Wafer cleaning wheel equipment
By designing an interference-fit cleaning wheel structure and transmission components, the problem of wafer slippage in wafer cleaning equipment was solved, resulting in more efficient cleaning and stability, and reduced production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FENGBAO INTELLIGENT TECH (SHANGHAI) CO LTD
- Filing Date
- 2025-04-27
- Publication Date
- 2026-04-28
AI Technical Summary
In existing wafer cleaning equipment, wear of the cleaning wheel causes the wafer to slip, affecting the cleaning effect, increasing production costs and reducing production efficiency.
An interference fit cleaning wheel structure was designed, which combines rounded corners and increased groove depth to enhance the adhesion between the wafer and the cleaning wheel. The synchronous rotation is achieved by a motor-driven transmission component, and it is equipped with brushes and nozzles for cleaning.
It effectively reduces wafer slippage on the cleaning wheel, improves cleaning effect, enhances the stability of wafers and cleaning wheel, reduces production costs and improves production efficiency.
Smart Images
Figure CN224178558U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer cleaning wheel device. Background Technology
[0002] In the semiconductor chip manufacturing industry, cleaning the wafer surface after each grinding process is a crucial step. This is because various particles inevitably adhere to the wafer surface during grinding. These particles are tightly attached to the wafer surface through physical adsorption, necessitating the use of specialized wafer cleaning equipment.
[0003] Initially, this cleaning equipment operated stably, but over time, we discovered that wafer slippage occurred. Once the wafers slipped, the cleaning effect deteriorated. To find the cause, technicians further observed that the cleaning rollers on the equipment were worn, increasing the gap between them and the wafers, causing the slippage. Currently, the only way to maintain normal operation is to frequently replace the cleaning rollers, increasing production costs, affecting production efficiency, and even delaying delivery deadlines.
[0004] Therefore, those skilled in the art urgently need to provide a wafer cleaning device that can reduce wafer slippage on the cleaning wheel, increase the adsorption force between the wafer and the cleaning wheel, and improve the wafer cleaning effect. Utility Model Content
[0005] The purpose of this invention is to provide a wafer cleaning wheel device that can reduce wafer slippage on the cleaning wheel, increase the adhesion between the wafer and the cleaning wheel, and improve the wafer cleaning effect.
[0006] To achieve the above objectives, this utility model provides a wafer cleaning wheel device, including a support and a cleaning wheel. The cleaning wheel is rotatably connected to the side of the support. The wafer is embedded in the groove of the cleaning wheel and is interference-fitted with the cleaning wheel. The edge of the cleaning wheel at the groove entrance is provided with a rounded corner one, and the bottom of the groove of the cleaning wheel is provided with a rounded corner two. The rounded corner two is smaller than the edge rounded corner size of the wafer. The cleaning wheel is driven by a motor, and several cleaning wheels are connected together through a transmission assembly.
[0007] Preferably, two brushes are provided on the top side of the support, and the two brushes are respectively located on both sides of the wafer. The brushes are in contact with the wafer. Nozzles are provided on both sides of the wafer and spray cleaning fluid onto the wafer. The nozzles are connected to a cleaning fluid storage tank through pipes, and a pump body is provided in the pipes.
[0008] Preferably, the cleaning wheel includes a first cleaning wheel, a second cleaning wheel, and a third cleaning wheel. The second cleaning wheel is located at the bottom of the wafer, and the first and second cleaning wheels are located at the outer edge of the wafer. The first and third cleaning wheels are arranged in parallel.
[0009] Preferably, the motor is mounted on the bracket, the output shaft of the motor is rotatably connected to the bracket, and the output shaft of the motor is connected to the cleaning wheel via a transmission.
[0010] The first cleaning wheel is rotatably connected to the bracket via the first rotating shaft, and the second cleaning wheel is rotatably connected to the bracket via the second rotating shaft. The output shaft of the motor is driven by the second and third pulleys. The first rotating shaft is fixedly connected to the first pulley, and the second rotating shaft is fixedly connected to the fourth pulley. The first and second pulleys are connected together by the first belt, and the third and fourth pulleys are connected together by the second belt.
[0011] Preferably, the brush is elongated and is arranged parallel to the support.
[0012] Preferably, the surface roughness of the cleaning wheel is Ra3.2, the radius of the first rounded corner is 0.2mm, the depth d1 of the groove is 5.5mm, and the radius of the second rounded corner is 0.5mm.
[0013] The advantages and positive effects of the wafer cleaning wheel equipment described in this utility model are:
[0014] 1. By using an interference fit between the wafer and the cleaning wheel, the stability of the wafer on the cleaning wheel is enhanced, reducing the occurrence of wafer slippage.
[0015] 2. By designing the grooves of the cleaning wheel to have rounded corners, and making the rounded corner size smaller than that of the wafer edge, the two are more tightly fitted together. By reducing the size of the rounded corner at the edge where the cleaning wheel enters the groove, the positioning area of the wafer is increased, reducing the occurrence of wafer slippage.
[0016] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description
[0017] Figure 1 This is an overall structural diagram of a wafer cleaning wheel device according to the present invention;
[0018] Figure 2 This is a schematic diagram of the cleaning wheel structure of this utility model;
[0019] Figure 3 This is a top view of the transmission component of this utility model.
[0020] Figure Labels
[0021] 1. Cleaning wheel; 101. Cleaning wheel one; 102. Cleaning wheel two; 103. Cleaning wheel three; 2. Wafer; 3. Support; 4. Brush; 5. Rounded corner one; 6. Rounded corner two; 7. Belt pulley one; 8. Belt pulley two; 9. Belt pulley three; 10. Belt pulley four; 11. Motor. Detailed Implementation
[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0023] In this application, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. In case of any inconsistency, the meaning set forth in this specification or derived from the content described herein shall prevail. Furthermore, the terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit the scope of this application.
[0024] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.
[0025] like Figure 1-3 As shown, a wafer cleaning wheel device includes a support 3 and a cleaning wheel 1. The cleaning wheel 1 is rotatably connected to the side of the support 3. A wafer 2 is embedded in the groove of the cleaning wheel 1 and is interference-fitted with the cleaning wheel 1. The edge of the cleaning wheel 1 at the groove entrance is provided with a rounded corner 5. The bottom of the groove of the cleaning wheel 1 is provided with a rounded corner 6, which is smaller than the edge rounded corner size of the wafer 2. The cleaning wheel 1 is driven by a motor 11, and several cleaning wheels 1 are connected together through a transmission assembly.
[0026] Two brushes 4 are mounted on the top side of the support 3. The two brushes 4 are located on opposite sides of the wafer 2. The brushes 4 are in contact with the wafer 2. Nozzles are located on both sides of the wafer 2 and spray cleaning fluid onto the wafer 2. The nozzles are connected to a cleaning fluid storage tank via pipes, and a pump is installed inside the pipes.
[0027] The cleaning wheel 1 includes cleaning wheel one 101, cleaning wheel two 102, and cleaning wheel three 103. Cleaning wheel two 102 is located at the bottom of wafer 2. Cleaning wheel one 101 and cleaning wheel two 102 are located at the outer edge of wafer 2. Cleaning wheel one 101 and cleaning wheel three 103 are arranged in parallel.
[0028] The motor 11 is mounted on the bracket 3, and the output shaft of the motor 11 is rotatably connected to the bracket 3. The output shaft of the motor 11 is connected to the cleaning wheel 102 via transmission.
[0029] Cleaning wheel 101 is rotatably connected to bracket 3 via shaft 1, and cleaning wheel 102 is rotatably connected to bracket 3 via shaft 2. Pulley 2 8 and pulley 3 9 are driven onto the output shaft of motor 11. Pulley 1 7 is fixedly connected to shaft 1, and pulley 4 10 is fixedly connected to shaft 2. Pulley 1 7 and pulley 2 8 are connected together via belt 1. Pulley 3 9 and pulley 4 10 are connected together via belt 2.
[0030] The brush 4 is elongated and is arranged parallel to the support to brush the surface of the wafer 2. Specifically, the brush 4 is fixed to the support.
[0031] The procedure for using this device is as follows:
[0032] First, the wafer is embedded into the grooves of the three cleaning rollers with an interference fit. Next, motor 11 is started, and the output shaft of motor 11 rotates, driving cleaning roller 102 to rotate. This rotation in turn drives pulleys 8 and 9. Pulley 8, in turn, drives pulley 7 via belt 1, and pulley 9, in turn, drives pulley 10 via belt 2. This causes cleaning rollers 101, 102, and 103 to rotate in the same direction, using friction to rotate the wafer 2. Finally, cleaning fluid sprayed from the nozzle cleans the wafer, while brush 4 brushes the wafer surface.
[0033] Specifically, the roughness of the cleaning wheel 1 is Ra3.2. Increasing the roughness of the cleaning wheel increases the friction between the cleaning wheel and the wafer, resulting in a greater mechanical interlocking effect between the two, thereby enhancing the adsorption force of the cleaning wheel.
[0034] The radius of fillet 5 is 0.2mm. Reducing the size of fillet 5 increases the positioning area of wafer 2 and reduces the occurrence of edge slippage on wafer 2.
[0035] The trench depth d1 is 5.5mm, which increases the depth of the cleaning wheel trench, thereby increasing the effective contact depth of the wafer.
[0036] The radius of the fillet 2.6 is 0.5mm, which fits the wafer better and increases stability. The fillet size is smaller than the wafer edge fillet size, resulting in a tighter fit between the two.
[0037] The wafer 2 is interference-fitted with the cleaning wheel 1. Specifically, the wafer thickness is 1.0mm ± 0.02mm, and the trench width d2 is 0.85mm-0.9mm, which makes the wafer more stable when the cleaning equipment is running.
[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and not to limit it. Although the utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solution of this utility model, and these modifications or equivalent substitutions cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of this utility model.
Claims
1. A wafer cleaning wheel device, characterized in that: The device includes a support and a cleaning wheel. The cleaning wheel is rotatably connected to the side of the support. The wafer is embedded in the groove of the cleaning wheel and is interference-fitted with the cleaning wheel. The edge of the cleaning wheel at the groove entrance is provided with a rounded corner one, and the bottom of the groove of the cleaning wheel is provided with a rounded corner two. The rounded corner two is smaller than the edge rounded corner size of the wafer. The cleaning wheel is driven by a motor, and several cleaning wheels are connected together through a transmission assembly.
2. The wafer cleaning wheel equipment according to claim 1, characterized in that: Two brushes are provided on the top side of the support, and the two brushes are respectively located on both sides of the wafer. The brushes are in contact with the wafer. Nozzles are provided on both sides of the wafer and spray cleaning fluid onto the wafer. The nozzles are connected to a cleaning fluid storage tank through pipes, and a pump body is provided in the pipes.
3. The wafer cleaning wheel equipment according to claim 1, characterized in that: The cleaning wheel includes cleaning wheel one, cleaning wheel two, and cleaning wheel three. Cleaning wheel two is located at the bottom of the wafer, and cleaning wheel one and cleaning wheel two are located at the outer edge of the wafer. Cleaning wheel one and cleaning wheel three are arranged in parallel.
4. The wafer cleaning wheel equipment according to claim 3, characterized in that: The motor is mounted on the bracket, and the output shaft of the motor is rotatably connected to the bracket. The output shaft of the motor is connected to the second washing wheel via a transmission. The first cleaning wheel is rotatably connected to the bracket via the first rotating shaft, and the second cleaning wheel is rotatably connected to the bracket via the second rotating shaft. The output shaft of the motor is driven by the second and third pulleys. The first rotating shaft is fixedly connected to the first pulley, and the second rotating shaft is fixedly connected to the fourth pulley. The first and second pulleys are connected together by the first belt, and the third and fourth pulleys are connected together by the second belt.
5. A wafer cleaning wheel device according to claim 2, characterized in that: The brush is long and narrow, and the brush is arranged parallel to the support.
6. The wafer cleaning wheel equipment according to claim 1, characterized in that: The surface roughness of the cleaning wheel is Ra3.2, the radius of the first rounded corner is 0.2mm, the depth d1 of the groove is 5.5mm, and the radius of the second rounded corner is 0.5mm.