IMD (In-Mold Decoration) IC (Integrated Circuit) card holder with Mesh circuit
By using a plastic IC card socket and an IMD security circuit film, combined with positioning posts and tensile-resistant silver paste circuitry, the problem of high cost and easy hacking of existing IC card sockets is solved, achieving higher security and convenient installation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU SIPULANDI ELECTRONICS CO LTD
- Filing Date
- 2025-04-03
- Publication Date
- 2026-05-01
AI Technical Summary
Existing IC card slots in financial POS devices are costly to protect and easy to crack, making it difficult to effectively prevent information leakage and unsafe acts.
The IC card socket body is made of plastic and the security circuit film material is formed by IMD molding. The security circuit film material includes a thin film substrate and security circuits printed on its bottom. The electrical connection point is located at the bottom of the side wing and is combined with the IC card socket through positioning posts to form tensile-resistant silver paste circuits and a grid-like structure.
It improves the security and ease of installation of the IC card socket, reduces production costs, and easily triggers alarms during disassembly to prevent information leakage.
Smart Images
Figure CN224191242U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component technology, and in particular to an IMD molded IC card holder with mesh circuitry. Background Technology
[0002] IC cards are commonly used financial data media, requiring the insertion of an IC card into the IC card slot of a financial payment device for data reading. Because information is easily stolen during IC card data transmission, the IC chips and card-swiping components of current financial payment devices (POS devices and desktop payment devices, etc.) require security protection to prevent hacker attacks, short-circuiting to steal data, and subsequent unauthorized card transactions. Based on these needs, existing financial POS manufacturers implement corresponding protection measures based on risk points identified by financial security certification agencies. A common practice is to install a PCB security circuit board on a stainless steel IC card holder, using a rigid PCB board and IC pins for protection. This method results in high overall costs for the IC card holder and security circuitry, is inconvenient to install, and is easily cracked. Utility Model Content
[0003] To address the shortcomings of existing technologies, the purpose of this invention is to provide an IMD molded IC card socket with mesh circuitry.
[0004] The technical solution adopted by this utility model to solve its technical problem is: an IMD molded IC card holder with mesh circuitry, comprising an IC card holder body made of plastic material and a security circuit film covering the surface of the IC card holder body. The security circuit film is IMD molded with the IC card holder. The security circuit film includes a thin film substrate and a security circuit disposed at the bottom of the thin film substrate. The two ends of the security circuit are provided with electrical connection points connected to an alarm circuit. The bottom of the IC card holder is provided with an IC card slot.
[0005] As a further improvement to this design, the security circuit film is provided with side wings extending to both sides of the bottom of the IC card holder, and the electrical connection point is located at the bottom of the side wings.
[0006] As a further improvement to this design, the IC card holder body is provided with a downwardly extending positioning post that penetrates the side wing.
[0007] As a further improvement to this design, each of the winglets is penetrated by at least two positioning posts, and the electrical connection point is located between the two positioning posts.
[0008] As a further improvement to this design, the security circuit film material includes a PET film substrate, security circuits printed on the bottom of the film substrate, a UV adhesive layer covering the security circuits and the bottom of the film substrate, and an adhesive layer covering the bottom of the UV adhesive layer. The security circuits are printed silver paste circuits.
[0009] As a further improvement to this design, the film substrate is a stretchable PET film, and the safety circuit is a tensile silver paste.
[0010] As a further improvement to this design, the electrical connection point is a silver paste contact, and the electrical connection point is electrically connected to the safety line through the silver paste in the via of the thin film substrate.
[0011] As a further improvement to this design, the surface of the electrical connection point is printed with conductive carbon paste.
[0012] As a further improvement to this design, the safety circuit is arranged in a serpentine single-layer or double-layer circuit to form a power grid.
[0013] The beneficial effects of this utility model are: by performing IMD molding of the security circuit film and the IC card socket, the security circuit film and the IC card socket are tightly bonded and not easily separated or disassembled, thus improving safety. At the same time, it can reduce production costs and make installation more convenient. The electrical connection point at the bottom of the IC card socket makes it easy to trigger an alarm when disassembling the IC card socket. Attached Figure Description
[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0015] Figure 1 This is a schematic diagram of the overall three-dimensional top view structure of this utility model.
[0016] Figure 2 This is a schematic diagram of the overall three-dimensional upward-view structure of this utility model.
[0017] Figure 3 This is a cross-sectional schematic diagram of the safety circuit film material of this utility model.
[0018] In the diagram: 1. IC card slot, 2. Security circuit film, 20. Adhesive layer, 21. UV adhesive layer, 22. Thin film substrate, 23. Security circuit, 24. Electrical connection point, 25. Conductive carbon paste, 3. IC card slot, 4. Side wing, 5. Positioning post. Detailed Implementation
[0019] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The illustrative embodiments and descriptions are only used to explain the present invention and are not intended to limit the present invention. Example
[0020] Please see Figure 1 and Figure 2 This embodiment provides an IMD-molded IC card holder with mesh circuitry, including an IC card holder 1 body made of plastic and a security circuit film 2 covering the surface of the IC card holder 1 body. The security circuit film 2 is IMD-molded with the IC card holder 1. The security circuit film 2 includes a thin film substrate 22 and a security circuit 23 disposed at the bottom of the thin film substrate 22. The security circuit 23 has electrical connection points 24 at both ends that are connected to an alarm circuit. The bottom of the IC card holder 1 is provided with an IC card slot 3.
[0021] The above-mentioned method of IMD molding the security circuit film 2 and the IC card socket 1 makes the security circuit film 2 and the IC card socket 1 tightly bonded and not easy to separate or disassemble, thereby improving safety, reducing production costs, and making installation more convenient. The electrical connection point 24 at the bottom of the IC card socket 1 makes it easy to trigger an alarm when disassembling the IC card socket 1.
[0022] To prevent hacking at the electrical connection point 24, the security circuit film 2 has side wings 4 extending to both sides of the bottom of the IC card holder 1, with the electrical connection point 24 located at the bottom of the side wings 4. The electrical connection point 24 is hidden beneath the IC card holder 1, making hacking impossible through it.
[0023] To facilitate convenient and precise installation of the IC card holder 1 and accurate connection between the electrical connection point 24 and the alarm circuit, the IC card holder 1 is provided with a downwardly extending positioning post 5, which penetrates the side wing 4. This facilitates positioning of the side wing 4 and allows for the setting of a smaller electrical connection point 24 to improve sensitivity.
[0024] To further enhance the stability of the electrical connection point 24, each of the side wings 4 is penetrated by at least two positioning posts 5, and the electrical connection point 24 is located between the two positioning posts 5.
[0025] Please see Figure 3 The security line 23 film material 2 includes a PET film substrate 22, a security line 23 printed on the bottom of the film substrate 22, a UV adhesive layer 21 covering the security line 23 and the bottom of the film substrate 22, and an adhesive layer 20 covering the bottom of the UV adhesive layer 21. The security line 23 is a printed silver paste line. The film substrate 22 is made of opaque PET to enhance the visual confidentiality of the security line 23.
[0026] The film substrate 22 is a stretchable PET film, which makes it easy to bend the side wings 4 to the bottom of the card holder 1. The safety line 23 is a tensile-resistant silver paste, which can be disconnected or short-circuited in time when the device is cracked.
[0027] To facilitate production and ensure good conductivity of the electrical connection point 24, preventing false alarms, the electrical connection point 24 is a silver paste contact. The electrical connection point 24 is electrically connected to the safety circuit 23 through a through-hole in the thin film substrate 22. When the IC card holder 1 becomes loose, the electrical connection point 24 disconnects from the alarm circuit, triggering the alarm.
[0028] To prevent false alarms caused by oxidation of the electrical connection point 24, a conductive carbon paste 25 is printed on the surface of the electrical connection point 24. This also prevents the electrical connection point 24 from adhering to the alarm circuit, which could lead to a decrease in sensitivity.
[0029] The security line 23 is arranged in a serpentine single-layer or double-layer form to create a power grid, which has a good effect on preventing information leakage.
[0030] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. An IMD molded IC card socket with mesh circuitry, characterized in that, The device includes an IC card holder body made of plastic and a security circuit film covering the surface of the IC card holder body. The security circuit film is formed with the IC card holder IMD. The security circuit film includes a thin film substrate and a security circuit disposed at the bottom of the thin film substrate. The two ends of the security circuit are provided with electrical connection points for connecting to an alarm circuit.
2. The IMD shaped IC card holder with a Mesh line according to claim 1, characterized in that, The security circuit film has side wings extending to both sides of the bottom of the IC card holder, and the electrical connection point is located at the bottom of the side wings.
3. The IMD molded IC card socket with mesh circuitry according to claim 2, characterized in that, The IC card holder body is provided with a downwardly extending positioning post that penetrates the side wing.
4. The IMD molded IC card socket with mesh circuitry according to claim 3, characterized in that, Each of the flanks is penetrated by at least two positioning posts, and the electrical connection point is located between the two positioning posts.
5. An IMD molded IC card socket with mesh circuitry according to claim 2, characterized in that, The security circuit film material includes a PET film substrate, security circuits printed on the bottom of the film substrate, a UV adhesive layer covering the security circuits and the bottom of the film substrate, and an adhesive layer covering the bottom of the UV adhesive layer. The security circuits are printed silver paste circuits.
6. The IMD molded IC card socket with mesh circuitry according to claim 5, characterized in that, The film substrate is a stretchable PET film, and the safety circuit is a tensile silver paste.
7. An IMD molded IC card socket with mesh circuitry according to claim 6, characterized in that, The electrical connection point is a silver paste contact, and the electrical connection point is electrically connected to the safety line through the silver paste in the through-hole of the thin film substrate.
8. An IMD molded IC card socket with mesh circuitry according to claim 7, characterized in that, The surface of the electrical connection point is printed with conductive carbon paste.
9. The IMD shaped IC card holder with a mesh line according to claim 1, characterized in that, The safety circuit is arranged in a serpentine single-layer or double-layer circuit to form a power grid.