Alloy glue pouring box for efficient heat dissipation of chip

Abstract

The utility model discloses an efficient heat dissipation alloy glue pouring box for a chip, which relates to the technical field of glue pouring boxes and is used for solving the problems that the existing glue pouring box is poor in heat dissipation capability and the performance of the chip is easy to reduce. The heat dissipation protrusions correspond to the chips on the PCB in position, the end faces of the inner sides of the heat dissipation protrusions are coated with heat conduction silicone grease layers, and the heat conduction silicone grease layers coated on the end faces of the heat dissipation protrusions make contact with the chips, so that the heat dissipation protrusions and the heat conduction silicone grease layers make contact with the chips to assist the chips in heat dissipation, and the heat dissipation effect of the chips is improved. The heat dissipation efficiency of the chip can be greatly improved, the heat dissipation capacity is high, the heat dissipation effect is good, the negative influence of high temperature on the performance of the chip is reduced, the normal performance of the chip is ensured, the reliability is improved, the safety is guaranteed, and the problems that an existing glue pouring box is poor in heat dissipation capacity, and the performance of the chip is prone to being reduced are solved.

Description

Technical Field

[0001] This utility model relates to the field of potting box technology, and in particular to a high-efficiency heat dissipation alloy potting box for chips. Background Technology

[0002] In existing technologies, chips are integrated onto PCB boards. However, most potting enclosures on the market currently use direct glue encapsulation, which prevents effective heat dissipation from the chip. Poor heat dissipation affects chip performance, reduces reliability, shortens lifespan, and degrades overall quality. Therefore, designing a potting enclosure with efficient heat dissipation to improve chip heat dissipation efficiency is essential.

[0003] In view of the shortcomings of the above solutions in actual production and implementation, modifications and improvements have been made. In the spirit and concept of seeking excellence, and with the assistance of professional knowledge and experience, and after much ingenuity and experimentation, a high-efficiency heat dissipation alloy potting box for chips has been specially provided to solve the problem of poor heat dissipation capacity of existing potting boxes, which easily leads to the degradation of chip performance. Utility Model Content

[0004] The purpose of this invention is to provide a high-efficiency heat dissipation alloy potting box for chips, which solves the problem that the existing potting boxes have poor heat dissipation capabilities and easily lead to a decline in chip performance.

[0005] The technical solution of this utility model is implemented as follows:

[0006] A high-efficiency heat dissipation alloy potting box for chips includes a cover and an alloy potting box that mates with it. End caps are provided on the left and right sides of the alloy potting box. A PCB board is placed in the internal space formed by the cover, the alloy potting box, and the end caps. A chip is placed on the PCB board. The cover has potting holes, and the alloy potting box has inwardly protruding hollow heat dissipation protrusions. The positions of the heat dissipation protrusions correspond to the positions of the chips on the PCB board. A thermally conductive silicone grease layer is applied to the inner end face of the heat dissipation protrusions, and the thermally conductive silicone grease layer applied to the end face of the heat dissipation protrusions is in contact with the chip.

[0007] The thermal grease layer in contact with the chip can quickly conduct heat and dissipate the chip's heat to achieve a rapid heat dissipation effect. The potting box and the heat dissipation protrusions on it are made of alloy material, which can quickly dissipate heat as a whole. In addition, the heat dissipation protrusions are hollow, which is more suitable for rapid heat dissipation.

[0008] In a preferred embodiment, a top post is provided on the inner side of the cover. The top post is used to fix the position of the PCB board so that the chip on the PCB board is in contact with the thermal grease layer.

[0009] In a preferred embodiment, the hollow portion of the heat dissipation protrusion is provided with heat sinks.

[0010] The heat sink is located in the hollow part of the heat dissipation protrusion, which increases the heat dissipation area and helps the heat dissipation protrusion to accelerate heat dissipation.

[0011] In a preferred embodiment, a plurality of raised heat dissipation strips are uniformly arranged on the outer surface of the alloy potting box.

[0012] Raised heat dissipation strips help increase the heat dissipation area on the outer surface of the alloy potting box, greatly improving heat dissipation efficiency.

[0013] The beneficial effects of this utility model are:

[0014] This solution uses heat dissipation bumps with thermally conductive silicone grease layers to contact the chip, thereby assisting in heat dissipation. This significantly improves the chip's heat dissipation efficiency, providing strong and effective heat dissipation. It reduces the negative impact of high temperatures on chip performance, ensures normal chip performance, improves reliability and safety, and indirectly extends the chip's lifespan. This solution also solves the problem of poor heat dissipation capacity in existing potting compounds, which can easily lead to a decline in chip performance. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a three-dimensional structural diagram of Embodiment 1 of the present utility model;

[0017] Figure 2 This is an exploded view of Embodiment 1 of the present invention;

[0018] Figure 3 This is a schematic diagram of the alloy potting box according to Embodiment 1 of this utility model;

[0019] Figure 4 This is a schematic diagram of the internal structure of Embodiment 1 of the present invention;

[0020] Figure 5 This is an exploded view of Embodiment 2 of the present invention.

[0021] In the diagram, 1-potting hole; 2-box cover; 3-alloy potting box; 4-PCB board; 5-thermal grease layer; 6-heat dissipation protrusion; 7-heat sink; 8-top post; 9-chip; 10-protruding heat sink strip; 11-end. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0024] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0025] In the description of the embodiments, unless otherwise expressly specified and limited, the terms "set," "connect," etc., should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or a connection through an intermediate medium, or it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0026] Implementation method 1, see Figures 1-4 A high-efficiency heat dissipation alloy potting box 3 for chip 9 includes a box cover 2 and an alloy potting box 3 that cooperates with it. The left and right sides of the alloy potting box 3 are respectively provided with plugs 11. The internal space formed by the box cover 2, the alloy potting box 3 and the plugs 11 at both ends is provided with a PCB board 4. The chip 9 is provided on the PCB board 4. The box cover 2 is provided with a potting hole 1. The alloy potting box 3 is provided with an inwardly protruding hollow heat dissipation protrusion 6. The position of the heat dissipation protrusion 6 corresponds to the position of the chip 9 on the PCB board 4. The inner end face of the heat dissipation protrusion 6 is coated with a thermal grease layer 5, and the thermal grease layer 5 applied to the end face of the heat dissipation protrusion 6 is in contact with the chip 9.

[0027] The thermal grease layer 5 that contacts the chip 9 can conduct heat quickly, dissipating the heat from the chip 9 to achieve rapid heat dissipation. The potting box and the heat dissipation protrusion 6 on it are made of alloy material, which can dissipate heat as quickly as possible. Furthermore, the heat dissipation protrusion 6 is hollow, which is more suitable for rapid heat dissipation.

[0028] The inner side of the cover 2 is provided with a top post 8, which is used to fix the position of the PCB board 4 so that the chip 9 on the PCB board 4 is in contact with the thermal grease layer 5.

[0029] The hollow part of the heat dissipation protrusion 6 is equipped with heat sink 7.

[0030] The heat sink 7 is located in the hollow part of the heat dissipation protrusion 6, which increases the heat dissipation area and helps the heat dissipation protrusion 6 to accelerate heat dissipation.

[0031] Implementation method 2, see Figure 5 The only difference between this embodiment and embodiment 1 is that a number of raised heat dissipation strips 10 are uniformly arranged on the outer surface of the alloy potting box 3.

[0032] The raised heat dissipation strip 10 helps to increase the heat dissipation area of ​​the outer surface of the alloy potting box 3, greatly improving the heat dissipation efficiency.

[0033] The beneficial effects of this utility model are:

[0034] This solution uses a heat dissipation protrusion 6 with a thermally conductive silicone grease layer 5 to contact the chip 9, thereby assisting the chip 9 in heat dissipation. This significantly improves the heat dissipation efficiency of the chip 9, providing strong and effective heat dissipation. It reduces the negative impact of high temperatures on the performance of the chip 9, ensures the normal performance of the chip 9, improves reliability and safety, and indirectly extends its service life. This solution solves the problem of poor heat dissipation capacity of existing potting boxes, which easily leads to a decline in the performance of the chip 9.

[0035] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope claimed by this utility model.

Claims

1. A high-efficiency heat dissipation alloy potting box for chips, comprising a cover and a matching alloy potting box, wherein end caps are respectively provided on the left and right sides of the alloy potting box, a PCB board is disposed in the internal space formed by the cover, the alloy potting box and the end caps, and a chip is disposed on the PCB board, wherein the cover is provided with potting holes, characterized in that, The alloy potting box is provided with an inwardly protruding hollow heat dissipation protrusion, the position of which corresponds to the position of the chip on the PCB board. The inner end face of the heat dissipation protrusion is coated with a thermal grease layer, and the thermal grease layer applied to the end face of the heat dissipation protrusion is in contact with the chip.

2. The high-efficiency heat dissipation alloy potting box for chips according to claim 1, characterized in that, The inner side of the box cover is provided with a top post, which is used to fix the position of the PCB board so that the chip on the PCB board is in contact with the thermal grease layer.

3. The high-efficiency heat dissipation alloy potting box for chips according to claim 1, characterized in that, The hollow portion of the heat dissipation protrusion is equipped with heat sinks.

4. The high-efficiency heat dissipation alloy potting box for chips according to claim 1, characterized in that, The outer surface of the alloy potting box is uniformly provided with several raised heat dissipation strips.

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