Wafer overturning structure

Abstract

The utility model provides a wafer overturning structure, which relates to the technical field of semiconductor processing, and comprises an overturning platform mounting plate and an overturning assembly, the overturning assembly comprises a motor arranged on the overturning platform mounting plate, the output end of the motor is provided with a rotating plate, the bottom of the rotating plate is fixedly provided with a cantilever, the cantilever is provided with an adsorption plate, and the adsorption plate is arranged on the overturning platform mounting plate. According to the utility model, the motor drives the rotating plate to rotate and drives the cantilever and the adsorption plate to realize wafer overturning, the parallel finger cylinder pushes the cylinder clamping plate to enable the centering clamping plate to move along the direction of the wafer so as to realize centering calibration of the wafer, and the first cylinder and the second cylinder are linked to adjust the telescopic stroke of the adsorption plate so as to adapt to different wafer sizes. The vacuum chuck is connected with an air channel through an air pipe connector to generate negative pressure to adsorb the wafer, then the motor is started, constant-speed rotation is achieved through the speed reducer, the cantilever drives the wafer to complete turning over, and therefore the wafers of different sizes can be turned over in a compatible mode.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer flipping structure. Background Technology

[0002] Flip-chip technology is an advanced semiconductor packaging technology that increases packaging density, reduces signal transmission distance, and lowers packaging costs by flipping and bonding wafers. This technology is widely used in high-performance computing, communications, and consumer electronics products, and helps improve integration and electrical performance.

[0003] However, in practical use, the following shortcomings still exist. For example, while there are various wafer flipping mechanisms on the market, most can only flip wafers of a single size and cannot be compatible with wafers of different sizes. For instance, in some existing flipping mechanisms, the size and structure of their clamping components are fixed and can only adapt to a specific wafer size. When it is necessary to flip wafers of different sizes, the entire flipping mechanism must be replaced. This not only increases production costs and operational complexity but also reduces production efficiency.

[0004] Therefore, this invention proposes a wafer flipping structure to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer flipping structure.

[0006] To achieve the above objectives, this utility model adopts the following technical solution: a wafer flipping structure, including a flipping platform mounting plate, and further comprising:

[0007] A flipping assembly includes a motor mounted on a flipping platform mounting plate, a rotating plate at the output end of the motor, a cantilever fixed to the bottom of the rotating plate, an adsorption plate on the cantilever, a vacuum suction cup on the adsorption plate, and an air pipe connector on one side of the adsorption plate.

[0008] The centering clamping assembly includes a cylinder lifting block mounted on a cantilever, an adsorption plate mounted on the cylinder lifting block, a fixing plate fixed on the cantilever, an mounting plate fixed on the fixing plate, a first cylinder mounted on the mounting plate, a second cylinder mounted on the mounting plate near the bottom of the first cylinder, a parallel finger cylinder mounted on the cantilever near the bottom, a cylinder clamping plate at the output end of the parallel finger cylinder, a clamping support plate fixed on the cylinder clamping plate, and a centering clamping plate fixed on the clamping support plate.

[0009] Furthermore, a speed reducer is provided at the output end of the motor, a platform desktop divider is provided at the bottom of the speed reducer, the rotating plate is provided at the bottom of the platform desktop divider, and a reinforcing plate is fixed on the cantilever.

[0010] The beneficial effects of adopting the above-mentioned further solution are as follows: the motor speed is reduced and the torque is increased by the reducer to ensure smooth flipping action. The output end of the reducer is connected to the platform desktop divider to realize high-precision intermittent motion control. The rotating plate is fixed at the bottom of the divider and rotates precisely with the platform desktop divider to drive the cantilever to complete the flipping, ensuring that the wafer does not vibrate during the flipping process and meeting the requirements of precision processing. The reinforcing plate is set at the key stress point of the cantilever to form a triangular support structure, which significantly improves the bending stiffness of the cantilever. During high-speed flipping, it effectively suppresses the deformation of the cantilever and ensures that the wafer on the adsorption plate remains in a horizontal state, avoiding wafer displacement or falling off due to vibration.

[0011] Furthermore, an anti-drop block is fixed on the centering clamping plate.

[0012] The beneficial effect of adopting the above-mentioned further solution is that the anti-drop block is fixed on the edge of the centering clamping plate. When the wafer is adsorbed and flipped by the vacuum chuck, the anti-drop block supports the edge of the wafer and forms a physical limit. Even if the vacuum adsorption fails temporarily, the wafer is still intercepted by the anti-drop block to prevent it from falling and being damaged.

[0013] Furthermore, the centering clamping plate is provided with a clamping buffer assembly, which includes a spring sheet fixed to the centering clamping plate, and a clamping plate is fixed on the spring sheet.

[0014] The beneficial effects of adopting the above-mentioned further solution are: when the centering clamping plate begins to clamp the wafer, the spring plays a key role. Since the wafer is relatively fragile, the spring will undergo elastic deformation at the moment the clamping plate contacts the wafer, thereby buffering the pressure applied to the wafer by the clamping plate and avoiding damage to the wafer due to excessive pressure. At the same time, the clamping plate can stably fit the wafer and ensure the clamping effect.

[0015] Furthermore, a limiting rod is slidably connected to the centering clamping plate, and a limiting block is fixed to one end of the limiting rod near the clamping plate.

[0016] The beneficial effects of adopting the above-mentioned further solution are: the limiting rod slides along the centering clamping plate, the limiting block restricts the maximum range of movement of the clamping plate, and the telescopic spring provides a reverse reset force, so that the clamping plate automatically returns to its position after releasing the wafer.

[0017] Furthermore, a telescopic spring is provided on the limiting rod, one end of the telescopic spring is fixed to the centering clamping plate, the other end of the telescopic spring is fixed to the limiting rod, and a limiting plate is fixed on the clamping plate.

[0018] The beneficial effect of adopting the above-mentioned further solution is that when it is necessary to clamp the wafer, the combination of the limiting plate and the anti-drop block can support the edge of the wafer when the wafer is adsorbed and flipped by the vacuum suction cup, forming a physical limit. Even if the vacuum adsorption fails temporarily, the wafer is still intercepted to prevent it from falling and being damaged.

[0019] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0020] In this invention, the device uses a motor to drive a rotating plate to rotate, which in turn drives the cantilever and adsorption plate to flip the wafer. A parallel finger cylinder pushes a cylinder clamping plate, causing the centering clamping plate to move along the wafer direction, thus achieving wafer centering and alignment. The first and second cylinders work together to adjust the extension and retraction stroke of the adsorption plate to accommodate different wafer sizes. A vacuum suction cup is connected to the air path through an air pipe connector to generate negative pressure to adsorb the wafer. Subsequently, the motor starts and rotates at a constant speed through a reducer. The cantilever drives the wafer to complete the flipping, thereby enabling the flipping of wafers of different sizes. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a wafer flipping structure according to the present invention;

[0022] Figure 2 This is a schematic diagram of the flipping component structure of a wafer flipping structure according to the present invention;

[0023] Figure 3 This is a schematic diagram of the centering clamping component structure of a wafer flipping structure according to the present invention;

[0024] Figure 4 This is a schematic diagram of the clamping buffer assembly structure of a wafer flipping structure according to this utility model.

[0025] Figure label:

[0026] 1. Tilting platform mounting plate;

[0027] 2. Tilting assembly; 21. Motor; 22. Reducer; 23. Platform desktop divider; 24. Rotating plate; 25. Reinforcing plate; 26. Cantilever; 27. Adsorption plate; 28. Vacuum suction cup; 29. ​​Air pipe connector;

[0028] 3. Centering clamping assembly; 31. Cylinder lifting block; 32. First cylinder; 33. Second cylinder; 34. Mounting plate; 35. Fixing plate; 36. Parallel finger cylinder; 37. Cylinder clamping plate; 38. Clamping support plate; 39. Centering clamping plate; 310. Anti-drop block;

[0029] 4. Clamping buffer assembly; 41. Spring sheet; 42. Clamping plate; 43. Limiting rod; 44. Limiting block; 45. Telescopic spring; 46. Limiting plate. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] like Figures 1-4 As shown, this embodiment provides a technical solution: a wafer flipping structure, including a flipping platform mounting plate 1, and further comprising:

[0032] The flipping assembly 2 includes a motor 21 mounted on the flipping platform mounting plate 1. A rotating plate 24 is mounted on the output end of the motor 21. A cantilever 26 is fixed to the bottom of the rotating plate 24. An adsorption plate 27 is mounted on the cantilever 26. A vacuum suction cup 28 is mounted on the adsorption plate 27. An air pipe connector 29 is mounted on one side of the adsorption plate 27.

[0033] The centering clamping assembly 3 includes a cylinder lifting block 31 mounted on the cantilever 26, an adsorption plate 27 mounted on the cylinder lifting block 31, a fixing plate 35 fixed on the cantilever 26, a mounting plate 34 fixed on the fixing plate 35, a first cylinder 32 mounted on the mounting plate 34, a second cylinder 33 mounted on the mounting plate 34 near the bottom of the first cylinder 32, a parallel finger cylinder 36 mounted on the cantilever 26 near the bottom, a cylinder clamping plate 37 provided at the output end of the parallel finger cylinder 36, a clamping support plate 38 fixed on the cylinder clamping plate 37, and a centering clamping device fixed on the clamping support plate 38. Plate 39: This device drives the rotating plate 24 to rotate via motor 21, which in turn drives the cantilever 26 and the adsorption plate 27 to achieve wafer flipping. Parallel finger cylinder 36 pushes the cylinder clamping plate 37, causing the centering clamping plate 39 to move along the wafer direction to achieve wafer centering and calibration. The first cylinder 32 and the second cylinder 33 are linked to adjust the extension and retraction stroke of the adsorption plate 27 to adapt to different wafer sizes. The vacuum suction cup 28 is connected to the air circuit through the air pipe connector 29 to generate negative pressure to adsorb the wafer. Then, the motor 21 starts and achieves uniform rotation through the reducer 22. The cantilever 26 drives the wafer to complete the flipping, thereby achieving wafer flipping compatible with different sizes.

[0034] The above solution also has the problem of failing to prevent wafer damage due to excessive pressure when the centering clamping plate 39 starts clamping the wafer. Figures 1-2As shown: A reducer 22 is installed at the output end of the motor 21, and a platform desktop divider 23 is installed at the bottom of the reducer 22. A rotating plate 24 is installed at the bottom of the platform desktop divider 23, and a reinforcing plate 25 is fixed on the cantilever 26. The motor 21 reduces the speed and increases the torque through the reducer 22 to ensure smooth flipping. The output end of the reducer 22 is connected to the platform desktop divider 23 to achieve high-precision intermittent motion control. The rotating plate 24 is fixed at the bottom of the divider and rotates precisely with the platform desktop divider 23 to drive the cantilever 26 to complete the flipping, ensuring that the wafer does not vibrate during the flipping process and meeting the requirements of precision processing. The reinforcing plate 25 is installed at the key stress point of the cantilever 26 to form a triangular support structure, which significantly improves the bending stiffness of the cantilever 26. During high-speed flipping, it effectively suppresses the deformation of the cantilever 26 and ensures that the wafer on the adsorption plate 27 remains horizontal, avoiding wafer displacement or falling off due to vibration.

[0035] like Figure 1 as well as Figure 4 As shown, an anti-drop block 310 is fixed on the centering clamping plate 39. The anti-drop block 310 is fixed to the edge of the centering clamping plate 39. When the wafer is attracted and flipped by the vacuum chuck 28, the anti-drop block 310 supports the edge of the wafer and forms a physical limit. Even if the vacuum adsorption fails temporarily, the wafer is still intercepted by the anti-drop block 310 to prevent it from falling and being damaged.

[0036] like Figure 1 as well as Figure 4 As shown, a clamping buffer assembly 4 is provided on the centering clamping plate 39. The clamping buffer assembly 4 includes a spring piece 41 fixed on the centering clamping plate 39, and a clamping plate 42 fixed on the spring piece 41. When the centering clamping plate 39 begins to clamp the wafer, the spring piece 41 plays a key role. Since the wafer is relatively fragile, the spring piece 41 will undergo elastic deformation at the moment the clamping plate 42 contacts the wafer, thereby buffering the pressure applied to the wafer by the clamping plate 42 and avoiding damage to the wafer due to excessive pressure. At the same time, the clamping plate 42 can stably fit the wafer to ensure the clamping effect. A limit rod 43 is slidably connected on the centering clamping plate 39. A limit block 44 is fixed on one end of the limit rod 43 near the clamping plate 42. 3. Slide along the centering clamping plate 39. The limiting block 44 restricts the maximum movement range of the clamping plate 42. The telescopic spring 45 provides a reverse reset force so that the clamping plate 42 automatically returns to its original position after releasing the wafer. The limiting rod 43 is equipped with a telescopic spring 45. One end of the telescopic spring 45 is fixed to the centering clamping plate 39, and the other end of the telescopic spring 45 is fixed to the limiting rod 43. The clamping plate 42 is fixed with a limiting plate 46. When it is necessary to clamp the wafer, through the cooperation of the limiting plate 46 and the anti-drop block 310, when the wafer is adsorbed and flipped by the vacuum suction cup 28, the edge of the wafer can be supported to form a physical limit. Even if the vacuum adsorption fails temporarily, the wafer is still intercepted to prevent it from falling and being damaged.

[0037] Working principle:

[0038] like Figures 1-4 As shown, when the wafer is transferred to the workstation, during wafer adsorption, the vacuum chuck 28 is connected to the air path through the air pipe connector 29, generating negative pressure to firmly adsorb the wafer. The centering clamping assembly 3 then starts working. The parallel finger cylinder 36 pushes the cylinder clamping plate 37, causing the centering clamping plate 39 to move along the wafer direction for centering and calibration. Simultaneously, the first cylinder 32 and the second cylinder 33 work together to adjust the extension and retraction stroke of the adsorption plate 27 according to the wafer size, ensuring that the vacuum chuck 28 can accurately adsorb wafers of different sizes. During the clamping process, when the clamping plate 42 on the centering clamping plate 39 contacts the wafer, the spring sheet 41 undergoes elastic deformation to buffer the pressure applied by the clamping plate 42, avoiding damage to the fragile wafer, while ensuring that the clamping plate 42 stably adheres to the wafer. The limiting rod 43 slides along the centering clamping plate 39, the limiting block 44 limits the maximum movement range of the clamping plate 42, and the telescopic spring 45 provides a reverse reset force, allowing the clamping plate 42 to self-reset after releasing the wafer. In the flipping phase, the motor 21 starts, and its output power is reduced in speed and increased in torque by the reducer 22 to ensure smooth flipping. The output end of the reducer 22 is connected to the platform desktop divider 23 to achieve high-precision intermittent motion control. The rotating plate 24 rotates precisely with the platform desktop divider 23, and then drives the rotating plate 24 to rotate at a stable speed. The cantilever 26 then drives the wafer to complete the flipping. The reinforcing plate 25 is set at the key stress point of the cantilever 26 to form a triangular support structure, which improves the bending stiffness of the cantilever 26 and effectively suppresses deformation during high-speed flipping, ensuring that the wafer remains horizontal. In addition, the anti-drop block 310 on the edge of the centering clamping plate 39 and the limiting plate 46 on the clamping plate 42 cooperate to support the edge of the wafer during flipping, forming a physical limit to prevent the wafer from falling and being damaged due to temporary failure of vacuum adsorption. Finally, the device releases the flipped wafer to the downstream conveyor belt to complete the entire workflow.

[0039] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A wafer flip structure comprising a flip platform mounting plate (1), characterized in that, Also includes: The flipping assembly (2) includes a motor (21) mounted on the flipping platform mounting plate (1), a rotating plate (24) is provided at the output end of the motor (21), a cantilever (26) is fixed at the bottom of the rotating plate (24), an adsorption plate (27) is provided on the cantilever (26), a vacuum suction cup (28) is provided on the adsorption plate (27), and an air pipe connector (29) is provided on one side of the adsorption plate (27). The centering clamping assembly (3) includes a cylinder lifting block (31) disposed on a cantilever (26), an adsorption plate (27) disposed on the cylinder lifting block (31), a fixing plate (35) fixed on the cantilever (26), an mounting plate (34) fixed on the fixing plate (35), a first cylinder (32) mounted on the mounting plate (34), a second cylinder (33) mounted on the mounting plate (34) near the bottom of the first cylinder (32), a parallel finger cylinder (36) mounted on the cantilever (26) near the bottom, a cylinder clamping plate (37) disposed at the output end of the parallel finger cylinder (36), a clamping support plate (38) fixed on the cylinder clamping plate (37), and a centering clamping plate (39) fixed on the clamping support plate (38).

2. The wafer flip structure of claim 1, wherein: The output end of the motor (21) is provided with a speed reducer (22), the bottom of the speed reducer (22) is provided with a platform desktop divider (23), the rotating plate (24) is provided at the bottom of the platform desktop divider (23), and a reinforcing plate (25) is fixed on the cantilever (26).

3. The wafer flip structure of claim 1, wherein: An anti-drop block (310) is fixed on the centering clamping plate (39).

4. The wafer flip structure of claim 1, wherein: The centering clamping plate (39) is provided with a clamping buffer assembly (4), which includes a spring piece (41) fixed on the centering clamping plate (39) and a clamping plate (42) fixed on the spring piece (41).

5. The wafer flip structure of claim 4, wherein: A limiting rod (43) is slidably connected to the centering clamping plate (39), and a limiting block (44) is fixed at one end of the limiting rod (43) near the clamping plate (42).

6. The wafer flip structure of claim 5, wherein: A telescopic spring (45) is provided on the limiting rod (43). One end of the telescopic spring (45) is fixed on the centering clamping plate (39), and the other end of the telescopic spring (45) is fixed on the limiting rod (43). A limiting plate (46) is fixed on the clamping plate (42).

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