distance wireless transmission module to communicate with the monitoring center server, offering convenient, flexible deployment and a fast response time.

[0064] 2. The intelligent monitoring and alarm device of this utility model can replace manual monitoring of high-risk areas in the coking process in real time, ensuring the personal safety of staff and improving the safety of the coking production process. Attached Figure Description

[0065] Figure 1 This is a schematic diagram of the principle of this utility model;

[0066] Figure 2 The figures show embodiments of this utility model.

[0067] Figure 3 This is a circuit diagram of the power module of this utility model;

[0068] Figure 4This is a circuit schematic diagram of the ARM processor module of this utility model;

[0069] Figure 5 This is a circuit diagram of the gas sensor module of this utility model;

[0070] Figure 6 This is a circuit diagram of the vibration sensor module of this utility model;

[0071] Figure 7 This is a circuit diagram of the temperature sensor module of this utility model;

[0072] Figure 8 This is a circuit diagram of the LoRaWAN wireless remote transmission module of this utility model;

[0073] Figure 9 This is a circuit diagram of the alarm module of this utility model. Detailed Implementation

[0074] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Specific implementation method one:

[0076] This embodiment provides an intelligent monitoring and alarm device for high-risk coking areas, including an explosion-proof box 8 and a device installed inside the explosion-proof box 8. Figure 1 The module consists of an ARM processor module 1, a temperature sensor module 2, a vibration sensor module 3, a gas sensor module 4, an alarm module 5, a LoRaWAN wireless remote transmission module 6, and a power supply module 7.

[0077] The NST_OUT signal input / output terminal of ARM processor module 1 is connected to the corresponding signal input / output terminal of temperature sensor module 2; the MSA_SDA, MSA_INT1, and MSA_SCL signal input / output terminals of ARM processor module 1 are connected to the corresponding signal input / output terminals of vibration sensor module 3; the OM_DOUT and OM_AOUT signal input / output terminals of ARM processor module 1 are connected to the corresponding signal input / output terminals of gas alarm module 4; the ALARM_OUT signal input / output terminal of ARM processor module 1 is connected to the corresponding signal input / output terminal of alarm module 5; the LORA_XTB, LORA_XTA, LORA_DIO2, LORA_DIO1, LORA_BUSY, LORA_RESET_N, LORA_MISO, LORA_MOSI, LORA_SCK, and LORA_NSS signal input / output terminals of ARM processor module 1 are connected to the corresponding signal input / output terminals of LoRaWAN wireless remote transmission module 6; the power supply module 7 converts the 24V external power supply to 3.3V to provide power for the entire system. Specific Implementation Method Two:

[0079] This embodiment of the intelligent monitoring and alarm device for high-risk areas in coking plants differs from specific embodiment one in that, for example... Figure 4 As shown, the ARM processor module 1 includes a microcontroller STM32F107VCT6, a JTAG boundary scan test interface, a header 5X2 pin connector, and an LD1.

[0080] A crystal oscillator X2 is connected between the PC14-OSC32_IN and PC15-OSC32_OUT interfaces of the STM32F107VCT6 microcontroller. Capacitors C1 and C2 are connected to the two ends of crystal oscillator X2, with the other ends of C1 and C2 grounded. The PA8 port of the STM32F107VCT6 microcontroller is connected to NST_Vout; the PA13 port is connected to TMS; the PA14 port is connected to TCK; and the PB1 port is connected to system. Run the command: Connect the PB2 port of the STM32F107VCT6 microcontroller to resistor R3, and connect R3 to ground; connect the PB7 port of the STM32F107VCT6 microcontroller to OM_DOUT, and connect the PB8 port to OM_AOUT; connect the PC0 port of the STM32F107VCT6 microcontroller to ALARM_OUT; connect the PD0 port of the STM32F107VCT6 microcontroller to MSA_INT1, and connect the PD1 port of the STM32F107VCT6 microcontroller to MSA_INT1. _SCL, the PD2 port of the STM32F107VCT6 microcontroller is connected to SDA; the PE0 port of the STM32F107VCT6 microcontroller is connected to LORA_NSS; the PE1 port of the STM32F107VCT6 microcontroller is connected to LORA_SCK; the PE2 port of the STM32F107VCT6 microcontroller is connected to LORA_MOSI; the PE3 port of the STM32F107VCT6 microcontroller is connected to LORA_MISO; the ST microcontroller... The PE4 port of the STM32F107VCT6 is connected to LORA_RESET_N; the PE5 port of the STM32F107VCT6 is connected to LORA_BUSY; the PE6 port of the STM32F107VCT6 is connected to LORA_DIO1; the PE7 port of the STM32F107VCT6 is connected to LORA_DIO2; and the PE8 port of the STM32F107VCT6 is connected to LORA_XTA. The PE9 port of the STM32F107VCT6 is connected to LORA_XTB; the OSC_IN port of the STM32F107VCT6 is grounded through capacitor C10, and the OSC_OUT port of the STM32F107VCT6 is grounded through capacitor C11. A crystal oscillator X1 is placed between capacitors C10 and C11, and the OSC_OUT port is connected to the crystal oscillator X1 and capacitor C11 through resistor R12; the NRST port of the STM32F107VCT6 is connected to switch S1 and one end of resistor R2 respectively. The other end of switch S1 is grounded, and the other end of resistor R2 is connected to the power supply. Resistor C12 is connected in parallel with switch S1;The BOOT10 interface of the STM32F107VCT6 microcontroller is connected to resistor R4. Resistor R4 is connected to jumper JP2, which is also connected to ground and power supply. Specific implementation method three:

[0082] This embodiment of an intelligent monitoring and alarm device for high-risk areas in coking plants differs from specific embodiments one or two in that, for example... Figure 5 As shown, the gas sensor module 4 includes:

[0083] Power and signal link section:

[0084] Resistor R1 acts as a current-limiting resistor, connecting the VCC power supply and the positive terminal of LED_D1 to form an indicator circuit; LED_D1 is connected in series with pin 1 of the collector of NPN transistor M_Q2 through its cathode to form a light signal output branch.

[0085] Transistor control network section:

[0086] M_Q2 adopts a common-emitter amplifier configuration. The base pin 2 is connected to the output pin 1 of the operational amplifier U1 through resistor R2; the emitter pin 3 is directly grounded; the collector junction and the LED form a current path; capacitor C1 is connected in parallel between the base of M_Q2 and ground to achieve high-frequency noise bypass.

[0087] Operational amplifier U1 circuit section:

[0088] The AD8041 forms the core amplification unit. The non-inverting input pin 3 establishes a virtual ground bias through the R3-R4 voltage divider network (R4 is connected to VCC); the inverting input pin 2 receives the QM_DOUT signal; the output pin 6 drives the base of the transistor through R2; R3 participates in the bias voltage divider of U1 and also serves as the feedback element of U2A.

[0089] Operational amplifier U2A circuit section:

[0090] The AD8041 is used to construct a feedback system. The output pin 1 of the AD8041 is fed back to the inverting input pin 2 through R3 to form a closed-loop amplification; the non-inverting input pin 3 is connected to the QM_AOUT signal source; the power supply pin 8 is connected to VCC, and the ground terminal (pin 4) is common to the ground. Specific implementation method four:

[0092] This embodiment of the intelligent monitoring and alarm device for high-risk areas in coking plants differs from specific embodiment three in that, for example... Figure 6As shown, in the vibration sensor module 3, pin 1 (NC) of the MSA311 chip is reserved; pin 2 (SDA, bidirectional I / O port) is connected to the SDA bus; pins 3 (NC), 4 (NC), 5 (INT1), and 6 (NC) are directly grounded, and pin 5 (INT1) is connected to MSA_INT1; pin 7 (analog ground VDD) is grounded; pins 8 (NC), 9 (GND), 10 (NC), and 11 (NC) are grounded, and pin 12 (SCL) is connected to the SCL bus.

[0093] The positive terminal of capacitor C1 (100nF) is connected to VCC, and the negative terminal is grounded;

[0094] Pull-up configuration for pin 2 SDA: Independent 4.7kΩ resistor R2 connected to VCC. Specific implementation method five:

[0096] This embodiment of an intelligent monitoring and alarm device for high-risk areas in coking plants differs from specific embodiments one, two, or four in that, for example... Figure 7 As shown, in the temperature sensor module 2,

[0097] On chip U1 (NST235), port 1 (VDD) is directly connected to the power supply VCC to provide the chip's operating voltage; port 2 (Vout) is connected to the input terminal of R1 (10KΩ); the output terminal of R1 is connected to the output node NST_Vout and capacitor C2, with the other end of capacitor C2 grounded; port 3 (GND) is grounded.

[0098] The positive terminal of capacitor C1 (100nF) is connected to the VCC power supply, and the negative terminal of capacitor C1 (100nF) is grounded.

[0099] The NST235 chip converts the analog signal to a digital level and outputs the digital signal, which is then current-limited by R1, through the Vout port. Dual capacitors C1 and C2 provide low-pass filtering for the power supply and output, respectively, ensuring signal integrity. In practical applications, an ESD protection device (such as PESD1CAN) can be added to the Vout output to improve anti-interference capabilities. Specific implementation method six:

[0101] This embodiment of the intelligent monitoring and alarm device for high-risk areas in coking plants differs from specific embodiment five in that, for example... Figure 8 As shown, in the LoRaWAN wireless remote transmission module 6,

[0102] Pin 1 (VDD_IN) and pin 24 are connected in parallel for power supply. Pin 1 (VDD_IN) is connected to a 3V3 power supply and grounded through capacitor C3 (10nF). Pin 1 (VDD_IN) is connected to the power supply through inductor L1 and decoupled and filtered through multiple capacitors.

[0103] Pin 2 (GND), pin 5 (GND), pin 8 (GND), and pin 20 (GND) are grounded;

[0104] Pin 3, LORA_XTA, is connected to the LORA_XTA signal;

[0105] Pin 4, LORA_XTB, is connected to the LORA_XTB signal;

[0106] Pin 5 (GND) is connected to capacitors C4 and C19;

[0107] Pin 6, DIO3, is connected to GND;

[0108] Pin 7, VREG, is connected to the power supply via inductor L1;

[0109] Pin 8, GND, is connected to the power supply via capacitor C19 and inductor L1;

[0110] Pin 9, DCC_SW, is connected to the power supply through inductors L2 and L1.

[0111] Pin 10 (VBAT) and pin 11 (VBAT_IO) are connected to the power supply and grounded through capacitor 18 (100nF);

[0112] Connect pin 12 DIO2 to LORA_DIO2;

[0113] Pin 13, DIO1, is connected to LORA_DIO1;

[0114] Pin 14 BUSY is connected to LORA_BUSY;

[0115] Pin 15, NRESET, is connected to LORA_RESET_N;

[0116] The 16-pin MISO connector is linked to LORA_MISO.

[0117] Pin 17 MOSI is connected to LORA_MOSI;

[0118] Pin 18 SCK is connected to LORA_SCK;

[0119] Pin 19 NSS is connected to LORA_NSS;

[0120] Pin 20 is grounded (GND).

[0121] Pin 21, RFI_P, is connected to capacitor C19 via capacitor C4 (3.9pF).

[0122] Pin 22 RFI_N is connected to LORA_RFN, and inductor L4 (33nh) is connected between pin 22 RFI_N and pin 21.

[0123] Pin 23 RFO is connected to LORA_RFO, and pin 23 RFO is connected to pin 24, capacitor C1 and capacitor C2 through inductor L3 (56nh). The other ends of capacitors C1 and C2 are grounded.

[0124] On the grounding line of capacitor 18, capacitor C7 is also connected via capacitor C6. The other end of capacitor C7 is connected to pin 5 (RFC) of chip U9. The line between the other end of capacitor C7 and pin 5 (RFC) is connected to pin 6 (CTRL) of chip U9 via resistor R1. The line between resistor R1 and pin 6 (CTRL) is grounded via capacitor C8 (1nF). Pin 1 (RF1) of chip U9 is connected to LORA_ via capacitor C13, inductor L6, inductor L7, and capacitor C10. RFO; Pin 2 GND of chip U9 is connected to capacitor C10 through capacitor C11; Pin 3 RF2 of chip U9 is connected to LORA_RFN through capacitor C17; Capacitor C14 (8.2pF) is connected in parallel between pin 1 RF1 and pin 2 GND of chip U9, and capacitor C16 (1pF) is connected in parallel between pin 2 GND and pin 3 RF2 of chip U9; RFIO1 is connected in parallel to capacitor C5, and capacitor C5 and inductor L5 (OR) are connected in parallel to capacitor C6. Specific implementation method seven:

[0126] This embodiment of an intelligent monitoring and alarm device for high-risk coking areas differs from specific embodiments one, two, four, or six in that, for example... Figure 9 As shown, in the alarm circuit 5,

[0127] The collector of transistor Q1 is connected to ALARM_OUT through resistor Res3; the emitter of transistor Q1 is connected to interface 1 of speaker U12, and interface 2 of speaker U12 is grounded; the base of transistor Q1 is connected to a 3V3 power supply. Detailed implementation method eight:

[0129] This embodiment of the intelligent monitoring and alarm device for high-risk areas in coking plants differs from specific embodiment seven in that, for example... Figure 3 As shown, in the circuit of the power module 7,

[0130] Pin SV of chip U2 is connected to pin 1 of CN1 through chip U1.

[0131] Pin 2 (SG) of chip U2 is connected to pins 2 and 3 of CN1.

[0132] A capacitor C1 and a diode Z1 are connected in parallel between pin 1 (SV) and pin 2 (SG) of chip U2, and pin 2 of chip U1 is connected to pin 2 (SG) of chip U2.

[0133] Pins 4 (CG1), 5 (CG2), and 6 (CG3) of chip U2 are connected in parallel and then grounded.

[0134] Pin CV of chip U2 is connected to the power supply, and capacitor C2 is connected in parallel between pin CV of chip U2 and pins CG1, CG2, and CG3.

[0135] Chip U3 is placed between the power supply and C2. The input terminal of chip U3 receives the filtered input voltage through parallel C3 and C4, and the output terminal of chip U3 is further filtered through parallel C5 and C6, forming a hybrid connection relationship of voltage regulation and filtering.

[0136] The chip U1 model is ZEN056V130A24LS;

[0137] The chip U2 model is BNX002-01;

[0138] The chip U3 model is LD1086D2M33.

[0139] The working principle of this utility model:

[0140] Combination Figures 1-9 Temperature sensor module 2, vibration sensor module 3, and gas sensor module 4 acquire ambient environmental data, transmit the acquired environmental data to ARM processor module 1 for processing, and then transmit it to remote monitoring server 9 via LoRaWAN wireless remote transmission module 6. Once the monitored data reaches a set alarm value, an alarm is triggered. ARM processor module 1 then triggers alarm module 5, emitting an alarm sound. The remote monitoring server also receives the alarm information, realizing intelligent monitoring and alarm for high-risk areas in coking plants. This invention can communicate directly with the remote monitoring server or via relay station 10 with the remote monitoring server 9.

[0141] The LoRaWAN wireless remote transmission module 6 uses the SX1268 chip, the vibration sensor module 3 uses the MSA311 chip, the temperature sensor module 2 uses the NST235 chip, and the gas sensor module 4 uses the MQ-2 chip.

[0142] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An intelligent monitoring and alarm device for high-risk areas in coking plants, characterized in that: Its components include an explosion-proof box (8), and an ARM processor module (1), a temperature sensor module (2), a vibration sensor module (3), a gas sensor module (4), an alarm module (5), a LoRaWAN wireless remote transmission module (6), and a power supply module (7) installed inside the explosion-proof box (8). The NST_OUT signal input / output terminal of the ARM processor module (1) is connected to the corresponding signal input / output terminal of the temperature sensor module (2); the MSA_SDA, MSA_INT1, and MSA_SCL signal input / output terminals of the ARM processor module (1) are respectively connected to the corresponding signal input / output terminals of the vibration sensor module (3); the OM_DOUT and OM_AOUT signal input / output terminals of the ARM processor module (1) are respectively connected to the corresponding signal input / output terminals of the gas alarm module (4); the ALARM_OUT signal output / output terminal of the ARM processor module (1) is connected to the corresponding signal input / output terminal of the gas alarm module (4); The input terminal is connected to the corresponding signal input / output terminal of the alarm module (5); the signal input / output terminals of LORA_XTB, LORA_XTA, LORA_DIO2, LORA_DIO1, LORA_BUSY, LORA_RESET_N, LORA_MISO, LORA_MOSI, LORA_SCK and LORA_NSS of the ARM processor module (1) are respectively connected to the corresponding signal input / output terminals of the LoRaWAN wireless remote transmission module (6); the power module (7) converts the 24V external power supply to 3.3V to provide power for the entire system.

2. The intelligent monitoring and alarm device for high-risk coking areas according to claim 1, characterized in that: The ARM processor module (1) includes a microcontroller STM32F107VCT6, a JTAG boundary scan test interface, a header 5X2 pin connector, and an LD1. A crystal oscillator X2 is connected between the PC14-OSC32_IN and PC15-OSC32_OUT interfaces of the STM32F107VCT6 microcontroller. Capacitors C1 and C2 are connected to the two ends of crystal oscillator X2, with the other ends of C1 and C2 grounded. The PA8 port of the STM32F107VCT6 microcontroller is connected to NST_Vout; the PA13 port is connected to TMS; the PA14 port is connected to TCK; and the PB1 port is connected to system. Run the command: Connect the PB2 port of the STM32F107VCT6 microcontroller to resistor R3, and connect R3 to ground; connect the PB7 port of the STM32F107VCT6 microcontroller to OM_DOUT, and connect the PB8 port to OM_AOUT; connect the PC0 port of the STM32F107VCT6 microcontroller to ALARM_OUT; connect the PD0 port of the STM32F107VCT6 microcontroller to MSA_INT1, and connect the PD1 port of the STM32F107VCT6 microcontroller to MSA_INT1. _SCL, the PD2 port of the STM32F107VCT6 microcontroller is connected to SDA; the PE0 port of the STM32F107VCT6 microcontroller is connected to LORA_NSS; the PE1 port of the STM32F107VCT6 microcontroller is connected to LORA_SCK; the PE2 port of the STM32F107VCT6 microcontroller is connected to LORA_MOSI; the PE3 port of the STM32F107VCT6 microcontroller is connected to LORA_MISO; the ST microcontroller... The PE4 port of the STM32F107VCT6 is connected to LORA_RESET_N; the PE5 port of the STM32F107VCT6 is connected to LORA_BUSY; the PE6 port of the STM32F107VCT6 is connected to LORA_DIO1; the PE7 port of the STM32F107VCT6 is connected to LORA_DIO2; and the PE8 port of the STM32F107VCT6 is connected to LORA_XTA. The PE9 port of the STM32F107VCT6 is connected to LORA_XTB; the OSC_IN port of the STM32F107VCT6 is grounded through capacitor C10, and the OSC_OUT port of the STM32F107VCT6 is grounded through capacitor C11. A crystal oscillator X1 is placed between capacitors C10 and C11, and the OSC_OUT port is connected to the crystal oscillator X1 and capacitor C11 through resistor R12; the NRST port of the STM32F107VCT6 is connected to switch S1 and one end of resistor R2 respectively. The other end of switch S1 is grounded, and the other end of resistor R2 is connected to the power supply. Resistor C12 is connected in parallel with switch S1;The BOOT10 interface of the single-chip microcomputer STM32F107VCT6 is connected with a resistor R4, the resistor R4 is connected with a jumper JP2, and the jumper JP2 is further connected with the ground and a power supply.

3. The intelligent monitoring and alarm device for high-risk coking areas according to claim 1 or 2, characterized in that: The gas sensor module (4) includes: Power and signal link section: Resistor R1 acts as a current-limiting resistor, connecting the VCC power supply and the positive terminal of LED_D1 to form an indicator circuit; LED_D1 is connected in series with pin 1 of the collector of NPN transistor M_Q2 through its cathode to form a light signal output branch. Transistor control network section: M_Q2 adopts a common-emitter amplifier configuration. The base pin 2 is connected to the output pin 1 of the operational amplifier U1 through resistor R2; the emitter pin 3 is directly grounded; the collector junction and the LED form a current path; capacitor C1 is connected in parallel between the base of M_Q2 and ground to achieve high-frequency noise bypass. Operational amplifier U1 circuit section: The AD8041 forms the core amplification unit. The non-inverting input pin 3 establishes a virtual ground bias through the R3-R4 voltage divider network; the inverting input pin 2 receives the QM_DOUT signal; the output pin 6 drives the base of the transistor through R2; R3 participates in the bias voltage divider of U1 and also serves as the feedback element of U2A. Operational amplifier U2A circuit section: The AD8041 is used to construct a feedback system. The output pin 1 of the AD8041 is fed back to the inverting input pin 2 through R3 to form a closed-loop amplification. The non-inverting input pin 3 is connected to the QM_AOUT signal source. The power supply pin 8 is connected to VCC, and the ground pin 4 is connected to the ground.

4. The intelligent monitoring and alarming device for high-risk area of coking according to claim 3, characterized in that: In the vibration sensor module (3), The MSA311 chip has the following configuration: NC pin 1 is reserved; SDA pin 2 is connected to the SDA bus; NC pins 3, 4, 5 (INT1), and NC pin 6 are directly grounded, with INT1 pin 5 connected to MSA_INT1; analog ground pin 7 (VDD) is grounded; NC pins 8, 9 (GND), 10, and 11 (NC) are grounded; and SCL pin 12 is connected to the SCL bus. Capacitor C1 has its positive terminal connected to VCC and its negative terminal grounded. SDA pin 2 is pull-up configured with an independent 4.7kΩ resistor R2 connected to VCC.

5. The intelligent monitoring and alarming device for high-risk area of coking according to claim 1, 2 or 4, characterized in that: In the temperature sensor module (2), On chip U1, port 1 (VDD) is directly connected to the power supply VCC to provide the chip's operating voltage; port 2 (Vout) is connected to the input of R1; the output of R1 is connected to the output node NST_Vout and capacitor C2, with the other end of capacitor C2 grounded; port 3 (GND) is grounded. The positive terminal of capacitor C1 is connected to the VCC power supply, and the negative terminal of capacitor C1 is grounded.

6. A device for intelligent monitoring and alarming of high risk zones in a coke oven battery as claimed in claim 5, wherein the said device is characterized by: In the LoRaWAN wireless remote transmission module (6), Pin 1 (VDD_IN) and pin 24 are connected in parallel for power supply. Pin 1 (VDD_IN) is connected to a 3V3 power supply and grounded through capacitor C3. Pin 1 (VDD_IN) is also connected to the power supply through inductor L1 and decoupled and filtered by multiple capacitors. Pins 2, 5, 8, and 20 (GND) are grounded. Pin 3 (LORA_XTA) is connected to the LORA_XTA signal. Pin 4 (LORA_XTB) is connected to the LORA_XTB signal. Pin 5 (GND) is connected to capacitors C4 and C19. Pin 6 (DIO3) is connected to GND. Pin 7 (VREG) is connected to the power supply through inductor L1. Pin 8 (GND) is connected to... Capacitor C19 and inductor L1 are connected to the power supply; pin 9, DCC_SW, is connected to the power supply through inductors L2 and L1; pins 10, VBAT, and 11, VBAT_IO, are connected to the power supply and grounded through capacitor 18; pin 12, DIO2, is connected to LORA_DIO2; pin 13, DIO1, is connected to ORA_DIO1; pin 14, BUSY, is connected to LORA_BUSY; pin 15, NRESET, is connected to LORA_RESET_N; pin 16, MISO, is connected to LORA_MISO; pin 17, MOSI, is connected to LORA_MOSI; pin 18, SCK, is connected to LORA_SCK; and pin 19, NSS, is connected to LORA_... NSS; Pin 20 is grounded (GND); Pin 21 (RFI_P) is connected to Capacitor C19 via Capacitor C4; Pin 22 (RFI_N) is connected to LORA_RFN, and Inductor L4 is connected between Pin 22 (RFI_N) and Pin 21; Pin 23 (RFO) is connected to LORA_RFO, and Pin 23 (RFO) is connected to Pin 24, Capacitor C1, and Capacitor C2 via Inductor L3. The other ends of Capacitors C1 and C2 are grounded; Capacitor C7 is also connected to the ground line via Capacitor C6, and the other end of Capacitor C7 is connected to Pin 5 (RFC) of Chip U9. The line between the other end of Capacitor C7 and Pin 5 (RFC) is connected to the chip via Resistor R1. Pin 6 (CTRL) of U9 is grounded via capacitor C8 on the line between resistor R1 and pin 6 (CTRL). Pin 1 (RF1) of chip U9 is connected to LORA_RFO via capacitor C13, inductor L6, inductor L7, and capacitor C10. Pin 2 (GND) of chip U9 is connected to capacitor C10 via capacitor C11. Pin 3 (RF2) of chip U9 is connected to LORA_RFN via capacitor C17. Capacitor C14 is connected in parallel between pin 1 (RF1) and pin 2 (GND) of chip U9, and capacitor C16 is connected in parallel between pin 2 (GND) and pin 3 (RF2). RFIO1 is connected in parallel to capacitor C5, and capacitor C5 and inductor L5 are connected in parallel to capacitor C6.

7. An intelligent monitoring and alarm device for high-risk coking areas according to claim 1, 2, 4 or 6, characterized in that: In the alarm module (5), The collector of transistor Q1 is connected to ALARM_OUT through resistor Res3; the emitter of transistor Q1 is connected to interface 1 of speaker U12, and interface 2 of speaker U12 is grounded; the base of transistor Q1 is connected to a 3V3 power supply.

8. A device for intelligent monitoring and alarming of high risk zones in a coke oven battery as claimed in claim 7, wherein: the said device is characterized by: In the circuit of the power module (7), Pin 1 (SV) of chip U2 is connected to pin 1 of CN1 via chip U1. Pin 2 (SG) of chip U2 is connected to pins 2 and 3 of CN1. A capacitor C1 and a diode Z1 are connected in parallel between pins 1 (SV) and 2 (SG) of chip U2. Pin 2 of chip U1 is connected to pin 2 (SG) of chip U2. Pins 4 (CG1), 5 (CG2), and 6 (CG3) of chip U2 are connected in parallel and then grounded. Pin 3 (CV) of chip U2 is connected to the power supply, and capacitor C2... The following components are connected in parallel: pin CV (3), pin CG1 (4), pin CG2 (5), and pin CG3 (6) of chip U2. Chip U3 is placed between the power supply and C2. The input of chip U3 receives the filtered input voltage through the parallel C3 and C4, and the output of chip U3 is further filtered through the parallel C5 and C6. The model of chip U1 is ZEN056V130A24LS; the model of chip U2 is BNX002-01; and the model of chip U3 is LD1086D2M33.

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