Circuit board structure, lamp panel and LED display device

Abstract

The utility model provides a circuit board structure, a lamp panel and an LED display device, and the circuit board structure comprises a substrate; the solder mask layer is arranged on one side of the substrate in a covering manner, and the solder mask layer is provided with an open window and exposes part of the substrate; the bonding pad part is arranged on the substrate and located in the open window, and the bonding pad part is provided with a first connecting end extending to the edge of the open window; and the first electric connecting piece is positioned between the solder mask layer and the substrate and is used for connecting the first connecting end and the conductive piece. According to the technical scheme, the problem of poor consistency of the circuit board in the related technology can be effectively solved.

Description

Technical Field

[0001] This utility model relates to the field of LED display technology, and more specifically, to a circuit board structure, a lamp board, and an LED display device. Background Technology

[0002] A printed circuit board (PCB) is a core component of electronic devices, providing electrical connections and structural support for electronic components through conductive lines and insulating substrates. PCBs include printed circuit boards and ceramic circuit boards, and can be classified by the number of layers into single-sided, double-sided, and multi-layer boards, and by characteristics into rigid PCBs, flexible PCBs, and rigid-flex PCBs. In the field of LED display technology, PCBs are also required within LED display devices; for example, a PCB can serve as part of the LED display's lamp panel.

[0003] Specifically, an array of LED beads (or light-emitting chips) can be placed on a circuit board to form a light panel for emitting light and displaying images. For example... Figure 1 as well as Figure 2 As shown, in typical COB technology, one pixel contains one R chip, one G chip, and one B chip. Each chip requires two pads 1, resulting in six pads 1 for one pixel. The surface of the circuit board substrate is usually covered with a solder mask layer, with openings 3 to expose parts of the substrate. The pads 1 are located within these openings 3. To achieve electrical connection between the pads 1 and other conductive components, wires 2 are typically placed between them. This results in some wires 2 being located under the solder mask layer and others being located within the openings 3. Furthermore, the varying shapes of the wires 2 within the openings 3 lead to inconsistent circuit board design. Utility Model Content

[0004] The main objective of this invention is to provide a circuit board structure, a lamp board, and an LED display device to solve the problem of poor consistency of circuit boards in related technologies.

[0005] To achieve the above objectives, according to one aspect of the present invention, a circuit board structure is provided, comprising: a substrate; a solder resist layer covering one side of the substrate, the solder resist layer having an opening and exposing a portion of the substrate; a pad portion disposed on the substrate and located within the opening, the pad portion having a first connection end extending to the edge of the opening; and a first electrical connector located between the solder resist layer and the substrate and used to connect the first connection end and a conductive element.

[0006] Furthermore, the pad portion includes a pad body and a protrusion. The pad body is spaced apart from the edge of the opening and is used to connect with electrical components. The protrusion is connected to the pad body, and the free end of the protrusion forms a first connection end.

[0007] Furthermore, the first electrical connector has a second connection end connected to the first connection end, and the difference between the width dimension of the first connection end and the width dimension of the second connection end is greater than or equal to 0 and less than or equal to 15 μm.

[0008] Furthermore, the circuit board structure also includes a through-hole, which is disposed through the substrate, and a first electrical connector is connected between the through-hole and a first connection end.

[0009] Furthermore, the surface area of ​​the pad body is greater than the surface area of ​​the protrusion; and / or, the pad body has a rectangular structure, and the pad portion also includes chamfered portions provided at the corners of the pad body.

[0010] Furthermore, the spacing between the pad body and the edge of the opening window is greater than or equal to 25 μm and less than or equal to 50 μm; and / or, the protrusion is a strip structure, and the width of the first connection end is greater than or equal to 25 μm and less than or equal to 55 μm.

[0011] Furthermore, there are multiple pads, a first electrical connector, and a via. The circuit board structure also includes a second electrical connector. Multiple pads are spaced apart along a first direction to form a first pad group and a second pad group, respectively. The first pad group and the second pad group are spaced apart along a second direction. Multiple pads in the first pad group are connected through a second electrical connector. Multiple vias are provided one-to-one with multiple pads in the second pad group and are connected through the first electrical connector. The first direction and the second direction are set at an angle.

[0012] Furthermore, the circuit board structure also includes a first positioning mark and a second positioning mark disposed within the opening window. The first positioning mark is located on the side of the first pad group away from the second pad group, and the second positioning mark is located on the side of the second pad group away from the first pad group. The distance between the first positioning mark and the first pad group is less than the distance between the second positioning mark and the second pad group.

[0013] According to another aspect of the present invention, a lamp board is provided, including a circuit board structure and lamp beads disposed on the circuit board structure, wherein the circuit board structure is the circuit board structure described above.

[0014] According to another aspect of the present invention, an LED display device is provided, including a lamp board, wherein the lamp board is the lamp board described above.

[0015] By applying the technical solution of this utility model, the substrate provides a mounting base for other structures of the circuit board. A solder resist layer is disposed on one side of the substrate to protect and shield the structure between the solder resist layer and the substrate. The solder resist layer has an opening that exposes part of the substrate. A pad portion is disposed on the substrate and located within the opening. The pad portion is used to connect with electrical components so that the electrical components are connected to the substrate. The pad portion has a first connection end extending to the edge of the opening. A first electrical connector is located between the solder resist layer and the substrate and is used to connect the first connection end and the conductive component. On the one hand, the first connection end and the first electrical connector can realize the electrical connection between the pad portion and the conductive component. On the other hand, the first electrical connector can be shielded by the solder resist layer, and the pad portion exposed within the opening has a relatively uniform shape, resulting in good consistency in the portion exposed within the opening. Therefore, the technical solution of this application can effectively solve the problem of poor circuit board consistency in related technologies. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0017] Figure 1 A front view schematic diagram of a circuit board structure in the related art is shown;

[0018] Figure 2 A front view schematic diagram of a circuit board structure in the related art is shown;

[0019] Figure 3 A front view schematic diagram of a partial structure according to an embodiment of the circuit board structure of the present invention is shown;

[0020] Figure 4 It shows Figure 1 A front view schematic diagram of a portion of the circuit board structure;

[0021] Figure 5 It shows Figure 4 An enlarged schematic diagram of point A in the circuit board structure.

[0022] The above figures include the following reference numerals:

[0023] 1. Solder pad; 2. Conductor; 3. Window;

[0024] a) First direction; b) Second direction;

[0025] 10. Substrate;

[0026] 20. Solder mask layer; 21. Opening window;

[0027] 30. Pad portion; 31. First connection end; 32. Pad body; 321. Chamfered portion; 33. Protrusion portion; 34. First pad group; 35. Second pad group;

[0028] 40. First electrical connector; 41. Second connection end;

[0029] 50. Through hole;

[0030] 60. Second electrical connection. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0032] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0033] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0034] like Figures 3 to 5As shown, this application provides a circuit board structure. An embodiment of the circuit board structure of this application includes: a substrate 10, a solder resist layer 20, a pad portion 30, and a first electrical connector 40; the solder resist layer 20 covers one side of the substrate 10, and the solder resist layer 20 has an opening 21 that exposes a portion of the substrate 10; the pad portion 30 is disposed on the substrate 10 and located within the opening 21, and the pad portion 30 has a first connection end 31 extending to the edge of the opening 21; the first electrical connector 40 is located between the solder resist layer 20 and the substrate 10 and is used to connect the first connection end 31 and a conductive element.

[0035] Using the technical solution of this embodiment, the substrate 10 provides a mounting base for other structures of the circuit board structure. The solder resist layer 20 covers one side of the substrate 10 to protect and shield the structure between the solder resist layer 20 and the substrate 10. The solder resist layer 20 has an opening 21 that exposes part of the substrate 10. The pad portion 30 is disposed on the substrate 10 and located within the opening 21. The pad portion 30 is used to connect with electrical components so that the electrical components are connected to the substrate 10. The pad portion 30 has a first connection end 31 extending to the edge of the opening 21. The first electrical connector 40 is located between the solder resist layer 20 and the substrate 10 and is used to connect the first connection end 31 and the conductive component. On the one hand, the first connection end 31 and the first electrical connector 40 can realize the electrical connection between the pad portion 30 and the conductive component. On the other hand, the first electrical connector 40 can be shielded by the solder resist layer 20. The pad portion 30 exposed within the opening 21 has a relatively uniform shape, so that the portion exposed within the opening 21 has good consistency. Therefore, the technical solution of this embodiment can effectively solve the problem of poor circuit board consistency in related technologies.

[0036] It should be noted that "the first electrical connector 40 is located between the solder resist layer 20 and the substrate 10" can refer to either the first electrical connector 40 being completely under the solder resist layer 20 and not exposed at all within the opening 21, or it can refer to the first electrical connector 40 being mostly under the solder resist layer 20 and only a small portion exposed within the opening 21. The first electrical connector 40 is typically a thin wire (in this embodiment, the width of the thin wire is the same as the width of the protrusion 33). The solder resist layer 20, also known as the green solder mask layer or solder resist ink layer, is a protective coating on the surface of a printed circuit board (PCB). It covers the non-soldering areas of the circuit board, protecting it from external environmental damage and ensuring the accuracy and reliability of the soldering process. The solder resist layer 20 is typically made of materials such as epoxy resin, acrylic resin, silicone resin, water-based solder resist ink, etc.

[0037] It should be noted that, typically, when designing a circuit board structure, the solder pads are designed first, followed by the conductors (i.e., the first electrical connector 40) and vias (i.e., the vias 50 mentioned later). The positions of the conductors and vias are not fixed. Compared to the first electrical connector 40 under the solder mask layer 20, the portion inside the opening 21 (i.e., the protrusion 33) requires chemical immersion gold or other processes. Therefore, separately designing the first electrical connector 40 and the protrusion 33 is beneficial for processing different processes.

[0038] like Figures 3 to 5 As shown, the pad portion 30 includes a pad body 32 and a protrusion 33. The pad body 32 is spaced apart from the edge of the opening window 21 and is used for connection with electrical components. The protrusion 33 is connected to the pad body 32, and the free end of the protrusion 33 forms a first connection end 31. Specifically, the pad portion 30 is an integral structure and is divided into two areas: one area is the pad body 32, and the other area is the protrusion 33. The pad body 32 is used for connection with electrical components, and the protrusion 33 is used to realize the function of electrical connection with the first electrical connector 40.

[0039] like Figures 3 to 5 As shown, the first electrical connector 40 has a second connector 41 connected to the first connector 31. The difference between the width of the first connector 31 and the width of the second connector 41 is greater than or equal to 0 and less than or equal to 15 μm. The difference between the width of the first connector 31 and the width of the second connector 41 is typically controlled to be 0, so that after the circuit board structure is formed, the first connector 31 and the second connector 41 are integrated. It should be noted that "width of the first connector 31" and "width of the second connector 41" refer to... Figure 3 as well as Figure 5 The vertical dimension is considered. This design takes into account two factors: firstly, the manufacturing process makes it difficult for the width of the first connecting end 31 and the width of the second connecting end 41 to be exactly the same; secondly, it aims to make the width of the first connecting end 31 as close as possible to the width of the second connecting end 41, thus ensuring that the width of the connection between the first connecting end 31 and the second connecting end 41 is as similar as possible to their respective widths, further guaranteeing the consistency of the circuit board structure. The difference between the width of the first connecting end 31 and the width of the second connecting end 41 can be 0, 6μm, 10μm, 12μm, or 15μm.

[0040] like Figures 3 to 5As shown, the circuit board structure also includes a through-hole 50, which is disposed through the substrate 10. A first electrical connector 40 is connected between the through-hole 50 and the first connection end 31. Specifically, the through-hole 50 is a conductive structure, consisting of a through hole on the substrate 10 and a conductive annular layer disposed on the wall of the through hole. The function of the through-hole 50 is to conduct conductive structures on both sides of the substrate 10.

[0041] like Figures 3 to 5 As shown, the surface area of ​​the pad body 32 is larger than the surface area of ​​the protrusion 33. Specifically, making the surface area of ​​the pad body 32 larger makes the connection between the pad portion 30 and the electrical component more stable; making the surface area of ​​the protrusion 33 smaller allows for greater consistency in the shape of the pad portion 30.

[0042] like Figures 3 to 5 As shown, the pad body 32 has a rectangular structure, and the pad portion 30 includes a chamfered portion 321 at the corner of the pad body 32. Specifically, some vias 50 are located close to the pad body 32. The chamfered portion 321, relative to a right angle, makes the pad body 32 farther away from these vias 50 to ensure electrical isolation and prevent mis-conduction.

[0043] like Figures 3 to 5 As shown, the spacing between the pad body 32 and the edge of the opening window 21 is greater than or equal to 25 μm and less than or equal to 50 μm. Specifically, the "spacing between the pad body 32 and the edge of the opening window 21" refers to... Figure 3 as well as Figure 5 The distance between the pad body 32 and the edge of the opening 21 in the transverse direction. The distance between the pad body 32 and the edge of the opening 21 can be 25μm, 30μm, 48μm, 49μm, or 50μm. The protrusion 33 is a strip structure, and the width of the first connection end 31 is greater than or equal to 25μm and less than or equal to 55μm. Specifically, the "width of the first connection end 31" refers to... Figure 3 as well as Figure 5 The vertical dimension. The width of the first connecting end 31 can be 25μm, 28μm, 36μm, 39μm or 55μm.

[0044] like Figures 3 to 5As shown, there are multiple pad portions 30, first electrical connectors 40, and through holes 50. The circuit board structure also includes a second electrical connector 60. Multiple pad portions 30 are spaced apart along a first direction a and respectively form a first pad group 34 and a second pad group 35. The first pad group 34 and the second pad group 35 are spaced apart along a second direction b. Multiple pad portions 30 in the first pad group 34 are connected through a second electrical connector 60. Multiple through holes 50 are arranged one-to-one with multiple pad portions 30 in the second pad group 35 and are connected through the first electrical connector 40. The first direction a and the second direction b are arranged at an angle. Specifically, in the field of LED displays, especially COB technology, a pixel typically includes three LED chips (R / G / B), each LED chip includes two electrodes (a first electrode and a second electrode), and a pixel can be correspondingly set with six pad portions 30. Among them, multiple pad portions 30 in the first pad group 34 are electrically connected to the first electrode of the LED chip. The first electrodes of these LED chips are connected through a second electrical connector 60 to form a common electrode. Multiple pad portions 30 in the second pad group 35 are connected one-to-one with the second electrodes of multiple LED chips. Each second electrode is electrically connected to the corresponding through-hole 50 through the corresponding pad portion 30, the first electrical connector 40, and the corresponding through-hole 50, thereby realizing individual control of each LED chip.

[0045] like Figures 3 to 5 As shown, the circuit board structure also includes a first positioning mark and a second positioning mark disposed within the opening 21. The first positioning mark is located on the side of the first pad group 34 away from the second pad group 35, and the second positioning mark is located on the side of the second pad group 35 away from the first pad group 34. The distance between the first positioning mark and the first pad group 34 is less than the distance between the second positioning mark and the second pad group 35. Specifically, the second electrical connector 60 is a wire. Since the diameter of the through hole 50 is larger than the width of the second electrical connector 60, when cutting the circuit board, if symmetrical cutting is used, the cutting edge is likely to be closer to the through hole 50. Therefore, an asymmetrical cutting method is adopted so that the cutting edge can have the same distance from both the through hole 50 and the second electrical connector 60, thereby ensuring the safety of the circuit board structure. Asymmetrical cutting can be achieved by making the distance between the first positioning mark and the first pad group 34 less than the distance between the second positioning mark and the second pad group 35. The first positioning mark and the second positioning mark can be set within the same window 21 of the same pad portion 30, or they can be set within the window 21 of different pad portions 30. Figure 3 as well as Figure 5In this context, "the distance between the first positioning mark point and the first pad group 34" refers to the lateral distance between the center point of the first positioning mark point and the center line of the first pad group 34, and "the distance between the second positioning mark point and the second pad group 35" refers to the lateral distance between the center point of the second positioning mark point and the center line of the second pad group 35.

[0046] Furthermore, in this embodiment, multiple through holes 50 are spaced apart along the first direction a. The circuit board structure also includes cutting marks, which are located outside the outermost through hole 50 and spaced apart from it. In this way, when the circuit board is cut along the cutting marks, the outermost through hole 50 can be prevented from being cut and damaged. The cutting marks can be physical marking structures or virtual spatial coordinate information.

[0047] This application also provides a light board, which includes a circuit board structure and LED beads disposed on the circuit board structure, wherein the circuit board structure is the aforementioned circuit board structure. The aforementioned circuit board structure can effectively solve the problem of poor circuit board consistency in related technologies, and the light board with the aforementioned circuit board structure also has the aforementioned advantages. It should be noted that in COB technology, the aforementioned LED beads refer to light-emitting chips.

[0048] This application also provides an LED display device, which includes a lamp board, wherein the lamp board is the aforementioned lamp board. The aforementioned lamp board can effectively solve the problem of poor circuit board consistency in related technologies, and the LED display device having the aforementioned lamp board also has the aforementioned advantages.

[0049] The circuit board structure, lamp board, and LED display device adopted in this embodiment can achieve high consistency of Cob pads and break through the technical bottleneck of smaller pixel pitch.

[0050] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0051] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0052] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0053] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A circuit board structure, characterized in that, include: base(10); A solder resist layer (20) is provided on one side of the substrate (10), the solder resist layer (20) having an opening (21) and exposing a portion of the substrate (10); A pad portion (30) is disposed on the substrate (10) and located within the opening window (21), the pad portion (30) having a first connection end (31) extending to the edge of the opening window (21); A first electrical connector (40) is located between the solder resist layer (20) and the substrate (10) and is used to connect the first connector (31) and the conductive element.

2. The circuit board structure according to claim 1, characterized in that, The pad portion (30) includes a pad body (32) and a protrusion (33). The pad body (32) is spaced apart from the edge of the opening window (21) and is used to connect to electrical components. The protrusion (33) is connected to the pad body (32), and the free end of the protrusion (33) forms the first connection end (31).

3. The circuit board structure according to claim 1, characterized in that, The first electrical connector (40) has a second connector (41) connected to the first connector (31), and the difference between the width of the first connector (31) and the width of the second connector (41) is greater than or equal to 0 and less than or equal to 15 μm.

4. The circuit board structure according to claim 1, characterized in that, The circuit board structure also includes a through hole (50), which is disposed through the substrate (10), and the first electrical connector (40) is connected between the through hole (50) and the first connection end (31).

5. The circuit board structure according to claim 2, characterized in that, The surface area of ​​the pad body (32) is greater than the surface area of ​​the protrusion (33); and / or, The pad body (32) has a rectangular structure, and the pad portion (30) also includes a chamfered portion (321) disposed at the corner of the pad body (32).

6. The circuit board structure according to claim 2 or 5, characterized in that, The distance between the pad body (32) and the edge of the window (21) is greater than or equal to 25 μm and less than or equal to 50 μm; and / or, The protrusion (33) is a strip structure, and the width of the first connecting end (31) is greater than or equal to 25 μm and less than or equal to 55 μm.

7. The circuit board structure according to claim 4, characterized in that, The solder pad portion (30), the first electrical connector (40), and the conductive via (50) are all multiple, and the circuit board structure also includes a second... An electrical connector (60) is provided, wherein a plurality of the pad portions (30) are spaced apart along a first direction (a) and respectively form a first pad group (34) and a second pad group (35), the first pad group (34) and the second pad group (35) are spaced apart along a second direction (b), the plurality of the pad portions (30) in the first pad group (34) are connected through a second electrical connector (60), and a plurality of through holes (50) are provided one-to-one with the plurality of the pad portions (30) in the second pad group (35) and are connected through the first electrical connector (40), wherein the first direction (a) and the second direction (b) are arranged at an angle.

8. The circuit board structure according to claim 7, characterized in that, The circuit board structure also includes a first positioning mark and a second positioning mark disposed within the opening window (21). The first positioning mark is located on the side of the first pad group (34) away from the second pad group (35), and the second positioning mark is located on the side of the second pad group (35) away from the first pad group (34). The distance between the first positioning mark and the first pad group (34) is less than the distance between the second positioning mark and the second pad group (35).

9. A lamp board, comprising a circuit board structure and lamp beads disposed on the circuit board structure, characterized in that, The circuit board structure is the circuit board structure according to any one of claims 1 to 8.

10. An LED display device, comprising a lamp panel, characterized in that, The lamp panel is the lamp panel described in claim 9.

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