Copper ball and tin ball multi-stage sorting machine for PCB (Printed Circuit Board)
By designing a multi-stage sorting machine for copper and solder balls used in PCB manufacturing, and utilizing inclined sorting rollers and gravity separation, the problem of difficulty in four-stage sorting of copper and solder balls in existing technologies has been solved, achieving efficient sorting of copper and solder balls.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LONGTENG ELECTRONICS TECH CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-01
AI Technical Summary
Existing sorting machines are unable to achieve four-level sorting of copper-tin balls. Medium and large copper-tin balls, small copper-tin balls and extra-small copper-tin balls need to be treated with different methods after cleaning.
A multi-stage sorting machine for copper and solder balls for PCBs was designed, including a frame and sorting components. Multiple first, second, and third sorting rollers are arranged sequentially in a downward inclined direction to achieve four-stage sorting of copper or solder balls by their own weight. The balls are separated through the first, second, and third gaps and collected by a receiving component and a guiding component.
It achieves four-level sorting of copper or tin balls, collecting extra-small, small, medium, and large copper and tin balls respectively, thus improving sorting efficiency and accuracy.
Smart Images

Figure CN224181389U_ABST
Abstract
Description
Multi-stage sorting machine for copper and solder balls for PCB Technical Field
[0001] This utility model relates to the field of sorting machine technology, and in particular to a multi-stage sorting machine for copper balls and solder balls used in PCBs. Background Technology
[0002] In PCB manufacturing, copper and solder balls are used for copper and tin plating processes. During this process, copper and solder balls of varying sizes are formed. Because the copper and solder balls undergo prolonged electrolytic reactions, oil or oxide layers on their surface can affect their normal use, necessitating cleaning. Before cleaning, the copper and solder balls need to be sorted. After cleaning, medium and large copper and solder balls can be added manually, small copper and solder balls can be added using tools (such as a spoon), and very small copper and solder balls are directly recycled to the supplier for disposal.
[0003] For example, the utility model patent with application number CN202321504543.8 proposes a circuit board copper plating copper ball cleaning and sorting machine, which includes a cleaning table, a screening component, and a spraying component. The screening component includes a screening cylinder and a driving component. The screening cylinder is rotatably connected to the cleaning table. The screening cylinder is inclined downwards. The side wall of the screening cylinder has a strip-shaped screening port group. The strip-shaped screening port group includes a plurality of strip-shaped screening ports evenly arranged along the circumference of the screening cylinder. The extension direction of the strip-shaped screening ports is the same as the inclination direction of the screening cylinder. The top of the screening cylinder is the feed port, and the bottom of the screening cylinder is the discharge port. The driving component is fixedly connected to the cleaning table. The output end of the driving component is connected to the screening cylinder to drive the screening cylinder to rotate. The spraying component is connected to the cleaning table and has a spraying end located above the strip-shaped screening port group.
[0004] Large, medium, small, and extra-small copper-tin balls require different treatment methods after cleaning; however, existing sorting machines are unable to achieve four-level sorting of copper-tin balls. Summary of the Invention
[0005] In view of this, it is necessary to provide a multi-stage sorting machine for copper and solder balls for PCBs to solve the problem that large, small, and extra-small copper and solder balls need to be treated differently after cleaning. However, existing sorting machines are difficult to achieve four-stage sorting of copper and solder balls.
[0006] This utility model provides a multi-stage sorting machine for copper and solder balls for PCBs, including a frame and a sorting assembly; the sorting assembly includes a plurality of first sorting rollers, a plurality of second sorting rollers and a plurality of third sorting rollers arranged sequentially on the frame in an inclined downward direction, a first gap is formed between any two adjacent first sorting rollers, a second gap is formed between any two adjacent second sorting rollers, and a third gap is formed between any two adjacent third sorting rollers, wherein the first gap is smaller than the second gap and the second gap is smaller than the third gap.
[0007] Furthermore, the tops of the plurality of first sorting rollers form a first sorting surface, the tops of the plurality of second sorting rollers form a second sorting surface, and the tops of the plurality of third sorting rollers form a third sorting surface. The length of the first sorting surface in the downward inclined direction is greater than the length of the second sorting surface in the downward inclined direction, and the length of the second sorting surface in the downward inclined direction is greater than the length of the third sorting surface in the downward inclined direction.
[0008] Furthermore, the sorting assembly also includes two side plates arranged in parallel along an inclined downward direction, and the two ends of a plurality of first sorting rollers, a plurality of second sorting rollers and a plurality of third sorting rollers are respectively attached to the two side plates.
[0009] Furthermore, it also includes a receiving component, which includes an extra-small copper-tin ball receiving box, a small copper-tin ball receiving box, a medium copper-tin ball receiving box, and a large copper-tin ball receiving box. The extra-small copper-tin ball receiving box is disposed below the plurality of first sorting rollers, the small copper-tin ball receiving box is disposed below the plurality of second sorting rollers, the medium copper-tin ball receiving box is disposed below the plurality of third sorting rollers, and the large copper-tin ball receiving box is disposed at the position indicated by the plurality of third sorting rollers inclined downward.
[0010] Furthermore, it also includes a material guiding assembly, wherein the projections of the extra-small copper-tin ball receiving box, the small copper-tin ball receiving box, the medium copper-tin ball receiving box, and the sorting assembly on the horizontal plane are staggered. One side of the material guiding assembly extends to the bottom of the plurality of first sorting rollers, the plurality of second sorting rollers, and the plurality of third sorting rollers, and the other side of the material guiding assembly extends to the top of the extra-small copper-tin ball receiving box, the small copper-tin ball receiving box, and the medium copper-tin ball receiving box.
[0011] Furthermore, the material guiding assembly includes three unpowered conveyor belts connected to the frame and arranged at an angle. The tops of the three unpowered conveyor belts extend to the bottoms of the plurality of first sorting rollers, the plurality of second sorting rollers, and the plurality of third sorting rollers, respectively. The bottoms of the three unpowered conveyor belts extend to the tops of the extra-small copper-tin ball receiving box, the small copper-tin ball receiving box, and the medium copper-tin ball receiving box, respectively.
[0012] Furthermore, the material guiding assembly also includes six baffles, with baffles provided on both sides of each of the unpowered conveyor belts. Two of the baffles form a first material guiding cavity and a second material guiding cavity in the downward inclined direction of the unpowered conveyor belt. The width of the first material guiding cavity is equal everywhere, and the width of the second material guiding cavity gradually decreases in the downward inclined direction.
[0013] Furthermore, the material guiding assembly also includes three inclined blocks, which are respectively disposed on the top of the three unpowered conveyor belts and located at the bottom of the upper first sorting roller, the upper second sorting roller and the upper third sorting roller, respectively. The top of the three inclined blocks forms an inclined surface that slopes downward along the sliding direction of the solder ball.
[0014] Furthermore, the material guiding assembly also includes three back plates, all of which are fixedly connected to the frame and are respectively disposed on the top of the three unpowered conveyor belts.
[0015] Furthermore, it also includes a feeding assembly, which includes a feeding hopper, a feeding box, and an inclined plate. The feeding box is fixedly mounted on the frame and located at the top of the sorting assembly. The top of the feeding box has a feeding port, and the side wall of the feeding box has a discharge port facing the plurality of first sorting rollers. The feeding hopper is installed on the top of the feeding box and communicates with the feeding port. The inclined plate is fixedly mounted on the inner bottom wall of the feeding box, and the inclined plate is inclined downward in the direction pointing to the discharge port.
[0016] Compared with the existing technology, by arranging multiple first sorting rollers, multiple second sorting rollers and multiple third sorting rollers sequentially on the frame in a downward inclined direction, the copper or tin balls to be sorted are poured down from above the sorting assembly. Under their own weight, the very small copper or tin balls fall from the first gap, the small copper or tin balls fall from the second gap, the medium copper or tin balls fall from the third gap, and the large copper or tin balls flow through the multiple third sorting rollers in a downward inclined direction. With the above arrangement, four-stage sorting of copper or tin balls can be achieved. Attached Figure Description
[0017] Figure 1 is a schematic diagram of the overall structure of the multi-stage sorting machine for copper and solder balls for PCBs provided in this embodiment of the present invention.
[0018] Figure 2 is a schematic diagram of the back panel setup in Figure 1;
[0019] Figure 3 is a schematic diagram of the feeding assembly in Figure 1. Detailed Implementation
[0020] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.
[0021] As shown in Figure 1, the multi-stage sorting machine for copper and solder balls for PCBs provided by this utility model includes a frame 100 and a sorting assembly 200. The sorting assembly 200 includes a plurality of first sorting rollers 210, a plurality of second sorting rollers 220 and a plurality of third sorting rollers 230 arranged sequentially on the frame 100 in an inclined downward direction. A first gap is formed between any two adjacent first sorting rollers 210, a second gap is formed between any two adjacent second sorting rollers 220, and a third gap is formed between any two adjacent third sorting rollers 230. The first gap is smaller than the second gap, and the second gap is smaller than the third gap.
[0022] In practice, multiple first sorting rollers 210, multiple second sorting rollers 220, and multiple third sorting rollers 230 arranged sequentially on the frame 100 in a downward inclined direction are used to pour the copper or tin balls to be sorted from above the sorting assembly 200. Under their own weight, the very small copper or tin balls fall from the first gap, the small copper or tin balls fall from the second gap, the medium copper or tin balls fall from the third gap, and the large copper or tin balls flow through the multiple third sorting rollers 230 in a downward inclined direction. Through the above arrangement, four-stage sorting of copper or tin balls can be achieved.
[0023] The rack 100 in this embodiment has an inclined mounting surface on top for mounting the sorting assembly 200.
[0024] The sorting assembly 200 in this embodiment includes a plurality of first sorting rollers 210, a plurality of second sorting rollers 220 and a plurality of third sorting rollers 230 arranged sequentially on the frame 100 in a downward inclined direction. A first gap is formed between any two adjacent first sorting rollers 210, a second gap is formed between any two adjacent second sorting rollers 220, and a third gap is formed between any two adjacent third sorting rollers 230. The first gap is smaller than the second gap, and the second gap is smaller than the third gap.
[0025] As the copper or tin balls to be sorted flow along the sorting assembly 200, the smallest copper or tin balls first pass through the first gap, and the remaining copper or tin balls continue to move downwards. As they flow through multiple second sorting rollers 220, the small copper or tin balls pass through the second gap, and the remaining copper or tin balls continue to move downwards. As they flow through multiple third sorting rollers 230, the medium-sized copper or tin balls pass through the third gap, and finally the large copper or tin balls flow down from the multiple third sorting rollers 230.
[0026] In one embodiment, the tops of a plurality of first sorting rollers 210 form a first sorting surface, the tops of a plurality of second sorting rollers 220 form a second sorting surface, and the tops of a plurality of third sorting rollers 230 form a third sorting surface. The length of the first sorting surface in the downward inclined direction is greater than the length of the second sorting surface in the downward inclined direction, and the length of the second sorting surface in the downward inclined direction is greater than the length of the third sorting surface in the downward inclined direction.
[0027] To prevent copper or tin balls from falling off the sides of the first sorting roller 210, the second sorting roller 220, and the third sorting roller 230, in one embodiment, the sorting assembly 200 further includes two side plates 240 arranged in parallel along an inclined downward direction, with both ends of the plurality of first sorting rollers 210, the plurality of second sorting rollers 220, and the plurality of third sorting rollers 230 respectively attached to the two side plates 240.
[0028] To facilitate the separate reception of extra-small copper or tin balls, small copper or tin balls, medium copper or tin balls, and large copper or tin balls after sorting, a receiving component 300 is also included. The receiving component 300 includes an extra-small copper or tin ball receiving box 310, a small copper or tin ball receiving box 320, a medium copper or tin ball receiving box 330, and a large copper or tin ball receiving box 340. The extra-small copper or tin ball receiving box 310 is located below multiple first sorting rollers 210, the small copper or tin ball receiving box 320 is located below multiple second sorting rollers 220, the medium copper or tin ball receiving box 330 is located below multiple third sorting rollers 230, and the large copper or tin ball receiving box 340 is located at the position indicated by the downward inclination of the multiple third sorting rollers 230.
[0029] If the receiving component 300 is located below the sorting component 200, it is inconvenient to pick up and put down the receiving component 300. Therefore, this embodiment also includes a guiding component 400. The projections of the extra-small copper-tin ball receiving box 310, the small copper-tin ball receiving box 320, the medium copper-tin ball receiving box 330 and the sorting component 200 on the horizontal plane are staggered. One side of the guiding component 400 extends to the bottom of the multiple first sorting rollers 210, the multiple second sorting rollers 220 and the multiple third sorting rollers 230, and the other side of the guiding component 400 extends to the top of the extra-small copper-tin ball receiving box 310, the small copper-tin ball receiving box 320 and the medium copper-tin ball receiving box 330.
[0030] In one embodiment, the material guiding assembly 400 includes three unpowered conveyor belts 410 connected to the frame 100 and arranged at an angle. The tops of the three unpowered conveyor belts 410 extend to the bottoms of a plurality of first sorting rollers 210, a plurality of second sorting rollers 220 and a plurality of third sorting rollers 230, respectively. The bottoms of the three unpowered conveyor belts 410 extend to the tops of a small copper-tin ball receiving box 310, a small copper-tin ball receiving box 320 and a medium copper-tin ball receiving box 330, respectively.
[0031] It is understandable that the aforementioned unpowered belt conveyor 410 can also be configured with an inclined guide plate.
[0032] To prevent copper or solder balls from falling from both sides of the unpowered conveyor belt 410, in one embodiment, the material guiding assembly 400 further includes six baffles 420. Each unpowered conveyor belt 410 has a baffle 420 on both sides. The two baffles 420 form a first material guiding cavity and a second material guiding cavity in the downward inclined direction of the unpowered conveyor belt 410. The width of the first material guiding cavity is equal everywhere, and the width of the second material guiding cavity gradually decreases in the downward inclined direction.
[0033] Because the vertical heights of the different sorting rollers to the unpowered conveyor belt 410 are different, if the vertical height is too large, the copper or solder balls are prone to bounce after falling, causing them to fall outside the unpowered conveyor belt 410. Therefore, in one embodiment, the guiding assembly 400 also includes three inclined blocks 430. The three inclined blocks 430 are respectively disposed on the top of the three unpowered conveyor belts 410, and are respectively located at the bottom of the upper first sorting roller 210, the upper second sorting roller 220, and the upper third sorting roller 230. The tops of the three inclined blocks 430 form inclined surfaces that slope downwards along the sliding direction of the solder balls. By using the inclined blocks 430, the falling height of the copper or solder balls can be reduced.
[0034] As shown in Figure 2, in order to prevent copper or solder balls from falling out of the unpowered conveyor belt 410 in an upward direction, in one embodiment, the material guiding assembly 400 further includes three back plates 440, all of which are fixedly connected to the frame 100 and are respectively disposed on the top of the three unpowered conveyor belts 410.
[0035] To facilitate the introduction of copper or tin balls to be sorted onto the sorting assembly 200, as shown in Figure 3, this embodiment also includes a feeding assembly 500. The feeding assembly 500 includes a feeding hopper 510, a feeding box 520, and an inclined plate 530. The feeding box 520 is fixedly mounted on the frame 100 and located at the top of the sorting assembly 200. The top of the feeding box 520 has a feeding port, and the side wall of the feeding box 520 has a discharge port facing the multiple first sorting rollers 210. The feeding hopper 510 is installed on the top of the feeding box 520 and is connected to the feeding port. The inclined plate 530 is fixedly mounted on the inner bottom wall of the feeding box 520, and the inclined plate 530 is inclined downward in the direction pointing towards the discharge port.
[0036] Compared with the prior art: By arranging multiple first sorting rollers 210, multiple second sorting rollers 220 and multiple third sorting rollers 230 sequentially on the frame 100 in a downward inclined direction, the copper balls or tin balls to be sorted are poured down from above the sorting assembly 200. Under their own weight, the very small copper balls or tin balls fall from the first gap, the small copper balls or tin balls fall from the second gap, the medium copper balls or tin balls fall from the third gap, and the large copper balls or tin balls flow through the multiple third sorting rollers 230 in a downward inclined direction. With the above arrangement, four-level sorting of copper balls or tin balls can be achieved.
[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model should be included within the protection scope of the present utility model.
Claims
1. A multi-stage sorting machine for copper and solder balls used in PCB manufacturing, characterized in that, include: frame; The sorting assembly includes a plurality of first sorting rollers, a plurality of second sorting rollers, and a plurality of third sorting rollers arranged sequentially on the frame in a downward inclined direction. A first gap is formed between any two adjacent first sorting rollers, a second gap is formed between any two adjacent second sorting rollers, and a third gap is formed between any two adjacent third sorting rollers. The first gap is smaller than the second gap, and the second gap is smaller than the third gap.
2. The multi-stage sorting machine for copper and solder balls for PCBs according to claim 1, characterized in that, The tops of the plurality of first sorting rollers form a first sorting surface, the tops of the plurality of second sorting rollers form a second sorting surface, and the tops of the plurality of third sorting rollers form a third sorting surface. The length of the first sorting surface in the downward inclined direction is greater than the length of the second sorting surface in the downward inclined direction, and the length of the second sorting surface in the downward inclined direction is greater than the length of the third sorting surface in the downward inclined direction.
3. The multi-stage sorting machine for copper and solder balls for PCBs according to claim 1, characterized in that, The sorting assembly also includes two side plates arranged in parallel along an inclined downward direction, and the two ends of a plurality of first sorting rollers, a plurality of second sorting rollers and a plurality of third sorting rollers are respectively attached to the two side plates.
4. The multi-stage sorting machine for copper and solder balls for PCBs according to claim 1, characterized in that, It also includes a receiving component, which includes a small copper-tin ball receiving box, a small copper-tin ball receiving box, a medium copper-tin ball receiving box, and a large copper-tin ball receiving box. The small copper-tin ball receiving box is located below a plurality of first sorting rollers, the small copper-tin ball receiving box is located below a plurality of second sorting rollers, the medium copper-tin ball receiving box is located below a plurality of third sorting rollers, and the large copper-tin ball receiving box is located at a position that the plurality of third sorting rollers point to along an inclined downward direction.
5. The multi-stage sorting machine for copper and solder balls for PCBs according to claim 4, characterized in that, It also includes a material guiding assembly. The projections of the extra-small copper-tin ball receiving box, the small copper-tin ball receiving box, the medium copper-tin ball receiving box, and the sorting assembly on the horizontal plane are staggered. One side of the material guiding assembly extends to the bottom of the plurality of first sorting rollers, the plurality of second sorting rollers, and the plurality of third sorting rollers, and the other side of the material guiding assembly extends to the top of the extra-small copper-tin ball receiving box, the small copper-tin ball receiving box, and the medium copper-tin ball receiving box.
6. The multi-stage sorting machine for copper and solder balls for PCBs according to claim 5, characterized in that, The material guiding assembly includes three unpowered conveyor belts connected to the frame and arranged at an angle. The tops of the three unpowered conveyor belts extend to the bottoms of the plurality of first sorting rollers, the plurality of second sorting rollers and the plurality of third sorting rollers, respectively. The bottoms of the three unpowered conveyor belts extend to the tops of the extra-small copper-tin ball receiving box, the small copper-tin ball receiving box and the medium copper-tin ball receiving box, respectively.
7. The multi-stage sorting machine for copper and solder balls for PCBs according to claim 6, characterized in that, The material guiding assembly also includes six baffles. Each of the non-powered belt conveyors has a baffle on both sides. The two baffles form a first material guiding cavity and a second material guiding cavity in the downward inclined direction of the non-powered belt conveyor. The width of the first material guiding cavity is equal everywhere, and the width of the second material guiding cavity gradually decreases in the downward inclined direction.
8. The multi-stage sorting machine for copper and solder balls for PCBs according to claim 6, characterized in that, The material guiding assembly also includes three inclined blocks, which are respectively disposed on the top of the three unpowered conveyor belts and located at the bottom of the first sorting roller, the second sorting roller, and the third sorting roller above. The top of the three inclined blocks forms an inclined surface that slopes downward along the sliding direction of the solder ball.
9. The multi-stage sorting machine for copper and solder balls for PCBs according to claim 6, characterized in that, The material guiding assembly also includes three back plates, all of which are fixedly connected to the frame and are respectively disposed on the top of the three unpowered belt conveyors.
10. The multi-stage sorting machine for copper and solder balls for PCBs according to claim 1, characterized in that, It also includes a feeding assembly, which includes a feeding hopper, a feeding box, and an inclined plate. The feeding box is fixedly mounted on the frame and located at the top of the sorting assembly. The top of the feeding box has a feeding port, and the side wall of the feeding box has a discharge port facing the plurality of first sorting rollers. The feeding hopper is installed on the top of the feeding box and is connected to the feeding port. The inclined plate is fixedly mounted on the inner bottom wall of the feeding box and is inclined downward in the direction pointing to the discharge port.
Citation Information
Patent Citations
Cleaning and sorting machine for copper-plated copper balls of circuit board
CN220311153U