Ultrathin high-sound-pressure piezoelectric buzzer

Abstract

The utility model relates to the technical field of buzzers, in particular to an ultrathin high-sound-pressure piezoelectric buzzer, which comprises a buzzing sheet body, a bonding piece and a wiring pin, the bonding piece and the wiring pin are arranged on the buzzing sheet body, and the buzzing sheet body is adhered on a product shell through the bonding piece; the buzzing sheet body comprises a metal substrate and a piezoelectric sheet arranged on the metal substrate, and the area of the piezoelectric sheet is smaller than that of the metal substrate; the bonding piece is arranged on the side, back to the piezoelectric plate, of the metal substrate, and an insulating layer is arranged on the side, back to the bonding piece, of the buzzing piece body. In the scheme of the invention, the buzzer omits a cavity structure and is attached to the product shell through the bonding piece on the buzzer, and the product shell is used as a vibration carrier, so that the thickness of the buzzer is greatly reduced, and the moisture resistance of the buzzer is improved by covering the insulating layer. The buzzing sheet body is adhered to a product shell through the central back adhesive arranged at the central part of the metal substrate, so that a larger vibration space can be provided.

Description

Technical Field

[0001] This utility model relates to the field of buzzer technology, and in particular to an ultra-thin high sound pressure piezoelectric buzzer. Background Technology

[0002] As electronic products become thinner and more portable, higher demands are placed on the space occupied and performance of internal components. Piezoelectric buzzers, as common sound-generating devices, traditionally rely on cavity designs to enhance sound pressure performance. For example, current technologies often use a single-layer piezoelectric ceramic sheet bonded to a metal substrate and placed within a cavity, amplifying the sound pressure through cavity resonance. However, the cavity structure significantly increases the overall thickness of the device, limiting its application in ultra-thin electronic products. Utility Model Content

[0003] The purpose of this invention is to provide an ultra-thin high-sound-pressure piezoelectric buzzer that addresses the shortcomings of existing technologies.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] An ultra-thin high-sound-pressure piezoelectric buzzer includes: a buzzer body and an adhesive component and wiring pins disposed thereon, wherein the buzzer body is attached to a product housing by the adhesive component;

[0006] The buzzer chip body includes a metal substrate and a piezoelectric element disposed thereon, wherein the area of ​​the piezoelectric element is smaller than the area of ​​the metal substrate;

[0007] The adhesive is disposed on the side of the metal substrate facing away from the piezoelectric sheet, and an insulating layer is disposed on the side of the buzzer body facing away from the adhesive.

[0008] Furthermore, a first connecting portion and a second connecting portion are formed on the insulating layer corresponding to the metal substrate and the piezoelectric sheet, respectively, and are used to connect the first pin and the second pin.

[0009] Furthermore, a conductive cloth is provided at the second connection portion of the piezoelectric sheet.

[0010] Furthermore, the first connecting portion is positioned close to the second connecting portion.

[0011] Furthermore, the adhesive includes a central adhesive and a supporting adhesive, the central adhesive being disposed corresponding to the center of the piezoelectric sheet, and the supporting adhesive being disposed corresponding to the first connecting portion.

[0012] Furthermore, the piezoelectric sheet is made of multilayer piezoelectric ceramic sheet.

[0013] Furthermore, the insulating layer is configured as a green oil layer and covers the combination of the metal substrate and the piezoelectric sheet.

[0014] Furthermore, the metal substrate is made of an iron-nickel alloy.

[0015] The beneficial effects of this utility model are as follows:

[0016] In this application, the buzzer omits the cavity structure and is attached to the product housing via adhesive components. The product housing serves as the vibration carrier, which greatly reduces the thickness of the buzzer. The buzzer's moisture resistance is improved by covering it with an insulating layer. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the ultra-thin high-sound-pressure piezoelectric buzzer of this utility model;

[0019] Figure 2 This is a schematic diagram showing the elevation angle of the ultra-thin high-sound-pressure piezoelectric buzzer in this utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the ultra-thin high-sound-pressure piezoelectric buzzer of this utility model;

[0021] Figure 4 This is an exploded schematic diagram of the ultra-thin high-sound-pressure piezoelectric buzzer of this utility model.

[0022] Reference numerals: 1. Buzzer chip body; 11. Metal substrate; 12. Piezoelectric sheet; 2. Adhesive component; 21. Central adhesive; 22. Supporting adhesive; 3. Insulating layer; 31. First connecting part; 32. Second connecting part; 4. Conductive cloth. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] like Figures 1 to 4 The ultra-thin high-volume piezoelectric buzzer shown includes a buzzer body 1, an adhesive component 2 disposed thereon, and wiring pins. The buzzer body 1 is attached to the product housing by the adhesive component 2. The buzzer body 1 includes a metal substrate 11 and a piezoelectric piece 12 disposed thereon, the area of ​​the piezoelectric piece 12 being smaller than the area of ​​the metal substrate 11. The adhesive component 2 is disposed on the side of the metal substrate 11 facing away from the piezoelectric piece 12, and an insulating layer 3 is disposed on the side of the buzzer body 1 facing away from the adhesive component 2.

[0027] In this application, the buzzer omits the cavity structure and is attached to the product housing via the adhesive 2. The product housing is used as the vibration carrier, which greatly reduces the thickness of the buzzer. The moisture resistance of the buzzer is improved by covering it with an insulating layer 3.

[0028] As a preferred embodiment of this application, such as Figure 2 and Figure 4 As shown, a first connecting portion 31 and a second connecting portion 32 are formed on the insulating layer 3 corresponding to the metal substrate 11 and the piezoelectric sheet 12, respectively, and are used to connect the first pin and the second pin. The adhesive 2 includes a central adhesive 21 and a supporting adhesive 22. The central adhesive 21 is disposed corresponding to the center of the piezoelectric sheet 12, and the supporting adhesive 22 is disposed corresponding to the first connecting portion 31.

[0029] The buzzer body 1 is attached to the product housing by a central adhesive 21 located at the center of the metal substrate 11. The central adhesive is a 3M substrate-free double-sided adhesive, which has the characteristics of strong temperature resistance, strong adhesion and retention, and low vibration transmission loss (i.e., does not affect the high sound pressure characteristics). Compared with the traditional four-peripheral fixed connection method, the connection method of the buzzer body 1 in this application can provide a larger vibration space. The supporting adhesive 22 is located on the other side of the metal substrate 11 at the connection point between the metal substrate 11 and the wiring pin. It can alleviate the influence of the pressure of the wiring pin on the metal substrate 11 on the amplitude of the piezoelectric element 12 and further enhance the reliability of the connection between the buzzer body 1 and the product housing.

[0030] In this application, the piezoelectric element 12 is a multilayer piezoelectric ceramic sheet. The multilayer piezoelectric ceramic sheet is bonded to the center of the metal substrate 11 with adhesive, ensuring that the area of ​​the piezoelectric element 12 is smaller than that of the metal substrate 11. The multilayer piezoelectric ceramic sheet can enhance the driving force and amplitude of the buzzer body 1, enabling the buzzer to have a higher sound pressure level.

[0031] The first connecting part 31 is positioned close to the second connecting part 32. When both the first connecting part 31 and the second connecting part 32 are connected to the wiring pins, the first connecting part 31 and the second connecting part 32, which are close to each other, can alleviate the amplitude effect caused by the pressure of the wiring pins by the support adhesive 22 after the wiring pins are connected.

[0032] Furthermore, as a preferred embodiment of this application, such as Figure 3 and Figure 4 As shown, a conductive cloth 4 is provided at the second connection portion 32 of the piezoelectric sheet 12. The second pin is flexibly electrically connected to the silver layer on the piezoelectric ceramic sheet through the conductive cloth 4.

[0033] Furthermore, the insulating layer 3 is set as a green oil layer and covers the combination of the metal substrate 11 and the piezoelectric sheet 12. The insulating layer 3 adopts the green oil process to enhance the moisture resistance. The metal substrate 11 is made of iron-nickel alloy. The iron-nickel alloy substrate optimizes mechanical strength and vibration transmission efficiency, and its surface is polished to enhance adhesive adhesion.

[0034] Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An ultra-thin high-audio-pressure piezoelectric buzzer, characterized in that, include: A buzzer body (1) and an adhesive (2) and wiring pins disposed thereon, wherein the buzzer body (1) is attached to the product housing by the adhesive (2); The buzzer chip body (1) includes a metal substrate (11) and a piezoelectric sheet (12) disposed thereon, wherein the area of ​​the piezoelectric sheet (12) is smaller than the area of ​​the metal substrate (11); The adhesive (2) is disposed on the side of the metal substrate (11) facing away from the piezoelectric sheet (12), and an insulating layer (3) is disposed on the side of the buzzer body (1) facing away from the adhesive (2).

2. The ultra-thin high-audio-pressure piezoelectric buzzer according to claim 1, characterized in that, A first connecting portion (31) and a second connecting portion (32) are formed on the insulating layer (3) corresponding to the metal substrate (11) and the piezoelectric sheet (12), respectively, and are used to connect the first pin and the second pin.

3. The ultra-thin high-audio-pressure piezoelectric buzzer according to claim 2, characterized in that, A conductive cloth (4) is provided on the piezoelectric sheet (12) at the second connection part (32).

4. The ultra-thin high-audio-pressure piezoelectric buzzer according to claim 2, characterized in that, The first connecting part (31) is disposed near the second connecting part (32).

5. The ultra-thin high-audio-pressure piezoelectric buzzer according to claim 2, characterized in that, The adhesive (2) includes a central adhesive (21) and a supporting adhesive (22). The central adhesive (21) is disposed corresponding to the center of the piezoelectric sheet (12), and the supporting adhesive (22) is disposed corresponding to the first connecting part (31).

6. The ultra-thin high-audio-pressure piezoelectric buzzer according to any one of claims 1 to 5, characterized in that, The piezoelectric sheet (12) is made of multilayer piezoelectric ceramic sheet.

7. The ultra-thin high-audio-pressure piezoelectric buzzer according to any one of claims 1 to 5, characterized in that, The insulating layer (3) is configured as a green oil layer and covers the combination of the metal substrate (11) and the piezoelectric sheet (12).

8. The ultra-thin high-audio-pressure piezoelectric buzzer according to any one of claims 1 to 5, characterized in that, The metal substrate (11) is made of iron-nickel alloy.

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