Chip resistor feeding device with dust blowing mechanism

Abstract

The utility model provides a chip resistor feeding device with a dust blowing mechanism. The chip resistor feeding device comprises a storage area, a moving area and a conveying area, the storage area is provided with a storage table for stacking square substrates with chip resistors; the moving area comprises a base table, a moving mechanism, a piece sucking mechanism and a dust blowing mechanism. The conveying area is provided with a sheet feeding mechanism; the moving mechanism is correspondingly provided with a sliding table, the sheet sucking mechanism is correspondingly provided with a sucking disc which is driven by the sliding table to suck the square substrate on the placing table and transfer the square substrate to the sheet conveying mechanism, and the sucking disc correspondingly grabs or places the square substrate in a negative pressure form; the dust blowing mechanism is correspondingly provided with an air blowing plate, the air blowing plate is correspondingly installed on the base table, and the air blowing plate correspondingly blows air towards the suction cups for transferring and conveying the square substrates, so that dust is blown away, and the square substrates subjected to dust blowing treatment are provided to the sheet feeding mechanism; the over-blowing plate conducts directional airflow cleaning on the square base plate grabbed by the vacuum suction cup, and paper scraps, dust and other particles are effectively removed.

Description

Technical Field

[0001] This utility model relates to the field of electronic component feeding technology, and more specifically, to a chip resistor feeding device equipped with a dust blowing mechanism. Background Technology

[0002] In modern automated assembly lines for electronic components, surface mount resistors and other components are typically mounted on a square substrate. The substrate is fed out step by step by a feeding mechanism, and the pick-and-place machine uses a vacuum nozzle to pick up the substrate and electronic components, and then transfers or mounts them.

[0003] Currently, material tapes, especially continuously stacked square substrates, often have paper scraps, dust, and other particles adhering to their surfaces or edges. These particles can cause poor suction during vacuum nozzle pickup or feeding, affecting the reliability of component handling, and leading to inaccurate feeding positioning, resulting in transport deviations or tape jams. They can even allow dust to enter the printing press, increasing equipment maintenance. Traditional feeding devices often rely on manual periodic cleaning or offline dust removal processes at the front end, which cannot meet the requirements of high-speed, high-reliability production lines for continuous online operation. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a chip resistor feeding device with a dust blowing mechanism to solve the above problems.

[0005] The present invention adopts the following solution:

[0006] This application provides a surface mount resistor feeding device with a dust blowing mechanism, including a placement area, a moving area, and a conveying area; the placement area is provided with a placement platform for stacking square substrates with surface mount resistors; the moving area includes a base, and a moving mechanism, a suction mechanism, and a dust blowing mechanism disposed on the base; the conveying area is provided with a feeding mechanism; the moving mechanism is provided with a sliding table, and the suction mechanism is provided with a suction cup driven by the sliding table to pick up and transfer the square substrates from the placement platform to the feeding mechanism, and the suction cup grips or places the square substrates in a negative pressure manner; the dust blowing mechanism is provided with an air blowing plate, which is mounted on the base and blows air toward the suction cup that transfers the square substrates, thereby blowing away dust and providing the dust-treated square substrates to the feeding mechanism.

[0007] As a further improvement, the placement area and the moving area are arranged side by side, and the sliding table drives the suction cup to transfer the square substrate in the lateral direction.

[0008] As a further improvement, the base is positioned above the storage area and the moving area, and the air blowing plate is positioned on the base and correspondingly horizontally on the moving path of the suction cup.

[0009] As a further improvement, the air blowing plate is provided with multiple air ports arranged in a straight line at intervals; and the air blowing plate and the suction cup share the same air source.

[0010] As a further improvement, the wafer feeding mechanism includes a conveyor frame disposed on one side of the placement stage. After the suction cup moves above the conveyor frame, the negative pressure is cut off accordingly, thereby placing the square substrate onto the conveyor frame.

[0011] As a further improvement, the conveyor frame is equipped with an adhesive roller on the transport path, which is used to further apply dust to the conveyed square substrate.

[0012] As a further improvement, the height of the conveyor rack is always higher than the height of the square substrates stacked on the placement platform.

[0013] As a further improvement, the sliding table is configured as a sliding rod module, which drives the suction cup to perform linear rotation through a ball screw and a linear guide rail.

[0014] As a further improvement, the suction cup is movably and vertically mounted on a linear guide rail, corresponding to descending to the gripping position, rising to the transfer position, or descending to the delivery position.

[0015] By adopting the above technical solution, the present invention can achieve the following technical effects:

[0016] 1. The chip resistor feeding device of this application has a dust blowing mechanism that works synchronously with the suction mechanism in the moving area. The blowing plate performs directional airflow cleaning on the square substrate grabbed by the vacuum suction cup through the air blowing plate, effectively removing paper scraps, dust and other particles, ensuring stable negative pressure adsorption of the suction cup, reducing the risk of missed suction and empty suction, thereby improving the reliability of chip resistor picking and placing. The surface and edges of the substrate are smoother after cleaning, and the positioning of the feeding mechanism in the feeding area is more accurate, which can reduce feeding errors and jamming caused by dust, thereby reducing the frequency of downtime maintenance and improving the overall uptime of the equipment.

[0017] 2. The dust blowing mechanism is integrated on the base of the moving area and is arranged in coordination with the moving mechanism, the suction mechanism, and the feeding mechanism. It does not require additional independent dust removal devices or occupy external space of the production line, achieving a compact structure and easy installation. The dust blowing process is triggered in parallel or synchronously with the clamping and transfer processes, resulting in short dust removal time and high efficiency. It meets the requirements of modern high-speed pick and place machines for feeding cycle time and does not affect the production rhythm. Online dust blowing reduces the accumulation of dust in the feeding channel and inside the pick and place machine, reduces the burden of equipment cleaning and maintenance, extends the service life of key components, and reduces downtime maintenance costs. Attached Figure Description

[0018] Figure 1This is a schematic diagram of the surface mount resistor feeding device according to an embodiment of the present invention;

[0019] Figure 2 This is a partial structural schematic diagram of the chip resistor feeding device according to an embodiment of the present invention from one view.

[0020] Figure 3 This is a partial structural schematic diagram of the chip resistor feeding device according to an embodiment of the present invention from another perspective.

[0021] Icons: 1-Placement platform; 2-Base; 3-Sliding platform; 4-Suction cup; 5-Air blowing plate; 6-Air inlet; 7-Transfer frame; 8-Adhesive roller; A-Square substrate. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.

[0023] Example

[0024] Combination Figures 1 to 3 This embodiment provides a surface mount resistor feeding device with a dust blowing mechanism, including a placement area, a moving area, and a conveying area. The placement area has a placement platform 1 for stacking square substrates A with surface mount resistors. The moving area includes a base 2, and a moving mechanism, a suction mechanism, and a dust blowing mechanism disposed on the base 2. The conveying area has a feeding mechanism. The moving mechanism is equipped with a sliding table 3, and the suction mechanism is equipped with a suction cup 4 driven by the sliding table 3 to pick up and transfer the square substrates A from the placement platform 1 to the feeding mechanism. The suction cup 4 grips or places the square substrates A in a negative pressure manner. The dust blowing mechanism is equipped with an air blowing plate 5, which is mounted on the base 2. The air blowing plate 5 blows air toward the suction cup 4 that transfers the square substrates A, thereby blowing away dust and providing the dust-treated square substrates A to the feeding mechanism.

[0025] In the aforementioned chip resistor feeding device, the dust blowing mechanism works synchronously with the suction mechanism in the moving area. The air blowing plate 5 performs directional airflow cleaning on the square substrate A held by the vacuum suction cup 4, effectively removing particles such as paper scraps and dust, ensuring stable negative pressure adsorption of the suction cup 4, reducing the risk of missed suction and empty suction, thereby improving the reliability of chip resistor picking and placing. The surface and edges of the cleaned substrate are smoother, and the positioning of the feeding mechanism in the feeding area is more accurate, which can reduce feeding errors and jamming caused by dust, thereby reducing the frequency of downtime maintenance and improving the overall uptime of the equipment.

[0026] In particular, the dust blowing mechanism is integrated on the moving area base 2 and arranged in coordination with the moving mechanism, suction mechanism, and feeding mechanism. It does not require additional independent dust removal devices or occupy external space of the production line, achieving a compact structure and easy installation. The dust blowing process is triggered in parallel or synchronously with the clamping and transfer processes, resulting in short dust removal time and high efficiency. It meets the requirements of modern high-speed pick and place machines for feeding cycle time and does not affect the production rhythm. Online dust blowing reduces the accumulation of dust in the feeding channel and inside the pick and place machine, reduces the burden of equipment cleaning and maintenance, extends the service life of key components, and reduces downtime maintenance costs.

[0027] In this embodiment, the placement area and the moving area are arranged side by side. The sliding table 3 drives the suction cup 4 laterally to transfer the square substrate A. This side-by-side arrangement of the placement and moving areas, compared to the traditional front-to-back arrangement, is more conducive to the lateral expansion of the device, saving vertical space and making the overall structure more compact. This facilitates integration into existing SMT production lines or equipment, improving space utilization. The sliding table 3 laterally drives the suction cup 4 to grasp and transfer the substrate between the side-by-side placement and moving areas. The linear transmission path, short distance, and simple operation help improve the pick-and-place response speed, reduce mechanical transmission errors, and thus improve overall loading efficiency and stability.

[0028] Specifically, the base 2 is positioned above the placement area and the moving area, and the air blowing plate 5 is placed on the base and positioned horizontally on the moving path of the suction cup 4. Placing the base 2 above the placement area and the moving area forms a cantilever and load-bearing structure, which provides more stable support for the sliding table 3 and its suction cup 4 during the transfer process, reduces vibration and offset, and improves the positioning accuracy of gripping and conveying the square substrate A.

[0029] Preferably, the air blowing plate 5 is provided with a plurality of air ports 6 arranged in a straight line at intervals. The plurality of air ports 6 are arranged in a straight line at intervals, which can form a wide and uniform air curtain on the transfer path of the suction cup 4, avoiding airflow concentration or blind spots caused by a single air port 6, and ensuring that the entire surface and edges of the square substrate A can be treated with consistent dust blowing.

[0030] Furthermore, the air blowing plate 5 and the suction cup 4 share the same air source. By sharing this same air source, seamless switching between blowing and suction can be achieved through reasonable allocation of valves or air path switching, eliminating the need for an additional independent compression source. This simplifies the air source system and reduces equipment procurement and maintenance costs. It is understandable that the blowing operation of the air blowing plate 5 and the vacuum suction operation of the suction cup 4 utilize the same air source, which is a conventional existing technology and will not be elaborated upon further.

[0031] In this embodiment, the wafer feeding mechanism includes a conveyor frame 7 disposed on one side of the placement table 1. After the suction cup 4 moves above the conveyor frame 7, the negative pressure is cut off accordingly, thereby placing the square substrate A onto the conveyor frame 7. Thus, the seamless docking between the suction cup 4 and the conveyor frame 7 enables the loading and conveying to form a seamless automated process, eliminating the need for additional robotic arms or manual intervention, significantly improving the continuity and automation level of the production line.

[0032] Furthermore, the conveyor frame 7 is equipped with an adhesive roller 8 on the transport path. The adhesive roller 8 is used to further remove dust from the transported square substrate A. Based on the initial cleaning by the dust blowing mechanism, the adhesive roller 8 performs a rolling adhesion cleaning on the surface of the square substrate A, which can effectively remove residual fine dust, paper scraps, electrostatic adsorption particles, etc., to achieve a more thorough secondary dust removal process and improve the downstream mounting quality.

[0033] In this embodiment, the height of the conveyor 7 is always higher than the height of the square substrate A stacked on the placement platform 1. Since the conveyor 7 is always positioned above the placement platform 1 and its stacked substrates, the suction cup 4 forms a movement trajectory from low to high as it picks up the substrate from the placement platform 1 and moves it to the conveyor 7. This naturally avoids the risk of mechanical interference or collision with the stacked substrates, improving operational smoothness and safety. Furthermore, after the suction cup 4 picks up the substrate from a low position and moves it to a high position, it releases the substrate. Under the influence of gravity, the substrate can fall naturally and adhere to the surface of the conveyor 7, which helps to achieve more precise landing point control and a more stable placement posture, improving the accuracy of subsequent conveying and positioning.

[0034] It should be mentioned that the sliding table 3 is configured as a sliding rod module, which drives the suction cup 4 to move linearly via a ball screw and a linear guide rail. Obviously, the specific structural configuration of the sliding rod module is existing technology and will not be described in detail here.

[0035] In this embodiment, the suction cup 4 is movably mounted on a linear guide rail, corresponding to descending to the gripping position, rising to the transfer position, or descending to the placement position. On one hand, the linear guide rail provides a rigid, low-friction motion channel, significantly improving the repeatability of the suction cup 4's vertical lifting and positioning, ensuring accurate placement for each gripping, transfer, and placement, and reducing pick-up and placement failures caused by deviations. On the other hand, constrained by the guide rail, the suction cup 4 experiences no lateral shaking or tilting during lifting. Combined with linear drives, such as servo motors, electric cylinders, or pneumatic cylinders, smooth acceleration and deceleration can be achieved, avoiding displacement and damage to the substrate or components caused by severe vibration.

[0036] The above are merely preferred embodiments of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions that fall within the scope of this utility model's concept are protected by this utility model.

Claims

1. A chip resistor feeding device equipped with a dust blowing mechanism, characterized in that, include: The storage area is equipped with a platform for stacking square substrates with surface mount resistors; The moving area includes a base, and a moving mechanism, a suction mechanism and a dust blowing mechanism configured on the base; The conveying area is equipped with a film feeding mechanism; The moving mechanism is provided with a sliding stage, and the suction mechanism is provided with a suction cup driven by the sliding stage to pick up and transfer the square substrate on the placement stage to the feeding mechanism. The suction cup grips or places the square substrate in the form of negative pressure. Furthermore, the dust blowing mechanism is provided with an air blowing plate, which is mounted on the base. The air blowing plate blows air toward the suction cup that transfers the square substrate, thereby blowing away the dust and providing the dust-treated square substrate to the wafer feeding mechanism.

2. The chip resistor feeding device with a dust blowing mechanism according to claim 1, characterized in that, The placement area and the moving area are arranged side by side, and the sliding table drives the suction cup to move and transfer the square substrate in the horizontal direction.

3. The chip resistor feeding device with a dust blowing mechanism according to claim 2, characterized in that, The base is positioned above the storage area and the moving area, and the air blowing plate is positioned on the base and horizontally on the moving path of the suction cup.

4. The chip resistor feeding device with a dust blowing mechanism according to claim 3, characterized in that, The air blowing plate has multiple air ports arranged in a straight line at intervals; and the air blowing plate and the suction cup share the same air source.

5. The chip resistor feeding device with a dust blowing mechanism according to claim 1, characterized in that, The wafer feeding mechanism includes a conveyor frame disposed on one side of the placement table. After the suction cup moves above the conveyor frame, the negative pressure is cut off accordingly, thereby placing the square substrate onto the conveyor frame.

6. The chip resistor feeding device with a dust blowing mechanism according to claim 5, characterized in that, The conveyor frame is equipped with an adhesive roller on the transport path, which is used to further apply dust to the conveyed square substrate.

7. The chip resistor feeding device with a dust blowing mechanism according to claim 5, characterized in that, The height of the conveyor rack is always higher than the height of the square substrates stacked on the placement platform.

8. The chip resistor feeding device with a dust blowing mechanism according to claim 1, characterized in that, The sliding table is configured as a sliding rod module, which drives the suction cup to move linearly via a ball screw and a linear guide rail.

9. The chip resistor feeding device with a dust blowing mechanism according to claim 8, characterized in that, The suction cup is movably mounted on a linear guide rail, and can be lowered to the gripping position, raised to the transfer position, or lowered to the delivery position.

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