Heat dissipation glue filling box and heat dissipation glue filling assembly

Abstract

A heat dissipation glue pouring box and a heat dissipation glue pouring assembly, the heat dissipation glue pouring box comprises a bottom wall and a plurality of side walls, the bottom wall and the plurality of side walls enclose an accommodating space with an opening at one end for accommodating a heat dissipation device, the heat dissipation device is fixed on a first side surface of a mounting plate, the mounting plate is fixed on the plurality of side walls, and the mounting plate is fixed on the side walls. The heat dissipation device makes contact with the first side face of the bottom wall, the second side face of the bottom wall is attached to the machine shell, heat dissipation glue is poured into the heat dissipation glue pouring box, and a heat conduction silica gel layer is arranged on the second side face of the bottom wall. According to the invention, the heat of the mounting plate can be effectively dissipated, and the influence on other devices on the printed circuit board is avoided, so that the service life of all devices on the mounting plate is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of power modules, and more specifically, to a heat dissipation potting box and a heat dissipation potting assembly. Background Technology

[0002] In power supply modules, printed circuit boards (PCBs) are typically used for filtering. A PCB is an electronic component or circuit assembly directly mounted on a printed circuit board to filter out unwanted frequency components, thereby ensuring signal purity. It utilizes the specific frequency response characteristics of components such as capacitors, inductors, and resistors to selectively pass or suppress signals. However, the components on a PCB are prone to generating significant heat during operation, which not only reduces the lifespan of the components on the PCB but also affects the lifespan of other components on the printed circuit board. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a heat dissipation potting box and heat dissipation potting assembly, which can effectively dissipate heat from printed circuit boards, thereby extending the life of all components on the printed circuit board.

[0004] The technical solution adopted by this utility model to solve its technical problem is as follows: a heat dissipation potting box is constructed, including a bottom wall and multiple side walls. The bottom wall and the multiple side walls form an accommodating space with one end open for accommodating a heat dissipation device. The heat dissipation device is fixed on a first side of a mounting plate. The mounting plate is fixed on the multiple side walls. The heat dissipation device is in contact with the first side of the bottom wall. The second side of the bottom wall is attached to the housing. Heat dissipation adhesive is poured into the heat dissipation potting box. A thermally conductive silicone layer is provided on the second side of the bottom wall.

[0005] In the heat dissipation potting box of this utility model, the plurality of sidewalls include a first sidewall, a second sidewall, a third sidewall and a fourth sidewall. The first sidewall and the second sidewall are directly opposite each other, and the third sidewall and the fourth sidewall are directly opposite each other. A plurality of fixing posts are respectively disposed on the third sidewall and the fourth sidewall.

[0006] In the heat dissipation potting box described in this utility model, the third sidewall includes a first sidewall segment, a second sidewall segment, a third sidewall segment, and a fourth sidewall segment;

[0007] The orthographic projections of the second sidewall segment, the third sidewall segment, and the fourth sidewall segment onto the plane containing the first sidewall or the second sidewall overlap with each other;

[0008] The orthographic projection of the first sidewall segment onto the plane containing the first or second sidewall is closer to the fourth sidewall than the orthographic projections of the second, third, and fourth sidewall segments onto the plane containing the first or second sidewall.

[0009] In the heat dissipation potting box of this utility model, a first fixing post is provided between the first side wall segment and the second side wall segment, a second fixing post is provided between the second side wall segment and the third side wall segment, a limiting hole is provided between the third side wall segment and the fourth side wall segment, and a fixing plate extending toward the fourth side wall is provided on the fourth side wall segment.

[0010] In the heat dissipation potting box described in this utility model, the fourth sidewall includes a fifth sidewall segment, a sixth sidewall segment, and a seventh sidewall segment;

[0011] The orthographic projections of the sixth sidewall segment and the seventh sidewall segment onto the plane containing the first sidewall or the second sidewall overlap with each other;

[0012] The orthographic projection of the fifth sidewall segment onto the plane containing the first or second sidewall is closer to the third sidewall than the orthographic projections of the sixth and seventh sidewall segments onto the plane containing the first or second sidewall.

[0013] In the heat dissipation potting box of this utility model, a third fixing post is provided between the fifth side wall segment and the sixth side wall segment, a fixing post is provided between the sixth side wall segment and the seventh side wall segment, and a fifth fixing post is provided at the connection between the fourth side wall segment and the seventh side wall segment.

[0014] In the heat dissipation potting box of this utility model, a potting port is provided on the second side of the mounting plate to pour the heat dissipation adhesive into the heat dissipation potting box through the potting port; and / or a plurality of reinforcing ribs are provided on the first side of the bottom wall, the plurality of reinforcing ribs being distributed in a grid pattern.

[0015] The heat dissipation potting box of this utility model forms an open-end accommodating space with a bottom wall and multiple side walls to accommodate heat dissipation devices. A mounting plate for fixing the heat dissipation devices is fixed to the side walls, so that the heat dissipation devices are in contact with a first side of the bottom wall, and the second side of the bottom wall is attached to the housing. Simultaneously, heat dissipation adhesive is poured into the heat dissipation potting box, and a thermally conductive silicone layer is provided on the second side of the bottom wall. This seals the heat from the heat dissipation devices within the heat dissipation potting box, and then effectively conducts the heat sealed within the heat dissipation potting box to the housing through the heat dissipation adhesive and the thermally conductive silicone layer. Therefore, it can effectively dissipate heat from the mounting plate and avoid affecting other components on the mounting plate, thereby extending the lifespan of all components on the mounting plate.

[0016] Another technical solution adopted by this utility model to solve its technical problem is to construct a heat dissipation potting assembly, including a printed circuit board, a heat dissipation potting box, a main body of the casing, and a top cover of the casing; multiple heat dissipation devices are installed on the first side of the printed circuit board.

[0017] The heat dissipation potting box includes a bottom wall and multiple side walls. The bottom wall and the multiple side walls form an accommodating space with one open end for accommodating the heat dissipation device on the printed circuit board. The multiple side walls are provided with fixing posts for fixing the printed circuit board. The heat dissipation device is in contact with a first side of the bottom wall. The second side of the bottom wall is attached to the upper cover of the housing. The second side of the printed circuit board is fixed to the main body of the housing. The second side of the printed circuit board is provided with a potting port for pouring heat dissipation adhesive into the heat dissipation potting box through the potting port. A thermally conductive silicone layer is provided on the second side of the bottom wall.

[0018] In the heat dissipation potting assembly of this utility model, the plurality of sidewalls include a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall. The first sidewall and the second sidewall are directly opposite each other, and the third sidewall and the fourth sidewall are directly opposite each other. The plurality of fixing posts are respectively disposed on the first sidewall and the second sidewall.

[0019] In the heat dissipation potting assembly of this utility model, the third sidewall includes a first sidewall segment, a second sidewall segment, a third sidewall segment, and a fourth sidewall segment; the fourth sidewall includes a fifth sidewall segment, a sixth sidewall segment, and a seventh sidewall segment.

[0020] The orthographic projections of the second sidewall segment, the third sidewall segment, and the fourth sidewall segment onto the plane containing the first sidewall or the second sidewall overlap with each other;

[0021] The orthographic projection of the first sidewall segment onto the plane containing the first or second sidewall is closer to the fourth sidewall than the orthographic projections of the second sidewall segment, the third sidewall segment, and the fourth sidewall segment onto the plane containing the first or second sidewall.

[0022] The orthographic projections of the sixth sidewall segment and the seventh sidewall segment onto the plane containing the first sidewall or the second sidewall overlap with each other;

[0023] The orthographic projection of the fifth sidewall segment onto the plane containing the first or second sidewall is closer to the third sidewall than the orthographic projections of the sixth and seventh sidewall segments onto the plane containing the first or second sidewall.

[0024] The heat dissipation potting assembly of this utility model comprises a bottom wall and multiple side walls forming an open-end accommodating space for accommodating heat dissipation devices. A mounting plate for fixing the heat dissipation devices is fixed to the side walls, so that the heat dissipation devices are in contact with a first side of the bottom wall. The second side of the bottom wall is attached to the housing. Simultaneously, heat dissipation adhesive is poured into the heat dissipation potting box, and a thermally conductive silicone layer is provided on the second side of the bottom wall. This seals the heat from the heat dissipation devices within the heat dissipation potting box, and then effectively conducts the heat sealed within the heat dissipation potting box to the housing through the heat dissipation adhesive and the thermally conductive silicone layer. Therefore, it can effectively dissipate heat from the printed circuit board and avoid affecting other components on the printed circuit board, thereby extending the lifespan of all components on the printed circuit board. Attached Figure Description

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0026] Figure 1 This is a perspective view of a preferred embodiment of the heat dissipation potting box of this utility model;

[0027] Figure 2 yes Figure 1 The front view of the heat dissipation potting box shown;

[0028] Figure 3 This is a front view of a preferred embodiment of the heat dissipation potting assembly of this utility model;

[0029] Figure 4 It is along Figure 3 A cross-sectional view along line AA;

[0030] Figure 5 This is a schematic diagram of a preferred embodiment of the printed circuit board of the heat dissipation potting assembly of this utility model;

[0031] Figure 6 This is an assembly diagram of the printed circuit board and the heat dissipation potting box of the heat dissipation potting assembly of this utility model.

[0032] Figure 7 This is a schematic diagram of the main body of the heat dissipation potting assembly of this utility model;

[0033] Figure 8 This is a schematic diagram of the housing cover of the heat dissipation potting assembly of this utility model. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0035] Figure 1 This is a perspective view of a preferred embodiment of the heat dissipation potting box of this utility model. Figure 2 yes Figure 1 A schematic diagram of the heat dissipation potting box from another angle. Figure 3 This is a front view of a preferred embodiment of the heat dissipation potting assembly of this utility model. Figure 4 It is along Figure 3 A cross-sectional view along line AA. Figure 5 This is a schematic diagram of a preferred embodiment of the printed circuit board of the heat dissipation potting assembly of this utility model. Figure 6 This is an assembly diagram of the printed circuit board and the heat dissipation potting box of the heat dissipation potting assembly of this utility model. Figure 7 This is a schematic diagram of the main body of the heat dissipation potting assembly of this utility model. Figure 8 This is a schematic diagram of the housing cover of the heat dissipation potting assembly of this utility model.

[0036] like Figures 1-8 As shown, the heat dissipation potting box 100 of this utility model includes a bottom wall 110 and multiple side walls 120-150. The bottom wall 110 and the multiple side walls 120-150 form an accommodating space with one end open for accommodating a heat dissipation device 210, which is fixed to a first side of a mounting plate 200. In a preferred embodiment of the present invention, the mounting plate 200 is a printed circuit board, and the heat dissipation device 210 is a filter board PCB mounted on the printed circuit board, which includes, for example, capacitors, inductors, and resistors. Of course, the heat dissipation device 210 may also include other devices, such as transformers. The heat dissipation device 210 needs to dissipate heat.

[0037] The mounting plate 200 is fixed to the plurality of side walls 120-150, for example, fixing posts 160 for fixing the mounting plate 200 are provided on the plurality of side walls 120-150. The heat dissipation device 210 contacts the first side 111 of the bottom wall 110, and the second side 112 of the bottom wall 110 is attached to the housing, preferably on the top cover 400 of the housing. A thermally conductive silicone layer 114 is provided on the second side 112 of the bottom wall 110. In a preferred embodiment of the present invention, a glue-filling port 220 is provided on the second side of the mounting plate 200 to fill the heat dissipation glue box 100 with heat dissipation glue 600 through the glue-filling port 220. The mounting plate 200 can also be fitted with a plurality of screw holes, and then fixed to the heat dissipation glue box 100 by mounting screws and screw holes.

[0038] In a preferred embodiment of this utility model, different heat dissipation potting boxes can be designed according to the shape of different mounting plates. The heat dissipation potting box may include a bottom wall and four side walls, such as side wall 120, side wall 130, side wall 140 and side wall 150. Of course, it may also include more side walls. These side walls can be manufactured independently or integrally formed, or they can be integrally formed together with the bottom wall 110.

[0039] The heat dissipation potting box of this utility model comprises a bottom wall and multiple side walls forming an open-end accommodating space for accommodating heat dissipation devices. A mounting plate for fixing the heat dissipation devices is fixed to the side walls, such that the heat dissipation devices are in contact with a first side of the bottom wall, and a second side of the bottom wall is attached to the housing. A potting port is provided on the mounting plate to inject heat dissipation potting box through the port. A thermally conductive silicone layer is provided on the second side of the bottom wall. This design seals the heat from the heat dissipation devices within the heat dissipation potting box, and then effectively conducts the heat sealed within the heat dissipation potting box to the housing through the heat dissipation potting box and the thermally conductive silicone layer. Therefore, it effectively dissipates heat from the mounting plate and avoids affecting other components on the mounting plate, thereby extending the lifespan of all components on the mounting plate.

[0040] Further as Figure 2 As shown, in a preferred embodiment of this utility model, sidewalls 120 and 130 face each other, and sidewalls 140 and 150 face each other. A plurality of fixing posts 160 are respectively disposed on sidewalls 140, 150, and the first side surface 111 of the bottom wall 110. Sidewall 140 includes sidewall segments 141, 142, 143, and 144. The orthographic projections of sidewall segments 142, 143, and 144 onto the plane containing sidewall 120 or sidewall 130 overlap each other. That is, as... Figure 1 As shown, the sidewall segments 142, 143, and 144 are arranged in a straight line in the horizontal direction. The orthographic projection of sidewall segment 141 onto the plane containing sidewall 120 or sidewall 130 is closer to sidewall 150 than the orthographic projections of sidewall segments 142, 143, and 144 onto the plane containing sidewall 120 or sidewall 130. That is, as... Figure 1 As shown, the sidewall segment 141 is concave in the horizontal direction relative to the sidewall segments 142, 143 and 144, that is, closer to the sidewall 150.

[0041] A fixing post 161 is provided between sidewall segments 141 and 142, a fixing post 162 is provided between sidewall segments 142 and 143, a limiting hole 164 is provided between sidewall segments 143 and 144, and a fixing plate 165 extending toward the sidewall 150 is provided on sidewall segment 144. Figure 1 As shown, the fixing post 161 is located at the bent connection structure of the side wall segments 141 and 142, and is recessed towards the side wall 150 to form a hollow fixing post; the fixing post 162 is located at the horizontal connection position of the side wall segments 142 and 143, and is also recessed towards the side wall 150 to form a hollow fixing post. The top of the fixing posts 161 and 162 is a fixing plate 166 with fixing holes. Fixing holes are also provided on the fixing plate 165.

[0042] Further as Figure 1 As shown, in a preferred embodiment of this utility model, the sidewall 150 includes sidewall segments 151, 152, and 153; the orthographic projections of sidewall segments 152 and 153 onto the plane containing the sidewall 120 or the sidewall 130 overlap each other. As previously described, in conjunction with Figure 1 It can be seen that the sidewall segments 152 and 153 are arranged in a straight line in the horizontal direction. The orthographic projection of the sidewall segment 151 onto the plane containing the sidewall 120 or the sidewall 130 is closer to the sidewall 140 than the orthographic projections of the sidewall segments 152 and 153 onto the plane containing the sidewall 120 or the sidewall 130. As mentioned above, in conjunction with Figure 1 It can be seen that the sidewall segment 151 is concave in the horizontal direction relative to the sidewall segments 152 and 153, that is, closer to the sidewall 140.

[0043] A fixing post 163 is provided between the sidewall segment 151 and the sidewall segment 152, a fixing post 164 is provided between the sidewall segment 152 and the sidewall segment 153, and a fixing post 168 is provided at the connection between the sidewall segment 144 and the sidewall segment 153. Figure 1 As shown, the fixing post 163 is located at the corner connection position of the side wall segments 151 and 152, and is recessed towards the side wall 140 to form a hollow fixing post; the fixing post 164 is located at the horizontal connection position of the side wall segments 142 and 143, and is recessed towards the side wall 140 to form a hollow fixing post. The top of the fixing posts 163 and 164 is a fixing plate with fixing holes. The fixing post 168 is located at the corner connection position of the side wall segments 144 and 153, and is also provided with fixing holes.

[0044] By providing a fixing post with a fixing plate and fixing holes, the mounting plate 200 can be fixed to the side wall segment by engaging with the screw holes on the mounting plate 200. Furthermore, the design of the side wall segment not only matches the shape of the heat dissipation device 210 on the mounting plate 200, but also helps to evenly distribute the thermal adhesive 600, ensuring that the thermal adhesive 600 is evenly distributed within the thermal potting box. Simultaneously, the side wall segment also prevents the thermal adhesive 600 from flowing out of the thermal potting box.

[0045] Further as Figure 1 As shown, in a preferred embodiment of this utility model, a plurality of reinforcing ribs 113 are provided on the first side 111 of the bottom wall 110. The plurality of reinforcing ribs 113 are distributed in a grid pattern, thereby effectively enhancing the strength of the heat dissipation potting box. A fixing post 169 may also be provided on the first side 111 of the bottom wall 110, which can match the mounting holes on the mounting plate 200.

[0046] The heat dissipation potting box of this utility model comprises a bottom wall and multiple side walls forming an open-end accommodating space for accommodating heat dissipation devices. A mounting plate for fixing the heat dissipation devices is fixed to the side walls, ensuring the heat dissipation devices are in contact with a first side of the bottom wall. The second side of the bottom wall is attached to the casing. A potting port is provided on the mounting plate to inject thermal adhesive 600 into the heat dissipation potting box. A thermally conductive silicone layer is provided on the second side of the bottom wall. This design seals the heat from the heat dissipation devices within the heat dissipation potting box, and the heat is effectively conducted to the casing through the thermal adhesive 600 and the thermally conductive silicone layer. Therefore, it effectively dissipates heat from the printed circuit board (PCB) while avoiding impact on other components on the PCB, thus extending the lifespan of all components on the PCB. This unique heat dissipation potting box structure not only perfectly matches PCBs, especially those housing filter PCBs for better sealing and heat dissipation, but also possesses sufficient strength to provide good support for the PCB, is easy to manufacture, and is suitable for mass production.

[0047] like Figures 3-8 As shown, this utility model further discloses a heat dissipation potting assembly 10, including a printed circuit board 200 (i.e., mounting plate 200), a heat dissipation potting box 100, a housing body 300, and a housing cover 400; a plurality of heat dissipation devices 210 are mounted on the first side of the printed circuit board 200.

[0048] Combination Figures 1-8The heat dissipation potting box 100 includes a bottom wall 110, side walls 120, 130, 140, and 150. The bottom wall 110 and the side walls 120, 130, 140, and 150 form an accommodating space with one open end for accommodating the heat dissipation device 210 on the printed circuit board 200. The heat dissipation device 210 contacts a first side surface 111 of the bottom wall 110. The second side surface 121 of the bottom wall 110 is attached to the upper cover 400 of the housing. The second side surface of the printed circuit board 200 is fixed to the main body 300 of the housing. A potting port 220 is provided on the second side surface of the printed circuit board 200 to pour heat dissipation adhesive 600 into the heat dissipation potting box 100 through the potting port 220. A thermally conductive silicone layer 700 is provided on the second side surface 112 of the bottom wall 110. The heat dissipation adhesive 600 is preferably a heat dissipation AB adhesive. Figures 3-8 As shown, the main body 300 and the upper cover 400 of the housing can be any known housing body and upper cover in the art, as long as they have enough space to accommodate the printed circuit board 200 (i.e., mounting plate 200) and the heat dissipation structure formed by the heat dissipation potting box 100.

[0049] Combination Figures 1-8 The sidewalls 120 and 130 face each other, and the sidewalls 140 and 150 face each other. Multiple fixing posts 160 are respectively disposed on the sidewalls 140 and 150, and on the first side surface 111 of the bottom wall 110. The sidewall 140 includes sidewall segments 141, 142, 143, and 144. The orthographic projections of sidewall segments 142, 143, and 144 onto the plane containing the sidewall 120 or 130 overlap each other. That is, as... Figure 1 As shown, the sidewall segments 142, 143, and 144 are arranged in a straight line in the horizontal direction. The orthographic projection of sidewall segment 141 onto the plane containing sidewall 120 or sidewall 130 is closer to sidewall 150 than the orthographic projections of sidewall segments 142, 143, and 144 onto the plane containing sidewall 120 or sidewall 130. That is, as... Figure 1 As shown, the sidewall segment 141 is concave in the horizontal direction relative to the sidewall segments 142, 143 and 144, that is, closer to the sidewall 150.

[0050] A fixing post 161 is provided between sidewall segments 141 and 142, a fixing post 162 is provided between sidewall segments 142 and 143, a limiting hole 164 is provided between sidewall segments 143 and 144, and a fixing plate 165 extending toward the sidewall 150 is provided on sidewall segment 144. Figure 1 As shown, the fixing post 161 is located at the bent connection structure of the side wall segments 141 and 142, and is recessed towards the side wall 150 to form a hollow fixing post; the fixing post 162 is located at the horizontal connection position of the side wall segments 142 and 143, and is also recessed towards the side wall 150 to form a hollow fixing post. The top of the fixing posts 161 and 162 is a fixing plate 166 with fixing holes. Fixing holes are also provided on the fixing plate 165.

[0051] Further as Figure 1 As shown, in a preferred embodiment of this utility model, the sidewall 150 includes sidewall segments 151, 152, and 153; the orthographic projections of sidewall segments 152 and 153 onto the plane containing the sidewall 120 or the sidewall 130 overlap each other. As previously described, in conjunction with Figure 1 It can be seen that the sidewall segments 152 and 153 are arranged in a straight line in the horizontal direction. The orthographic projection of the sidewall segment 151 onto the plane containing the sidewall 120 or the sidewall 130 is closer to the sidewall 140 than the orthographic projections of the sidewall segments 152 and 153 onto the plane containing the sidewall 120 or the sidewall 130. As mentioned above, in conjunction with Figure 1 It can be seen that the sidewall segment 151 is concave in the horizontal direction relative to the sidewall segments 152 and 153, that is, closer to the sidewall 140.

[0052] A fixing post 163 is provided between the sidewall segment 151 and the sidewall segment 152, a fixing post 164 is provided between the sidewall segment 152 and the sidewall segment 153, and a fixing post 168 is provided at the connection between the sidewall segment 144 and the sidewall segment 153. Figure 1 As shown, the fixing post 163 is located at the corner connection position of the side wall segments 151 and 152, and is recessed towards the side wall 140 to form a hollow fixing post; the fixing post 164 is located at the horizontal connection position of the side wall segments 142 and 143, and is recessed towards the side wall 140 to form a hollow fixing post. The top of the fixing posts 163 and 164 is a fixing plate with fixing holes. The fixing post 168 is located at the corner connection position of the side wall segments 144 and 153, and is also provided with fixing holes.

[0053] By providing a fixing post with a fixing plate and fixing holes, the mounting plate 200 can be fixed to the side wall segment by engaging with the screw holes on the mounting plate 200. Furthermore, the design of the side wall segment not only matches the shape of the heat dissipation device 210 on the mounting plate 200, but also helps to evenly distribute the thermal adhesive 600, ensuring that the thermal adhesive 600 is evenly distributed within the thermal potting box. Simultaneously, the side wall segment also prevents the thermal adhesive 600 from flowing out of the thermal potting box.

[0054] Further as Figure 1 As shown, in a preferred embodiment of this utility model, a plurality of reinforcing ribs 113 are provided on the first side 111 of the bottom wall 110. The plurality of reinforcing ribs 113 are distributed in a grid pattern, thereby effectively enhancing the strength of the heat dissipation potting box. A fixing post 169 may also be provided on the first side 111 of the bottom wall 110, which can match the mounting holes on the mounting plate 200.

[0055] The heat dissipation potting assembly of this invention comprises a bottom wall and multiple side walls forming an open-end accommodating space for housing a heat dissipation device. A mounting plate for fixing the heat dissipation device is fixed to the side walls, ensuring the heat dissipation device contacts a first side of the bottom wall. The second side of the bottom wall is attached to the housing. A potting port is provided on the mounting plate to inject heat dissipation potting compound into the heat dissipation potting box. A thermally conductive silicone layer is provided on the second side of the bottom wall. This seals the heat from the heat dissipation device within the heat dissipation potting box, and the heat is effectively conducted to the housing through the heat dissipation potting compound and the thermally conductive silicone layer. Therefore, it effectively dissipates heat from the printed circuit board (PCB) while avoiding impact on other components on the PCB, thus extending the lifespan of all components on the PCB. This unique heat dissipation potting box structure not only perfectly matches the PCB, especially for PCBs housing filter circuit boards, achieving better sealing and heat dissipation, but also possesses sufficient strength to provide good support for the PCB. Furthermore, it is easy to manufacture and suitable for mass production.

[0056] Although this utility model has been described through specific embodiments, those skilled in the art should understand that various modifications and equivalent substitutions can be made to this utility model without departing from its scope. Furthermore, various modifications can be made to this utility model for specific situations or materials without departing from its scope. Therefore, this utility model is not limited to the specific embodiments disclosed, but should include all embodiments falling within the scope of the claims of this utility model.

[0057] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation potting box, characterized in that, The device includes a bottom wall and multiple side walls, which together form an open-end accommodating space for accommodating a heat dissipation device. The heat dissipation device is fixed to a first side of a mounting plate, and the mounting plate is fixed to the multiple side walls. The heat dissipation device is in contact with the first side of the bottom wall, and the second side of the bottom wall is attached to the housing. Heat dissipation adhesive is poured into the heat dissipation potting box, and a thermally conductive silicone layer is provided on the second side of the bottom wall.

2. The heat dissipation potting box according to claim 1, characterized in that, The plurality of sidewalls includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall. The first sidewall and the second sidewall are directly opposite each other, and the third sidewall and the fourth sidewall are directly opposite each other. A plurality of fixed posts are respectively disposed on the third sidewall and the fourth sidewall.

3. The heat dissipation potting box according to claim 2, characterized in that, The third sidewall includes a first sidewall segment, a second sidewall segment, a third sidewall segment, and a fourth sidewall segment; The orthographic projections of the second sidewall segment, the third sidewall segment, and the fourth sidewall segment onto the plane containing the first sidewall or the second sidewall overlap with each other; The orthographic projection of the first sidewall segment onto the plane containing the first or second sidewall is closer to the fourth sidewall than the orthographic projections of the second, third, and fourth sidewall segments onto the plane containing the first or second sidewall.

4. The heat dissipation potting box according to claim 3, characterized in that, A first fixing post is provided between the first sidewall segment and the second sidewall segment, a second fixing post is provided between the second sidewall segment and the third sidewall segment, a limiting hole is provided between the third sidewall segment and the fourth sidewall segment, and a fixing plate extending toward the fourth sidewall is provided on the fourth sidewall segment.

5. The heat dissipation potting box according to claim 3, characterized in that, The fourth sidewall includes a fifth sidewall segment, a sixth sidewall segment, and a seventh sidewall segment; The orthographic projections of the sixth sidewall segment and the seventh sidewall segment onto the plane containing the first sidewall or the second sidewall overlap with each other; The orthographic projection of the fifth sidewall segment onto the plane containing the first or second sidewall is closer to the third sidewall than the orthographic projections of the sixth and seventh sidewall segments onto the plane containing the first or second sidewall.

6. The heat dissipation potting box according to claim 5, characterized in that, A third fixing post is provided between the fifth sidewall segment and the sixth sidewall segment, a fixing post is provided between the sixth sidewall segment and the seventh sidewall segment, and a fifth fixing post is provided at the connection between the fourth sidewall segment and the seventh sidewall segment.

7. The heat dissipation potting box according to any one of claims 1 to 6, characterized in that, The second side of the mounting plate is provided with a glue-filling port to fill the heat-dissipating glue into the heat-dissipating glue box through the glue-filling port; and / or the first side of the bottom wall is provided with a plurality of reinforcing ribs, the plurality of reinforcing ribs being distributed in a grid pattern.

8. A heat dissipation potting assembly, characterized in that, It includes a printed circuit board, a heat dissipation potting box, a main body of the casing, and a top cover of the casing; multiple heat dissipation devices are mounted on the first side of the printed circuit board; The heat dissipation potting box includes a bottom wall and multiple side walls. The bottom wall and the multiple side walls form an accommodating space with one open end for accommodating the heat dissipation device on the printed circuit board. The multiple side walls are provided with fixing posts for fixing the printed circuit board. The heat dissipation device is in contact with a first side of the bottom wall. The second side of the bottom wall is attached to the upper cover of the housing. The second side of the printed circuit board is fixed to the main body of the housing. The second side of the printed circuit board is provided with a potting port for pouring heat dissipation adhesive into the heat dissipation potting box through the potting port. A thermally conductive silicone layer is provided on the second side of the bottom wall.

9. The heat dissipation potting assembly according to claim 8, characterized in that, The plurality of sidewalls include a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall. The first sidewall and the second sidewall are directly opposite each other, and the third sidewall and the fourth sidewall are directly opposite each other. The plurality of fixed posts are respectively disposed on the first sidewall and the second sidewall.

10. The heat dissipation potting assembly according to claim 9, characterized in that, The third sidewall includes a first sidewall segment, a second sidewall segment, a third sidewall segment, and a fourth sidewall segment; the fourth sidewall includes a fifth sidewall segment, a sixth sidewall segment, and a seventh sidewall segment. The orthographic projections of the second sidewall segment, the third sidewall segment, and the fourth sidewall segment onto the plane containing the first sidewall or the second sidewall overlap with each other; The orthographic projection of the first sidewall segment onto the plane containing the first or second sidewall is closer to the fourth sidewall than the orthographic projections of the second sidewall segment, the third sidewall segment, and the fourth sidewall segment onto the plane containing the first or second sidewall. The orthographic projections of the sixth sidewall segment and the seventh sidewall segment onto the plane containing the first sidewall or the second sidewall overlap with each other; The orthographic projection of the fifth sidewall segment onto the plane containing the first or second sidewall is closer to the third sidewall than the orthographic projections of the sixth and seventh sidewall segments onto the plane containing the first or second sidewall.

Images