SMT patch steel mesh detection equipment

Abstract

The utility model relates to the technical field of SMT (Surface Mount Technology), and particularly discloses SMT patch steel mesh detection equipment which comprises a base and a detection table fixedly connected to the base, a containing groove is downwards formed in the top surface of the detection table, and a transparent glass partition plate used for placing an SMT patch steel mesh is detachably connected in the containing groove. A vertically-upward millimeter-level laser dot matrix light source is arranged in the containing groove below the transparent glass partition plate, a controller electrically connected with the millimeter-level laser dot matrix light source is arranged on the detection table, the light-proof sealing plate is arranged above the detection table and can seal the containing groove, and the moving structure is arranged on the base and used for driving the light-proof sealing plate to vertically move. A receiver and an image processor electrically connected with the receiver are fixedly connected to the light-proof sealing plate, and the problems that according to traditional SMT patch steel mesh detection equipment, an SMT patch steel mesh needs to be manually loaded and unloaded, a size detection structure needs to be pre-adjusted, and use is inconvenient are solved.

Description

Technical Field

[0001] This application relates to the field of SMT (Surface Mount Technology) technology, and specifically discloses an SMT stencil inspection device. Background Technology

[0002] SMT (Surface Mount Technology) refers to a series of processes performed on a PCB (Printed Circuit Board) substrate. When using SMT stencils, inspection is required. A stencil typically includes a main stencil and printing slots on that stencil. The inspection of an SMT stencil primarily involves checking its dimensions.

[0003] In the existing technology, there are semi-automatic devices for dimensional inspection of SMT stencils. These devices mainly include an SMT placement structure and a dimensional inspection structure. The SMT placement structure presses the SMT stencil to be inspected, and then the dimensional inspection structure, with pre-adjusted dimensional spacing, compares the pressurized SMT stencil to complete the dimensional inspection.

[0004] Existing SMT stencil inspection equipment not only requires manual loading and unloading of the SMT stencil but also necessitates pre-adjustment of the dimensional inspection structure, making it inconvenient to use. However, existing technologies include methods such as laser dot matrix measurement of object shape. This method utilizes a laser dot matrix, a receiver, and an image processor. The receiver receives the light source and transmits it to the image processor, which then uses an imaging algorithm to generate a two-dimensional or three-dimensional image. The object's dimensions can be determined during image generation.

[0005] This invention provides an SMT stencil inspection device to solve the above-mentioned problems. Utility Model Content

[0006] The purpose of this invention is to solve the problem that traditional SMT stencil inspection equipment not only requires manual loading and unloading of the SMT stencil, but also pre-adjustment of the size inspection structure, making it inconvenient to use.

[0007] To achieve the above objectives, the basic solution of this utility model provides an SMT stencil inspection device, including a base and an inspection table fixed on the base. The top surface of the inspection table has a receiving groove facing downwards. A transparent glass partition for placing the SMT stencil is detachably connected in the receiving groove. A vertically upward millimeter-level laser dot matrix light source is provided in the receiving groove below the transparent glass partition. A controller electrically connected to the millimeter-level laser dot matrix light source is provided on the inspection table.

[0008] It also includes an opaque sealing plate located above the testing platform and capable of sealing the receiving slot, and a moving structure located on the base for driving the opaque sealing plate to move vertically. A receiver and an image processor electrically connected to the receiver are fixedly attached to the opaque sealing plate.

[0009] Furthermore, the receiving groove above the transparent glass partition extends outward and penetrates to one side wall of the testing platform, and the opaque sealing plate fits the edge of the receiving groove.

[0010] Furthermore, the top edge of the opaque sealing plate extends outward to form an extension portion, which covers the connection between the opaque sealing plate and the edge of the receiving groove.

[0011] Furthermore, the inner walls of the receiving groove are all coated with a light-absorbing coating.

[0012] Furthermore, the movable structure includes a guide rod vertically fixed to the base, a threaded rod rotatably connected to the base, a lifting platform slidably connected to the guide rod, and a handle fixed to the top of the threaded rod. The lifting platform has an internal threaded hole that is threadedly connected to the threaded rod, and a connecting piece is provided between the lifting platform and the opaque sealing plate.

[0013] Furthermore, the connecting component includes a crossbar fixed to the lifting platform and a horizontal plate slidably connected to the crossbar, with an opaque sealing plate fixed below the horizontal plate.

[0014] The principle and effect of this solution are as follows:

[0015] Compared with existing technologies, this invention directly places the SMT stencil to be inspected on a transparent glass partition. A laser beam is emitted from a millimeter-level laser dot matrix light source, which blocks the laser beam. The receiver receives the light emitted from the millimeter-level laser dot matrix light source and transmits the data to the image processor. The missing image size is the size of the SMT stencil. The image processor generates a two-dimensional image and marks the size during the two-dimensional image generation. This solves the problems of traditional SMT stencil inspection equipment, which not only requires manual loading and unloading of the SMT stencil but also pre-adjustment of the size inspection structure, making it inconvenient to use. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of an SMT stencil inspection device according to an embodiment of this application is shown;

[0018] Figure 2 A schematic diagram of a millimeter-level laser dot matrix light source and receiver for an SMT stencil inspection device according to an embodiment of this application is shown. Detailed Implementation

[0019] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0020] The reference numerals in the accompanying drawings include: 1. Testing platform; 2. Transparent glass plate; 3. Opaque sealing plate; 4. Lifting platform; 5. Threaded rod; 6. Horizontal plate; 7. Controller; 8. Receiver; 9. SMT stencil.

[0021] An SMT stencil inspection device, implementing, for example Figure 1 and Figure 2 As shown:

[0022] Includes a base and a testing table 1 fixedly mounted on the base.

[0023] The top surface of the testing station 1 has a downward-facing receiving groove. The inner walls of the receiving groove all protrude inwards to form placement platforms. A transparent glass plate 2 is mounted on these platforms, and the SMT stencil 9 to be tested is placed on the transparent glass plate 2. The receiving groove above the transparent glass plate 2 extends to the right and penetrates the right side wall of the testing station 1. A millimeter-level laser dot matrix light source is installed in the receiving groove below the transparent glass plate 2, and the laser beam from the millimeter-level laser dot matrix light source is emitted vertically upwards. A controller 7, specifically a light-on controller 7, is installed on the testing station 1 and is electrically connected to the millimeter-level laser dot matrix light source.

[0024] An opaque sealing plate 3 is installed above the testing station 1, and a moving structure for driving the opaque sealing plate 3 to move vertically is installed on the base. Furthermore, a receiver 8 and an image processor electrically connected to the receiver 8 are installed below the opaque sealing plate 3. Figure 2 As shown, receiver 8 receives the light emitted from the millimeter-level laser dot matrix light source and transmits the data to the image processor, which then generates a two-dimensional image and marks its dimensions during image generation. In this embodiment, the installed millimeter-level laser dot matrix light source, receiver 8, and image processor all use components commonly used in the prior art.

[0025] like Figure 1 As shown, the opaque sealing plate 3 extends downward on the right side and fits against the edge of the receiving groove to isolate the internal space of the receiving groove, preventing the SMT stencil 9 from being affected by external ambient light during inspection.

[0026] Meanwhile, the top edge of the opaque sealing plate 3 extends outward to form an extension, which covers the connection between the opaque sealing plate 3 and the edge of the receiving groove. Furthermore, the inner walls of the receiving groove are coated with a light-absorbing coating, specifically a black light-absorbing coating.

[0027] The movable structure includes two guide rods vertically fixed on the base, a threaded rod 5 mounted on the base between the two guide rods and rotatable, and a lifting platform 4. The lifting platform 4 has two through holes for the guide rods to pass through. The lifting platform 4 also has an internal threaded hole that is threadedly connected to the threaded rod 5. A handle is fixedly installed on the top of the threaded rod 5, and a top plate is installed between the threaded rod 5 and the guide rods.

[0028] A connector is installed between the lifting platform 4 and the opaque sealing plate 3. The connector includes a crossbar fixedly installed on the lifting platform 4 and a horizontal plate 6 installed on the crossbar and slidable. The opaque sealing plate 3 is fixedly installed below the horizontal plate 6. In this embodiment, the horizontal plate 6 and the crossbar have a frosted texture to increase frictional resistance.

[0029] When using this utility model, first turn off the millimeter-level laser dot matrix light source, raise the opaque cover, place the SMT stencil 9 to be tested into the transparent glass partition through the receiving groove, and then cover it with the opaque cover.

[0030] When the millimeter-level laser dot matrix light source is activated, the SMT stencil 9 will block the laser beam. The receiver 8 receives the light emitted by the millimeter-level laser dot matrix light source and transmits the data to the image processor. The missing image size is the size of the SMT stencil 9. The image processor generates a two-dimensional image and marks the size when generating the two-dimensional image. In addition, the laser beam can also be used to detect the printing position on the SMT stencil 9.

[0031] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. An SMT paste screen inspection apparatus, characterized by, The device includes a base and a testing platform fixed to the base. The testing platform has a downward-facing receiving groove on its top surface. A transparent glass partition for placing SMT stencils is detachably connected inside the receiving groove. A vertically upward millimeter-level laser dot matrix light source is installed in the receiving groove below the transparent glass partition. A controller electrically connected to the millimeter-level laser dot matrix light source is installed on the testing platform. It also includes an opaque sealing plate located above the testing platform and capable of sealing the receiving slot, and a moving structure located on the base for driving the opaque sealing plate to move vertically. A receiver and an image processor electrically connected to the receiver are fixedly attached to the opaque sealing plate.

2. The SMT patch steel mesh detection device according to claim 1, characterized in that, The receiving groove above the transparent glass partition extends outward and penetrates to one side wall of the testing platform, and the opaque sealing plate fits the edge of the receiving groove.

3. The SMT patch steel mesh detection device according to claim 2, characterized in that, The top edge of the opaque sealing plate extends outward to form an extension portion, which covers the connection between the opaque sealing plate and the edge of the receiving groove.

4. The SMT patch steel mesh detection device according to claim 2, characterized in that, The inner walls of the receiving groove are all coated with a light-absorbing coating.

5. The SMT patch steel mesh detection device according to claim 1, characterized in that, The movable structure includes a guide rod vertically fixed to the base, a threaded rod rotatably connected to the base, a lifting platform slidably connected to the guide rod, and a handle fixed to the top of the threaded rod. The lifting platform has an internal threaded hole that is threadedly connected to the threaded rod, and a connecting piece is provided between the lifting platform and the opaque sealing plate.

6. The SMT patch steel mesh detection device according to claim 5, characterized in that, The connector includes a crossbar fixed to the lifting platform and a horizontal plate slidably connected to the crossbar, with an opaque sealing plate fixed below the horizontal plate.

Images