Wireless charging device

Abstract

The utility model relates to wireless charging equipment, which comprises a heat dissipation shell, a mainboard, a cover plate and a wireless charging assembly, at least part of the heat dissipation shell is exposed out of the wireless charging equipment, the heat dissipation shell is of an integrated structure, a first accommodating cavity is formed in the heat dissipation shell, and the wireless charging assembly is arranged in the first accommodating cavity. The mainboard is fixed on the heat dissipation shell and electrically connected with the wireless charging assembly, the cover plate covers the first containing cavity to seal the first containing cavity, and the wireless charging assembly is attached to the bottom of the first containing cavity. According to the wireless charging equipment provided by the invention, the heat dissipation efficiency of the wireless charging assembly can be effectively improved, the problems that the resistance of an electronic element is too large and the charging efficiency is reduced due to the fact that the temperature of the assembly is too high are solved, the heat dissipation shell is of an integrated structure, a gap structure is not needed in the heat conduction process, and the heat conduction speed is higher.

Description

Technical Field

[0001] This utility model relates to the field of charging equipment technology, and in particular to a wireless charging device. Background Technology

[0002] With the rapid development of wireless charging technology, wireless charging devices are increasingly widely used in consumer electronics, smart homes, and automotive electronics. However, during wireless charging, due to limitations in energy conversion efficiency, core components such as coils and magnetic plates generate a large amount of heat. If this heat cannot be dissipated in time, the device temperature will rise, affecting charging efficiency, device stability, and even shortening the lifespan of electronic components. Therefore, heat dissipation performance has become one of the key challenges in the design of wireless charging devices. Current technologies for heat dissipation in wireless charging devices are limited by the optimization of component layout, cavity design, and heat conduction paths, resulting in risks such as poor heat dissipation, complex structures, and poor performance. For example, some wireless charging devices directly mount the coil and magnetic plate inside the casing, but the contact area between the magnetic plate and the casing is insufficient, leading to high thermal resistance; some existing technologies, although employing a split-cavity layout, do not adequately consider the fixing method between the motherboard and the heat dissipation casing, resulting in low heat conduction efficiency; and existing technologies use a split heat dissipation structure, requiring heat to pass through gaps during conduction, resulting in low thermal conductivity. Utility Model Content

[0003] Therefore, it is necessary to provide a wireless charging device that can effectively improve the heat dissipation efficiency of wireless charging components, avoid the problem of excessive component temperature leading to excessive resistance of electronic components and reduced charging efficiency, and the heat dissipation shell is an integrated structure, so that heat conduction does not need to pass through gap structures, and the heat conduction speed is faster.

[0004] A wireless charging device includes a heat dissipation shell, a motherboard, a cover plate, and a wireless charging component. The heat dissipation shell is at least partially exposed in the wireless charging device and is an integral structure. A first accommodating cavity is formed in the heat dissipation shell. The wireless charging component is disposed in the first accommodating cavity. The motherboard is fixed to the heat dissipation shell and electrically connected to the wireless charging component. The cover plate is disposed on the first accommodating cavity to close the first accommodating cavity. The wireless charging component is attached to the bottom of the first accommodating cavity.

[0005] In the wireless charging device provided in this application, the heat generated by the wireless charging component during operation can be transferred to the heat dissipation shell through the bottom of the first accommodating cavity, while the heat dissipation shell is exposed to the outside. Thus, the heat of the wireless charging component can be dissipated through the contact surface between the heat dissipation shell and the outside, effectively improving the heat dissipation efficiency of the wireless charging component and avoiding the problem of excessive resistance of electronic components and reduced charging speed due to excessive component temperature. Moreover, the heat dissipation shell is an integral structure, and the heat conduction process does not need to pass through the gap structure, so the heat conduction speed is faster.

[0006] In one embodiment, the wireless charging assembly further includes a coil and a magnetic plate, the magnetic plate being connected to the bottom of the first accommodating cavity, the coil being connected to the magnetic plate and located on the side of the magnetic plate opposite to the bottom of the first accommodating cavity, and the main board being electrically connected to the coil.

[0007] In one embodiment, the magnetic plate is bonded to the bottom of the first accommodating cavity by thermally conductive adhesive.

[0008] In one embodiment, a support frame is formed inside the heat dissipation housing, the support frame is integrally formed with the heat dissipation housing, and a first receiving cavity is formed between the support frame and one end of the heat dissipation housing, the support frame being the bottom of the first receiving cavity.

[0009] In one embodiment, a second receiving cavity is formed between the support frame and the other end of the heat dissipation housing, the motherboard is disposed in the second receiving cavity, and the motherboard is fixedly connected to the support frame.

[0010] In one embodiment, the motherboard is bonded to the support frame using thermally conductive adhesive.

[0011] In one embodiment, the system further includes a bottom shell, which is fixedly connected to the heat dissipation outer shell and seals the second accommodating cavity, wherein the first accommodating cavity is in communication with the second accommodating cavity.

[0012] In one embodiment, the bottom shell is provided with a support column, which abuts against the side of the motherboard away from the support frame.

[0013] In one embodiment, the outer peripheral wall of the heat dissipation housing is provided with heat dissipation fins.

[0014] In one embodiment, the wireless charging component is clamped and fixed between the cover plate and the bottom of the first accommodating cavity. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0016] Figure 1This is a schematic diagram of the structure of a wireless charging device provided in an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the structure of a wireless charging device provided in an embodiment of this application;

[0018] Figure 3 This is a cross-sectional view of a wireless charging device provided in an embodiment of this application.

[0019] Reference numerals: Wireless charging device 10; Heat dissipation shell 20; First accommodating cavity 21; Support frame 22; Second accommodating cavity 23; Heat dissipation fins 24; Main board 30; Cover plate 40; Wireless charging assembly 50; Coil 51; Magnet plate 52; Thermal conductive adhesive 60; Bottom shell 70; Support column 71. Detailed Implementation

[0020] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0021] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0022] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] With the rapid development of wireless charging technology, wireless charging devices are increasingly widely used in consumer electronics, smart homes, and automotive electronics. However, during wireless charging, due to limitations in energy conversion efficiency, core components such as coils and magnetic plates generate a large amount of heat. If this heat cannot be dissipated in time, the device temperature will rise, affecting charging efficiency, device stability, and even shortening the lifespan of electronic components. Therefore, optimizing the heat dissipation structure has become one of the key issues in the design of wireless charging devices. Current technologies for heat dissipation in wireless charging devices are limited by the optimization of component layout, cavity design, and heat conduction paths, resulting in risks such as poor heat dissipation, complex structures, and poor performance. Traditional wireless charging devices typically use metal casings for heat dissipation, but the heat dissipation efficiency is limited, and the layout of the motherboard and wireless charging components may affect the overall heat dissipation effect. Furthermore, the fixing method of wireless charging components in existing devices may not be stable enough, leading to displacement during vibration or movement, affecting charging efficiency. Simultaneously, the connection method between the motherboard and the heat dissipation structure may also affect heat conduction efficiency, thus impacting the long-term stability of the device.

[0025] refer to Figures 1-3 To address the aforementioned issues, this application provides a wireless charging device 10, comprising a heat dissipation shell 20, a motherboard 30, a cover plate 40, and a wireless charging component 50. The heat dissipation shell 20 is at least partially exposed within the wireless charging device 10 and is an integral structure. A first accommodating cavity 21 is formed within the heat dissipation shell 20. The wireless charging component 50 is disposed within the first accommodating cavity 21. The motherboard 30 is fixed to the heat dissipation shell 20 and electrically connected to the wireless charging component 50. The cover plate 40 covers the first accommodating cavity 21 to close it. The wireless charging component 50 is attached to the bottom of the first accommodating cavity 21.

[0026] The wireless charging device 10 provided in this application is convenient, efficient, and safe, and can be applied to daily life, commercial, and industrial fields. For example, the wireless charging device 10 can be used for personal purposes; users can place the wireless charger on their bedside table or desk and simply place their mobile phones, headphones, and other devices on it to charge, avoiding frequent plugging and unplugging of data cables and improving the user experience. The wireless charging device 10 can also be integrated with smart homes; for example, some furniture (such as coffee tables, table lamps, and speakers) can have built-in wireless charging modules to provide a convenient charging experience. The wireless charging device 10 can also support a multi-coil design to simultaneously power mobile phones, watches, headphones, and other devices, thereby meeting the user's multi-device charging needs.

[0027] Furthermore, the wireless charging device 10 includes a heat dissipation shell 20, a motherboard 30, a cover plate 40, and a wireless charging component 50. The heat dissipation shell 20 is the outer structure of the wireless charging device 10, providing support while also dissipating heat. The heat dissipation shell 20 is a one-piece structure, eliminating the need for gaps in the heat transfer process, resulting in faster heat conduction. Specifically, the heat dissipation shell 20 can be made of metal, which has high thermal conductivity. Specifically, the metal can be copper, aluminum, iron, or their alloys. Aluminum alloy heat dissipation shells 20, in particular, offer advantages such as lightweight and good thermal conductivity. The heat dissipation shell 20 can also be made of engineering plastics, such as polycarbonate, which has high temperature resistance and insulation properties and can be made into a transparent shell. In actual manufacturing, thermally conductive fillers (such as graphite or metal powder) can be added to polycarbonate to improve its heat dissipation capacity. The heat dissipation housing 20 can also be a composite structure of metal and plastic, with an internal metal thermally conductive layer (such as an aluminum plate) and an external plastic shell. This combination of materials allows the heat dissipation housing 20 to balance heat dissipation and design flexibility. The appropriate material for the heat dissipation housing 20 can be selected based on actual needs and cost, enabling the heat dissipation housing 20 to quickly conduct and dissipate heat generated by internal components.

[0028] Furthermore, a first accommodating cavity 21 is formed in the heat dissipation shell 20. The first accommodating cavity 21 is used to install the wireless charging component 50 to ensure stable assembly of the wireless charging component 50. The wireless charging component 50 is responsible for electromagnetic induction to achieve the wireless charging function. The wireless charging component 50 is in close contact with the heat dissipation shell 20 to facilitate rapid heat dissipation and avoid the impact of high temperature on charging efficiency. The wireless charging component 50 includes a coil 51 and a magnetic plate 52. The coil 51 is the core of energy output for wireless charging. The coil 51 is usually made of copper wire. When the AC power output from the motherboard 30 passes through the coil 51, an alternating magnetic field is generated. The coil 51 inside the receiving device (such as a mobile phone) senses the magnetic field and converts it into current, thereby realizing wireless charging. Since the winding method and number of turns of the coil 51 directly affect the magnetic field strength and transmission efficiency, preferably, a multi-coil 51 array can be used to automatically detect the device position and improve the flexibility of charging alignment. The magnetic plate 52 has a concentrating effect, which reduces energy scattering and improves transmission efficiency. Simultaneously, the magnetic plate 52 prevents magnetic field interference with surrounding metal objects, avoiding overheating or false triggering. The magnetic plate 52 can be a magnetically conductive plate or a magnetically shielding plate. The magnetically shielding plate absorbs leakage magnetic field, reducing electromagnetic interference to the device motherboard 30 or other electronic components. The coil 51 is electrically connected to the motherboard 30 to ensure efficient power transmission. The magnetic plate 52 is connected to the coil 51 and is in contact with the bottom of the first accommodating cavity 21. Direct contact between the magnetic plate 52 and the bottom of the first accommodating cavity 21 helps conduct the heat generated by the coil 51 to the heat dissipation shell 20 for dissipation. In some embodiments, the magnetic plate 52 can be bonded to the bottom of the first accommodating cavity 21 with thermally conductive adhesive 60, allowing for a tighter connection between the magnetic plate 52 and the heat dissipation shell 20. The thermally conductive adhesive 60 has excellent thermal conductivity, enabling rapid transfer of heat generated by the magnetic plate 52 and coil 51 during operation to the heat dissipation shell 20, preventing heat accumulation that could affect charging efficiency. The thermally conductive adhesive 60 can be 3M thermally conductive double-sided tape. Heat from the magnetic plate 52 and coil 51 is conducted through the 3M thermally conductive double-sided tape to the heat dissipation housing 20, thereby transferring heat to the air. The adhesive method ensures a tight fit between the magnetic plate 52 and the bottom of the receiving cavity, preventing displacement due to vibration or movement, ensuring magnetic field stability and charging reliability. Simultaneously, the thermally conductive adhesive 60 has a certain degree of elasticity, absorbing slight vibrations to protect the structure of the magnetic plate 52 and coil 51. The thermally conductive adhesive 60 can be epoxy resin-based or silicone-based.

[0029] The wireless charging component 50 is in direct contact with the heat dissipation shell 20, allowing heat to dissipate quickly. Simultaneously, the wireless charging component 50 is securely clamped between the cover plate 40 and the bottom of the first accommodating cavity 21, preventing displacement due to vibration or movement and ensuring a stable and reliable charging process. The coil 51 is located on the side of the magnetic plate 52 opposite to the bottom of the first accommodating cavity 21. The coil 51 inside the device senses the magnetic field and converts it into current to achieve wireless charging. The motherboard 30 is fixed to the heat dissipation shell 20 and electrically connected to the wireless charging component 50. It is responsible for adjusting the charging power, managing the charging process, and providing necessary circuit protection functions. The cover plate 40 covers the first accommodating cavity 21, providing a sealing and protective function to prevent dust or foreign objects from entering and affecting the operation of the wireless charging component 50. The cover plate 40 fits tightly with the heat dissipation shell 20, ensuring the overall structural stability without affecting heat dissipation performance.

[0030] To ensure that the various structures of the wireless charging component 50 do not affect each other during use, a support frame 22 can be formed inside the heat dissipation shell 20. The support frame 22 serves a supporting and fixing function and is an important load-bearing component inside the heat dissipation shell 20. The support frame 22 and the heat dissipation shell 20 are integrally molded, which increases the structural strength of the heat dissipation shell 20 and effectively improves its overall rigidity, enabling it to effectively resist external impacts and deformation. At the same time, the integral molded structure eliminates the connection gaps that may exist in traditional assembled brackets. As part of the heat conduction path, the support frame 22 can quickly transfer internal heat to the entire shell, significantly improving the overall structural strength and heat conduction efficiency. In addition, the integral structure reduces the number of parts, simplifies the assembly process, and makes the wireless charging device 10 easier to assemble and install. Specifically, the support frame 22 and one end of the heat dissipation shell 20 naturally enclose each other to form a first receiving cavity 21, which is used to house the wireless charging component 50. The support frame 22 itself forms the bottom base of the first accommodating cavity 21. The size and shape of the first accommodating cavity 21 are adapted to the size and shape of the wireless charging component 50. This design not only ensures the stable installation of the wireless charging component 50, but also leaves reasonable space for heat dissipation of the coil 51 and the magnetic plate 52.

[0031] In some embodiments, the support frame 22 divides the cavity inside the heat dissipation shell 20 into two parts. Specifically, a second receiving cavity 23 is formed between the support frame 22 and the other end of the heat dissipation shell 20. The second receiving cavity 23 is located on the other side of the support frame 22 opposite to the first receiving cavity 21, forming an independent and regular installation space. The motherboard 30 is disposed in the second receiving cavity 23 and is fixedly connected to the support frame 22. The motherboard 30 can be connected to the shell through thermally conductive adhesive 60 or fasteners to effectively transfer heat to the heat dissipation shell 20 for heat dissipation, thereby transferring heat to the air. The partitioned structure of the first receiving cavity 21 and the second receiving cavity 23 achieves physical isolation between the wireless charging component 50 and the motherboard 30, ensuring the stability of signal transmission and optimizing the overall heat dissipation path. The size and shape of the second receiving cavity 23 are adapted to the size and shape of the motherboard 30. This design ensures the stable installation of the wireless charging component 50 and provides reasonable space for heat dissipation of the motherboard 30. The motherboard 30 and the wireless charging component 50 are not housed in the same cavity. This prevents the high-temperature gases in the cavity containing the wireless charging component 50 from directly affecting the motherboard 30, thus avoiding performance and lifespan degradation. Physical isolation between the wireless charging component 50 and the motherboard 30 ensures that the high-temperature gases in the cavity containing the wireless charging component 50 will not affect the motherboard 30, extending its lifespan and facilitating maintenance of the wireless charging device 10. To improve the stability of the motherboard 30 during installation, it can be bonded to the support frame 22 using thermally conductive adhesive 60. Epoxy resin-based thermally conductive adhesive 60 can be used, providing extremely high bonding strength and forming a rigid bond after curing. Silicone thermally conductive adhesive 60 can also be used, offering good temperature resistance and elasticity. Bonding the motherboard 30 to the support frame 22 increases the stability of the contact area between the motherboard 30 and the heat sink 20, improving heat dissipation efficiency.

[0032] See Figure 3The wireless charging device 10 also includes a bottom shell 70, which is fixedly connected to the heat dissipation shell 20. The bottom shell 70 is specifically installed at the bottom of the heat dissipation shell 20. The bottom shell 70 seals the second accommodating cavity 23, sealing its opening and forming a complete device shell structure. This makes the wireless charging device 10 a sealed structure, giving it excellent waterproof properties and preventing dust from entering, effectively preventing dust and improving its lifespan. The first accommodating cavity 21 and the second accommodating cavity 23 are connected, enabling natural air convection inside the wireless charging device 10, maintaining a balanced internal temperature, and improving heat dissipation efficiency. The connected structure also facilitates cable routing and signal transmission. The bottom shell 70 can be made of engineering plastics, such as PC (polycarbonate). A bottom shell 70 made of polycarbonate has advantages such as lightweight, good insulation, and strong impact resistance. The bottom shell 70 can also be made of metal, such as aluminum alloy or magnesium alloy die casting. The bottom shell 70 made of metal has excellent heat dissipation performance and high structural strength.

[0033] To ensure a more stable contact between the motherboard 30 and the heatsink housing 20, a support post 71 is provided on the bottom shell 70. The support post 71 abuts against the side of the motherboard 30 facing away from the support bracket 22. The support post 71 provides stable support and protection for the motherboard 30, effectively preventing the motherboard 30 from bending or deforming, buffering the impact of external shocks on the motherboard 30, and avoiding damage caused by transportation or drops. In addition, the support post 71 can also optimize heat dissipation, increase the contact area between the motherboard 30 and the bottom shell 70, and improve the heat dissipation efficiency of the main body.

[0034] In some embodiments, the outer peripheral wall of the heat dissipation shell 20 is provided with heat dissipation fins 24. Specifically, the heat dissipation fins 24 are evenly distributed along the peripheral wall of the shell to form a three-dimensional heat dissipation network. The heat dissipation fins 24 and the heat dissipation shell 20 adopt an integrated structure. The structure of the heat dissipation fins 24 can increase the contact area between the heat dissipation shell 20 and the outside environment, and improve the efficiency of dissipating heat into the air. The device temperature is effectively reduced through physical heat dissipation, ensuring a safe and stable charging process, and extending the service life of the device. In some embodiments, the wireless charging component 50 is clamped and fixed between the cover plate 40 and the bottom of the first accommodating cavity 21, which can improve the installation stability of the wireless charging component 50, and at the same time, it can also make the wireless charging component 50 more tightly connected to the heat dissipation shell 20, thereby improving the heat dissipation efficiency.

[0035] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A wireless charging device, characterized in that, The device includes a heat dissipation shell, a motherboard, a cover plate, and a wireless charging component. The heat dissipation shell is at least partially exposed in the wireless charging device. The heat dissipation shell is an integral structure, and a first accommodating cavity is formed in the heat dissipation shell. The wireless charging component is disposed in the first accommodating cavity. The motherboard is fixed to the heat dissipation shell and electrically connected to the wireless charging component. The cover plate is placed on the first accommodating cavity to close the first accommodating cavity. The wireless charging component is attached to the bottom of the first accommodating cavity.

2. The wireless charging device according to claim 1, characterized in that, The wireless charging assembly also includes a coil and a magnetic plate, the magnetic plate being connected to the bottom of the first accommodating cavity, the coil being connected to the magnetic plate and located on the side of the magnetic plate opposite to the bottom of the first accommodating cavity, and the main board being electrically connected to the coil.

3. The wireless charging device according to claim 2, characterized in that, The magnetic plate is bonded to the bottom of the first accommodating cavity with thermally conductive adhesive.

4. The wireless charging device according to claim 1, characterized in that, A support frame is formed inside the heat dissipation shell. The support frame is integrally formed with the heat dissipation shell. A first receiving cavity is formed between the support frame and one end of the heat dissipation shell. The support frame is the bottom of the first receiving cavity.

5. The wireless charging device according to claim 4, characterized in that, A second accommodating cavity is formed between the support frame and the other end of the heat dissipation shell. The motherboard is disposed in the second accommodating cavity and is fixedly connected to the support frame.

6. The wireless charging device according to claim 5, characterized in that, The motherboard is bonded to the support frame with thermally conductive adhesive.

7. The wireless charging device according to claim 5, characterized in that, It also includes a bottom shell, which is fixedly connected to the heat dissipation shell and seals the second accommodating cavity, and the first accommodating cavity is in communication with the second accommodating cavity.

8. The wireless charging device according to claim 7, characterized in that, The bottom shell is provided with a support column, which abuts against the side of the motherboard away from the support frame.

9. The wireless charging device according to claim 1, characterized in that, The outer peripheral wall of the heat dissipation shell is provided with heat dissipation fins.

10. The wireless charging device according to claim 1, characterized in that, The wireless charging component is clamped and fixed between the cover plate and the bottom of the first accommodating cavity.

Images