Device for removing wafer back abnormity corresponding to front chip point

Abstract

The utility model provides a device for dotting and removing a wafer back abnormity corresponding to a front chip, and relates to the field of integrated circuit manufacturing, and the device is characterized in that a dotting and removing device panel is engraved with Y-axis digital coordinate scales; the wafer placing tray is used for bearing and placing a wafer; the X-axis lead screw with the digital scales is used for X-axis coordinate positioning of the surface B of the wafer; the Y-axis slidable positioning screw rod is used for positioning the Y-axis coordinate of the B surface of the wafer according to the Y-axis digital coordinate scales; the X-axis transparent positioning sliding block is used for positioning in the X-axis direction; and the wafer point removal ink tube is used for performing point removal on the wafer A surface chip corresponding to the back surface abnormity according to the abnormal coordinate of the wafer B surface. The technical problems of high processing cost and low product quality caused by the fact that the wafer back abnormity cannot be accurately mapped to the front chip position in the prior art are solved, and the technical effects of improving the wafer abnormity positioning precision, reducing the misoperation risk and ensuring the chip quality through the cooperation of the bidirectional coordinate scales and the automatic turnover mechanism are achieved.

Description

Technical Field

[0001] This application relates to the field of integrated circuit manufacturing, specifically to a device for removing chips on the front side of a wafer corresponding to anomalies on the back side. Background Technology

[0002] In the field of integrated circuit manufacturing, a single wafer contains many chips. Defective chips are marked during the testing process to facilitate identification during subsequent chip packaging. However, anomalies on the back side of the wafer often cannot be effectively marked during testing, leading to the risk of misuse of these defective chips.

[0003] In wafer manufacturing processes, to improve the contact surface on the back of the chip and reduce resistance and improve heat dissipation, a layer of metal is usually evaporated on the back of the wafer. The evaporated metal is mainly silver. However, silver is prone to oxidation, scratches, and contamination. When this abnormality occurs, the chip often cannot pass the test and the chip with the back abnormality can be rejected. In end applications, such chips are prone to increased chip contact resistance and poor heat dissipation due to back abnormality, which brings high reliability risks and may even directly cause the terminal equipment using such chips to malfunction and fail to operate normally.

[0004] Currently, wafers affected on the back side face product scrapping or rework, directly increasing processing, time, and quality costs for wafer fabs. Taking a 6-inch wafer as an example, a single wafer contains hundreds of thousands of chips, some of which are extremely small. Existing technology cannot accurately and effectively mark the front side of chips with back-side anomalies. Therefore, a device is needed to accurately mark the front-side chips with back-side anomalies on the wafer. Utility Model Content

[0005] This application provides a device for removing wafer backside anomalies corresponding to frontside chip locations, solving the technical problem in the prior art where wafer backside anomalies cannot be accurately mapped to frontside chip locations, resulting in high processing costs and low product quality.

[0006] To address the aforementioned issues, this application provides a device for removing wafer backside anomalies corresponding to frontside chip defects, comprising: a defect removal device panel, the panel having a Y-axis digital coordinate scale; a wafer placement tray, the tray being mounted on the panel with a diameter smaller than the wafer size for supporting and placing the wafer; an X-axis digitally graduated lead screw, mounted on the panel, the lead screw having two sets of positive and negative X-axis digital coordinate scales for X-axis coordinate positioning of the wafer's B-side; and a Y-axis slidable positioning lead screw, the length of which is perpendicular to the wafer backside anomaly. An X-axis digitally scaled lead screw and a Y-axis slidable positioning lead screw are mounted on the panel of the de-scraping device via a lead screw connector. The lead screw is used to position the Y-axis coordinates of the wafer's B-side according to the digitally scaled Y-axis coordinates. An X-axis transparent positioning slider slides along the X-axis digitally scaled lead screw for X-axis positioning. A wafer de-inking tube is mounted on the X-axis transparent positioning slider, driving the X-axis digitally scaled lead screw and the Y-axis slidable positioning lead screw to perform abnormal positioning on the wafer's B-side, and de-scraping the corresponding A-side chip on the back side according to the abnormal coordinates of the B-side.

[0007] The above-described one or more technical solutions in this application have at least one or more of the following technical effects:

[0008] This application provides a device for removing defects on the back side of a wafer corresponding to chip defects on the front side, comprising: a removal device panel, the removal device panel having a Y-axis numerical coordinate scale; a wafer placement tray, the wafer placement tray being placed on the removal device panel, and the diameter of the wafer placement tray being smaller than the wafer size, used to support and place the wafer; an X-axis numerically graduated lead screw, the X-axis numerically graduated lead screw being mounted on the removal device panel, the surface of the X-axis numerically graduated lead screw having two sets of positive and negative X-axis numerical coordinate scales engraved on its surface, used for X-axis coordinate positioning of the B-side of the wafer; and a Y-axis slidable positioning lead screw, the length direction of the Y-axis slidable positioning lead screw being perpendicular to the X-axis numerically graduated lead screw. The device comprises a lead screw with digital scales on the X-axis and a slidable positioning lead screw on the Y-axis, mounted on the panel of the wafer removal device via a lead screw connector. These are used to position the Y-axis coordinates of the wafer's B-side according to the digital coordinate scale. An X-axis transparent positioning slider slides along the X-axis lead screw for X-axis positioning. A wafer dot-cleaning tube is mounted on the X-axis transparent positioning slider, driving the X-axis lead screw and the slidable positioning lead screw to slide and perform abnormal positioning on the wafer's B-side. Based on the abnormal coordinates of the wafer's B-side, the corresponding A-side chip is removed. This solution addresses the technical problem in existing technologies where abnormalities on the back side of the wafer cannot be accurately mapped to the front-side chip location, leading to high processing costs and low product quality. It achieves the technical effect of improving wafer abnormality positioning accuracy, reducing the risk of misoperation, and ensuring chip quality through the coordinated use of bidirectional coordinate scales and an automatic flipping mechanism. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a structural diagram of an apparatus for removing chip defects on the front side of a wafer, as provided in an embodiment of this application.

[0011] Figure 2 This is a structural diagram of an automatic wafer flipping arm accompanying a device for removing front-side chips corresponding to back-side anomalies provided in an embodiment of this application.

[0012] Reference numerals: 1. Dot removal device panel; 2. Wafer dot removal tube; 3. X-axis transparent positioning sliding block; 4. Wafer position positioning pin; 5. X-axis lead screw with digital scale; 6. Y-axis sliding positioning lead screw; 7. Wafer placement tray; 8. Wafer automatic flipping mechanism; 9. Drive transmission component; 10. Wafer automatic flipping arm; 11. Controller; 12. Robotic arm body; 13. Clamping component; 14. First gripper; 15. Second gripper. Detailed Implementation

[0013] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0014] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0015] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in the description of embodiments in this application is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of this application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0016] In this embodiment, the present application provides an apparatus for removing chips on the front side corresponding to anomalies on the back side of a wafer, such as... Figure 1 and Figure 2 As shown, the device includes:

[0017] The panel 1 of the spot removal device is engraved with a Y-axis digital coordinate scale.

[0018] Optionally, the spot removal device panel 1 is a structural panel used to support and fix other components. The surface of this panel is engraved with a digital coordinate scale along the Y-axis for precise indication and adjustment of the position in the Y-axis direction. The design of the digital coordinate scale along the Y-axis allows operators to directly read the specific coordinates of the Y-axis visually, helping to locate abnormal areas on the wafer and ensuring the accuracy of the spot removal process. These scales make Y-axis movement more precise, and operators can adjust the device according to the scale values ​​to ensure the correct positioning of the wafer in the Y-axis direction, thereby improving the accuracy of the spot removal operation and avoiding positional errors.

[0019] A wafer placement tray 7 is mounted on the panel 1 of the spot removal device, and the diameter of the wafer placement tray 7 is smaller than the size of the wafer, for holding and placing the wafer.

[0020] Optionally, the wafer placement tray 7 is a component used to support and place the wafer. The wafer placement tray 7 is mounted on the panel 1 of the wafer removal device, serving as a base for fixing and supporting the wafer. The diameter of the wafer placement tray 7 is designed to be smaller than the size of the wafer to ensure stable placement of the wafer on the tray and facilitate subsequent operations such as wafer flipping and positioning. Specifically, the size of the tray is slightly smaller than the edge of the wafer, ensuring that the wafer is not easily slipped or shifted on the tray, thus providing a stable foundation for subsequent wafer processing. Through this design, the tray not only effectively supports the wafer but also facilitates wafer clamping, positioning, and other process steps, ensuring that the wafer maintains accurate positioning and a stable state throughout the entire processing.

[0021] Furthermore, the wafer placement tray 7 has a preset number of positioning pin holes on its edge.

[0022] Optionally, the wafer placement tray 7 has multiple positioning pin holes on its edge. These holes are located in the edge area of ​​the wafer placement tray 7, and their number and position are preset to allow the wafer positioning pins 4 to align with the positioning pin holes during wafer placement, thereby ensuring that the wafer can be accurately and securely placed on the tray. The design of the positioning pin holes helps to fix the position of the wafer and prevent it from shifting or moving during operation. Through these positioning pin holes, operators can quickly and accurately place the wafer in the correct position, thereby improving the accuracy and stability of the entire wafer processing process.

[0023] Furthermore, the device also includes:

[0024] A wafer positioning pin 4, one end of which is fixed in the positioning pin hole of the wafer placement tray 7, is used to fix the wafer position.

[0025] Optionally, the wafer positioning pin 4 is a component used to fix the wafer position. One end of the wafer positioning pin 4 is securely installed in the positioning pin hole of the wafer placement tray 7. Through the cooperation with the positioning pin hole, the wafer can be accurately aligned when placed on the tray, and the wafer's position will not shift during operation. One end of the positioning pin is tightly installed in the positioning pin hole by physical methods such as insertion, snap-fit, or threaded fixation, ensuring that the wafer will not be displaced during operation. This avoids misoperation or mismarking caused by wafer movement during subsequent processing, ensuring that the wafer remains in the correct position throughout the entire processing.

[0026] The X-axis digital scale lead screw 5 is mounted on the panel of the dot-mapping device. The surface of the X-axis digital scale lead screw 5 is engraved with two sets of positive and negative X-axis digital coordinate scales for X-axis coordinate positioning of the B side of the wafer.

[0027] Optionally, the X-axis digitally graduated lead screw 5 is a mechanical component for precise positioning. Mounted on the panel of the spot removal device, it provides stable support for the entire device. Its surface is engraved with two sets of digital coordinate scales, representing the forward and reverse coordinates respectively. These scales are designed for X-axis coordinate positioning on the B-side (i.e., the back side of the wafer). Through these digital scales, the operator can intuitively read the specific position on the X-axis, thus achieving precise X-axis coordinate positioning. The forward and reverse design of the scales allows the lead screw to be precisely adjusted and positioned in both directions, ensuring that the operator can accurately control and adjust the wafer's position in the X-axis direction. This design improves operational accuracy, facilitates fine adjustments during processing, and ensures that abnormal areas on the back side of the wafer are accurately aligned for subsequent spot removal operations.

[0028] Furthermore, the device also includes:

[0029] The wafer automatic flipping mechanism 8 is located on the same side as the X-axis digital scale lead screw 5 in the same length direction, and is used to automatically grip and flip the wafer.

[0030] Optionally, the automatic wafer flipping mechanism 8 is an automated device used to flip wafers from the back side to the front side during processing. The automatic wafer flipping mechanism 8 is positioned on the same side as the X-axis digitally graduated lead screw 5 along its length, so as to synchronize with the movement in the X-axis direction. The main function of this automatic wafer flipping mechanism 8 is to automatically grip and flip the wafer, enabling it to be flipped from the back side to the front side, or vice versa. Specifically, first, the wafer is placed on the wafer placement tray 7. The tray's design ensures that the wafer can be stably and accurately placed in the correct position. When it is necessary to flip the wafer from the back side to the front side, the automatic flipping mechanism, receiving a flipping command from the controller 11, begins to work in coordination with the axis lead screw. Based on the previously positioned coordinate information, it determines the exact position of the wafer and then grips the wafer with a flipping arm, ensuring that the wafer is not damaged or moved during the flipping process. After gripping the wafer, the automatic wafer flipping mechanism 8 uses the drive transmission component 9 to initiate the flipping action, causing the wafer to rotate around a specific axis, thereby flipping the back side of the wafer to the front side. After flipping, the wafer automatically aligns, ensuring its front side is in the correct orientation within the processing unit. Once flipping is complete, the wafer is precisely released, and the automatic flipping mechanism exits operation, ready for the next step. This process is automated, improving the accuracy and efficiency of wafer flipping, reducing manual intervention, and ensuring the wafer remains accurately positioned throughout the entire process.

[0031] Furthermore, the automatic wafer flipping mechanism 8 includes:

[0032] A drive transmission component 9 is arranged on one side of the panel 1 of the wafer removal device via a fixing member, and is used to provide wafer flipping driving force; an automatic wafer flipping arm 10 is mounted on the drive transmission component 9, and is used to grip and flip the wafer placed on the wafer placement tray 7; a controller 11 is used to control the drive transmission component 9 to perform the flipping action on the automatic wafer flipping arm 10.

[0033] Optionally, the drive transmission component 9 is a power-providing assembly mounted on one side of the die-cutting device panel 1 via a fixed component. Its main function is to provide the driving force required for the automatic wafer flipping arm 10, enabling the wafer to complete the flipping operation. The drive transmission component 9 typically includes a motor, belt, gears, or other transmission system. The motor provides rotational power, which is then transmitted to the flipping arm via the belt or gears, thereby realizing the wafer flipping action. The automatic wafer flipping arm 10 is mounted on the drive transmission component 9 and is responsible for gripping and flipping the wafer. The automatic wafer flipping arm 10 grips the wafer using a clamping device, such as a mechanical gripper, and rotates around its axis with the power provided by the drive transmission component 9, completing the wafer flipping process and ensuring the accuracy of the wafer flipping process. The controller 11 is the core control component of the entire flipping process, responsible for controlling the operation of the drive transmission component 9. The controller 11 controls the start / stop, speed, and direction of movement of the motor through commands, precisely adjusting the timing and amplitude of the flipping action. The flipping process can be precisely performed as needed by adjusting the controller 11, ensuring that the wafer maintains the accurate operation sequence and position during automatic flipping.

[0034] Furthermore, the automated wafer flipping arm 10 includes:

[0035] The robotic arm body 12 has one end slidably connected to the drive transmission component 9; the clamping component 13 is located at the end of the robotic arm body 12 and is used to grip and fix the wafer.

[0036] Optionally, the robotic arm body 12 is a mechanical component of the automated wafer flipping arm 10. One end of it is slidably connected to the drive transmission component 9, allowing it to move and adjust under the action of the drive transmission component 9. Through this sliding connection, the robotic arm body 12 can flexibly adjust its position within the required range to grip and flip the wafer. The clamping component 13 is another mechanical component of the automated wafer flipping arm 10, located at the end of the robotic arm body 12. Its main function is to grip and hold the wafer. Through precise movements, the clamping component 13 ensures that the wafer is firmly clamped during the flipping process, preventing the wafer from loosening or falling off during operation. The clamping component 13 typically consists of two grippers, which stabilize the position of the wafer through the clamping operation and provide the necessary support and stability for subsequent flipping actions.

[0037] Furthermore, the clamping component 13 includes:

[0038] A first gripper 14 and a second gripper 15 are arranged opposite to each other at the end of the robotic arm body 12 to form a gripping space for accommodating and gripping wafers.

[0039] Optionally, the clamping component 13 consists of a first gripper 14 and a second gripper 15. The first gripper 14 and the second gripper 15 are mounted at the end of the robotic arm body 12 and are arranged opposite each other, i.e., there is a certain distance between the first gripper 14 and the second gripper 15, forming a clamping space. This clamping space is designed to allow the clamping component 13 to accommodate and grip the wafer. Through the symmetrical clamping of the two grippers, the clamping component 13 can firmly hold the wafer, ensuring that the wafer will not slip or fall during operation, thereby providing the necessary support and stability for wafer flipping.

[0040] Furthermore, the distance between the first gripper 14 and the second gripper 15 is adjusted by the controller 11 according to the wafer size.

[0041] Optionally, the distance between the first gripper 14 and the second gripper 15 can be adjusted by the controller 11 to accommodate wafers of different sizes. The controller 11 receives wafer size data or obtains the actual size of the wafer through a built-in size detection system (such as a sensor or automatic measuring device), and automatically adjusts the distance between the grippers based on this data. Specifically, the controller 11 controls an electric motor or servo drive device to drive the grippers to slide or rotate within a predetermined range, thereby adjusting the distance between the grippers. Through this adjustment mechanism, the clamping component 13 can flexibly adapt to wafers of different sizes, ensuring that the grippers can clamp the edge of the wafer at an appropriate distance, providing sufficient clamping force, and ensuring that the wafer is firmly clamped during the clamping process, avoiding wafer damage or operation failure due to improper clamping.

[0042] The Y-axis slidable positioning screw 6 has its length direction perpendicular to the X-axis digital scale screw 5. The X-axis digital scale screw 5 and the Y-axis slidable positioning screw 6 are mounted on the panel 1 of the dot-splitting device via a screw connector. They are used to position the Y-axis coordinate of the B-side of the wafer according to the Y-axis digital coordinate scale.

[0043] Optionally, the Y-axis sliding positioning screw 6 is a mechanical component for precise positioning. Its length direction is perpendicular to the X-axis digitally graduated screw 5, and it is mounted on the de-scraping device panel 1 together with the X-axis digitally graduated screw 5 via a screw connector, ensuring that the positioning functions in both directions can work effectively together. The main function of the Y-axis sliding positioning screw 6 is to achieve coordinate positioning in the Y-axis direction. Through sliding adjustment, the position of the wafer's B-side (i.e., the back side of the wafer) in the Y-axis direction can be precisely controlled. During this process, the operator can read and adjust the Y-axis coordinates through the digital coordinate scale on the Y-axis, thereby accurately locating abnormal areas on the back side of the wafer. By adjusting the Y-axis screw, the operator can accurately position the wafer in this direction, ensuring the accuracy and stability of the wafer during processing. Combined with the X-axis digitally graduated screw 5, precise adjustment in both directions ensures accurate positioning of the wafer in the XY plane, thus providing a precise reference and basis for subsequent de-scraping operations.

[0044] Furthermore, the surface of the panel 1 of the dot removal device, which is in the same direction as the length of the Y-axis slidable positioning screw 6, is engraved with a Y-axis digital coordinate scale.

[0045] Optionally, on one side surface of the wafer removal device panel 1, along the same direction as the length of the Y-axis sliding positioning screw 6, a Y-axis digital coordinate scale is engraved. This scale helps the operator accurately read and adjust the position in the Y-axis direction. When the Y-axis sliding positioning screw 6 slides, the digital coordinate scale visually displays the current coordinate position, facilitating precise positioning of the wafer in the Y-axis direction. This design allows the operator to easily record and adjust the Y-axis coordinates, ensuring accurate positioning and processing of the wafer during the process.

[0046] X-axis transparent positioning sliding block 3 slides along the X-axis screw with digital scale 5 for positioning in the X-axis direction.

[0047] Optionally, the X-axis transparent positioning slider 3 is a movable component mounted on the X-axis digitally graduated lead screw 5, which can slide along the X-axis in the X-axis direction. The main function of the X-axis transparent positioning slider 3 is to precisely position the wafer in the X-axis direction. The slider is made of transparent material, allowing the operator to clearly see the digital coordinate scale on the lead screw when adjusting the position, facilitating accurate reading of the current position and fine-tuning. Through the X-axis transparent positioning slider 3, the position of the dot-matrix ink removal tube attached to it can be flexibly adjusted, thereby achieving precise positioning and processing of specific areas on the wafer.

[0048] The wafer dot ink removal tube 2 is mounted on the X-axis transparent positioning sliding block 3, which drives the X-axis digital scale lead screw 5 and the Y-axis slidable positioning lead screw 6 to slide and perform abnormal positioning on the B side of the wafer, and performs dot removal on the wafer A side chip corresponding to the abnormality on the back side according to the abnormal coordinates of the B side of the wafer.

[0049] Optionally, the wafer dot ink removal tube 2 is a device mounted on the X-axis transparent positioning slider 3. Its main function is to accurately identify abnormal locations on the back side of the wafer through positioning. During operation, the wafer dot ink removal tube 2 can precisely adjust the position of the ink tube by sliding the X-axis digitally graduated screw 5 and the Y-axis sliding positioning screw 6, aligning it with the marked abnormal area on the B-side of the wafer. At this time, through the sliding of the X and Y axes, the end of the wafer dot ink removal tube 2 approaches the abnormal point on the back side of the wafer, and records the coordinate information of the abnormal position on the back side according to the X and Y axis scales. This abnormal coordinate information can be used to determine the corresponding chip position on the A-side (front side) of the wafer. Subsequently, based on the recorded abnormal coordinate information, and according to the known wafer size and the geometric relationship (geometric symmetry) between the back and front sides, the corresponding chip position on the front side is automatically determined, and the abnormal chip on the front side is removed by inkjet printing or other physical methods using the wafer dot ink removal tube 2. This precise anomaly location and removal process ensures that chips with anomalies on the back side can be accurately marked and removed from the A side of the wafer, preventing defective chips from entering subsequent processing stages and improving the overall reliability and efficiency of the process.

[0050] The apparatus provided in this application has at least the following technical effects or advantages:

[0051] This application provides an embodiment of a device for removing wafer backside anomalies corresponding to frontside chip defects, comprising: a defect removal device panel 1, the panel 1 having Y-axis digital coordinate scales; a wafer placement tray 7, the wafer placement tray 7 being mounted on the defect removal device panel 1, the diameter of the wafer placement tray 7 being smaller than the wafer size, used to support and place the wafer; an X-axis digital scale lead screw 5, the X-axis digital scale lead screw 5 being mounted on the defect removal device panel, the surface of the X-axis digital scale lead screw 5 having two sets of positive and negative X-axis digital coordinate scales for X-axis coordinate positioning of the wafer B-side; and a Y-axis slidable positioning lead screw 6, the length direction of the Y-axis slidable positioning lead screw 6 being perpendicular to the X-axis digital coordinate scale. A digital scale lead screw 5, with the X-axis digital scale lead screw 5 and the Y-axis slidable positioning lead screw 6 mounted on the de-pointing device panel 1 via a lead screw connector, is used to position the Y-axis coordinate of the wafer B-side according to the Y-axis digital coordinate scale. An X-axis transparent positioning slider 3 slides along the X-axis digital scale lead screw 5 for X-axis positioning. A wafer dot-removal tube 2 is mounted on the X-axis transparent positioning slider 3, driving the X-axis digital scale lead screw 5 and the Y-axis slidable positioning lead screw 6 to slide and perform abnormal positioning on the wafer B-side, and then perform de-pointing on the wafer A-side chip corresponding to the abnormality on the back side according to the abnormal coordinates of the wafer B-side. This solves the technical problem in the prior art where abnormalities on the back side of the wafer cannot be accurately mapped to the chip position on the front side, resulting in high processing costs and low product quality. It achieves the technical effect of improving wafer abnormality positioning accuracy, reducing the risk of misoperation, and ensuring chip quality through the collaboration of bidirectional coordinate scale and automatic flipping mechanism.

[0052] Although preferred embodiments of this application have been described, those skilled in the art, once they have learned the basic inventive concept, can make other changes and modifications to these embodiments.

[0053] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of the embodiments of this application. Therefore, if these modifications and variations of this application fall within the scope of this application and its equivalents, this application also intends to include these modifications and variations.

Claims

1. A device for wafer backside abnormality corresponding frontside chip point division, characterized in that, The device includes: The panel of the spot removal device is engraved with a Y-axis digital coordinate scale. A wafer placement tray is mounted on the panel of the die removal device, and the diameter of the wafer placement tray is smaller than the size of the wafer, for holding and placing the wafer. The X-axis lead screw with digital scale is mounted on the panel of the dot-mapping device. The surface of the X-axis lead screw with digital scale has two sets of positive and negative X-axis digital coordinate scales for X-axis coordinate positioning of the B side of the wafer. The Y-axis slidable positioning lead screw has its length direction perpendicular to the X-axis digital scale lead screw. The X-axis digital scale lead screw and the Y-axis slidable positioning lead screw are mounted on the panel of the dot-splitting device through a lead screw connector. The lead screw is used to position the Y-axis coordinate of the B-side of the wafer according to the digital coordinate scale of the Y-axis. X-axis transparent positioning slider, which slides along the X-axis screw with digital scale, is used for positioning in the X-axis direction; A wafer dot ink removal tube is installed on the X-axis transparent positioning sliding block. It drives the X-axis digital scale lead screw and the Y-axis slidable positioning lead screw to slide and locate the abnormality of the B side of the wafer. Based on the abnormal coordinates of the B side of the wafer, the chip on the A side of the wafer corresponding to the abnormality is removed.

2. The device of claim 1, wherein the device is configured to: determine a plurality of wafer backside abnormality corresponding frontside chip points; and determine a plurality of wafer backside abnormality corresponding frontside chip point pairs. The wafer placement tray has a preset number of positioning pin holes on its edge.

3. The apparatus for removing front-side chip defects corresponding to back-side anomalies as described in claim 2, characterized in that, The device further includes: A wafer positioning pin, one end of which is fixed in the positioning pin hole of the wafer placement tray, is used to fix the wafer position.

4. The device of claim 1, wherein the device is configured to: determine a plurality of wafer backside abnormality corresponding frontside chip points; and determine a plurality of wafer backside abnormality corresponding frontside chip point pairs. The device further includes: An automatic wafer flipping mechanism is located on the same side as the X-axis digitally graduated lead screw, and is used to automatically grip and flip wafers.

5. The device of claim 4, wherein the device further comprises: a wafer backside abnormality corresponding frontside chip point excluding unit configured to exclude the chip points on the wafer backside abnormality map. The automatic wafer flipping mechanism includes: A drive transmission component is provided on one side of the panel of the spot removal device via a fixing member, and is used to provide wafer flipping drive force. An automatic wafer flipping arm is mounted on the drive transmission component and is used to grip and flip wafers placed on the wafer placement tray. A controller is used to control the drive transmission component to perform a flipping action on the automatic wafer flipping arm.

6. The apparatus for removing front-side chip defects corresponding to back-side anomalies as described in claim 5, characterized in that, The automated wafer flipping arm includes: The main body of the robotic arm, one end of which is slidably connected to the drive transmission component; A clamping component, located at the end of the main body of the robotic arm, is used to grip and hold the wafer.

7. The apparatus for removing front-side chip defects corresponding to back-side anomalies as described in claim 6, characterized in that, The clamping component includes: First gripper; The second gripper and the first gripper are arranged opposite each other at the end of the main body of the robotic arm to form a gripping space for accommodating and gripping wafers.

8. The apparatus for removing front-side chip defects corresponding to back-side anomalies as described in claim 7, characterized in that, The distance between the first gripper and the second gripper is adjusted by the controller according to the wafer size.

9. The device of claim 1, wherein the device is configured to: determine a plurality of wafer backside abnormality corresponding frontside chip points; and determine a plurality of wafer backside abnormality corresponding frontside chip point pairs. The surface of the panel of the point-removal device, which is in the same direction as the length of the Y-axis slidable positioning lead screw, is engraved with a Y-axis digital coordinate scale.

Images