Multi-spliced PCB (Printed Circuit Board)

Abstract

The utility model relates to the technical field of PCBs, and discloses a multi-spliced PCB, which comprises a PCB substrate. The PCB substrate comprises a first PCB unit group and a second PCB unit group, wherein the first PCB unit group comprises a plurality of first PCBs, the long sides of the first PCBs are parallel to the first long sides of the PCB substrate, and the first PCBs are arranged on the PCB substrate in an array splicing manner; the second PCB unit group comprises a plurality of second PCBs, the long sides of the second PCBs are parallel to the second long sides of the PCB substrate, and the second PCBs are spliced on the PCB substrate in parallel; and the first long edge and the second long edge of the PCB substrate are perpendicular to each other. The multi-spliced PCB provided by the utility model not only can effectively improve the overall utilization rate of the PCB substrate and reduce the overall waste of the PCB substrate so as to effectively reduce the overall cost of the PCB product, but also can effectively improve the production quality and production efficiency of the PCB product.

Description

Technical Field

[0001] This utility model relates to the field of PCB board technology, specifically to a multi-panel PCB board. Background Technology

[0002] PCB, also known as printed circuit board, is an important electronic component in electronic products. It is generally located inside electronic products and is used for the control and regulation of electronic products.

[0003] To improve the overall production efficiency of PCB products, multi-board splicing is generally used to achieve PCB product production. In the existing technology, the substrate used to produce PCB products is generally a substrate of a specific size, and is generally a square board, depending on the process of the upstream supplier. When the PCB products to be produced are rectangular and distributed on the substrate in an array along one side, it is easy for the PCB products to not completely fill the substrate, resulting in substrate waste.

[0004] Therefore, designing a technology that can effectively improve substrate utilization and reduce PCB product costs is of great significance to the development of electronic products. Utility Model Content

[0005] To address the shortcomings of the prior art, this utility model provides a multi-panel PCB board, including a PCB substrate. The PCB substrate includes a first PCB unit group and a second PCB unit group. The long sides of individual PCB products in the two PCB unit groups are perpendicular to each other and spliced ​​on the PCB substrate. Compared with the PCB product array distribution method in the prior art, this method can effectively improve the overall utilization rate of the PCB substrate, reduce the overall waste of the PCB substrate, and thus effectively reduce the overall cost of the PCB product.

[0006] The technical effects to be achieved by this utility model are realized through the following technical aspects:

[0007] This utility model provides a multi-panel PCB board, including a PCB substrate; the PCB substrate includes:

[0008] The first PCB board unit group includes multiple first PCB boards whose long sides are parallel to the first long side of the PCB substrate and are arranged in an array on the PCB substrate;

[0009] And a second PCB board unit group, including multiple second PCB boards whose long sides are parallel to the second long side of the PCB substrate and are spliced ​​on the PCB substrate;

[0010] Furthermore, the first long side and the second long side of the PCB substrate are perpendicular to each other.

[0011] As one preferred embodiment, the first PCB board and the second PCB board have the same structure, both being rectangular PCB board structures.

[0012] As one preferred embodiment, the length of the long side of the first PCB board and the second PCB board is 1.5 to 2 times the length of their short side.

[0013] As one preferred embodiment, the PCB substrate further includes a first partition groove disposed between the long sides of two adjacent first PCB boards, a second partition groove disposed between the short sides of two adjacent first PCB boards, and a third partition groove disposed between the long sides of two adjacent second PCB boards.

[0014] As a preferred embodiment, the PCB substrate further includes a board group separator plate spliced ​​between the first PCB board unit group and the second PCB board unit group; the width of the board group separator plate is at least 1 times the width between the long sides of two adjacent first PCB boards.

[0015] As one preferred embodiment, a first board group slab slot is provided between the board group separator and the first PCB board unit group, and a second board group slab slot is provided between the board group separator and the second PCB board unit group.

[0016] As one preferred embodiment, the PCB substrate further includes a first protective strip spliced ​​on the side of the first PCB board unit group away from the second PCB board unit group, a second protective strip spliced ​​on the side of the second PCB board unit group away from the first PCB board unit group, and a third protective strip spliced ​​on both sides of the first PCB board unit group and the second PCB board unit group, connecting the two ends of the first protective strip and the second protective strip.

[0017] As one preferred embodiment, the PCB substrate further includes a first protective partition groove disposed between the first protective strip and the first PCB board unit group, a second protective partition groove disposed between the second protective strip and the second PCB board unit group, and a third protective partition groove disposed between the third protective strip and the first PCB board unit group and the second PCB board unit group.

[0018] As one preferred embodiment, the PCB substrate further includes a filler plate spliced ​​between the third protective strip and the second PCB board unit group.

[0019] As one preferred embodiment, the filler plate is disposed on one side of the second PCB board unit group, or symmetrically disposed on both sides of the second PCB board unit group.

[0020] In summary, this utility model has at least the following advantages:

[0021] The multi-panel PCB board provided by this utility model includes a PCB substrate, wherein the PCB substrate includes a first PCB board unit group and a second PCB board unit group. The long sides of individual PCB board products in the two PCB board unit groups are perpendicular to each other and spliced ​​on the PCB substrate. Compared with the existing PCB board product array distribution method, it can effectively improve the overall utilization rate of the PCB substrate, reduce the overall waste of the PCB substrate, and thus effectively reduce the overall cost of the PCB board products. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the multi-panel PCB board in the embodiment of this utility model.

[0023] Figure 2 for Figure 1 Enlarged diagram of point A in the middle.

[0024] Figure 3 for Figure 1 Enlarged diagram of point B in the middle.

[0025] Figure label:

[0026] 10. PCB substrate;

[0027] 100. First PCB board unit group; 110. First PCB board;

[0028] 200. Second PCB board unit group; 210. Second PCB board;

[0029] 310. First dividing groove; 320. Second dividing groove; 330. Third dividing groove;

[0030] 400, Plate group partition plate; 410, First plate group partition groove; 420, Second plate group partition groove;

[0031] 510. First protective strip; 520. Second protective strip; 530. Third protective strip; 540. First protective partition groove; 550. Second protective partition groove; 560. Third protective partition groove;

[0032] 600. Filler plate. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this utility model, not all embodiments.

[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0035] Example 1:

[0036] Please see the appendix Figure 1 The multi-panel PCB board of this utility model embodiment includes a PCB substrate 10; the PCB substrate 10 includes a first PCB board unit group 100 and a second PCB board unit group 200; wherein, the first PCB board unit group 100 includes a plurality of first PCB boards 110 whose long sides are parallel to the first long side L1 of the PCB substrate 10 and are arranged in an array on the PCB substrate 10; the second PCB board unit group 200 includes a plurality of second PCB boards 210 whose long sides are parallel to the second long side L2 of the PCB substrate 10 and are arranged in parallel on the PCB substrate 10; and the first long side and the second long side of the PCB substrate 10 are perpendicular to each other, that is, the long sides of the first PCB board 110 and the second PCB board 210 are also perpendicular to each other.

[0037] When laying out the PCB substrate 10, the first PCB board 110 can be first arranged in a matrix on the PCB substrate 10 with its long side parallel to the first long side L1 of the PCB substrate 10. When the remaining width of the second long side L2 of the PCB substrate 10 is insufficient to set up two columns of the first PCB board 110, multiple second PCB boards 210 with their long sides parallel to the second long side L2 of the PCB substrate 10 are used to lay out the PCB substrate 10. Compared with the layout method of PCB boards being arranged in the same direction array on the PCB substrate 10, the utilization rate of the PCB substrate 10 can be effectively improved, the overall waste of the PCB substrate 10 can be reduced, and the overall cost of the PCB board product can be effectively reduced.

[0038] With attachment Figure 1For example, when the width of the first long side L1 of the PCB substrate 10 can accommodate two rows of first PCB boards 110, and the width of the second long side L2 of the PCB substrate 10 can accommodate three columns of first PCB boards 110, but is insufficient to accommodate four rows of first PCB boards 110, the PCB substrate 10 can be laid out using three second PCB boards 210 whose long sides are perpendicular to the first PCB boards 110. Compared to laying the first PCB boards 110 in a 2-row, 3-column layout to form six PCB products, laying the first PCB boards 110 in a 2-row, 2-column layout combined with three second PCB boards 210 can form seven PCB products, effectively improving the utilization rate of the PCB substrate 10 and increasing the production quantity of PCB products on the same PCB substrate 10.

[0039] Furthermore, the PCB substrate 10 has a square board structure; the first PCB board 110 and the second PCB board 210 have the same structure, both being rectangular PCB board structures. Preferably, the length of the long side of the first PCB board 110 and the second PCB board 210 is 1.5-2 times the length of its short side.

[0040] The multi-panel PCB board of this utility model embodiment includes a PCB substrate 10 comprising a first PCB board unit group 100 and a second PCB board unit group 200. The long sides of individual PCB board products in the two PCB board unit groups are perpendicular to each other and are spliced ​​on the PCB substrate 10. Compared with the PCB board product array distribution method in the prior art, it can effectively improve the overall utilization rate of the PCB substrate 10, reduce the overall waste of the PCB substrate 10, and thus effectively reduce the overall cost of the PCB board products.

[0041] Example 2:

[0042] Please see the appendix Figure 1 The multi-panel PCB board of this embodiment is the same as that of Embodiment 1, both including a PCB substrate 10; the PCB substrate 10 includes a first PCB board unit group 100 and a second PCB board unit group 200; wherein, the first PCB board unit group 100 includes a plurality of first PCB boards 110 whose long sides are parallel to the first long side L1 of the PCB substrate 10 and are arrayed and spliced ​​on the PCB substrate 10; the second PCB board unit group 200 includes a plurality of second PCB boards 210 whose long sides are parallel to the second long side L2 of the PCB substrate 10 and are spliced ​​and parallel on the PCB substrate 10; and the first long side and the second long side of the PCB substrate 10 are perpendicular to each other. The main difference is:

[0043] Please refer to the appendix for further details. Figure 2The PCB substrate 10 also includes a first partition groove 310 disposed between the long sides of two adjacent first PCB boards 110, a second partition groove 320 disposed between the short sides of two adjacent first PCB boards 110, and a third partition groove 330 disposed between the long sides of two adjacent second PCB boards 210; these features effectively facilitate subsequent cutting and segmentation of the PCB product, thereby improving the efficiency and quality of PCB product forming. Preferably, the first partition groove 310, the second partition groove 320, and the third partition groove 330 are all V-shaped groove structures, with a maximum depth of 15%-30% of the thickness of the PCB substrate 10. This not only effectively facilitates the forming of the PCB product but also effectively ensures the overall stability of the PCB substrate 10, preventing the PCB substrate 10 from breaking during the manufacturing process.

[0044] Please see the appendix Figure 1 Furthermore, the PCB substrate 10 also includes a board group separator 400 spliced ​​between the first PCB board unit group 100 and the second PCB board unit group 200; effectively facilitating the separation and production of the first PCB board unit group 100 and the second PCB board unit group 200; preferably, the width of the board group separator 400 is at least twice the width between the long sides of two adjacent first PCB boards 110, that is, the width of the board group separator 400 is at least the width between the long sides of two adjacent first PCB boards 110. Please refer to the appendix for further details. Figure 3 More preferably, a first board group partitioning groove 410 is provided between the board group partition plate 400 and the first PCB board unit group 100, and a second board group partitioning groove 420 is provided between the board group partition plate 400 and the second PCB board unit group 200; this effectively facilitates the subsequent cutting and segmentation of PCB products, and effectively improves the efficiency and quality of PCB product forming. Similarly, the structure of the first board group partitioning groove 410 and the second board group partitioning groove 420 is the same as that of the first partitioning groove 310, the second partitioning groove 320 and the third partitioning groove 330, which is a V-shaped groove structure, and the maximum depth of the groove is 15%-30% of the thickness of the PCB substrate 10; this not only effectively facilitates the forming of PCB products, but also effectively ensures the overall stability of the PCB substrate 10, so as to prevent the PCB substrate 10 from breaking during the manufacturing process.

[0045] The multi-panel PCB board of this utility model embodiment, based on embodiment 1, further improves the layout and structural design of the PCB substrate 10, which can not only effectively improve the overall utilization rate of the PCB substrate 10 and reduce the overall waste of the PCB substrate 10, but also effectively improve the production efficiency of PCB products.

[0046] Example 3:

[0047] Please see the appendix Figure 1The multi-panel PCB board of this embodiment is the same as that of Embodiment 1 or 2, both including a PCB substrate 10; the PCB substrate 10 includes a first PCB board unit group 100 and a second PCB board unit group 200; wherein, the first PCB board unit group 100 includes a plurality of first PCB boards 110 whose long sides are parallel to the first long side L1 of the PCB substrate 10 and are arranged in an array on the PCB substrate 10; the second PCB board unit group 200 includes a plurality of second PCB boards 210 whose long sides are parallel to the second long side L2 of the PCB substrate 10 and are arranged in parallel on the PCB substrate 10; and the first long side and the second long side of the PCB substrate 10 are perpendicular to each other. The main difference is:

[0048] Furthermore, the PCB substrate 10 also includes a first protective strip 510 spliced ​​on the side of the first PCB unit group 100 away from the second PCB unit group 200, a second protective strip 520 spliced ​​on the side of the second PCB unit group 200 away from the first PCB unit group 100, and a third protective strip 530 spliced ​​on both sides of the first PCB unit group 100 and the second PCB unit group 200 and connected between the two ends of the first protective strip 510 and the second protective strip 520; the first protective strip 510, the second protective strip 520 and the third protective strip 530 are combined and surround the outer periphery of the first PCB unit group 100 and the second PCB unit group 200, which can effectively prevent the safety of the first PCB unit group 100 and the second PCB unit group 200 during the production process and prevent the first PCB unit group 100 and the second PCB unit group 200 from being damaged during the production process.

[0049] Furthermore, the PCB substrate 10 also includes a first protective separation groove 540 disposed between the first protective strip 510 and the first PCB board unit group 100, a second protective separation groove 550 disposed between the second protective strip 520 and the second PCB board unit group 200, and a third protective separation groove 560 disposed between the third protective strip 530 and the first PCB board unit group 100 and the second PCB board unit group 200; this effectively facilitates the subsequent separation of the first protective strip 510, the second protective strip 520, and the third protective strip 530 from the PCB product, effectively improving the efficiency and convenience of PCB product molding. Similarly, the first protective separation groove 540, the second protective separation groove 550, and the third protective separation groove 560 are V-shaped groove structures, and the maximum depth of the groove is 15%-30% of the thickness of the PCB substrate 10.

[0050] Furthermore, the PCB substrate 10 also includes a filler plate 600 spliced ​​between the third protective strip 530 and the second PCB board unit group 200; that is, the part of the PCB substrate 10 not used for PCB product production; mainly used to fill the gap between the first PCB board unit group 100 and the second PCB board unit group 200, ensuring the overall consistency and stability of the PCB substrate 10. Preferably, the filler plate 600 is disposed on one side of the second PCB board unit group 200, or symmetrically disposed on both sides of the second PCB board unit group 200; it can be set according to actual production needs.

[0051] The multi-panel PCB board of this utility model embodiment, based on embodiment 1 or 2, has further protection and filling design for the PCB substrate, which can not only effectively improve the overall utilization rate of the PCB substrate and reduce the overall waste of the PCB substrate, but also effectively improve the production quality of PCB products.

[0052] As can be seen from the technical solutions of the above embodiments, the present invention provides a multi-panel PCB board, which can not only effectively improve the overall utilization rate of the PCB substrate and reduce the overall waste of the PCB substrate, thereby effectively reducing the overall cost of the PCB board product, but also effectively improve the production quality and production efficiency of the PCB product.

[0053] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0054] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0055] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0056] In this invention, unless otherwise expressly specified and limited, "above or below" the first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" the first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0057] Although the description of this utility model has been given in conjunction with the specific embodiments described above, it is obvious to those skilled in the art that many substitutions, modifications, and variations can be made based on the above description. Therefore, all such substitutions, modifications, and variations are included within the spirit and scope of the appended claims.

Claims

1. A multi-panel PCB board, characterized in that, Includes a PCB substrate (10); the PCB substrate (10) includes: The first PCB board unit group (100) includes multiple first PCB boards (110) whose long sides are parallel to the first long side of the PCB substrate (10) and are arranged in an array on the PCB substrate (10). And the second PCB board unit group (200), including multiple second PCB boards (210) whose long sides are parallel to the second long side of the PCB substrate (10) and are spliced ​​on the PCB substrate (10). Furthermore, the first long side and the second long side of the PCB substrate (10) are perpendicular to each other.

2. The multi-panel PCB board according to claim 1, characterized in that, The first PCB board (110) and the second PCB board (210) have the same structure, both being rectangular PCB board structures.

3. The multi-panel PCB board according to claim 2, characterized in that, The length of the long side of the first PCB board (110) and the second PCB board (210) is 1.5-2 times the length of its short side.

4. The multi-panel PCB board according to claim 1, characterized in that, The PCB substrate (10) further includes a first partition groove (310) disposed between the long sides of two adjacent first PCB boards (110), a second partition groove (320) disposed between the short sides of two adjacent first PCB boards (110), and a third partition groove (330) disposed between the long sides of two adjacent second PCB boards (210).

5. The multi-panel PCB board according to claim 1, characterized in that, The PCB substrate (10) further includes a board group partition (400) spliced ​​between the first PCB board unit group (100) and the second PCB board unit group (200); the width of the board group partition (400) is at least 1 times the width between the long sides of two adjacent first PCB boards (110).

6. The multi-panel PCB board according to claim 5, characterized in that, A first board group partition groove (410) is provided between the board group partition plate (400) and the first PCB board unit group (100), and a second board group partition groove (420) is provided between the board group partition plate (400) and the second PCB board unit group (200).

7. The multi-panel PCB board according to claim 1, characterized in that, The PCB substrate (10) further includes a first protective strip (510) spliced ​​on the side of the first PCB board unit group (100) away from the second PCB board unit group (200), a second protective strip (520) spliced ​​on the side of the second PCB board unit group (200) away from the first PCB board unit group (100), and a third protective strip (530) spliced ​​on both sides of the first PCB board unit group (100) and the second PCB board unit group (200) and connected between the two ends of the first protective strip (510) and the second protective strip (520).

8. The multi-panel PCB board according to claim 7, characterized in that, The PCB substrate (10) further includes a first protective partition groove (540) disposed between the first protective strip (510) and the first PCB board unit group (100), a second protective partition groove (550) disposed between the second protective strip (520) and the second PCB board unit group (200), and a third protective partition groove (560) disposed between the third protective strip (530) and the first PCB board unit group (100) and the second PCB board unit group (200).

9. The multi-panel PCB board according to claim 7, characterized in that, The PCB substrate (10) also includes a filler plate (600) spliced ​​between the third protective strip (530) and the second PCB board unit group (200).

10. The multi-panel PCB board according to claim 9, characterized in that, The filler plate (600) is disposed on one side of the second PCB board unit group (200), or symmetrically disposed on both sides of the second PCB board unit group (200).

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