Electronic tag gluing device
By using a telescopic mechanism and a glue-dipping structure in tire production, the problem of inconsistent glue application on electronic tags was solved, achieving stable glue quantity and uniform position, reducing the defect rate, and meeting the needs of automated production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QINGDAO HIGHWAY IOT TECH CO LTD
- Filing Date
- 2025-05-06
- Publication Date
- 2026-05-01
AI Technical Summary
In tire production, the inconsistent application process of electronic tags in existing technologies leads to a high defect rate and fails to meet the needs of automated production.
The adhesive dispensing mechanism, consisting of a telescopic mechanism and an adhesive dispensing structure, uses an adhesive dispensing stick to pick up adhesive and apply it to the antenna of the electronic tag, ensuring a stable amount of adhesive and consistent placement each time.
It achieves stability and consistency in the application of adhesive to electronic tags, reduces the defect rate, and meets the needs of automated production.
Smart Images
Figure CN224181161U_ABST
Abstract
Description
An electronic tag adhesive application device Technical Field
[0001] This application relates to the field of tire technology, and more particularly to an electronic tag adhesive application device. Background Technology
[0002] In the production of traditional tire treads, vulcanized electronic tags are the unique identifiers of tires during their circulation. However, with the continuous advancement of the concept of intelligent manufacturing and the increasing level of automation in the tire industry, RFID (Radio Frequency Identification) electronic tags for tires are about to be widely used (hereinafter referred to as RFID electronic tags or RFID tags).
[0003] Before being implanted into tires or other products, RFID tags generally need to be coated or otherwise specially treated to ensure that the tags do not fall off during automated implantation and to increase the adhesion between the RFID tags and the implanted products.
[0004] With the promotion of RFID electronic tag applications, new RFID electronic tag implantation methods are gradually increasing: the method of applying adhesive to the tag to ensure the adhesion between the tag and the implanted product is being verified and tested. Summary of the Invention
[0005] The purpose of this utility model application is to provide an electronic tag adhesive application device to improve the effect of applying adhesive to electronic tags.
[0006] This application provides a glue-applying device, which includes a glue container for holding glue and a glue-dipping mechanism disposed on one side of the glue container; wherein...
[0007] The adhesive dispensing mechanism includes a telescopic mechanism, a connecting plate fixedly connected to the telescopic end of the telescopic mechanism, and an adhesive dispensing structure disposed on the connecting plate; wherein the adhesive dispensing structure includes at least one adhesive dispensing rod.
[0008] When the telescopic mechanism retracts to the first set position, the glue stick is immersed in the glue contained in the glue container;
[0009] When the telescopic mechanism extends to the second set position, the adhesive stick is exposed outside the adhesive container and comes into contact with the electronic tag to apply adhesive to the antenna of the electronic tag.
[0010] In the above technical solution, the glue-dipping mechanism, which consists of a telescopic mechanism and a glue-dipping structure, is used in conjunction with the glue container to apply glue to the electronic tag, thereby ensuring a stable amount of glue used each time. In addition, the glue is applied in a uniform position during application, which improves the glue application effect.
[0011] In one feasible embodiment, the telescopic mechanism is fixed to the outer wall of the adhesive container.
[0012] In a specific feasible solution, the telescopic mechanism is a drive cylinder, a drive hydraulic cylinder, or a linear motor.
[0013] In a specific feasible solution, there are two telescopic mechanisms, and the two telescopic mechanisms are arranged side by side.
[0014] In a specific feasible embodiment, the adhesive stick is L-shaped, wherein the vertical portion of the adhesive stick is fixedly connected to the connecting plate; and the horizontal portion of the adhesive stick is used to abut against the antenna of the electronic tag.
[0015] In a specific and feasible solution, there are two adhesive sticks, and the two adhesive sticks correspond one-to-one with the two antennas of the electronic tag; each adhesive stick is slidably connected to the connecting plate and can be locked in a set position; wherein, the direction of sliding of the adhesive stick is along the direction in which the two adhesive sticks are arranged.
[0016] In a specific feasible solution, the connecting plate is provided with a waist-shaped hole, and the end of the adhesive stick connected to the connecting plate is provided with a threaded rod. The threaded rod passes through the waist-shaped hole and is locked and fixed in the waist-shaped hole by a nut. Attached Figure Description
[0017] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments provided according to this disclosure and should not be construed as limiting the scope of this disclosure.
[0018] Figure 1 is a schematic diagram of the structure of the electronic tag provided in an embodiment of this application;
[0019] Figure 2 is a schematic diagram of the adhesive application device provided in an embodiment of this application;
[0020] Figure 3 is a top view of the adhesive application device provided in an embodiment of this application;
[0021] Figures 4a-4c are flowcharts illustrating the use of the adhesive application device provided in the embodiments of this application. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.
[0023] It should be noted that, unless otherwise defined, the technical or scientific terms used in one or more embodiments of this specification should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar words used in one or more embodiments of this specification do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0024] To facilitate understanding of the electronic tag adhesive application device provided in this application embodiment, its application scenario is first described. The electronic tag adhesive application device provided in this application embodiment is used to apply adhesive to electronic tags. Currently, adhesive application to electronic tags is often done manually, resulting in inconsistent adhesive application amounts and positions, leading to a high defect rate when the electronic tags are later fixed to tires. Therefore, this application embodiment provides an electronic tag adhesive application device to improve the adhesive application effect of electronic tags and adapt to automated production. A detailed description follows with reference to specific drawings and embodiments.
[0025] To facilitate understanding of the function of the adhesive application device provided in this application embodiment, the structure of its corresponding electronic tag is first introduced. As shown in Figure 1, the electronic tag 100 provided in this application embodiment includes an RFID chip 110 and an antenna 120. The RFID chip 110 embodies the main function of the electronic tag 100. The antenna 120 is used to transmit and receive signals, writing external information into the RFID chip 110 or reading information from the RFID chip 110 through the antenna 120. In configuration, the antenna 120 is fixedly connected to the RFID chip 110, and there are two antennas 120, positioned on opposite sides of the RFID chip 110, thus forming the elongated structure shown in Figure 2. Using the two antennas 120 enhances the information interaction capability of the electronic chip 110 itself. Furthermore, when the two antennas 120 are arranged as described above, they can also serve as a connection structure for fixing the electronic tag 100 to the tire. For example, embedding the two antennas 120 into the tire improves the firmness of the electronic tag 100. The adhesive applicator provided in this embodiment is used to apply adhesive to the two antennas 120 of the electronic tag 100 respectively to enhance the stability of the electronic tag when it is fixed in the tire.
[0026] Referring to Figures 2 and 3, Figure 2 shows a schematic diagram of the adhesive application device provided in this embodiment, and Figure 3 shows a top view of the adhesive application device. The adhesive application device provided in this embodiment mainly includes an adhesive container 200 and an adhesive dipping mechanism 300. The adhesive container 200 is used to hold the adhesive, while the adhesive dipping mechanism 300 is used to apply the adhesive from the adhesive container 200 to the electronic tag 100. The structure of the adhesive application device will be described in detail below with reference to the specific accompanying drawings.
[0027] Referring again to Figures 2 and 3, the adhesive container 200 provided in this embodiment is an open container 200, with the opening located at the top of the adhesive container 200. The adhesive applicator 300 can enter into the adhesive container 200 through this opening and exit from the adhesive container 200 through the opening. When setting the electronic tag 100, the electronic tag 100 to be applied with adhesive is located above the opening of the adhesive container 200. It should be understood that when the electronic tag 100 is located above the opening of the adhesive container 200, it can be clamped and fixed by a clamping mechanism. This clamping mechanism can be a common mechanical claw or suction cup, etc., and will not be described in detail here. In addition, when the electronic tag 100 is located above the opening of the adhesive container 200, the area of the electronic tag 100 to be applied with adhesive faces the opening of the adhesive container 200 to facilitate cooperation with the adhesive applicator 300 for applying adhesive.
[0028] In one feasible solution, the adhesive container 200 can be a rectangular, elliptical, or other shaped container 200, as long as it can hold the adhesive.
[0029] Referring again to Figures 2 and 3, the adhesive dipping mechanism 300 provided in this embodiment is located on one side of the adhesive container 200. It is used to transfer adhesive from the adhesive container 200 to the electronic tag 100 and perform adhesive dipping. Specifically, it includes a telescopic mechanism 310 and an adhesive dipping structure 330. Specifically, the telescopic mechanism 310 is located outside the adhesive container 200, and its telescopic direction is vertical. A connecting plate 320 is fixedly connected to the telescopic end of the telescopic mechanism 310. The adhesive dipping mechanism 300 is fixedly connected to the connecting plate 320, and the adhesive dipping structure 330 includes at least one adhesive dipping rod 331. Exemplarily, there are two adhesive dipping rods 331, each fixedly connected to the connecting plate 320, and the adhesive dipping rods 331 can be inserted into the adhesive container 200. The aforementioned connecting plate 320 serves as an intermediate connector, enabling the telescopic mechanism 310 located outside the adhesive container 200 to drive the adhesive stick 331 located inside the adhesive container 200.
[0030] Specifically, when the telescopic mechanism 310 extends or retracts, it can immerse the glue-applying stick 331 in the glue or remove it from the glue. For ease of understanding, the working process of the glue-applying device will be explained in detail below.
[0031] Referring to Figures 4a-4c, which illustrate the workflow of the adhesive application device, as shown in Figure 4a, before applying the adhesive, the electronic tag 100 is fixed above the adhesive container 200, and the telescopic mechanism 310 retracts to the first preset position, with the adhesive stick 331 immersed in the adhesive in the adhesive container 200. Referring to Figure 4b, the telescopic end of the telescopic mechanism 310 extends outward, moving the adhesive stick 331 outward from the adhesive container 200. When the telescopic mechanism 310 extends to the second preset position, the adhesive stick 331 is exposed outside the adhesive in the adhesive container 200 and abuts against the electronic tag 100. Referring to Figures 4b and 4c, the arrows in Figures 4b and 4c indicate the telescopic direction of the telescopic mechanism. Referring to Figure 4b, when the adhesive stick 331 is removed from the glue, adhesive stick 331 is still coated with glue. When the adhesive stick 331 comes into contact with the antenna of the electronic tag 100, the glue adheres to the antenna of the electronic tag 100, thus applying glue to the antenna of the electronic tag 100. Referring to Figure 4c, after applying the glue, the telescopic mechanism 310 moves the adhesive stick 331 down to the initial position, immersing the adhesive stick 331 in the glue, preparing for subsequent application of glue to other electronic tags 100.
[0032] As can be seen from the above description, the adhesive application device provided in this application uses an adhesive dipping mechanism 300, composed of a telescopic mechanism 310 and an adhesive dipping structure 330, in conjunction with an adhesive container 200 to apply adhesive to the electronic tag 100. This ensures a stable amount of adhesive used each time. Furthermore, the application area is uniform, improving the adhesive application effect. Additionally, the reciprocating motion of the adhesive dipping rod 331 in the adhesive prevents the adhesive from separating or becoming insufficiently mixed due to prolonged storage.
[0033] In one specific implementation, to enhance the stability of the adhesive dispensing mechanism 300 when it engages with the adhesive container 200, a telescopic mechanism 310 is fixed to the outer wall of the adhesive container 200. For example, the telescopic mechanism 310 is fixedly connected to the adhesive container 200 via a threaded connector, thereby securing the two together. Of course, in addition to the above-described fixing method, the telescopic mechanism 310 and the adhesive container 200 can also be fixed to the same support surface, as long as the telescopic mechanism 310 and the adhesive container 200 are relatively fixed.
[0034] The telescopic mechanism 310 provided in this application embodiment can employ different telescopic mechanisms. For example, the telescopic mechanism 310 can be a drive cylinder, a drive hydraulic cylinder, or a linear motor. Of course, in addition to the drive mechanism described above, other linear drive mechanisms can also be used, such as a lifting mechanism composed of a linkage mechanism, which can also be used to drive the adhesive stick 331. Of course, in addition to the reciprocating motion formed by the telescopic mechanism 310 in the above example, other closed curve motion forms can also be used instead, and no specific limitation is made in this application embodiment.
[0035] In one feasible solution, the output end of the telescopic mechanism 310 is welded and fixedly connected to the connecting plate 320 to ensure the stability of the connection between the telescopic mechanism 310 and the connecting plate 320. Of course, in addition to the welding example above, threaded connectors can also be used to fix the connecting plate 320 and the output end of the telescopic mechanism 310 to ensure the stability of the connection and to stably transmit the driving force of the telescopic mechanism 310 to the adhesive stick 331.
[0036] In one feasible solution, to enhance the stability of the adhesive stick 331 during operation, two telescopic mechanisms 310 are used, and these two telescopic mechanisms 310 are arranged side by side. Specifically, the telescopic ends of both telescopic mechanisms 310 are fixedly connected to the connecting plate 320. This ensures the stability of the connecting plate 320 during lifting and lowering through the synchronous extension and retraction of the two telescopic mechanisms 310, thus enhancing the stability of the adhesive stick 331 when it comes into contact with the antenna. Using two adhesive sticks 331 also reduces the possibility of inconsistent adhesive application due to different contact forces when the two sticks 331 come into contact with the two antennas.
[0037] Of course, in addition to the two telescopic mechanisms 310 described above, a single telescopic mechanism 310 can be used in conjunction with a guide mechanism to limit the movement state of the connecting plate 320. For example, guide posts are provided on both sides of the telescopic mechanism 310, and the connecting plate 320 passes through the guide posts to guide the movement direction of the connecting plate 320, while the telescopic mechanism 310 provides the driving force required for the movement of the connecting plate 320.
[0038] Referring again to Figures 2 and 3, the adhesive stick 331 provided in this embodiment is L-shaped, wherein the vertical portion of the adhesive stick 331 is fixedly connected to the connecting plate 320; the horizontal portion of the adhesive stick 331 is used to contact the antenna of the electronic tag 100. With this structure, the horizontal portion of the adhesive stick 331 can be immersed to a deeper depth, ensuring that adhesive application can still be achieved even when there is little adhesive in the adhesive container 200.
[0039] In addition, the adhesive stick 331 adopts an L-shaped structure, which allows multiple electronic tags 100 to be applied with adhesive simultaneously along the horizontal part of the adhesive stick 331. If multiple electronic tags 100 are arranged in a row at intervals along the length of the horizontal part of the adhesive stick 331, the row of electronic tags 100 can be applied with adhesive simultaneously when the adhesive stick 331 is applying adhesive.
[0040] In one optional embodiment, two adhesive sticks 331 are used, each corresponding to one of the two antennas of the electronic tag 100, for applying adhesive to the antennas. When the antenna bonding position changes, the spacing between the two adhesive sticks 331 can be adjusted. For example, each adhesive stick 331 is slidably connected to the connecting plate 320 and can be locked in a set position; wherein the sliding direction of the adhesive stick 331 is along the direction in which the two adhesive sticks 331 are arranged. With this structure, when the adhesive application position of the antenna needs to be adjusted, the adhesive stick 331 can be slid, and when it reaches the desired position, it can be locked, thus adapting to electronic tags 100 with different adhesive application positions. It can also adapt to electronic tags 100 of different sizes, improving the adaptability of the adhesive application device.
[0041] In an optional configuration, the connecting plate 320 has a slotted hole. The end of the adhesive stick 331 connected to the connecting plate 320 has a threaded rod that passes through the slotted hole and is secured in place by a nut. In practical use, when the adhesive stick 331 needs to slide, the nut is loosened, allowing the stick to slide within the slotted hole. When the stick reaches the desired position, the nut is tightened to lock it in place. The use of the threaded rod and nut ensures the stability of the connection between the adhesive stick 331 and the connecting plate 320 after adjustment, guaranteeing the adhesive application effect.
[0042] In one feasible embodiment, the opening of the glue container 200 provided in this application embodiment is larger than the bottom plate of the glue container 200. As shown in FIG2, the cross-section of the glue container 200 provided in this application embodiment is a hexagon. For this hexagon, the base side is parallel to the fixed side, the two sides connected to the base side are inclined outward, and the vertical side is parallel to the two sides connected to the fixed side. When this structure is adopted, the glue load at the bottom of the glue container 200 is relatively small, while the glue load at the upper part is relatively large.
[0043] One or more embodiments of this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments of this specification should be included within the scope of protection of this disclosure.
[0044] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. An electronic tag adhesive application device, characterized in that, include: A glue container for holding glue; a glue-dipping mechanism disposed on one side of the glue container; wherein the glue-dipping mechanism includes a telescopic mechanism and a connecting plate fixedly connected to the telescopic end of the telescopic mechanism; a glue-dipping structure disposed on the connecting plate; wherein the glue-dipping structure includes at least one glue-dipping rod; when the telescopic mechanism retracts to a first predetermined position, the glue-dipping rod is immersed in the glue carried in the glue container; when the telescopic mechanism extends to a second predetermined position, the glue-dipping rod is exposed outside the glue carried in the glue container and abuts against the electronic tag to apply glue to the antenna of the electronic tag.
2. The electronic tag adhesive application device according to claim 1, characterized in that, The telescopic mechanism is fixed to the outer wall of the adhesive container.
3. The electronic tag adhesive application device according to claim 2, characterized in that, The telescopic mechanism is a drive cylinder, a drive hydraulic cylinder, or a linear motor.
4. The adhesive application device according to claim 2, characterized in that, There are two telescopic mechanisms, and the two telescopic mechanisms are arranged side by side.
5. The electronic tag adhesive application device according to claim 1, characterized in that, The vertical part of the adhesive stick is fixedly connected to the connecting plate; the horizontal part of the adhesive stick is used to abut against the antenna of the electronic tag.
6. The electronic tag adhesive application device according to any one of claims 1 to 5, characterized in that, There are two adhesive sticks, and each adhesive stick corresponds to one of the two antennas of the electronic tag; each adhesive stick is slidably connected to the connecting plate and can be locked in a set position; wherein, the direction of sliding of the adhesive stick is along the direction in which the two adhesive sticks are arranged.
7. The electronic tag adhesive application device according to claim 6, characterized in that, The connecting plate is provided with a waist-shaped hole, and the end of the adhesive stick connected to the connecting plate is provided with a threaded rod. The threaded rod passes through the waist-shaped hole and is locked and fixed in the waist-shaped hole by a nut.