Graphene liquid cooling plate and electronic equipment

Abstract

The utility model relates to a graphene liquid cooling plate and electronic equipment. The graphene liquid cooling plate comprises a liquid cooling plate body and a graphene vapor chamber. A first area and a second area are arranged in the liquid cooling plate body. And the first area and the second area are distributed along the thickness direction of the liquid cooling plate body. And in a projection plane along the thickness direction of the liquid cooling plate body, at least part of the area of the second region is overlapped with the first region. A liquid flow channel is formed in the first area, and a graphene uniform temperature plate is assembled in the second area. After the graphene vapor chamber is assembled, the problem of uneven heat dissipation can be effectively solved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a graphene liquid cooling plate and electronic device. Background Technology

[0002] In fields such as high-performance computers, servers, and power battery packs for new energy vehicles, equipment generates a significant amount of heat during operation. Liquid cooling plates, as commonly used heat dissipation components, consist of an outer metal plate and internal fine liquid channels, offering advantages such as high heat transfer efficiency and customizability. However, as electronic products become increasingly miniaturized, integrated, lightweight, and high-powered, their heat density continues to rise. Heat concentration points easily appear on liquid cooling plates, and excessively high temperatures at these locations can severely impact the lifespan of electronic components, thereby reducing the reliability of the entire system. Existing liquid cooling plates struggle to address the problem of uneven heat dissipation. Utility Model Content

[0003] Therefore, it is necessary to provide a graphene liquid cooling plate to address the problem of uneven heat dissipation in liquid cooling plates.

[0004] A graphene liquid cooling plate includes:

[0005] The liquid cooling plate body has a first region and a second region arranged along the thickness direction inside, and a liquid flow channel is opened in the first region.

[0006] A graphene vapor chamber is assembled in the second region; in a planar projection along the thickness direction of the liquid cooling plate body, at least a portion of the area of ​​the second region coincides with that of the first region.

[0007] In one embodiment, a groove is formed on the second region of the liquid cooling plate body, and a graphene heat spreader is disposed in the groove, with the graphene heat spreader conforming to the groove.

[0008] In one embodiment, a metal overlay is provided on the outside of the groove.

[0009] In one embodiment, the liquid cooling plate body has a liquid flow hole that connects to the interior of the liquid flow channel.

[0010] In one embodiment, the cross-sectional shape of the liquid flow channel is one or more combinations of a circle, a square, or a trapezoid.

[0011] In one embodiment, the graphene heat spreader is made by hot pressing and sintering alternating layers of graphene film and pure aluminum foil.

[0012] In one embodiment, the area of ​​the second region accounts for at least fifty percent of the total area of ​​the liquid cooling plate body.

[0013] In one embodiment, a metal welding layer is further included, with the graphene heat spreader disposed between the graphene heat spreader and the metal covering layer; and / or, the graphene heat spreader is disposed between the graphene heat spreader and the groove.

[0014] In one embodiment, the liquid cooling plate body is integrally formed.

[0015] An electronic device equipped with a graphene liquid cooling plate as described above.

[0016] The aforementioned graphene liquid cooling plate includes a liquid cooling plate body and a graphene vapor chamber. The liquid cooling plate body has a first region and a second region internally. The first and second regions are distributed along the thickness direction of the liquid cooling plate body. In a projection plane along the thickness direction of the liquid cooling plate body, at least a portion of the area of ​​the second region overlaps with the first region. A liquid flow channel is formed within the first region, and the graphene vapor chamber is assembled inside the second region. The assembled graphene vapor chamber effectively solves the problem of uneven heat dissipation.

[0017] An electronic device equipped with the aforementioned graphene liquid cooling plate has the aforementioned beneficial effects. Attached Figure Description

[0018] Figure 1 This is an assembly diagram of the graphene liquid cooling plate provided in an embodiment of this application.

[0019] Figure 2 This is a schematic diagram of the structure of the graphene liquid cooling plate provided in the embodiments of this application.

[0020] Icon labels:

[0021] 1000, Liquid cooling plate body; 1001, Groove; 1002, Liquid flow hole; 2000, Graphene heat spreader; 3000, Metal covering layer. Detailed Implementation

[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0023] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0025] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0028] See Figure 1 and Figure 2 As shown, Figure 1 This is an assembly diagram of the graphene liquid cooling plate provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a graphene liquid-cooled plate provided in an embodiment of this application. A graphene liquid-cooled plate is provided. The graphene liquid-cooled plate includes a liquid-cooled plate body 1000 and a graphene heat spreader 2000. A first region and a second region are disposed inside the liquid-cooled plate body 1000. The first region and the second region are distributed along the thickness direction of the liquid-cooled plate body 1000. In a projection plane along the thickness direction of the liquid-cooled plate body 1000, at least a portion of the area of ​​the second region overlaps with the first region.

[0029] The space referred to in the first region can be either three-dimensional, such as the area occupied by a three-dimensional cube, sphere, or irregular polyhedron, or two-dimensional, such as the area covered by a two-dimensional circle, rectangle, or triangle. This region can be flexibly set into various specific and unique shapes according to actual needs. Similarly, the second region also has this characteristic. Whether in a three-dimensional dimension, it can be shaped into three-dimensional shapes such as cylinders or cones, or in a two-dimensional realm, it can be set into two-dimensional shapes such as trapezoids or rhombuses, all can be determined according to the specific requirements of the context.

[0030] The core purpose of dividing the first and second regions is to clearly demonstrate their relative positional relationship. For example, the first region may be located above, below, to the left, or to the right of the second region, or they may partially overlap. The specific "regions" mentioned here have considerable flexibility and are not overly strictly defined to accommodate diverse application scenarios and needs. Within the first region, liquid channels are provided for coolant flow, achieving initial heat dissipation. Simultaneously, a graphene vapor chamber 2000 is installed inside the second region, effectively addressing uneven heat dissipation. Furthermore, at least a portion of the second region covers the first region; this arrangement, in conjunction with the liquid channels in the first region, further optimizes the heat dissipation effect.

[0031] The first zone plays a crucial role in the initial cooling of the coolant during the entire liquid cooling process. The liquid channels are the pathways through which the coolant circulates, driven by pumps and other power devices. When the coolant flows near a heat source, it absorbs heat, thus achieving initial cooling of the heat source. This method of removing heat through liquid convection has high heat dissipation efficiency. The second zone is equipped with a graphene vapor chamber 2000.

[0032] Graphene was combined with metal foil to create a graphene heat spreader 2000, which preserved the high thermal conductivity of graphene as much as possible. The final material density was 2.2-2.3 g / cm³. 3 (grams per cubic centimeter), thermal conductivity can reach 800-1000 W / (m·K) (watts per meter Kelvin), density is higher than aluminum's 2.7 g / cm³. 3 Lighter.

[0033] The graphene vapor chamber 2000 possesses excellent thermal conductivity, enabling rapid and uniform heat transfer. In practical operation, when electronic devices generate heat, the heat is transferred to the graphene vapor chamber 2000, where graphene rapidly conducts the heat across the entire vapor chamber, resulting in uniform temperature distribution and preventing heat concentration points. Furthermore, at least a portion of the second region covers the first region. This layout design allows the graphene vapor chamber 2000 to work collaboratively with the liquid flow channels in the first region. On one hand, residual heat after initial cooling by the liquid flow channels can be further homogenized by the graphene vapor chamber 2000; on the other hand, the heat evenly distributed by the graphene vapor chamber 2000 can be further removed through the coolant circulation in the liquid flow channels, thereby further optimizing the overall heat dissipation effect of the liquid cooling plate, ensuring uniform temperature across all parts of the electronic device, and improving the operational stability of the equipment. The heat dissipation effect of the entire graphene liquid cooling plate is greatly optimized; when it is closely attached to heat sources such as electronic devices, it can ensure that the temperature of each part of the electronic device is uniform, effectively reduce the overall temperature of the device, avoid performance degradation and shortened life due to local overheating, significantly improve the stability and reliability of electronic device operation, and extend the service life of electronic devices.

[0034] In some embodiments of this application, a groove 1001 is formed in the second region of the liquid cooling plate body 1000. The groove 1001 is formed to precisely fit the installation of the graphene heat spreader 2000. The graphene heat spreader 2000 is disposed within the groove 1001 and conformally fits the groove 1001. This conformal fitting means that the shape of the graphene heat spreader 2000 precisely matches the shape of the groove 1001, and the two are in close contact.

[0035] The groove 1001 maximizes heat conduction between the graphene vapor chamber 2000 and the liquid cooling plate body 1000. Due to their tight fit, thermal resistance is reduced, allowing heat to be transferred more efficiently from the liquid cooling plate body 1000 to the graphene vapor chamber 2000, thus achieving rapid and uniform heat dissipation. Secondly, the conformal fit ensures the stability of the graphene vapor chamber 2000 within the groove 1001. During equipment operation, even under external forces such as vibration, the graphene vapor chamber 2000 is not prone to displacement, ensuring the continuity and stability of the heat dissipation effect.

[0036] The thickness of the groove 1001 is the same as the thickness of the graphene heat spreader 2000. After assembly, the graphene heat spreader 2000 can completely fill the groove 1001.

[0037] In some embodiments of this application, a metal covering layer 3000 is provided on the outside of the groove 1001. The metal covering layer 3000 is typically made of a metal material with good thermal conductivity, such as aluminum alloy. The metal covering layer 3000 serves multiple purposes. On one hand, the metal covering layer 3000 protects the graphene vapor chamber 2000 within the groove 1001. In actual use, the equipment may be affected by external factors such as collisions and dust. The metal covering layer 3000 can prevent physical damage to the graphene vapor chamber 2000, extending its service life. On the other hand, the good thermal conductivity of the metal covering layer 3000 itself allows it to assist in heat dissipation. When the graphene vapor chamber 2000 distributes heat evenly, some of the heat is transferred to the metal covering layer 3000, which can quickly dissipate this heat into the surrounding environment, further improving the heat dissipation performance of the liquid cooling plate and enhancing the overall ability of the liquid cooling plate to meet the heat dissipation requirements of high-power equipment.

[0038] In some embodiments of this application, a liquid flow hole 1002 is provided on the liquid cooling plate body 1000. The liquid flow hole 1002 is a channel for coolant to enter the liquid flow channel. The liquid flow hole 1002 communicates with the interior of the liquid flow channel, and the coolant enters the liquid flow channel through the liquid flow hole 1002 via an external coolant supply device, such as a coolant tank and a circulation pump.

[0039] By designing the position of the liquid flow hole 1002, it is ensured that the coolant flows evenly into the liquid channel, avoiding situations where the flow rate is too high or too low in certain areas. This arrangement guarantees the circulation of coolant within the liquid cooling plate, continuously carrying away the heat generated by the heat source and ensuring continuous heat dissipation. Only with continuous coolant circulation can the stable heat dissipation effect of the liquid cooling plate be maintained, allowing electronic equipment to maintain a suitable temperature during long-term operation.

[0040] In some embodiments of this application, the cross-sectional shape of the liquid flow channel can be one or more combinations of circles, squares, or trapezoids. Different cross-sectional shapes affect the flow rate, flow volume, and contact area with the liquid cooling plate wall of the coolant, thereby affecting the heat dissipation effect. Combinations of various shapes can be flexibly adjusted according to actual heat dissipation requirements.

[0041] In some embodiments of this application, the graphene heat spreader 2000 is made by hot pressing and sintering alternating layers of graphene film and pure aluminum foil.

[0042] Graphene film is a two-dimensional material composed of carbon atoms with extremely high thermal conductivity, making it one of the best-performing thermally conductive materials known to date. In the Graphene Heat Spreader 2000, the graphene film plays a crucial role in rapidly conducting heat. When heat is transferred to the graphene film, it can quickly diffuse across the entire film surface, laying the foundation for achieving uniform heat dissipation.

[0043] Pure aluminum foil possesses excellent flexibility and certain thermal conductivity. In the laminated structure, the pure aluminum foil serves two purposes: firstly, it supports the graphene film, giving the entire vapor chamber a certain mechanical strength and making it less prone to damage; secondly, it aids in heat dissipation, further dissipating the heat conducted from the graphene film and facilitating heat exchange with the surrounding environment. The hot-pressing sintering process involves treating the alternately laminated graphene film and pure aluminum foil under high temperature and pressure. Through hot-pressing sintering, a tight bond is formed between the graphene film and the pure aluminum foil, reducing interlayer thermal resistance and enhancing the efficiency of heat transfer between different layers. This manufacturing method fully utilizes the excellent thermal conductivity of graphene and the auxiliary heat dissipation function of pure aluminum foil. The combination of these two significantly improves the uniform heat dissipation effect of the graphene vapor chamber 2000, effectively solving the problem of uneven heat dissipation in traditional liquid cooling plates.

[0044] First, graphene films and pure aluminum foil are alternately laminated and sintered in a hot-pressing furnace to form a heat spreader plate 2000, which is then machined. A groove is cut into the body plate 1000, made of 6061 aluminum alloy (6-series aluminum alloy, the grade of wrought aluminum alloy is 6061), with the groove thickness matching the heat spreader plate 2000 material. The machined heat spreader plate 2000 is placed into the groove 1001, with a 0.1mm layer of 4004 aluminum alloy welding sheet (4-series aluminum alloy, welding material number 4004) placed on the top and bottom. A 1mm thick metal covering layer 3000 is then added to the outside. After assembly, the entire assembly is clamped and threaded together with two high-temperature mold steel plates thicker than 30mm, and then placed in a welding furnace. The welding process is set to hold at 585℃ for 5 minutes, followed by a 30-minute hold at 400℃. After welding, the liquid cooling plate is precision machined.

[0045] In some embodiments of this application, the area of ​​the second region accounts for at least 50% of the total area of ​​the liquid cooling plate body 1000. A larger second region ensures sufficient coverage by the graphene vapor chamber 2000. Since heat distribution is often uneven during operation of electronic devices, localized heat concentrations are common. A larger graphene vapor chamber 2000 can cover more areas prone to heat concentration. When heat is generated, the graphene vapor chamber 2000 can absorb the heat promptly and distribute it evenly across the entire vapor chamber, then, through synergy with the liquid flow channels in the first region, remove the heat. This configuration more effectively solves the problem of uneven heat dissipation, improves the overall heat dissipation performance of the liquid cooling plate, ensures that temperature differences between different parts of the electronic device remain within a small range, improves the reliability and stability of the device, and extends the service life of the electronic device.

[0046] In some embodiments of this application, the graphene liquid cooling plate further includes a metal welding layer disposed between the graphene heat spreader 2000 and the metal covering layer 3000; the metal welding layer is disposed between the graphene heat spreader 2000 and the groove 1001.

[0047] The metal welding layer typically uses a metal material that is highly compatible with both the graphene vapor chamber 2000 and the metal cover layer 3000, such as certain specific brazing filler metals. When the metal welding layer is placed between the two, the graphene vapor chamber 2000 and the metal cover layer 3000 can be firmly connected together through a welding process. This arrangement enhances the connection stability between the two, making it less prone to separation even when subjected to factors such as vibration and temperature changes during equipment operation. Simultaneously, the metal welding layer further promotes heat transfer between the two, optimizing the heat dissipation path.

[0048] Similarly, the metal welding layer at this location securely connects the graphene vapor chamber 2000 to the liquid cooling plate body 1000 located in the groove 1001. This ensures the stability of the graphene vapor chamber 2000 within the groove 1001, preventing displacement during use. Furthermore, the excellent thermal conductivity of the metal welding layer facilitates more efficient heat transfer from the liquid cooling plate body 1000 to the graphene vapor chamber 2000, improving heat dissipation efficiency. The metal welding layer enhances the connection stability between components, ensuring that components such as the graphene vapor chamber 2000 do not shift during use, guaranteeing stable heat dissipation, and enabling the liquid cooling plate to continuously and reliably provide heat dissipation services for electronic devices.

[0049] In some embodiments of this application, the liquid cooling plate body 1000 is integrally formed. This reduces the seams between the liquid cooling plate body 1000 and the cooling fluid. Seams are often potential sources of coolant leakage; reducing seams effectively prevents coolant leakage, ensures normal circulation of coolant within the liquid flow channels, and maintains heat dissipation. Secondly, the integral forming process enhances the structural strength of the liquid cooling plate body 1000. During equipment operation, the liquid cooling plate may be subjected to vibration, external impacts, etc. The integrally formed structure can better withstand these forces, improving its reliability, extending the service life of the liquid cooling plate, and reducing equipment maintenance costs.

[0050] The first liquid cooling plate design involves fabricating a 100*100*12mm liquid cooling plate using 6063 aluminum alloy (a 6-series aluminum alloy, with wrought aluminum alloy grade 6063). The upper and lower body plates of the liquid cooling plate are 3.5mm thick, with the remaining space in between serving as water channels. At an ambient temperature of 22℃, a 40*40mm ceramic heating element is placed on each of the upper and lower surfaces of the liquid cooling plate. Each heating element has a heating power of 50W, for a total heating power of 100W. Water is circulated into the liquid cooling plate at a flow rate of 150L / H. This embodiment serves as a comparative basis for analyzing the difference in performance after adding a 2000-level heat spreader.

[0051] The second liquid cooling plate solution: Also using 6063 material (6-series aluminum alloy, the grade of wrought aluminum alloy is 6063), a liquid cooling plate with dimensions of 100*100*12mm is fabricated. The upper and lower body plates 1000 of the liquid cooling plate are still 3.5mm thick, with a water flow channel in between. Unlike the first liquid cooling plate solution, a 1.5mm thick heat spreader plate 2000 is welded into the 3.5mm body plate 1000 using the following process: First, graphene film and pure aluminum foil are alternately stacked and sintered in a hot press furnace to prepare the heat spreader plate 2000 material, which is then machined to meet requirements; next, grooves are cut into the body plate 1000 to match the thickness of the grooves to the heat spreader plate 2000 material, and the processed heat spreader plate 2000 is placed in the groove 1001, under the heat spreader plate 2000 material. A layer of 0.1mm 4004 welding sheet (4-series aluminum alloy, welding material number 4004) is placed on the top and bottom of the 2000-temperature plate, and a 1mm thick metal covering layer 3000 is added to the outside. The workpiece is then assembled and clamped between two high-temperature mold steel plates with a thickness greater than 30mm, secured with threads, and placed in a welding furnace. The welding process is set to 585℃ for 5 minutes, followed by a 30-minute interval at 400℃. After welding, the workpiece is removed and precision-machined. At an ambient temperature of 22℃, a 40*40mm ceramic heating element with a heating power of 50W is placed on the top and bottom surfaces of the liquid cooling plate, for a total heating power of 100W. Water flows through the liquid cooling plate at a flow rate of 150L / H.

[0052] The two liquid cooling plate designs are identical except for the structure of the main body plate 1000. Testing showed that in the first design, the temperature difference at the measuring points of the 6063 liquid cooling plate was 1.25℃, and its mass was 252.7g. In the second design, the temperature difference between the measuring points of the heat spreader 2000 and the liquid cooling plate was 0.97℃, and its mass was 244.1g. Therefore, welding the heat spreader 2000 into the main body plate 1000 of the liquid cooling plate effectively reduces the temperature difference at the measuring points, improves the temperature uniformity of the liquid cooling plate, reduces its mass, and enhances its overall performance.

[0053] In some embodiments of this application, an electronic device is provided. This electronic device is equipped with the aforementioned graphene liquid cooling plate. During operation, the internal electronic components of the electronic device generate a large amount of heat. Traditional heat dissipation methods are insufficient to meet the increasing heat dissipation demands of electronic devices, easily leading to overheating of electronic components and affecting their performance and lifespan. By equipping the electronic device with this graphene liquid cooling plate, the problem of uneven heat dissipation can be effectively solved. When the electronic device generates heat, the liquid channels of the graphene liquid cooling plate and the graphene heat spreader 2000 work together to quickly remove and evenly distribute the heat, ensuring that the electronic components operate in a suitable temperature environment. A suitable temperature environment can reduce performance degradation and malfunctions caused by overheating of electronic components, extend the lifespan of electronic components, thereby improving the reliability of the entire electronic device system, ensuring stable and efficient operation of the electronic device, and providing users with a better user experience.

[0054] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A graphene liquid-cooled plate, characterized in that, The graphene liquid cooling plate includes: The liquid cooling plate body (1000) has a first region and a second region arranged along the thickness direction inside, and a liquid flow channel is formed in the first region; A graphene vapor chamber (2000) is assembled in the second region; in a planar projection along the thickness direction of the liquid cooling plate body (1000), at least a portion of the area of ​​the second region coincides with that of the first region.

2. The graphene liquid cooling plate of claim 1, wherein, A groove (1001) is provided on the second region of the liquid cooling plate body (1000), and the graphene heat spreader (2000) is disposed in the groove (1001), and the graphene heat spreader (2000) conforms to the groove (1001).

3. The graphene liquid cooling plate of claim 2, wherein, A metal covering layer (3000) is provided on the outside of the groove (1001).

4. The graphene liquid cooling plate of claim 1, wherein, The liquid cooling plate body (1000) has a liquid flow hole (1002) which is connected to the interior of the liquid flow channel.

5. The graphene liquid cooling plate of claim 1, wherein, The cross-sectional shape of the liquid flow channel is one or more combinations of a circle, a square, or a trapezoid.

6. The graphene liquid cooling plate of claim 1, wherein, The graphene heat spreader (2000) is made by hot pressing and sintering alternating layers of graphene film and pure aluminum foil.

7. The graphene liquid cooling plate of claim 1, wherein, The area of ​​the second region accounts for at least fifty percent of the total area of ​​the liquid cooling plate body (1000).

8. The graphene liquid cooling plate of claim 3, wherein, It also includes a metal welding layer, wherein the graphene heat spreader (2000) is disposed between the graphene heat spreader (2000) and the metal covering layer (3000); And / or, The graphene heat spreader (2000) is disposed between the graphene heat spreader (2000) and the groove (1001).

9. The graphene liquid cooling plate of claim 1, wherein, The liquid cooling plate body (1000) is integrally formed.

10. An electronic device, comprising: Equipped with the graphene liquid cooling plate as described in any one of claims 1-9.

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