Chip assembling equipment

Abstract

The utility model discloses chip assembling equipment, which comprises a carrying mechanism for transferring chips. The jacking piece can move up and down; the fixing frame is arranged above the jacking piece; the first pressing piece is arranged at the lower part of the fixing frame in a manner of moving up and down; the first elastic piece is used for driving the first pressing piece to move downwards; the fixing frame is provided with a vertically-through operation space. The cover plate is provided with a first position and a second position relative to the fixing frame, and when the cover plate is located at the first position, the cover plate is far away from the operation space; and when the main board and the chip are located at the second position, the cover plate shields the operation space, the second pressing piece is located below the cover plate, and the assembly equipment can achieve fixation of the main board and the chip through a simple structure and simple operation.

Description

Chip assembly equipment Technical Field

[0001] This utility model relates to a chip assembly device. Background Technology

[0002] Existing chip assembly equipment is used to transfer chips onto motherboards and secure them. To improve assembly accuracy, the motherboard needs to be secured during chip transfer, and the chip needs to be secured after it is placed on top of the motherboard before being connected to the motherboard. Most assembly equipment has two sets of securing mechanisms. These two mechanisms enter the processing area sequentially and secure the motherboard and chip in turn. After assembly is complete, the two sets of securing mechanisms leave the processing area to avoid collisions. As described above, the assembly equipment has a complex structure, cumbersome operation, increased equipment cost, and low assembly efficiency. Summary of the Invention

[0003] The purpose of this invention is to provide a new chip assembly device.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: a chip assembly device for assembling chips onto a motherboard, the assembly device including a transport mechanism for transferring chips, and the chip assembly device further including:

[0005] A lifting member, which is movable up and down to lift the motherboard upward;

[0006] A fixed frame is provided above the lifting member, and the fixed frame has an operating space that extends vertically to allow the conveying mechanism to extend below it;

[0007] The first clamping member is used to clamp the main board, and the first clamping member is disposed at the lower part of the fixed frame and is movable up and down;

[0008] A first elastic element is disposed between the fixed frame and the first clamping element, and the first elastic element is used to provide the force required to drive the first clamping element to move downward.

[0009] A cover plate is movably mounted on the fixed frame. The cover plate has a first position and a second position relative to the fixed frame. When it is in the first position, the cover plate is away from the operating space. When it is in the second position, the cover plate covers the operating space.

[0010] The second clamping member is used to clamp the chip. The second clamping member is disposed on the cover plate. When the cover plate is in the second position, the second clamping member is located below the cover plate and extends to the bottom of the fixing frame.

[0011] In some embodiments, the lifting member has a first working height and a second working height above the first working height. When at the first working height, the first clamping member abuts against the motherboard located above the lifting member. When the lifting member is at the second working height and the cover plate is at the second position, the second clamping member abuts against the chip transferred to the motherboard.

[0012] In some embodiments, the cover plate is slidably connected to the fixing frame, the second clamping member is disposed at the lower part of the cover plate, and the bottom of the second clamping member is located above the bottom of the first clamping member in the vertical direction.

[0013] In some embodiments, the fixing frame is provided with a clearance space, which is connected to the operating space along the sliding direction of the cover plate. When the cover plate is in the first position, the cover plate is located in the clearance space.

[0014] Specifically, the fixing frame is provided with a through hole extending in the vertical direction, and multiple sets of first clamping members are provided around the through hole. The second clamping member is located in the through hole, and the through hole is divided into the clearance space and the operating space along the sliding direction of the cover plate.

[0015] In some embodiments, the cover plate is rotatably connected to the fixing frame, and when the cover plate is in the second position, the second clamping member abuts against the chip transferred to the motherboard.

[0016] In some embodiments, the second clamping member is movably connected to the cover plate, and when the cover plate is in the second position, the second clamping member is movable relative to the cover plate.

[0017] Specifically, the assembly equipment further includes a second elastic element disposed between the cover plate and the second clamping member, the second elastic element being used to provide the force required to drive the second clamping member away from the cover plate.

[0018] In some embodiments, the assembly equipment is used to fix chip bolts to the motherboard. The assembly equipment includes a bolt fastening mechanism. The cover plate is provided with an operating channel for the bolt fastening mechanism to pass through. When the cover plate is in the second position, the operating channel extends in the vertical direction.

[0019] In some embodiments, the cover plate is provided with a guide tube. When the cover plate is in the second position, the guide tube extends in the vertical direction, and the cavity of the guide tube constitutes the operating channel.

[0020] In some embodiments, the assembly equipment includes a motherboard transfer mechanism for transferring a motherboard, an assembly station is provided on the transfer path of the motherboard, and the lifting component is disposed at the assembly station; the assembly equipment also includes a feeding mechanism for providing chips and a preprocessing mechanism for preprocessing chips, the feeding mechanism, the preprocessing mechanism and the motherboard transfer mechanism being arranged sequentially along a first direction.

[0021] In some embodiments, the assembly equipment further includes a feeding mechanism disposed between the pretreatment mechanism and the motherboard transmission mechanism along the first direction; the motherboard transmission mechanism includes a motherboard transmission track, the feeding mechanism includes a feeding track, the pretreatment mechanism includes a fixture transmission track, the motherboard transmission track, the feeding track and the fixture transmission track are parallel to each other and extend along a second direction, the second direction being perpendicular to the first direction.

[0022] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art: In the chip assembly equipment of this utility model, during chip assembly, the motherboard is first lifted upwards by a lifting member, and then the motherboard is pressed and fixed by a first clamping member against it. The chip can then be transferred while the cover plate is in the first position. After the chip is transferred above the motherboard, the cover plate is driven to the second position, where the chip is fixed by a second clamping member against it. Alternatively, after the cover plate is moved to the second position, the lifting member continues to be driven upwards, causing the chip to contact the second clamping member. The equipment does not require frequent movement of the clamping member into and out of the processing area, simplifying the fixing of the motherboard and the chip, while also simplifying the equipment structure and saving costs. Attached Figure Description

[0023] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 is a schematic diagram of a chip assembly device according to a specific embodiment of the present invention;

[0025] Figure 2 is a top view of Figure 1;

[0026] Figure 3 is a schematic diagram of the fixing device, lifting device and main board transmission mechanism;

[0027] Figure 4 is a side view of Figure 3;

[0028] Figure 5 is a schematic diagram of the fixing device;

[0029] Figure 6 is a schematic diagram of Figure 5 from another perspective;

[0030] Figure 7 is a bottom view of Figure 5;

[0031] Figure 8 is a schematic diagram of the lifting device;

[0032] Figure 9 is a schematic diagram of the bolt fastening mechanism;

[0033] Figure 10 is a schematic diagram of the conveying mechanism;

[0034] In the above attached diagrams: 100, chip; 200, motherboard; 201, motherboard carrier; 300, adapter.

[0035] 1. Lifting device; 11. Lifting component; 12. Lifting mechanism; 13. Rotating mechanism; 21. Fixing frame; 211. Through hole; 2111. Operating space; 2112. Clearance space; 22. First clamping component; 221. Pressing foot; 23. Cover plate; 231. Guide tube; 24. Second clamping component; 25. Baffle plate; 3. Bolt locking mechanism; 31. Mounting base; 32. Sleeve; 33. Tightening gun; 34. Displacement sensor; 4. Main board transmission mechanism; 41. Main board transmission track; 5. Handling mechanism; 51. First handling component; 52. Second handling component; 53. Vision inspection module; 54. Moving base; 6. Feeding mechanism; 61. Feeding track; 7. Pre-treatment mechanism; 71. Fixture transmission track; 8. Loading mechanism. Detailed Implementation

[0036] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is for the purpose of aiding understanding the present invention, but does not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0037] Referring to Figures 1 and 2, a chip assembly device is used to assemble a chip 100 onto a motherboard 200. The assembly device includes a conveying mechanism 5 for transferring the chip 100, and also includes a lifting device for lifting the motherboard 200 upwards and a fixing device that cooperates with the lifting device to fix the motherboard 200 and the chip 100.

[0038] Specifically, referring to Figures 3 and 4, the lifting device includes a lifting member 11 capable of vertical movement, and the fixing device includes a fixing frame 21, a first clamping member 22, a cover plate 23, and a second clamping member 24. The fixing frame 21 is positioned above the lifting member 11 and has a vertically penetrating operating space 2111 through which the transport mechanism 5 can pass and transfer the chip 100 to the motherboard 200 located below. The first clamping member 22 is vertically movable and positioned at the lower part of the fixing frame 21, and is used to clamp and fix the motherboard 200. Specifically, the motherboard 200 is fixed by the lifting member 11 lifting it upwards and bringing it into contact with the first clamping member 22.

[0039] In this embodiment, the fixing device further includes a first elastic element (not shown in the figure). The first elastic element is disposed between the fixing frame 21 and the first clamping member 22. The first elastic element is used to provide the force required to drive the first clamping member 22 to move downward. The first elastic element can, on the one hand, prevent the first clamping member 22 from making hard contact with the motherboard 200, thereby avoiding damage to the motherboard 200. On the other hand, after the first clamping member 22 contacts the motherboard 200, it can still compress the first elastic element to drive the motherboard 200 to continue to move upward.

[0040] In this embodiment, the cover plate 23 is movably mounted on the fixing frame 21. The cover plate 23 has a first position and a second position relative to the fixing frame 21. When in the first position, the cover plate 23 is away from the operating space 2111, and the conveying mechanism 5 can transfer the chip 100 to the motherboard 200. When in the second position, the cover plate 23 blocks the operating space 2111. Specifically, in some embodiments, when in the second position, the cover plate 23 is located in the operating space 2111; in other embodiments, when in the second position, the cover plate 23 is positioned above or below the operating space 2111.

[0041] In this embodiment, the cover plate 23 in the second position is located above the lifting member 11, and the cover plate 23 is also located above the motherboard 200. Specifically, the motherboard 200 is provided with an assembly area for assembling the chip 100. When the motherboard 200 is located above the lifting member 11 and the cover plate 23 is in the second position, the cover plate 23 is located above the assembly area.

[0042] In this embodiment, the second clamping member 24 is disposed on the cover plate 23 and is used to clamp the chip 100. When the cover plate 23 is in the second position, the second clamping member 24 is located below the cover plate 23 and extends below the fixing bracket 21. In some embodiments, after the chip 100 is transferred above the motherboard 200, by driving the cover plate 23 from the first position to the second position, the second clamping member 24 can clamp and fix the chip 100 on the motherboard 200. In other embodiments, after the cover plate 23 is moved to the second position, the second clamping member 24 is located above the chip 100. At this time, by continuing to drive the motherboard 200 upward by the lifting member 11, the second clamping member 24 can abut against the chip 100, thus achieving the clamping and fixing of the chip 100.

[0043] In this embodiment, the lifting member 11 has a first working height and a second working height higher than the first working height. When at the first working height, the first clamping member 22 abuts against the motherboard 200 located above the lifting member 11. After the chip 100 is assembled above the motherboard 200 and the cover plate 23 is switched to the second position, the lifting member 11 continues to move upward to the second working height, at which point the second clamping member 24 abuts against the chip 100 transferred to the motherboard 200. The assembly equipment can achieve the clamping and fixing of the motherboard 200 and the chip 100 through two lifting operations of the lifting member 11, which is simple to operate.

[0044] In this embodiment, referring to Figures 5 to 7, the cover plate 23 is slidably connected to the fixing frame 21. Specifically, the cover plate 23 is slidably connected to the fixing frame 21 in the horizontal direction, and the second clamping member 24 is disposed at the lower part of the cover plate 23. In this embodiment, the bottom of the second clamping member 24 is located above the bottom of the first clamping member 22 in the vertical direction, and there is a height difference between the bottom of the second clamping member 24 and the bottom of the first clamping member 22. Therefore, during the upward lifting process of the lifting member 11, the first clamping member 22 contacts and presses against the motherboard 200 first, while the second clamping member 24 does not contact the motherboard 200. In this embodiment, the second clamping member 24 can only clamp and fix the chip 100 when the cover plate 23 is in the second position and as the lifting member 11 continues to lift upward.

[0045] In other embodiments, the cover plate 23 is rotatably connected to the fixing frame 21, and its rotation between a first position and a second position is achieved by driving the cover plate 23 to rotate relative to the fixing frame 21. In some embodiments where the cover plate 23 is rotatably connected to the fixing frame 21, when the cover plate 23 is rotated to the second position, the second clamping member 24 can directly abut against the chip 100; in other embodiments where the cover plate 23 is rotatably connected to the fixing frame 21, after the cover plate 23 is rotated to the second position, the lifting member 11 must continue to lift to achieve the abutment of the second clamping member 24 against the chip 100.

[0046] In this embodiment, referring to Figures 6 and 7, the fixing frame 21 is provided with a clearance space 2112. The clearance space 2112 is connected to the operating space 2111 along the sliding direction of the cover plate 23. When the cover plate 23 is in the first position, the cover plate 23 is in the clearance space 2112, thus forming a clearance. Specifically, the fixing frame 21 is provided with a through hole 211 extending in the vertical direction. Multiple sets of first clamping members 22 are provided around the through hole 211 to improve the stability of clamping and fixing the main board 200. The second clamping member 24 is located in the through hole 211. The through hole 211 is divided into the clearance space 2112 and the operating space 2111 along the sliding direction of the cover plate 23.

[0047] In this embodiment, referring to Figure 5, the assembly equipment also includes a shielding plate 25. When the cover plate 23 is in the second position, the shielding plate 25 is positioned at the clearance space 2112 to provide shielding protection for the main board 200 below. In this embodiment, the shielding plate 25 and the cover plate 23 are synchronously slidably arranged, and the shielding plate 25 and the cover plate 23 can be driven to move by the same drive mechanism.

[0048] In this embodiment, the second clamping member 24 is movably disposed on the cover plate 23. When the cover plate 23 is in the second position, the second clamping member 24 can be moved up and down relative to the cover plate. In this embodiment, the fixing device also includes a second elastic member disposed between the cover plate 23 and the second clamping member 24. The second elastic member is used to provide the force required to drive the second clamping member 24 away from the cover plate 23. Specifically, when the cover plate 23 is in the second position, the second elastic member drives the second clamping member 24 to move downward. The provision of the second elastic member can prevent the second clamping member 24 from making hard contact with the chip 100, thereby avoiding damage to the chip 100. Moreover, the second elastic member, in conjunction with the upward lifting of the lifting member 11, can ensure that the chip 100 is clamped and fixed, improving the reliability of the device.

[0049] In this embodiment, the chip assembly equipment is used to transfer the adapter 300 and the chip 100 sequentially onto the motherboard 200, stacking the adapter 300 and the chip 100 together, and then fixing the chip 100 and the adapter 300 onto the motherboard 200. Specifically, the adapter 300 has contacts on both its front and back sides. After the adapter 300 is transferred to the motherboard 200, it can achieve an electrical connection with the motherboard 200. Then, the transport mechanism 5 transfers the chip 100 onto the adapter 300, and the adapter 300 can achieve an electrical connection with the chip 100. This achieves an electrical connection between the chip 100 and the motherboard 200. In this embodiment, the chip 100 is a memory chip.

[0050] In this embodiment, the transport mechanism 5 is also used for transporting the adapter 300. Specifically, referring to Figure 10, the transport mechanism 5 includes a first transport member 51 for transporting the chip 100 and a second transport member 52 for transporting the adapter 300. The first transport member 51 and the second transport member 52 are respectively arranged to move up and down. In this embodiment, the transport mechanism 5 also includes a vision inspection module 53. The first transport member 51, the second transport member 52, and the vision inspection module 53 are arranged adjacent to each other along a straight line. Specifically, the transport mechanism 5 includes a movable base 54, which is movable along both a first direction and a second direction, with the second direction perpendicular to the first direction. The first transport member 51, the second transport member 52, and the vision inspection module 53 are arranged on the movable base 54 along the first direction, wherein the first transport member 51 and the second transport member 52 are respectively arranged to move up and down on the movable base 54.

[0051] In this embodiment, the chip 100 and the adapter 300 are fixed to the motherboard with bolts. The assembly equipment includes a bolt fastening mechanism 3, which fastens the chip 100 and the adapter 300 with bolts. In this embodiment, the cover plate 23 is provided with an operating channel for the bolt fastening mechanism 3 to pass through. When the cover plate 23 is in the second position, the operating channel extends vertically, and the bolt fastening mechanism 3 can pass through the operating channel from top to bottom to install and tighten the bolts.

[0052] Specifically, as shown in Figure 6, the cover plate 23 is provided with a guide tube 231. When the cover plate 23 is in the second position, the guide tube 231 extends in the vertical direction. The cavity of the guide tube 231 constitutes the above-mentioned operating channel. The tube wall of the guide tube 231 can provide guidance for the bolt fastening mechanism 3.

[0053] In this embodiment, referring to Figure 9, the bolt fastening mechanism 3 includes a mounting base 31, a sleeve 32, and a tightening gun 33. The sleeve 32 is used to attract the bolt, and the tightening gun 33 is used to tighten the bolt. In this embodiment, the sleeve 32 and the tightening gun 33 are respectively movably mounted on the mounting base 31. During the bolt fixing operation, the sleeve 32 attracts the bolt to its lower part, and then the bolt is inserted into the bolt fixing hole of the chip 100 and the adapter 300 by driving the sleeve 32 downward. Then, the tightening gun 33 is used to tighten and fix the bolt. In some embodiments, the sleeve 32 and the tightening gun 33 are driven to move up and down by different moving mechanisms.

[0054] In other embodiments, the sleeve 32 and the tightening gun 33 can move up and down synchronously, while the sleeve 32 can float up and down independently relative to the mounting base 31. The up-and-down movement of the sleeve 32 is used to determine whether the bolt is correctly inserted into the bolt fixing hole. In this embodiment, the mounting base 31 is provided with a displacement sensor 34, which is used to detect the displacement of the sleeve 32 relative to the mounting base 31 to determine whether the bolt is accurately inserted into the bolt fixing hole. Specifically, the displacement of the sleeve 32 relative to the mounting base 31 is different when the sleeve 32 accurately inserts the bolt into the bolt fixing hole and when the bolt is not inserted into the bolt fixing hole, and the displacement sensor 34 makes a judgment accordingly.

[0055] In this embodiment, referring to Figure 6, the first clamping member 22 includes a plurality of clamping feet 221, which can contact the motherboard 200 and clamp the motherboard 200. In some embodiments, a positioning structure is provided between the clamping feet 221 and the motherboard 200. For example, one of the clamping feet 221 and the motherboard 200 is provided with a positioning pin, and the other is provided with a positioning groove. When the clamping feet 221 abut against the motherboard 200, the positioning pin is inserted into the positioning groove, further improving positioning accuracy and restricting the movement of the motherboard 200.

[0056] In this embodiment, the assembly equipment includes a motherboard transfer mechanism 4 for transferring the motherboard 200. An assembly station is provided on the transfer path of the motherboard 200. A lifting member 11 is disposed at the assembly station, and a fixing frame 21 is disposed above the assembly station. When the motherboard 200 is transferred to the assembly station, the lifting member 11 lifts the motherboard 200 upward and fixes the motherboard 200 and the chip 100 through multiple lifting operations.

[0057] Specifically, in this embodiment, the motherboard transmission mechanism 4 transmits the motherboard carrier 201 carrying the motherboard 200, and the lifting member 11 lifts the motherboard carrier 201. Preferably, a positioning structure is provided between the lifting member 11 and the motherboard carrier 201.

[0058] In this embodiment, referring to Figure 8, the lifting device 1 includes a lifting mechanism 12 for driving the lifting member 11 to move up and down, and a rotating mechanism 13 for driving the lifting member 11 to rotate around a rotation center line. The rotation center line extends in the vertical direction. The rotating mechanism 13 can adjust the angle of the lifting member 11, thereby adjusting the angle of the motherboard 200 lifted by the lifting member 11. Specifically, after the motherboard carrier 201 carrying the motherboard 200 is transferred to the assembly station, the lifting member 11 first moves upward to the detection height, which is lower than the first working height. After the lifting member 11 moves to the detection height, the vision module of the assembly equipment identifies and positions the motherboard 200, and then the angle of the motherboard 200 can be adjusted by the rotating mechanism 13.

[0059] In this embodiment, the assembly equipment further includes a loading mechanism 8 for providing the chip 100 and a pre-processing mechanism 7 for pre-processing the chip 100. The loading mechanism 8, the pre-processing mechanism 7, and the motherboard transfer mechanism 4 are arranged sequentially along a first direction. Specifically, in this embodiment, the loading mechanism 8 is used to provide the chip 100 and the adapter 300. The pre-processing mechanism 7 includes a cleaning module, a detection module, and a scanning module, which are used to perform surface cleaning and detection on the chip 100 and the adapter 300, and to scan the contacts on the surface of the adapter 300.

[0060] In this embodiment, the assembly equipment also includes a feeding mechanism 6 disposed between the pre-processing mechanism 7 and the motherboard transfer mechanism 4 along the first direction. The chip 100 and the adapter 300 that have undergone pre-processing are collected by the feeding mechanism 6 and transferred to a set feeding station. The transport mechanism 5 obtains the chip 100 and the adapter 300 from the feeding station and transfers the chip 100 and the adapter 300 to the motherboard 200 located at the assembly station.

[0061] In this embodiment, the motherboard transfer mechanism 4 includes a motherboard transfer track 41 for transferring the motherboard carrier 201. The feeding mechanism 6 includes a feeding track 61 for transferring the pre-processed chip 100 and the adapter 300. The pre-processing mechanism 7 includes a fixture transfer track 71, and the cleaning module, detection module, and scanning module of the pre-processing mechanism 7 are arranged sequentially parallel to the length direction of the fixture transfer track 71. In this embodiment, the motherboard transfer track 41, the feeding track 61, and the fixture transfer track 71 are parallel to each other and extend along a second direction, resulting in a cleaner and more compact equipment layout.

[0062] In summary, the chip assembly equipment of this utility model, during chip assembly, can successively press and fix the motherboard 200 through the first clamping member 22 and the chip 100 and adapter 300 through the second clamping member 24 by lifting the lifting member 11 twice. The operation is simple and can effectively improve the assembly efficiency.

[0063] It is understood that the same or similar parts in the above embodiments can be referred to each other, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

[0064] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art. In the event of any contradiction or inconsistency between the definitions used herein and those contained in other published documents, the definitions used herein shall prevail.

[0065] As indicated in this specification and claims, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0066] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made based on the essence of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A chip assembly apparatus for assembling chips onto a motherboard, the assembly apparatus comprising a transport mechanism for transferring chips, characterized in that, The chip assembly equipment further includes: a lifting member, which is movable up and down to lift the motherboard upwards; a fixing frame, which is disposed above the lifting member and has a vertically penetrating operating space for the conveying mechanism to extend below; a first clamping member, used to clamp the motherboard, which is movable up and down at the lower part of the fixing frame; a first elastic member, disposed between the fixing frame and the first clamping member, which provides the force required to drive the first clamping member downwards; a cover plate, movably disposed on the fixing frame, which has a first position and a second position relative to the fixing frame. When in the first position, the cover plate is away from the operating space; when in the second position, the cover plate blocks the operating space; and a second clamping member, used to clamp the chip, which is disposed on the cover plate. When the cover plate is in the second position, the second clamping member is located below the cover plate and extends below the fixing frame.

2. The chip assembly equipment according to claim 1, characterized in that: The lifting member has a first working height and a second working height higher than the first working height. When it is at the first working height, the first clamping member abuts against the motherboard located above the lifting member. When the lifting member is at the second working height and the cover plate is at the second position, the second clamping member abuts against the chip transferred to the motherboard.

3. The chip assembly equipment according to claim 1, characterized in that: The cover plate is slidably connected to the fixing frame, and the second clamping member is disposed at the lower part of the cover plate, with the bottom of the second clamping member located above the bottom of the first clamping member in the vertical direction.

4. The chip assembly equipment according to claim 3, characterized in that: The fixing frame has a clearance space, which is connected to the operating space along the sliding direction of the cover plate. When the cover plate is in the first position, the cover plate is in the clearance space. The fixing frame has a through hole that runs through the vertical direction. Multiple sets of first clamping members are provided around the through hole. The second clamping members are located in the through hole. The through hole is divided into the clearance space and the operating space along the sliding direction of the cover plate.

5. The chip assembly equipment according to claim 1, characterized in that: The cover plate is rotatably connected to the fixing frame; when the cover plate is in the second position, the second clamping member abuts against the chip transferred to the motherboard.

6. The chip assembly equipment according to claim 1, characterized in that: The second clamping member is movably connected to the cover plate. When the cover plate is in the second position, the second clamping member can be moved up and down relative to the cover plate. The assembly equipment also includes a second elastic member disposed between the cover plate and the second clamping member. The second elastic member is used to provide the force required to drive the second clamping member away from the cover plate.

7. The chip assembly equipment according to claim 1, characterized in that: The assembly equipment is used to fix the chip to the motherboard with bolts. The assembly equipment includes a bolt fastening mechanism. The cover plate is provided with an operating channel for the bolt fastening mechanism to pass through. When the cover plate is in the second position, the operating channel extends in the vertical direction.

8. The chip assembly equipment according to claim 7, characterized in that: The cover plate is provided with a guide tube. When the cover plate is in the second position, the guide tube extends in the vertical direction, and the cavity of the guide tube constitutes the operating channel.

9. The chip assembly equipment according to claim 1, characterized in that: The assembly equipment includes a motherboard transmission mechanism for transmitting the motherboard, an assembly station is provided on the transmission path of the motherboard, and the lifting component is disposed at the assembly station; the assembly equipment also includes a feeding mechanism for providing the chip and a preprocessing mechanism for preprocessing the chip, the feeding mechanism, the preprocessing mechanism and the motherboard transmission mechanism are arranged sequentially along a first direction.

10. The chip assembly equipment according to claim 9, characterized in that: The assembly equipment further includes a feeding mechanism disposed between the pretreatment mechanism and the motherboard transmission mechanism along the first direction; the motherboard transmission mechanism includes a motherboard transmission track, the feeding mechanism includes a feeding track, the pretreatment mechanism includes a fixture transmission track, the motherboard transmission track, the feeding track and the fixture transmission track are parallel to each other and extend along a second direction, the second direction being perpendicular to the first direction.

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