LED structure
Through innovative substrate design and electroplating process, the problems of complex LED bracket structure and high development cost have been solved, realizing a low-cost, highly flexible and highly compatible LED structure design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU LEITING OPTOELECTRONICS TECH CO LTD
- Filing Date
- 2025-04-09
- Publication Date
- 2026-04-24
AI Technical Summary
The existing electroplating or sputtering processes for LED bracket structures are complex, resulting in high development costs, lack of mass production capability, and a lack of flexibility.
The innovative design of the first and second substrates is adopted. They are aligned and pressed together by a press, and a metal coating is formed on the surface of the substrate by electroplating or chemical plating. Heat-conducting pillars are set inside the substrate, and the chip is fixed by die bond adhesive. The encapsulating colloid wraps the chip and conductive lines, forming a flexible and low-cost LED structure.
It reduces production costs, improves design and development flexibility and product compatibility, achieves direct compatibility with existing products, and meets end-user needs.
Smart Images
Figure CN224165059U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of LED optoelectronic technology, and specifically relates to an LED structure. Background Technology
[0002] Currently, most cup-shaped gold-plated cup-shaped products in sizes 2319 / 2219 or other sizes on the market use plastic electroplating or sputtering for their support structure. However, the metal support structure is complex and costly to manufacture. Each design change requires a new mold, which also increases costs, raising the overall development cost. Furthermore, domestic electroplating manufacturers lack mature mass production processes for this technology, hindering the widespread adoption of such products. Therefore, there is an urgent need to design a new product structure that avoids the complex electroplating or sputtering processes used in plastic supports, thus providing an alternative for these products. Utility Model Content
[0003] The purpose of this invention is to solve the problems of difficult electroplating or sputtering processes and high development costs in the existing technology, and to provide an LED structure that is highly flexible, technologically mature, and low in cost.
[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: an LED structure, including a first substrate and a second substrate, wherein a cup is provided inside the first substrate, and a positive electrode pad and a negative electrode pad connected to the bottom surface of the cup are provided on the second substrate. A die-bonding region is provided on the positive electrode pad or the negative electrode pad and located inside the cup. A chip is provided on the die-bonding region, and conductive lines are provided for the surface electrode of the chip to conduct to the positive electrode pad or the negative electrode pad. The outer periphery of the chip and the conductive lines is wrapped with an encapsulating colloid. Heat-conducting pillars are also provided inside the second substrate at positions corresponding to the positive electrode pad, the negative electrode pad and the die-bonding region.
[0005] Preferably, the upper surface of the first substrate, the inner wall of the bowl / cup, and the upper and lower surfaces of the second substrate are all provided with a metal plating layer, and the material of the metal plating layer is selected from copper, nickel, silver, palladium or gold.
[0006] Preferably, the materials of the first substrate and the second substrate are BT, FR4 or CEM-3.
[0007] Preferably, the first substrate and the second substrate are aligned and pressed together using a press.
[0008] Preferably, the wafer is fixed on the die bonding area by die bonding adhesive, which is a conductive adhesive or a resin adhesive.
[0009] Preferably, the bowl is a conical bowl that is wider at the top and narrower at the bottom, and the encapsulating colloid fills the conical bowl and extends to cover the upper surface of the first substrate. The encapsulating colloid is silicone or epoxy resin.
[0010] Preferably, the heat-conducting pillar is a heat-conducting copper pillar or a heat-conducting resin.
[0011] After adopting the above technical solution, the LED structure provided by this utility model has the following beneficial effects:
[0012] 1) This utility model breaks away from the traditional bracket design process of electroplating or sputtering. Compared with the one-piece bracket mold electroplating, its design and development cost is lower and its design and development flexibility is higher.
[0013] 2) The product designed by this utility model is directly compatible with existing products on the market. It has a wider range of options for product length and width, and can be finely adjusted and modified according to the product terminal design requirements, resulting in high design flexibility.
[0014] 3) The product designed in this utility model is not affected in any way when used at the customer's terminal. The terminal does not need to make any design modifications and can be used in a compatible manner. It has the advantages of better product practicality, better compatibility, and better effect and performance. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of an LED structure according to the present invention;
[0016] Figure 2 This is a side view of the first substrate in this utility model;
[0017] Figure 3 This is a front view of the first substrate in this utility model;
[0018] Figure 4 This is a side view of the second substrate in this utility model.
[0019] Among them: first substrate 1, second substrate 2, cup 3, positive electrode pad 4, negative electrode pad 5, die bonding area 6, wafer 7, conductive line 8, encapsulating colloid 9, heat-conducting pillar 10. Detailed Implementation
[0020] The present invention will now be described in further clear and complete detail with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0021] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0022] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.
[0023] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.
[0024] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.
[0025] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.
[0026] like Figure 1-4 As shown, the present invention provides an LED structure comprising a first substrate 1 and a second substrate 2 stacked on top of each other. Specifically, the first substrate 1 and the second substrate 2 can be made of materials such as BT, FR4, and CEM-3. The first substrate 1 is aligned and pressed onto the second substrate 2 using a press to form an integral structure. The first substrate 1 has an inverted conical cup 3 that is larger at the top and smaller at the bottom. Both the upper surface of the first substrate 1 and the inner wall of the cup 3 are coated with a metal layer by electroplating or chemical plating. The metal coating can be made of metals such as copper, nickel, silver, palladium, and gold. The upper and lower surfaces of the second substrate 2 are also coated with a metal layer by electroplating or chemical plating, and the metal coating on the second substrate 2 is connected to the first substrate 2 by electroplating or chemical plating. The metal plating on the first substrate 1 uses the same metal material. Further, the second substrate 2 is provided with a positive electrode pad 4 and a negative electrode pad 5 connecting the bottom surface of the cup 3. The positive electrode pad 4 or the negative electrode pad 5 has a die bonding area 6 located inside the cup 3. The die bonding area 6 is provided with a wafer 7 and conductive lines 8 for conducting between the surface electrodes of the wafer 7 and the positive electrode pad 4 or the negative electrode pad 5. The wafer 7 and the conductive lines 8 are wrapped with an encapsulating colloid 9. Specifically, the wafer 7 is fixed to the die bonding area 6 by die bonding adhesive, which is conductive adhesive or resin adhesive. The encapsulating colloid 9 fills the conical cup 3 and extends outward to cover the upper surface of the first substrate 1. The encapsulating colloid 9 is silicone or epoxy resin.
[0027] Furthermore, the second substrate 2 is provided with heat-conducting pillars 10 at the positions corresponding to the positive electrode pad 4, the negative electrode pad 5, and the die bonding region 6, respectively. The heat-conducting pillars 10 are heat-conducting copper pillars or heat-conducting resin.
[0028] This utility model also provides a packaging method for the above-mentioned LED structure, including the following steps:
[0029] S1. Multiple conical holes resembling bowls and cups are formed on the first substrate 1 using a conical drill bit, and a metal plating layer is formed on the upper surface of the first substrate 1 and the inner wall of the bowl 3 using electroplating or chemical plating processes.
[0030] S2. A metal plating layer is formed on the upper and lower surfaces of the second substrate 2 by electroplating or chemical plating process, and the metal material of the metal plating layer is the same as the metal material of the metal plating layer on the first substrate 1.
[0031] S3. Design pads and die-bonding areas on the second substrate 2, and set heat-conducting pillars 10 at the corresponding positions of the pads and die-bonding areas for auxiliary heat dissipation.
[0032] S4. The first substrate 1 and the second substrate 2 are aligned and pressed together by the board factory press equipment to form a complete integral structure.
[0033] S5. Sequentially fix the wafer 7 to the die bonding area 6, weld the conductive wires 8, and fill the encapsulating colloid 9.
[0034] S6. Cut the entire product into individual LED finished products.
[0035] In step S3, the heat-conducting pillar 10 is made of heat-conducting copper, which is placed in the second substrate 2 by drilling and filling copper.
[0036] In summary, the LED structure provided by this utility model mainly involves the innovative design of the substrate structure to solve the problems of difficult and costly development of traditional bracket electroplating or sputtering processes. This utility model has high design flexibility and mature manufacturing process in the industry, thus further reducing design costs.
[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. An LED structure, characterized by, The substrate includes a first substrate (1) and a second substrate (2). The first substrate (1) has a bowl (3) inside. The second substrate (2) has a positive electrode pad (4) and a negative electrode pad (5) connected to the bottom surface of the bowl (3). The positive electrode pad (4) or the negative electrode pad (5) has a die-bonding region (6) located inside the bowl (3). The die-bonding region (6) has a wafer (7) and a conductive line (8) for conducting the surface electrode of the wafer (7) to the positive electrode pad (4) or the negative electrode pad (5). The wafer (7) and the conductive line (8) are wrapped with an encapsulating colloid (9). The second substrate (2) also has heat-conducting pillars (10) at positions corresponding to the positive electrode pad (4), the negative electrode pad (5) and the die-bonding region (6).
2. The LED structure of claim 1, wherein: Metal plating is provided on the upper surface of the first substrate (1), the inner wall of the bowl (3), and the upper and lower surfaces of the second substrate (2). The metal plating material is selected from copper, nickel, silver, palladium or gold.
3. The LED structure of claim 1, wherein: The first substrate (1) and the second substrate (2) are made of BT, FR4 or CEM-3.
4. The LED structure of claim 1, wherein: The first substrate (1) and the second substrate (2) are aligned and pressed together by a press.
5. The LED structure of claim 1, wherein: The wafer (7) is fixed on the die bonding area (6) by die bonding adhesive, which is a conductive adhesive or a resin adhesive.
6. The LED structure of claim 1, wherein: The bowl (3) is a conical bowl that is larger at the top and smaller at the bottom. The encapsulating colloid (9) fills the conical bowl and extends to cover the upper surface of the first substrate (1). The encapsulating colloid (9) is silicone or epoxy resin.
7. The LED structure of claim 1, wherein: The heat-conducting column (10) is a heat-conducting copper column or a heat-conducting resin.