Packaging substrate and electromagnetic shielding packaging structure

Abstract

The utility model provides a packaging substrate and an electromagnetic shielding packaging structure. The package substrate includes: a plurality of substrate units for packaging a semiconductor element; the grounding region is located at the packaging line of the substrate unit and extends along the packaging line, and the grounding region has a first width; and the plurality of first grounding structures are distributed on the packaging substrate in a staggered manner, and the central axes of all the first grounding structures are located in the grounding region. According to the technical scheme, the wide grounding area is arranged at the packaging line of the substrate unit, and the first grounding structures which are distributed in the staggered mode are arranged in the grounding area, so that cutting deviation existing in the cutting process is made up, and the first grounding structures exist in the whole cutting deviation area.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging, and in particular to a packaging substrate and an electromagnetic shielding packaging structure. Background Technology

[0002] In the electronics field, electromagnetic interference (EMI) refers to the phenomenon where electromagnetic waves emitted by electronic products during operation interfere with other electronic products in the vicinity. EMI includes two types: conducted interference and radiated interference. Conducted interference refers to the coupling (interference) of a signal from one electrical network to another through a conductive medium; radiated interference refers to the coupling (interference) of its signal from an interference source to another electrical network through space. In high-speed PCB and system design, high-frequency signal lines, integrated circuit pins, and various connectors can all become sources of radiated interference with antenna characteristics, emitting electromagnetic waves and affecting the normal operation of other systems or other subsystems within the same system.

[0003] Currently, there are two types of EMI package lines: the first type has an internal grounding line 11 extending to the package line 12 (PackageOutline), such as... Figure 1 As shown; the second type has a few grounding vias 412, such as laser vias, centered at the encapsulation line 42, while the internal grounding line 411 extends out. Figure 4 As shown. After the packaging substrate is cut into individual units, the grounding medium inside the unit extends to the Package Outline. Then, an alloy-metal-alloy EMI medium is formed on the outer surface of the unit through sputtering or other methods, which is electrically connected to the grounding medium extending from the inside of the unit, thereby forming a complete EMI shielding structure and playing the role of shielding electromagnetic interference.

[0004] However, both common EMI shielding wires currently available suffer from problems such as a small contact area between the grounding line and the EMI dielectric, resulting in poor EMI shielding performance (e.g.) Figures 2-3 (As shown). A small contact area affects current conduction and shielding effectiveness, making it difficult to effectively shield electromagnetic interference. For the second method, with the via centered at the Package Outline, if the cutting deviation is greater than half the via diameter during package substrate cutting, the via may not be cut, preventing the formation of a large grounding dielectric on the package outline. This results in a small contact area between the grounding line and the EMI dielectric (e.g., as shown). Figures 5-7 (As shown).

[0005] Therefore, how to avoid a small contact area between the grounding via and the electromagnetic shielding medium due to cutting offset is a problem that needs to be solved. Summary of the Invention

[0006] The technical problem to be solved by this utility model is how to avoid the small contact area between the grounding through hole and the electromagnetic shielding medium due to cutting offset, and to provide a packaging substrate and an electromagnetic shielding packaging structure.

[0007] To address the aforementioned problems, this utility model provides a packaging substrate, comprising: a plurality of substrate units for packaging semiconductor elements; a grounding region located at and extending along the packaging lines of the substrate units, the grounding region having a first width W1; and a plurality of first grounding structures staggered on the packaging substrate, wherein the central axis of all the first grounding structures is located within the grounding region.

[0008] To address the aforementioned problems, this utility model provides an electromagnetic shielding encapsulation structure, comprising: an independent encapsulation unit, including a substrate unit, wherein a grounding area is provided at the encapsulation line of the substrate unit, the grounding area extends along the encapsulation line, and a plurality of first grounding structures are staggered within the grounding area; the independent encapsulation unit has a cut surface at the encapsulation line, and the cut surface of the independent encapsulation unit exposes at least a portion of the cut surface of the first grounding structure; and an electromagnetic shielding layer, covering the surface of the independent encapsulation unit and the cut surface, and forming an electromagnetic shielding structure with the first grounding structures exposed at the cut surface.

[0009] The above technical solution compensates for cutting deviations in the cutting process by setting a wider grounding area at the packaging line of the substrate unit and setting staggered first grounding structures within the grounding area, ensuring that the first grounding structure exists throughout the entire cutting deviation area. When the packaging substrate is subsequently cut into independent packaging units after packaging, it is guaranteed that a first grounding structure will be cut, forming a first grounding structure connecting the upper and lower layers at the cut surface of the independent packaging unit. This ensures sufficient contact between the first grounding structure of the independent packaging unit and the electromagnetic shielding layer, improving the situation where the contact area between the first grounding structure and the electromagnetic shielding layer is small due to cutting deviation, thus giving the product better electromagnetic shielding functionality.

[0010] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the present invention. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the accompanying drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some specific embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0012] Figure 1 This is a schematic diagram of a packaging substrate with a grounding line cut off from the packaging line;

[0013] Figure 2 This is a cross-sectional view of an electromagnetic shielding package structure formed using a package substrate with ground lines at the package lines.

[0014] Figure 3 A side view of an electromagnetic shielding package structure formed using a package substrate with ground lines at the package lines;

[0015] Figure 4 This is a schematic diagram of a packaging substrate with a grounding via at the packaging line.

[0016] Figure 5 An electromagnetic shielding package structure is formed using a package substrate with grounding vias at the package lines;

[0017] Figure 6 This is a side view of an electromagnetic shielding package structure formed using a package substrate with grounding vias at the package lines;

[0018] Figure 7 This is a side view of an electromagnetic shielding package structure formed using a package substrate with a grounding via at the package line when a cutting offset occurs.

[0019] Figure 8 This is a schematic diagram of the structure of the first embodiment of the packaging substrate of this utility model;

[0020] Figure 9 for Figure 8 Enlarged view of section A;

[0021] Figure 10 This is a three-dimensional structural diagram of the first embodiment of the packaging substrate of the present invention after being cut along the packaging line;

[0022] Figure 11 This is a schematic diagram of the first grounding structure of the first embodiment of the packaging substrate of this utility model;

[0023] Figure 12 This is a schematic diagram of the structure of the second embodiment of the packaging substrate of this utility model;

[0024] Figure 13 for Figure 12 Enlarged view of section B;

[0025] Figure 14 This is a three-dimensional structural diagram of the second embodiment of the packaging substrate of this utility model after being cut along the packaging line;

[0026] Figure 15 This is a schematic diagram of the structure of the third embodiment of the packaging substrate of this utility model;

[0027] Figure 16 for Figure 15 Enlarged view of section C;

[0028] Figure 17 This is a three-dimensional structural diagram of the third embodiment of the packaging substrate of the present invention after being cut along the packaging line;

[0029] Figure 18 This is a cross-sectional view of an embodiment of the electromagnetic shielding packaging structure described in this utility model;

[0030] Figure 19 This is a top view of a substrate unit of an embodiment of the electromagnetic shielding packaging structure described in this utility model. Detailed Implementation

[0031] The technical solutions in the embodiments of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0032] Please see Figures 1-3 ,in, Figure 1 This is a schematic diagram of a packaging substrate with a ground line at the packaging line. Figure 2 This is a cross-sectional view of an electromagnetic shielding package structure formed using a package substrate with ground lines at the package lines. Figure 3 This is a side view of an electromagnetic shielding package structure formed using a package substrate with grounded lines at the package lines; wherein... Figure 3 The electromagnetic shielding layer on the side is omitted to clearly show the cut surface of the grounding line.

[0033] like Figures 1-3 As shown, after the packaging substrate 10 is packaged, it is cut along the packaging line 12 to form an independent packaging unit, and the ground line 11 is exposed at the cut surface of the independent packaging unit; in this packaging structure, the ground line 11 inside is not limited to the interior of the independent packaging unit, but extends to the edge of the independent packaging unit.

[0034] Subsequently, an alloy-metal-alloy electromagnetic shielding layer 13 is formed on the outer surface of the independent packaging unit by sputtering or other methods, and is electrically connected to the grounding line 11 exposed at the cut surface of the independent packaging unit to form an electromagnetic shielding structure, which plays the role of shielding electromagnetic interference.

[0035] However, the cutting surface area of ​​the grounding line 11 is very small. The electromagnetic shielding structure formed by the electrical connection between the grounding line 11 and the electromagnetic shielding layer 13 has a small contact area, which affects the conduction of current and the shielding effectiveness, making it impossible to effectively shield electromagnetic interference.

[0036] Furthermore, in order to increase the contact area and enhance the shielding effect of the electromagnetic shielding structure, Figures 4-6 Another packaging substrate and packaging method are provided. Please refer to [link / reference]. Figures 4-6 ,in, Figure 4 This is a schematic diagram of a packaging substrate with a grounding via at the packaging line. Figure 5 An electromagnetic shielding package structure is formed using a package substrate with grounding vias at the package lines; Figure 6 This is a side view of an electromagnetic shielding package structure formed using a package substrate with grounding vias at the package lines; wherein... Figure 6 The electromagnetic shielding layer on the side is omitted to clearly show the cut surface of the grounding through hole.

[0037] like Figures 4-6 As shown, after the packaging substrate 40 is packaged, an independent packaging unit is formed by cutting along the packaging line 42. The grounding line 411 and the grounding via 412 are exposed at the cut surface of the independent packaging unit. In this packaging structure, the grounding via 412 at the packaging line of the independent packaging unit greatly increases the contact area with the subsequently formed electromagnetic shielding layer 43, increases the current conduction and shielding effectiveness, and enables electromagnetic interference to be well shielded.

[0038] Through-holes are conductive channels on a circuit board used to connect different layers. The grounding through-hole 412 is a connection channel for grounding and is located in the middle of the package line.

[0039] However, due to limitations in the manufacturing process, there are cutting deviations when cutting the packaging substrate. Furthermore, the grounding via 412 is located in the middle of the packaging line. If the cutting deviation is large, the grounding via 412 may not be cut. Figure 7 As shown, the cut surface of the independent packaging unit only exposes the grounding line 411, or the exposed grounding through hole 412 is small, which cannot fully achieve the effect of increasing the contact area and improving the electromagnetic shielding effect.

[0040] To address the issue of small contact area between the grounding via and the electromagnetic shielding layer due to cutting offset, this invention provides a packaging substrate that can increase the exposed area of ​​the grounding via at the cut surface without modifying the cutting process. This, in turn, increases the contact area between the grounding via and the electromagnetic shielding layer in the subsequently formed packaging structure, resulting in a packaging structure with better electromagnetic shielding functionality.

[0041] Please see Figures 8-11 ,in, Figure 8 This is a schematic diagram of the structure of the first embodiment of the packaging substrate of this utility model; Figure 9 for Figure 8 Enlarged view of section A; Figure 10 This is a three-dimensional structural diagram of the first embodiment of the packaging substrate of the present invention after being cut along the packaging line; Figure 11 This is a schematic diagram of the first grounding structure of the first embodiment of the packaging substrate of this utility model.

[0042] like Figures 8-11 As shown, the packaging substrate 80 of this invention includes: a plurality of substrate units 81, a grounding region 82, and a plurality of first grounding structures 83. The substrate units 81 are used to package semiconductor devices. The grounding region 82 is located at and extends along the packaging line 810 of the substrate unit 81, and the grounding region 82 has a first width W1. The first grounding structures 83 are staggered on the packaging substrate 80, and the central axis OO' of all the first grounding structures 83 is located within the grounding region 82. This ensures that when the grounding region 82 of the substrate unit 81 is cut along the packaging line 810, at least a portion of the first grounding structures 83 is cut.

[0043] The above technical solution provides a wider grounding area at the packaging line of the substrate unit and sets staggered first grounding structures within the grounding area to compensate for the cutting deviation in the cutting process, so that the first grounding structure exists throughout the entire cutting deviation area.

[0044] When the packaging substrate is cut into independent packaging units after the subsequent packaging is completed, it is ensured that the first grounding structure is cut. The first grounding structure connecting the upper and lower layers is formed at the cut surface of the independent packaging unit, which ensures that the first grounding structure of the independent packaging unit is in full contact with the electromagnetic shielding layer. This improves the situation where the contact area between the first grounding structure and the electromagnetic shielding layer is small due to cutting offset, and makes the product have better electromagnetic shielding function.

[0045] In some embodiments, the packaging substrate 80 is a packaging substrate for electrically connecting semiconductor components to other external devices. The packaging substrate 80 may include circuit traces within the packaging substrate body of the dielectric material layer. The packaging substrate 80 may also be in the form of a printed circuit board (PCB). The packaging substrate 80 provides mechanical support for electronic components, ensuring their stable position in the device; it enables electrical connections between electronic components through internal conductive lines, ensuring the transmission of signals and current; and it also provides physical protection for electronic components, preventing them from being affected by external environmental factors such as dust, moisture, and mechanical impact.

[0046] In this embodiment, multiple substrate units 81 are arranged in an array within the packaging substrate 80. This array arrangement can greatly improve production efficiency, enabling the integration of more substrate units 81 within a limited space, thus laying the foundation for subsequent mass production.

[0047] In other embodiments, the plurality of substrate units 81 may also be arranged in a straight line within the packaging substrate 80. This arrangement is simple and direct, facilitating uniform processing during production. The cutting process can be performed along a straight line, reducing the complexity of the cutting process, improving cutting efficiency and accuracy, and reducing error accumulation during cutting. In the manufacturing of semiconductor products with strict cost control and relatively simple production processes, linear arrangement can effectively reduce production costs. When producing simple discrete components, linear arrangement facilitates subsequent inspection and sorting.

[0048] In other embodiments, the plurality of substrate units 81 may be randomly distributed within the packaging substrate 80, which is suitable for some special semiconductor manufacturing scenarios, such as the experimental product development stage. When developing new semiconductor devices, it is necessary to quickly test different circuit layouts and parameter combinations. Random arrangement can facilitate the trial of multiple designs without following fixed rules, saving layout design time. Random arrangement is also suitable for small-batch production scenarios where space utilization efficiency is not critical, but product diversity is required.

[0049] like Figure 8 As shown, in some embodiments, the substrate unit 81 is rectangular, and the contact area 82 is located at the encapsulation lines 810 on the four edges of the substrate unit 81.

[0050] In other embodiments, the substrate unit 81 may also take the shape of a circle, polygon, or irregular shape to meet different functional requirements, manufacturing process requirements, and product characteristics.

[0051] In some embodiments, when cutting the packaging substrate 80, the cutting position has a cutting deviation T on both sides of the packaging line 810, and the first width W1 is greater than the cutting deviation T.

[0052] Ideally, when cutting the packaging substrate 80, the cutting is performed along the packaging line 810 of the substrate unit 81, so that the first grounding structure 83 disposed on the packaging line 810 of the substrate unit 81 is precisely cut to obtain a sufficiently large contact area.

[0053] However, due to inherent limitations of the process itself, when cutting along the packaging line 810 of the substrate unit 81, a deviation area of ​​width T will be formed on both sides of the packaging line 810 of the substrate unit 81. When the deviation area is large enough, for a substrate structure where the contact via is centered at the packaging line, it may be impossible to cut the contact via, resulting in a small contact area between the contact via and the electromagnetic shielding layer and poor contact effect.

[0054] Therefore, this application provides a grounding area 82 with a first width W1 at the packaging line 810 of the substrate unit 81, and the first width W1 of the grounding area 82 is greater than the cutting deviation T, so that the distribution range of the first grounding structure 83 fully covers the cutting deviation T.

[0055] In some embodiments, when cutting the grounding area 82 of the substrate unit 81, the cutting is performed along the extension direction of the packaging line 810. The presence of the grounding area 82 compensates for cutting deviations in the cutting process, ensuring that the first grounding structure 83 is exposed on the cut surface, thus guaranteeing full contact between the first grounding structure 83 and the electromagnetic shielding layer, and giving the product better electromagnetic shielding function.

[0056] like Figure 11 As shown, in some embodiments, the packaging substrate 80 has an upper surface S1 and a lower surface S2, and the first grounding structure 83 further includes a through hole 831 and a plate-shaped extension 832. The through hole 831 penetrates the packaging substrate 80. The plate-shaped extension 832 is disposed on the upper surface S1 or the lower surface S2 of the packaging substrate 80 and is electrically connected to the through hole 831.

[0057] In this embodiment, the first grounding structure 83 includes two plate-shaped extensions 832, which are respectively disposed on the upper surface S1 and the lower surface S2 of the packaging substrate 80, and are electrically connected to both ends of the through hole 831.

[0058] In some other embodiments, the first grounding structure 83 may also include only one plate-shaped extension 832, disposed on the upper surface S1 or the lower surface S2 of the encapsulation substrate 80, and electrically connected to one end of the through hole 831.

[0059] The radial dimension of the plate-shaped extension 832 is larger than the radial dimension of the through hole 831. A plate-shaped extension 832 with a larger radial dimension is formed on the upper surface S1 or lower surface S2 of the packaging substrate 80 to increase the probability that the first grounding structure 83 is cut. When the packaging substrate 80 is cut along the packaging line 810, more of the first grounding structures 83 can be cut, thereby increasing the total contact area between the subsequent electromagnetic shielding layer and the first grounding structure 83 and improving the electromagnetic shielding effect.

[0060] In some embodiments, the through hole 831 is a cylinder, the plate-shaped extension 832 is a circular plate, and the through hole 831 and the central axis of the plate-shaped extension 832 are coaxial.

[0061] In some other embodiments, the through hole 831 may also be a prism, and the plate-shaped extension 832 may also be a polygonal plate.

[0062] In some other embodiments, the central axis of the through hole 831 and the plate-shaped extension 832 may not be coaxial; the two plate-shaped extensions 832 on the upper surface S1 and lower surface S2 of the packaging substrate 80 may also not be coaxial, so as to increase the coverage area of ​​the first grounding structure 83, increase the probability of the first grounding structure 83 being cut, so that more first grounding structures 83 are cut, thereby increasing the total contact area of ​​the first grounding structure 83 and improving the electromagnetic shielding effect.

[0063] In some embodiments, the first grounding structure 83 is made of metal. In this embodiment, the first grounding structure 83 is made of copper.

[0064] like Figure 9 As shown, in some embodiments, the radius of the through-hole 831 is R, and the first width W1 is 2(R+T). That is, with the encapsulation line 810 of the substrate unit 81 as the center, the contact area 82 is offset to both sides by R+T; if the encapsulation line 810 of the substrate unit 81 is marked as the origin, and an X-axis is established in the direction perpendicular to the encapsulation line 810 of the substrate unit 81, then the coverage area of ​​the contact area 82 is (-(R+T), R+T).

[0065] Taking the endpoint values ​​of the above range as an example, when the coordinate of the central axis OO' of the first grounding structure 83 on the X-axis is -(R+T) or (R+T), the radius of the through hole 831 is R, that is, the edge of the through hole 831 is tangent to the coordinate -T or the coordinate T.

[0066] In this invention, the central axis OO' of all the first grounding structures 83 is located within the grounding area 82. That is, the central axis OO' of the first grounding structure 83 is located between (-(R+T) and (R+T) on the X-axis. Therefore, it can be concluded that the through holes 831 of the first grounding structure 83 are at least partially or entirely located within the cutting offset range (-T, T). The first grounding structures 83 are staggered on both the inner and outer sides of the packaging line 810 of the substrate unit 81, thereby ensuring that when the packaging substrate 80 is cut, a first grounding structure 83 will be cut, increasing the contact area with the subsequently formed electromagnetic shielding layer and improving the electromagnetic shielding effect.

[0067] Preferably, the central axis OO' of the first grounding structure 83 is located between (-T, T) on the X-axis, which allows more of the through holes 831 of the first grounding structure 83 to be cut while keeping the number of the first grounding structures 83 unchanged.

[0068] In this embodiment, the radius R of the through hole 831 is greater than or equal to the cutting deviation T; the first grounding structure 83 has a first density in the distribution of the grounding area 82.

[0069] In this embodiment, the diameter of the plate-shaped extension 832 can be 2R.

[0070] Because the first grounding structure 83 in this embodiment is relatively large, fewer of the first grounding structures 83 are needed to completely cover the cutting deviation area (-T, T). This ensures that when the packaging substrate 80 is cut, at least one of the first grounding structures 83 will be cut, increasing the contact area with the subsequently formed electromagnetic shielding layer and improving the electromagnetic shielding effect.

[0071] Please see Figure 8 In some embodiments, the packaging substrate 80 further includes a second grounding structure 84, which is staggered within the substrate unit 81. The second grounding structure 84 is used to ground the interior of the substrate unit 81 and to provide a grounding line for semiconductor devices subsequently packaged on the substrate unit 81.

[0072] In some embodiments, the shape and size of the second grounding structure 84 are the same as those of the first grounding structure 83, so as to reduce the complexity of the process and improve the consistency of the product.

[0073] In some other embodiments, the second grounding structure 84 may also adopt a conventional through-hole structure to reduce production costs and save packaging space.

[0074] In some embodiments, the second grounding structure 84 is made of metal. In this embodiment, the second grounding structure 84 is made of copper.

[0075] Please see Figures 12-14 ,in, Figure 12 This is a schematic diagram of the structure of the second embodiment of the packaging substrate of this utility model; Figure 13 for Figure 12 Enlarged view of section B; Figure 14 This is a three-dimensional structural diagram of the second embodiment of the packaging substrate of this utility model after being cut along the packaging line.

[0076] Figures 12-14 The illustrated embodiments and Figures 8-11 Unlike the embodiment shown, in this embodiment, the radius R of the through hole 831 is smaller than the cutting deviation T and greater than half of the cutting deviation T; the first grounding structure 83 has a second density in the distribution of the grounding area 82.

[0077] In this embodiment, the second density is greater than the first density. Since the radius R of the through-hole 831 in this embodiment is smaller than the cutting deviation T, therefore relative to... Figures 8-11 The illustrated embodiment requires more of the first grounding structures 83 to cover the cutting deviation area (-T, T). This ensures that when the packaging substrate 80 is cut, at least one of the first grounding structures 83 will be cut, increasing the contact area with the subsequently formed electromagnetic shielding layer and improving the electromagnetic shielding effect.

[0078] In this embodiment, the shape and size of the second grounding structure 84 are the same as those of the first grounding structure 83, so as to reduce the complexity of the process and improve the consistency of the product.

[0079] Please see Figures 15-17 ,in, Figure 15 This is a schematic diagram of the structure of the third embodiment of the packaging substrate of this utility model; Figure 16 for Figure 15 Enlarged view of section C; Figure 17 This is a three-dimensional structural diagram of the third embodiment of the packaging substrate of the present invention after being cut along the packaging line. Figures 15-17 The illustrated embodiments and Figures 12-14 Unlike the illustrated embodiment, in this embodiment, the radius R of the through hole 831 is less than or equal to half of the cutting deviation T; the distribution of the first grounding structure 83 in the grounding area has a third density.

[0080] In this embodiment, the third density is greater than the second density. Since the radius R of the through-hole 831 in this embodiment is less than half of the cutting deviation T, therefore relative to... Figures 12-14 The illustrated embodiment requires more of the first grounding structures 83 to cover the cutting deviation area (-T, T). This ensures that when the packaging substrate 80 is cut, at least one of the first grounding structures 83 will be cut, increasing the contact area with the subsequently formed electromagnetic shielding layer and improving the electromagnetic shielding effect.

[0081] In summary, it is clear from the above three embodiments that the size of the first grounding structure 83 is flexible, but an appropriate distribution density needs to be set according to the size of the first grounding structure 83. A larger first grounding structure 83 requires fewer units and a lower density, resulting in fewer units being cut during the cutting process, but a larger individual cut cross-sectional area. Conversely, a smaller first grounding structure 83 requires more units and a higher density, resulting in a smaller individual cut cross-sectional area, but a larger number of units being cut. By considering both the size and distribution density of the first grounding structure 83 and setting appropriate size and distribution density parameters, it is possible to ensure that a sufficient number of the through-holes 831 of the first grounding structures 83 are cut during the cutting of the packaging substrate 80, forming a sufficiently large total contact area to improve the electromagnetic shielding effect.

[0082] Based on the same inventive concept, an embodiment of this utility model also provides an electromagnetic shielding packaging structure.

[0083] Please see Figures 18-19 ,in, Figure 18 This is a cross-sectional view of an embodiment of the electromagnetic shielding packaging structure described in this utility model; Figure 19 This is a top view of a substrate unit of an embodiment of the electromagnetic shielding packaging structure described in this utility model, wherein the invisible parts are drawn with dashed lines. Figures 18-19 As shown, the electromagnetic shielding packaging structure includes: an independent packaging unit 91 and an electromagnetic shielding layer 92. The independent packaging unit 91 includes a substrate unit 81. A grounding area 82 is provided at the packaging line 810 of the substrate unit 81. The grounding area 82 extends along the packaging line 810, and multiple first grounding structures 83 are staggered within the grounding area 82. The independent packaging unit 91 has a cut surface 910 at the packaging line 810, and the cut surface 910 of the independent packaging unit 91 exposes at least a portion of the cut surfaces 830 of the first grounding structures 83. The electromagnetic shielding layer 92 covers the surface 911 and the cut surface 910 of the independent packaging unit 91, and forms an electromagnetic shielding structure with the first grounding structures 83 exposed at the cut surface 910.

[0084] The above technical solution compensates for cutting deviations in the cutting process by setting a wider grounding area at the packaging line of the substrate unit and setting staggered first grounding structures within the grounding area, ensuring that the first grounding structure exists throughout the entire cutting deviation area. When the packaging substrate is subsequently cut into independent packaging units after packaging, it is guaranteed that a first grounding structure will be cut, forming a first grounding structure connecting the upper and lower layers at the cut surface of the independent packaging unit. This ensures sufficient contact between the first grounding structure of the independent packaging unit and the electromagnetic shielding layer, improving the situation where the contact area between the first grounding structure and the electromagnetic shielding layer is small due to cutting deviation, thus giving the product better electromagnetic shielding functionality.

[0085] Please refer to this utility model for details. Figures 8 to 17 The encapsulation substrate 80 shown is used to form the independent encapsulation unit 91, which is formed by encapsulating the encapsulation substrate 80 and then cutting along the cutting area 82 of the encapsulation substrate 80. The encapsulation substrate 80 includes a plurality of substrate units 81. The cutting area 82 is located at the encapsulation line 810 of the substrate unit 81 and extends along the encapsulation line 810. The cutting area 82 has a first width W1. A plurality of first ground structures 83 are staggered on the encapsulation substrate 80, and the central axis OO' of all the first ground structures 83 is located within the cutting area 82. This is such that when the encapsulation line 810 of the substrate unit 81 is cut along the cutting area 82, at least a portion of the first ground structures 83 is cut, and the cutting surface 830 of the first ground structure 83 is exposed at the cutting surface 910 of the independent encapsulation unit 91.

[0086] In some embodiments, the independent packaging unit 91 further includes a semiconductor element 93 and a molding compound 94. The semiconductor element 93 is packaged on the substrate unit 81. The molding compound 94 is disposed on the surface of the substrate unit 81 and covers the semiconductor element 93.

[0087] In some embodiments, the independent packaging unit 91 further includes a plurality of solder balls 95 disposed on the back side of the substrate unit 81, the solder balls 95 being used for electrical connection with an external PCB board or other electronic components.

[0088] It should be noted that references to "an embodiment," "an embodiment," "an exemplary embodiment," "some embodiments," etc., in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but each embodiment may not necessarily include that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure, or characteristic is described in connection with an embodiment, whether explicitly described or not, implementing such a feature, structure, or characteristic in conjunction with other embodiments is within the knowledge of those skilled in the art.

[0089] Generally, terms can be understood at least partially from their usage in context. For example, the term "one or more," as used herein, depends at least partially on the context and can be used to describe any feature, structure, or characteristic in a singular sense, or in a plural sense, to describe a combination of features, structures, or characteristics. Similarly, terms such as "a," "a," or "the" can also be understood, at least partially on the context, to express either a singular or plural usage. Furthermore, the term "based on" can be understood not necessarily to express an exclusive set of factors, but rather, alternatively, also at least partially on the context, to allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connection / coupling" refers not only to a direct coupling of one component to another, but also to an indirect coupling of one component to another via an intermediate component.

[0090] It should be noted that the terms "comprising" and "having," and their variations, used in this utility model document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context. It should be understood that such data used interchangeably where appropriate. Furthermore, embodiments and features within embodiments of this utility model can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this utility model. In the various embodiments described above, each embodiment focuses on its differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.

[0091] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A package substrate, characterized by, include: Multiple substrate units are used to package semiconductor components; The contact area is located at the packaging line of the substrate unit and extends along the packaging line, and the contact area has a first width W1; Multiple first grounding structures are staggered on the packaging substrate, and the central axis of all the first grounding structures is located within the grounding area.

2. The package substrate of claim 1, wherein The packaging line has a cutting deviation T on both sides, and the first width W1 is greater than the cutting deviation T.

3. The package substrate of claim 2, wherein, The packaging substrate has an upper surface and a lower surface, and the first grounding structure further includes: Through-hole, penetrating the packaging substrate; A plate-shaped extension is disposed on the upper or lower surface of the packaging substrate and electrically connected to the through hole; wherein the radial dimension of the plate-shaped extension is larger than the radial dimension of the through hole.

4. The package substrate of claim 3, wherein The through hole is a cylinder, the plate-shaped extension is a circular plate, and the through hole is coaxial with the central axis of the plate-shaped extension.

5. The package substrate of claim 4, wherein, The radius of the through hole is R, and the first width is 2(R+T).

6. The package substrate of claim 5, wherein, The radius R of the through hole is greater than or equal to the cutting deviation T; the distribution of the first grounding structure in the grounding area has a first density.

7. The package substrate of claim 5, wherein The radius R of the through hole is smaller than the cutting deviation T and greater than half of the cutting deviation T; the distribution of the first grounding structure in the grounding area has a second density.

8. The package substrate of claim 5, wherein, The radius R of the through hole is less than or equal to half of the cutting deviation T; the distribution of the first grounding structure in the grounding area has a third density.

9. The package substrate according to any one of claims 1 to 8, wherein Multiple substrate units are arranged in an array within the packaging substrate.

10. The package substrate according to any one of claims 1 to 8, wherein The substrate unit is rectangular, and the contact area is located at the encapsulation lines on the four edges of the substrate unit.

11. The package substrate according to any one of claims 1 to 8, wherein It also includes a second grounding structure, which is staggered within the substrate unit.

12. The package substrate of claim 11, wherein, The shape and size of the second grounding structure are the same as those of the first grounding structure.

13. An electromagnetic shielded package structure, characterized by, include: An independent packaging unit includes a substrate unit, wherein a grounding area is provided at the packaging line of the substrate unit, the grounding area extends along the packaging line, and a plurality of first grounding structures are staggered in the grounding area. The independent packaging unit has a cut surface at the packaging line, and the cut surface of the independent packaging unit exposes at least part of the cut surface of the first grounding structure. An electromagnetic shielding layer covers the surface and cut surface of the independent packaging unit, and forms an electromagnetic shielding structure with the first grounding structure exposed at the cut surface.

14. The electromagnetic shield package structure of claim 13, wherein, The independent packaging unit also includes: Semiconductor components are packaged on the substrate unit; A molding layer is disposed on the surface of the substrate unit and covers the semiconductor element.

15. The electromagnetic shield package structure of claim 14, wherein, The independent packaging unit further includes: Multiple solder balls are disposed on the back side of the substrate unit.

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