PCB soldering tin clamp
By creating ventilation slots between PCB boards to utilize the negative pressure suction inside the bottom box, the problem of poor fume collection during soldering is solved, achieving effective fume removal and improving the soldering environment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- OUYA HI TECH CHONGYANG CO LTD
- Filing Date
- 2025-04-24
- Publication Date
- 2026-04-21
AI Technical Summary
During the PCB soldering process, some PCBs are far from the exhaust hood, resulting in poor fume collection and affecting the workshop environment and dust pollution.
A ventilation groove is formed between adjacent PCB boards through a limiting part, which communicates with the inner cavity of the bottom box. The negative pressure suction effect inside the bottom box is used to remove the smoke.
It effectively removes fumes generated during the soldering process, improving the workshop environment and reducing dust pollution.
Smart Images
Figure CN224143689U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of PCB board processing technology and relates to a PCB board solder clamping device. Background Technology
[0002] When PCB boards are soldered, the soldering fumes are usually collected by a side-mounted fume hood. However, when soldering small PCB boards, because multiple PCB boards are positioned on a single clamp, some PCB boards are far from the fume hood during soldering, resulting in poor fume collection and affecting the workshop environment and dust pollution. Utility Model Content
[0003] The purpose of this invention is to address the aforementioned problems in the existing technology by providing a PCB board soldering clamp. The technical problem to be solved by this invention is how to improve the fume extraction effect during the soldering process.
[0004] The purpose of this utility model can be achieved through the following technical solution: a PCB board solder clamping device, characterized in that it includes a positioning plate, a bottom box located below the positioning plate, and an air suction hood set on the vertical side plate of the bottom box. The air suction hood is connected to a negative pressure air source. The positioning plate has a plurality of placement grooves communicating with the inner cavity of the bottom box. The placement grooves are provided with a plurality of limiting parts along the length direction, and the four limiting parts form a clamping area for a PCB board.
[0005] Traditional side-suction methods cannot effectively remove fumes generated by soldering on PCBs that are far from the negative pressure area. In this solution, a ventilation groove identical to the inner cavity of the bottom box is formed between adjacent PCBs through a limiting part. The negative pressure inside the bottom box can create a suction effect at the ventilation groove, allowing the fumes generated by soldering to flow into the bottom box, ensuring that the fumes from each PCB are effectively removed during the soldering process. Attached Figure Description
[0006] Figure 1 This is a schematic diagram of the PCB board clamping structure.
[0007] Figure 2 This is a schematic diagram of the structure after the PCB board is clamped in the clamping area.
[0008] In the diagram, 1 is the positioning plate; 2 is the base box; 3 is the air intake hood; 4 is the mounting slot; and 5 is the limiting part. Detailed Implementation
[0009] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.
[0010] like Figure 1 and Figure 2The PCB soldering clamp shown includes a positioning plate 1, a base box 2 located below the positioning plate 1, and an air suction hood 3 mounted on the vertical side plate of the base box 2. The air suction hood 3 is connected to a negative pressure air source. The positioning plate 1 has several placement grooves 4 communicating with the inner cavity of the base box 2. Several limiting parts 5 are arranged alternately along the length of the placement grooves 4, forming a clamping area for a PCB board between four limiting parts 5. Traditional side suction methods cannot effectively remove fumes generated by soldering on PCB boards far from the negative pressure area in the same clamping. In this solution, a ventilation groove identical to the inner cavity of the base box 2 is formed between adjacent PCB boards through the limiting parts 5. The negative pressure inside the base box 2 creates a suction effect at the ventilation groove, allowing the fumes generated by soldering to flow into the base box 2, ensuring that the fumes from each PCB board are effectively removed during the soldering process.
[0011] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.
Claims
1. A PCB soldering jig, characterized by, It includes a positioning plate (1), a bottom box (2) located below the positioning plate (1), and an air suction hood (3) set on the vertical side plate of the bottom box (2). The air suction hood (3) is connected to a negative pressure air source. The positioning plate (1) has several placement grooves (4) that communicate with the inner cavity of the bottom box (2). Several limiting parts (5) are arranged alternately along the length direction of the placement grooves (4). The four limiting parts (5) form a clamping area for a PCB board.