Automatic parallel grinding device of CMP equipment

Abstract

The utility model provides an automatic parallel grinding device of CMP (Chemical Mechanical Polishing) equipment, which relates to the field of CMP equipment and comprises a CMP equipment main body, and a grinding table, a polishing head, a grinding pad trimmer and a grinding liquid spray head support arm are arranged in the upper side of the CMP equipment main body; a groove is formed in the right side of the bottom end face of the grinding fluid spray head supporting arm, a grinding fluid spray head is slidably connected into the groove, and a reciprocating driving mechanism is arranged on the front end face of the grinding fluid spray head supporting arm. Through the arrangement of the reciprocating driving mechanism, when the grinding liquid spray head sprays grinding liquid, the grinding liquid spray head is driven to move left and right in a reciprocating mode, the uniformity of the grinding liquid spray head during spraying of the grinding liquid is effectively improved, and meanwhile the machining efficiency of wafer surface grinding is remarkably improved; the problems that in the liquid spraying process of a grinding liquid spray head on existing CMP equipment, due to the fact that the grinding liquid spray head is in a fixed state all the time, the uniformity is poor when the grinding liquid spray head sprays grinding liquid, and the grinding efficiency of the surface of a wafer is affected are solved.

Description

An automatic parallel grinding device for CMP equipment Technical Field

[0001] This utility model relates to the technical field of chemical mechanical grinding devices, and in particular to an automatic parallel grinding device for CMP equipment. Background Technology

[0002] In the semiconductor manufacturing field, chemical mechanical polishing (CMP) is a key process for achieving global planarization of wafer surfaces and is widely used in integrated circuit manufacturing. When CMP equipment is operating, the wafer stage carries the wafer and automatically arranges it in parallel with the polishing table to remove the protruding material on the wafer surface, thereby achieving a high-precision surface planarization effect.

[0003] In existing CMP equipment, the polishing slurry nozzles remain stationary during the spraying process, resulting in poor uniformity of the polishing slurry application and affecting the smoothing efficiency of the wafer surface. In addition, the bottom of the polishing slurry storage tank in existing CMP equipment lacks an automatic anti-settling structure. During long periods of standing or continuous use, the abrasive particles in the polishing slurry will gradually settle due to gravity, forming a sedimentation and stratification phenomenon. This disrupts the original concentration and composition ratio of the polishing slurry, greatly weakening its polishing effect. Summary of the Invention

[0004] This utility model relates to an automatic parallel grinding device for CMP equipment, which solves the problems of poor uniformity of the sprayed grinding slurry due to the fixed state of the grinding slurry nozzle during the spraying process in existing CMP equipment, which affects the wafer grinding efficiency. In addition, the lack of an automatic anti-settling structure at the bottom of the storage tank causes the abrasive particles to settle and stratify when the grinding slurry is left to stand for a long time or used continuously, thereby destroying the original concentration of the grinding slurry and weakening the grinding effect.

[0005] In a first aspect, this utility model provides an automatic parallel grinding device for CMP equipment, specifically comprising: a CMP equipment body, wherein a grinding table, a polishing head, a grinding pad dresser, and a grinding slurry nozzle support arm are installed inside the upper side of the CMP equipment body; a groove is formed on the right side of the bottom end face of the grinding slurry nozzle support arm, and a grinding slurry nozzle is slidably connected inside the groove; a reciprocating drive mechanism is provided on the front end face of the grinding slurry nozzle support arm; a liquid storage tank is installed inside the lower side of the CMP equipment body, and a linkage anti-settling mechanism is provided at the bottom of the liquid storage tank; the reciprocating drive mechanism includes a drive motor, which is installed on the left side of the front end face of the grinding slurry nozzle support arm, and a drive disc is fixedly installed on the drive motor shaft; a connecting rod is rotatably connected to the edge of the front end face of the drive disc via a rotating shaft; a drive column is rotatably connected to the other end of the connecting rod; a drive block is fixedly connected to the rear end of the drive column, and the drive block is fixedly connected to the front end face of the grinding slurry nozzle.

[0006] Furthermore, the liquid outlet at the rear bottom of the storage tank is connected to the suction port of the infusion pump via a water pipe, and the infusion pump is installed on the lower inner bottom surface of the CMP equipment body. The liquid outlet of the infusion pump is connected to a hydraulic drive housing, which is installed on the rear side of the storage tank. The liquid outlet of the hydraulic drive housing is connected to a delivery hose, and the other end of the delivery hose is connected to the inlet of the grinding slurry nozzle. The bottom surface of the grinding slurry nozzle is uniformly provided with nozzles.

[0007] Furthermore, the front end face of the grinding fluid nozzle support arm is provided with a rectangular opening communicating with the groove, and the rectangular opening is slidably connected to the driving block; the top surface inside the groove is provided with a T-shaped groove, and the top surface of the grinding fluid nozzle is provided with a T-shaped slider, and the T-shaped slider is slidably connected to the T-shaped groove.

[0008] Furthermore, when the drive motor shaft drives the drive disk to rotate, the drive disk drives the left end of the connecting rod to rotate, and the right end of the connecting rod drives the drive column, drive block and grinding fluid nozzle to move back and forth.

[0009] Furthermore, a drive shaft is rotatably connected to the hydraulic drive housing, and an impeller is mounted on the outside of the drive shaft, with the impeller located inside the hydraulic drive housing.

[0010] Furthermore, the linkage anti-sedimentation mechanism includes a worm gear, a drive shaft, and a stirring shaft. The worm gear and drive shaft are rotatably connected to the bottom inner surface of the lower side of the CMP equipment body, and a driven pulley is installed at the right end of the worm gear. The left end of the drive shaft is fixedly connected to the right end of the drive shaft, and a driving pulley is installed at the right end of the drive shaft. The driving pulley is connected to the driven pulley via a belt, and the diameter of the driven pulley is two to three times the diameter of the driving pulley. The stirring shaft is rotatably connected to the bottom of the storage tank and penetrates through the bottom of the storage tank. A stirring blade is installed on the upper outer side of the stirring shaft, and the stirring blade is located inside the storage tank. A worm wheel that meshes with the worm gear is installed at the lower end of the stirring shaft.

[0011] This utility model provides an automatic parallel grinding device for CMP equipment, which has the following beneficial effects:

[0012] 1. By setting up a reciprocating drive mechanism, when the polishing slurry nozzle sprays polishing slurry, the drive motor is started, which drives the drive disk to rotate. The drive disk drives the left end of the connecting rod to rotate, and then the right end of the connecting rod drives the drive column, drive block and polishing slurry nozzle to move back and forth, which effectively improves the uniformity of polishing slurry spraying and significantly enhances the processing efficiency of wafer surface polishing.

[0013] 2. Through the hydraulic drive housing, drive shaft, impeller, and linkage anti-settling mechanism, when the grinding fluid flows through the hydraulic drive housing, its liquid flow impact force drives the impeller to rotate. The impeller drives the transmission shaft through the drive shaft, and through the transmission of the driving pulley, driven pulley, worm and worm wheel, it finally drives the stirring shaft and stirring blades to rotate and stir the abrasive particles that are about to settle in the storage tank, preventing them from stratifying and depositing, thereby maintaining the uniform concentration and stable composition ratio of the grinding fluid, and ensuring the stability and effectiveness of the grinding process. Attached Figure Description

[0014] To more clearly illustrate the technical solution of this utility model, the accompanying drawings will be briefly described below.

[0015] In the attached diagram:

[0016] Figure 1 shows a schematic diagram of the overall structure of this application;

[0017] Figure 2 shows a schematic diagram of the overall structure of this application in its disassembled state;

[0018] Figure 3 shows a schematic diagram of the structure of the polishing slurry nozzle support arm and the polishing slurry nozzle after disassembly in this application;

[0019] Figure 4 shows a schematic diagram of the liquid storage tank and the linkage anti-sedimentation mechanism of this application;

[0020] Figure 5 shows a schematic diagram of the hydraulic drive housing, drive shaft, and linkage anti-sedimentation mechanism of this application;

[0021] Figure 6 shows a partial cross-sectional structural schematic diagram of the hydraulic drive housing of this application.

[0022] List of reference numerals

[0023] 1. CMP equipment body; 101. Grinding table; 102. Polishing head; 103. Grinding pad dresser; 104. Grinding slurry nozzle support arm; 105. Storage tank; 106. Infusion pump; 107. Hydraulic drive housing; 108. Delivery hose; 109. Grinding slurry nozzle; 1010. Groove; 1011. Rectangular opening; 1012. Drive shaft; 1013. Impeller;

[0024] 2. Reciprocating drive mechanism; 201. Drive motor; 202. Drive disc; 203. Connecting rod; 204. Drive column; 205. Drive block;

[0025] 3. Linkage anti-sedimentation mechanism; 301. Worm gear; 302. Drive shaft; 303. Worm wheel; 304. Stirring shaft; 305. Stirring blade. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the described embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0027] Example 1: Please refer to Figures 1 to 6:

[0028] This utility model proposes an automatic parallel grinding device for CMP equipment, comprising: a CMP equipment body 1, wherein a grinding table 101, a polishing head 102, a grinding pad conditioner 103, and a grinding slurry nozzle support arm 104 are installed inside the upper side of the CMP equipment body 1; a groove 1010 is formed on the right side of the bottom end face of the grinding slurry nozzle support arm 104, and a grinding slurry nozzle 109 is slidably connected inside the groove 1010; a reciprocating drive mechanism 2 is provided on the front end face of the grinding slurry nozzle support arm 104; a liquid storage tank 105 is installed inside the lower side of the CMP equipment body 1, and a linkage anti-settling mechanism 3 is provided at the bottom of the liquid storage tank 105; the reciprocating drive mechanism 2 includes a drive motor. The reciprocating drive mechanism 201 is installed on the left side of the front end face of the polishing slurry nozzle support arm 104. A drive disc 202 is fixedly installed on the rotating shaft of the drive motor 201. A connecting rod 203 is rotatably connected to the edge of the front end face of the drive disc 202 via the rotating shaft. A drive column 204 is rotatably connected to the other end of the connecting rod 203. A drive block 205 is fixedly connected to the rear end of the drive column 204. The drive block 205 is fixedly connected to the front end face of the polishing slurry nozzle 109. By setting the reciprocating drive mechanism 2, when the polishing slurry nozzle 109 sprays polishing slurry, it moves the polishing slurry nozzle 109 back and forth, which improves the uniformity of the polishing slurry nozzle 109 when spraying polishing slurry.

[0029] The liquid outlet at the bottom rear side of the storage tank 105 is connected to the suction port of the infusion pump 106 via a water pipe. The infusion pump 106 is installed on the lower inner bottom surface of the CMP equipment body 1. The outlet of the infusion pump 106 is connected to a hydraulic drive housing 107, which is installed on the rear side of the storage tank 105. The outlet of the hydraulic drive housing 107 is connected to a delivery hose 108. The other end of the delivery hose 108 is connected to the inlet of the grinding slurry nozzle 109. The bottom surface of the grinding slurry nozzle 109 is uniformly provided with nozzles for spraying grinding slurry.

[0030] The front end face of the polishing slurry nozzle support arm 104 is provided with a rectangular opening 1011 that communicates with the groove 1010, and the rectangular opening 1011 is slidably connected to the driving block 205; the top surface inside the groove 1010 is provided with a T-shaped groove, and the top surface of the polishing slurry nozzle 109 is provided with a T-shaped slider, and the T-shaped slider is slidably connected to the T-shaped groove to improve the stability of the polishing slurry nozzle 109 when it reciprocates.

[0031] When the drive motor 201 drives the drive disk 202 to rotate, the drive disk 202 drives the left end of the connecting rod 203 to rotate, and the right end of the connecting rod 203 drives the drive column 204, drive block 205 and polishing slurry nozzle 109 to move back and forth, which improves the uniformity of polishing slurry spraying and enhances the polishing efficiency of the wafer surface.

[0032] In Example 2, based on Example 1, as shown in Figures 4 to 6, a drive shaft 1012 is rotatably connected to the hydraulic drive housing 107, and an impeller 1013 is mounted on the outside of the drive shaft 1012, with the impeller 1013 located inside the hydraulic drive housing 107. The linkage anti-sedimentation mechanism 3 includes a worm gear 301, a transmission shaft 302, and a stirring shaft 304. The worm gear 301 and the transmission shaft 302 are rotatably connected to the lower inner bottom surface of the CMP equipment body 1, and a driven pulley is mounted on the right end of the worm gear 301. The left end of the transmission shaft 302 is fixedly connected to the right end of the drive shaft 1012, and a driving pulley is mounted on the right end of the transmission shaft 302. The driving pulley is connected to the driven pulley via a belt, and the diameter of the driven pulley is two to three times the diameter of the driving pulley. This makes it easier for the driving pulley to rotate when it drives the driven pulley. The stirring shaft 304 is rotatably connected to the bottom of the storage tank 105 and passes through the bottom of the storage tank 105. The stirring blade 305 is installed on the upper side of the outside of the stirring shaft 304 and is located inside the storage tank 105. The lower end of the stirring shaft 304 is equipped with a worm wheel 303 that meshes with the worm 301. Through the arrangement of the hydraulic drive housing 107, the drive shaft 1012, the impeller 1013 and the linkage anti-settling mechanism 3, when the grinding fluid flows through the hydraulic drive housing 107, it ultimately drives the stirring shaft 304 and the stirring blade 305 to rotate and stir, preventing the abrasive particles from stratifying and depositing, maintaining the uniform concentration and stable composition ratio of the grinding fluid, and ensuring the stability and effectiveness of the grinding process.

[0033] The working principle of this embodiment is as follows: During use, a polishing pad is placed on the upper surface of the grinding table 101. The wafer is then fixed to the bottom surface of the polishing head 102. The polishing head 102 carries the wafer above the polishing pad, automatically aligning the wafer with the opposite surface of the polishing pad. The grinding table 101 then rotates with the polishing pad, followed by the polishing head 102 rotating with the wafer and slowly moving downwards. The rotating polishing head 102, carrying the wafer, presses it against the rotating polishing pad with a certain pressure. Immediately afterwards, the grinding fluid inside the storage tank 105 is delivered to the grinding fluid nozzle 109 via the hydraulic drive housing 107 and the delivery hose 108 through the infusion pump 106. The grinding fluid is then delivered through the grinding fluid nozzle 109. The bottom nozzle sprays polishing slurry onto the upper part of the polishing pad. At this time, the motor 201 is started, which drives the drive disk 202 to rotate. The drive disk 202 drives the left end of the connecting rod 203 to rotate. Then, the right end of the connecting rod 203 drives the drive column 204, the drive block 205 and the polishing slurry nozzle 109 to move back and forth, thereby improving the uniformity of the polishing slurry spraying nozzle 109 when spraying polishing slurry and improving the polishing efficiency of the wafer surface. Then, the polishing slurry is quickly and evenly coated between the wafer and the polishing pad under the action of centrifugal force, forming a liquid film. Finally, the planarization of the wafer surface is achieved through the alternating process of chemical film removal and mechanical film removal.

[0034] When the grinding fluid passes through the hydraulic drive housing 107, it drives the impeller 1013 to rotate under the action of liquid impact force. Then, the impeller 1013 drives the drive shaft 1012, transmission shaft 302, driving pulley, driven pulley, worm 301, worm wheel 303 and stirring shaft 304 to rotate. Finally, the stirring shaft 304 drives the stirring blade 305 to rotate, thereby stirring up the abrasive particles that are to be settled inside the storage tank 105, avoiding the formation of sedimentation and stratification of abrasive particles.

[0035] The following points should be noted in this article:

[0036] 1. The accompanying drawings of this utility model only relate to the structures involved in this utility model; other structures can be referred to conventional designs.

[0037] 2. Where there is no conflict, the embodiments of this utility model and the features in the embodiments can be combined with each other to obtain new embodiments.

[0038] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An automated parallel polishing apparatus of a CMP apparatus, comprising: The main body (1) of the CMP equipment is equipped with a grinding table (101), a polishing head (102), a grinding pad dresser (103), and a grinding slurry nozzle support arm (104) installed inside the upper side of the main body (1); characterized in that a groove (1010) is provided on the right side of the bottom end face of the grinding slurry nozzle support arm (104), and a grinding slurry nozzle (109) is slidably connected inside the groove (1010); a reciprocating drive mechanism (2) is provided on the front end face of the grinding slurry nozzle support arm (104); a liquid storage tank (105) is installed inside the lower side of the CMP equipment main body (1), and the bottom of the liquid storage tank (105) is... The part is equipped with a linkage anti-settling mechanism (3); the reciprocating drive mechanism (2) includes a drive motor (201), the drive motor (201) is installed on the left side of the front end face of the grinding fluid nozzle support arm (104), and a drive disc (202) is fixedly installed on the rotating shaft of the drive motor (201). A connecting rod (203) is rotatably connected to the edge of the front end face of the drive disc (202) through the rotating shaft. A drive column (204) is rotatably connected to the other end of the connecting rod (203). A drive block (205) is fixedly connected to the rear end of the drive column (204), and the drive block (205) is fixedly connected to the front end face of the grinding fluid nozzle (109).

2. The apparatus according to claim 1, wherein: The liquid outlet at the bottom rear side of the storage tank (105) is connected to the suction port of the infusion pump (106) via a water pipe. The infusion pump (106) is installed on the lower inner bottom surface of the CMP equipment body (1). The outlet of the infusion pump (106) is connected to a hydraulic drive housing (107), which is installed on the rear side of the storage tank (105). The outlet of the hydraulic drive housing (107) is connected to a delivery hose (108), and the other end of the delivery hose (108) is connected to the inlet of the grinding slurry nozzle (109). The bottom surface of the grinding slurry nozzle (109) is uniformly provided with nozzles.

3. The automatic parallel grinding device for CMP equipment according to claim 1, characterized in that: The front end face of the grinding fluid nozzle support arm (104) is provided with a rectangular opening (1011) that communicates with the groove (1010), and the rectangular opening (1011) is slidably connected to the driving block (205); the top surface inside the groove (1010) is provided with a T-shaped groove, and the top surface of the grinding fluid nozzle (109) is provided with a T-shaped slider, and the T-shaped slider is slidably connected to the T-shaped groove.

4. The apparatus of claim 1, wherein: When the drive motor (201) is rotating with the drive disk (202), the drive disk (202) rotates with the left end of the connecting rod (203), and the right end of the connecting rod (203) moves back and forth with the drive column (204), the drive block (205) and the grinding fluid nozzle (109).

5. The apparatus of claim 2, wherein: A drive shaft (1012) is rotatably connected to the hydraulic drive housing (107), and an impeller (1013) is installed outside the drive shaft (1012), and the impeller (1013) is located inside the hydraulic drive housing (107).

6. The apparatus of claim 5, wherein: The linkage anti-settling mechanism (3) includes a worm gear (301), a drive shaft (302), and a stirring shaft (304). The worm gear (301) and the drive shaft (302) are rotatably connected to the bottom surface of the lower side of the CMP equipment body (1). A driven pulley is installed on the right end of the worm gear (301). The left end of the drive shaft (302) is fixedly connected to the right end of the drive shaft (1012). A driving pulley is installed on the right end of the drive shaft (302), and the driving pulley is connected to the driven pulley via a belt. The driven pulley is connected by a wheel drive, and the diameter of the driven pulley is two to three times the diameter of the driving pulley. The stirring shaft (304) is rotatably connected to the bottom of the storage tank (105), and the stirring shaft (304) passes through the bottom of the storage tank (105). A stirring blade (305) is installed on the upper side of the outside of the stirring shaft (304), and the stirring blade (305) is located inside the storage tank (105). A worm wheel (303) that meshes with the worm (301) is installed at the lower end of the stirring shaft (304).

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