Automatic OC attaching device

Abstract

The utility model relates to the field of automatic attaching, in particular to an automatic OC attaching device which comprises a gantry transplanting feeding mechanism, a stock bin, a regular middle platform, a mechanical arm and an assembling station. A stock bin is arranged at the bottom of the gantry transplanting feeding mechanism, the arranging middle platform is arranged in the conveying direction of the gantry transplanting feeding mechanism, an assembling station is arranged on one side of the arranging middle platform, and a mechanical arm is arranged between the assembling station and the arranging middle platform. And the gantry transplanting feeding mechanism conveys the OC in the stock bin to the normalizing middle platform for normalizing and positioning, then the OC is conveyed to the assembling station through the mechanical arm, and the mechanical arm is controlled to be automatically attached based on position information provided by the CCD camera. The gantry transplanting feeding mechanism and the regular middle platform are matched with the mechanical arm to achieve automatic OC conveying, automatic OC attaching is achieved based on CCD camera positioning, the whole process is high in speed, high in assembling precision and high in yield, manual errors are reduced, and efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of automatic bonding, specifically an automatic OC bonding device. Background Technology

[0002] LCD TVs, LCD monitors, and other appliances using LCD panels are already very common in the market. Among them, OC (Open Cell, LCD panel) has a multi-layer structure and a smooth, flat surface. Since there is no light source inside the LCD panel, it needs to be combined with a backlight to form a module to display an image. Before the LCD panel and backlight are assembled into a module, the sides of the LCD panel are already connected to the PCB board via COF (Chip-on-Flush) assembly, which requires manual assembly. However, manual assembly is slow, has poor assembly accuracy, and a low yield rate.

[0003] Chinese utility model patent CN219936237U discloses a fixture for automatically attaching LCD panels, including a placement plate with a support frame engaged at the top. An attachment mechanism is located on one side of the support frame, comprising a suction cup, a connecting rod, and a crossbar. Limiting blocks are fixed to both ends of the crossbar, and a connecting block is sleeved inside each limiting block. The connecting block is fixedly connected to the connecting rod, and the connecting rod is rotatably connected to the limiting block. In this utility model, the connecting rod and the moving block can drive the suction cup to adjust its position, thereby adjusting the contact position between the suction cup and the LCD panel, making it suitable for attaching LCD panels of different sizes. However, this solution has limited functionality, only enabling OC adsorption and not automatic OC attachment. Utility Model Content

[0004] To overcome the problems existing in the prior art, the purpose of this utility model is to provide an automatic OC bonding device.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an automatic OC bonding device, comprising a gantry transfer and feeding mechanism, a hopper, a standardization intermediate platform, a robotic arm, and an assembly station;

[0006] The bottom of the gantry transplanting and feeding mechanism is equipped with a hopper, and the regular intermediate platform is set in the conveying direction of the gantry transplanting and feeding mechanism. An assembly station is set on one side of the regular intermediate platform, and a robotic arm is set between the assembly station and the regular intermediate platform. A CCD camera is set on the assembly station.

[0007] The gantry transfer and feeding mechanism transports the OC in the hopper to the regularization intermediate platform for regularization and positioning, and then the robotic arm transports it to the assembly station. Based on the position information provided by the CCD camera, the robotic arm is controlled to attach the material.

[0008] The gantry transfer and feeding mechanism takes the OC out of the hopper and places it on the leveling platform. The OC in the hopper is connected to the FPC (flexible printed circuit board). The leveling platform levels the OC and provides bottom support for the FPC. After the back plate blocks it, the robotic arm grabs the OC. After the film is peeled off manually, the robotic arm places the OC on the assembly station for assembly.

[0009] The present invention is further configured such that: the gantry transfer and feeding mechanism includes a Y-axis transfer mechanism, an assembly suction cup, a fixing frame, and a Z-axis lifting module;

[0010] A Y-axis transplanting mechanism is installed at the bottom of the fixed frame, which drives the fixed frame to reciprocate horizontally along the linear guide rail; the Z-axis lifting module is installed on the fixed frame, and the bottom of the Z-axis lifting module is connected to the assembly suction cup.

[0011] The present invention is further configured such that: the Y-axis transplanting mechanism adopts a linear guide rail mechanism, and the Z-axis lifting module adopts a rack and pinion lifting module.

[0012] The present invention is further configured such that: the leveling intermediate platform is located at the bottom of the Y-axis transplanting mechanism, and the leveling intermediate platform includes a leveling platform, a servo module and a POM support block; the POM support block is centrally located below the leveling platform, and an FPC is placed on the POM support block; the FPC is connected to the OC.

[0013] The regularized platform is a rectangular platform, and the servo module includes a front servo module, a rear servo module, a left servo module, and a right servo module respectively disposed on the four sides of the rectangular platform;

[0014] The front servo module and the left servo module each include a push block and a telescopic mechanism, and the push block is connected to the output end of the telescopic mechanism.

[0015] The rear servo module and the right servo module respectively include a floating push block, a spring, a slide rail and a baffle; the floating push block is set on the slide rail, a baffle is set at one end of the slide rail, one end of the spring is connected to the floating slider and the other end is connected to the baffle.

[0016] It should be noted that during the placement, alignment, and robotic arm pickup of the OC, the FPC is always kept horizontal with the OC to avoid damage to the FPC; the FPC is connected to the OC via a flexible flat cable.

[0017] The OC is centered and positioned by the servo module, which makes it easier for the robotic arm to pick up materials. When changing to different sizes of OC, the picking point of the robotic arm does not need to be adjusted, making it more versatile.

[0018] The present invention is further configured such that: the automatic OC bonding device also includes a backplate conveyor line, a backplate carrier and a blocking mechanism, wherein the backplate carrier is transported along the backplate conveyor line;

[0019] The backplate conveyor line passes through the assembly station, and the blocking mechanism is installed on the assembly station; the blocking mechanism includes a stop block and a blocking cylinder, and the stop block is connected to the output end of the blocking cylinder.

[0020] The backplate is placed on the circulating carrier, and a blocking mechanism is used to stop the backplate carrier. The blocking mechanism is installed on the return line. When the blocking cylinder is in the extended state, the circulating backplate carrier stops after hitting the blocking block. After assembly, the blocking cylinder retracts, and the carrier flows out.

[0021] The present invention is further configured such that: the gripping end of the robotic arm is equipped with a suction cup gripper for gripping OC and placing it on the assembly station.

[0022] The present invention is further configured such that a film-tearing station is provided next to the robotic arm.

[0023] After the robotic arm grabs the OC, the film is manually torn off by the staff at the film-tearing station.

[0024] The present invention is further configured such that: the assembly station includes an assembly platform and a CCD camera; a support frame is provided above the assembly platform, and the CCD camera is mounted on the support frame; the CCD camera guides the robotic arm to attach the OC to the back plate by capturing the relative position of the back plate and the OC.

[0025] Based on the CCD camera's image capture, the backplate and OC positions are located. Based on the position information provided by the CCD camera, the robotic arm is adjusted so that it attaches the OC to the backplate.

[0026] The present invention is further configured such that the automatic OC bonding device also includes a control module, which is connected to the gantry transfer feeding mechanism, the robotic arm, the servo module and the CCD camera signal respectively.

[0027] In summary, the beneficial effects of the above-mentioned technical solution of this utility model are as follows:

[0028] This invention achieves automated transportation of OCs through a gantry-type transfer and feeding mechanism, a standardized intermediate platform, and a robotic arm. Based on CCD camera positioning, it realizes automatic attachment of OCs. The overall process is fast, with high assembly accuracy and high yield, reducing human error and improving efficiency. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 Front view of the automatic OC bonding device;

[0031] Figure 2 Top view of the automatic OC bonding device.

[0032] The attached diagram lists the components represented by each number as follows:

[0033] 1. Gantry transfer and feeding mechanism; 2. Robotic arm; 3. Assembly station; 31. CCD camera; 32. Assembly platform; 4. OC; 5. Material bin; 6. Sorting platform; 7. Front servo module; 8. Rear servo module; 9. Left servo module; 10. Right servo module; 11. Z-axis lifting module; 12. Fixed frame; 13. Y-axis transfer mechanism; 14. Assembly suction cup; 15. Floating pusher; 16. Pusher; 17. Backplate conveyor line; 18. Backplate carrier; 19. Blocking mechanism. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solution of this utility model, the technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Based on the embodiments of this utility model, other similar embodiments obtained by those skilled in the art without creative effort should all fall within the protection scope of this utility model. Furthermore, directional terms mentioned in the following embodiments, such as "up," "down," "left," and "right," are only for reference to the directions in the accompanying drawings; therefore, the directional terms used are for illustrative purposes and not for limiting the scope of this utility model.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0036] The present invention will be further described below with reference to the accompanying drawings and preferred embodiments.

[0037] Example:

[0038] like Figure 1-2 As shown, this is a preferred embodiment of the present invention, an automatic OC bonding device, including a gantry transfer and feeding mechanism 1, a hopper 5, a regular intermediate platform, a robotic arm 2 and an assembly station 3;

[0039] The bottom of the gantry transplanting and feeding mechanism 1 is provided with a hopper 5, and the gantry transplanting and feeding mechanism 1 is provided with a regular intermediate platform in the conveying direction. An assembly station 3 is provided on one side of the regular intermediate platform, and a robotic arm 2 is provided between the assembly station 3 and the regular intermediate platform. A CCD camera 31 is provided on the assembly station 3.

[0040] The gantry transfer and feeding mechanism 1 transports the OC4 in the hopper 5 to the regularization intermediate platform for regularization and positioning, and then the robotic arm 2 transports it to the assembly station 3. Based on the position information provided by the CCD camera 31, the robotic arm 3 is controlled to attach the OC4.

[0041] The gantry transfer and loading mechanism 1 includes a Y-axis transfer mechanism 13, an assembly suction cup 14, a fixed frame 12, and a Z-axis lifting module 11. The two ends of the fixed frame 12 are respectively connected to the slide rail, and the fixed frame 12 is driven by the Y-axis transfer mechanism 13 to reciprocate along the horizontal direction of the linear guide rail. The Z-axis lifting module 11 is installed on the fixed frame 12, and the assembly suction cup 14 is connected to the bottom of the Z-axis lifting module 11.

[0042] The Y-axis transplanting mechanism 13 adopts a linear guide rail mechanism, and the Z-axis lifting module 11 adopts a rack and pinion lifting module.

[0043] The alignment intermediate platform is located at the bottom of the Y-axis transplanting mechanism 13. The alignment intermediate platform includes an alignment platform 6, a servo module, and a POM support block. The POM support block is centrally located below the alignment platform 6, and an FPC is placed on the POM support block.

[0044] The regularized platform 6 is a rectangular platform, and the servo module includes a front servo module 7, a rear servo module 8, a left servo module 9, and a right servo module 10 respectively disposed on the four sides of the rectangular platform;

[0045] The front servo module 7 and the left servo module 9 each include a push block 16 and a telescopic mechanism, with the push block 16 connected to the output end of the telescopic mechanism; the rear servo module 8 and the right servo module 10 each include a floating push block 15, a spring, a slide rail, and a baffle; the floating push block 15 is mounted on the slide rail, a baffle is mounted at one end of the slide rail, and one end of the spring is connected to the floating slider, while the other end is connected to the baffle.

[0046] The automatic OC bonding device also includes a backplate conveyor line 17, a backplate carrier 18 and a blocking mechanism 19, wherein the backplate carrier 18 is transported along the backplate conveyor line 17.

[0047] The back panel conveyor line 17 passes through the assembly station 3, and the blocking mechanism 19 is installed on the assembly station 3; the blocking mechanism 3 includes a stop block and a blocking cylinder, and the stop block is connected to the output end of the blocking cylinder.

[0048] The backplate is placed on the rotating backplate carrier 18, and the blocking mechanism 19 is used to stop the backplate carrier 18; when the blocking cylinder is in the extended state, the rotating backplate carrier 18 stops after hitting the block. After assembly, the blocking cylinder retracts, and the backplate carrier 18 flows out.

[0049] The robotic arm 2 is equipped with a suction cup gripper at its gripping end for grasping OC4 and placing it on the assembly station 3. A film-tearing station is also located next to the robotic arm 2. After the robotic arm 2 grasps OC4, the film is manually peeled off by workers at the film-tearing station.

[0050] The assembly station 3 includes an assembly platform 32 and a CCD camera 31. A support frame is provided above the assembly platform 32, and the CCD camera 31 is mounted on the support frame. The CCD camera 31 guides the robotic arm 2 to attach the OC4 to the back plate by photographing the relative position of the back plate and the OC4.

[0051] Based on the image taken by the CCD camera 31, the position of the back plate and OC4 is located. Based on the position information provided by the CCD camera 31, the robotic arm 2 is adjusted so that the robotic arm 2 attaches OC4 to the back plate.

[0052] The automatic OC bonding device also includes a control module, which is connected to the gantry transfer feeding mechanism 1, the robotic arm 2, the servo module and the CCD camera 31 respectively.

[0053] Finally, it should be noted that the above content is only used to illustrate the technical solution of this utility model, and is not intended to limit the scope of protection of this utility model. Simple modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model do not depart from the essence and scope of the technical solution of this utility model.

Claims

1. An automatic OC bonding device, characterized in that, This includes a gantry-type material transfer and loading mechanism, a hopper, a standardized intermediate platform, a robotic arm, and an assembly station; The bottom of the gantry transplanting and feeding mechanism is equipped with a hopper, and the regularized intermediate platform is set in the conveying direction of the gantry transplanting and feeding mechanism. An assembly station is set on one side of the regularized intermediate platform, and a robotic arm is set between the assembly station and the regularized intermediate platform. A CCD camera is set on the assembly station. The gantry transfer and feeding mechanism transports the OC in the hopper to the regularization intermediate platform for regularization and positioning, and then the robotic arm transports it to the assembly station. Based on the position information provided by the CCD camera, the robotic arm is controlled to attach the material.

2. The automatic OC bonding device according to claim 1, characterized in that, The gantry transfer and feeding mechanism includes a Y-axis transfer mechanism, an assembly suction cup, a fixing frame, and a Z-axis lifting module; A Y-axis transplanting mechanism is installed at the bottom of the fixed frame, which drives the fixed frame to reciprocate horizontally along the linear guide rail; the Z-axis lifting module is installed on the fixed frame, and the bottom of the Z-axis lifting module is connected to the assembly suction cup.

3. The automatic OC bonding device according to claim 2, characterized in that, The Y-axis transplanting mechanism adopts a linear guide rail mechanism, and the Z-axis lifting module adopts a rack and pinion lifting module.

4. The automatic OC bonding device according to claim 2, characterized in that, The alignment intermediate platform is located at the bottom of the Y-axis transplanting mechanism. The alignment intermediate platform includes an alignment platform, a servo module, and a POM support block. The POM support block is centrally located below the alignment platform, and an FPC is placed on the POM support block. The FPC is connected to the OC. The regularized platform is a rectangular platform, and the servo module includes a front servo module, a rear servo module, a left servo module, and a right servo module respectively disposed on the four sides of the rectangular platform; The front servo module and the left servo module each include a push block and a telescopic mechanism, with the push block connected to the output end of the telescopic mechanism; the rear servo module and the right servo module each include a floating push block, a spring, a slide rail, and a baffle; the floating push block is mounted on the slide rail, a baffle is mounted at one end of the slide rail, one end of the spring is connected to the floating slider, and the other end is connected to the baffle.

5. The automatic OC bonding device according to claim 1, characterized in that, The automatic OC bonding device also includes a backplate conveyor line, a backplate carrier, and a blocking mechanism, wherein the backplate carrier is transported along the backplate conveyor line; The backplate conveyor line passes through the assembly station, and the blocking mechanism is installed on the assembly station; the blocking mechanism includes a stop block and a blocking cylinder, and the stop block is connected to the output end of the blocking cylinder.

6. The automatic OC bonding device according to claim 1, characterized in that, The robotic arm is equipped with a suction cup gripper at its gripping end, which is used to grasp the OC and place it on the assembly station.

7. The automatic OC bonding device according to claim 1, characterized in that, A film-tearing station is also set up next to the robotic arm.

8. The automatic OC bonding device according to claim 4, characterized in that, The assembly station includes an assembly platform; a support frame is provided above the assembly platform, and a CCD camera is mounted on the support frame. The CCD camera guides the robotic arm to attach the OC to the back plate by capturing the relative position of the back plate and the OC.

9. The automatic OC bonding device according to claim 8, characterized in that, The automatic OC bonding device also includes a control module, which is connected to the gantry transfer feeding mechanism, the robotic arm, the servo module, and the CCD camera signal.

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