Driving integrated circuit integration structure for packaging power semiconductor

Abstract

The utility model discloses a driving integrated circuit integrated structure of a packaged power semiconductor, which comprises a packaged power semiconductor module, and at least three wiring terminals and signal pins are arranged on the packaged power semiconductor module at intervals. A driving circuit board is installed on the packaging power semiconductor module in a limiting mode, a limiting plate is arranged on the driving circuit board, a limiting notch and a limiting hole are formed in the limiting plate, the limiting hole is arranged on the insulating part of one wiring terminal in a sleeving mode, and the limiting notch is attached to the insulating part of the adjacent wiring terminal; the driving circuit board is provided with a bayonet connected with the signal pin; the driving circuit board is vertically connected with an isolation power supply board through pins; one wiring terminal of the packaging power semiconductor module is connected with a sampling rigid-flexible board and a power copper bar, and the sampling rigid-flexible board is conductively connected with the driving circuit board; the structure of the drive circuit board is optimized, and the drive circuit board can be conveniently and quickly disassembled and assembled under the condition of being shielded by the power copper bar.

Description

An integrated circuit structure for driving packaged power semiconductors Technical Field

[0001] This utility model relates to the field of circuit integration technology, and in particular to a driver integrated circuit structure for packaged power semiconductors. Background Technology

[0002] In use, 62mm packaged power semiconductor modules will lead out drive-related signals and sampling signals (IGBT collector or MOSFET drain) using a single wire connection and aggregate them onto the drive circuit board. This requires drilling holes in the copper busbars, insulating plates, and other structural components on the 62mm module to extract the soldered signal wires. This results in complex installation processes, high assembly difficulty, and the need for adapter board signals to be soldered through wires, with the signal wires also requiring insulation tubing to address insulation issues.

[0003] Because the copper busbar has a large area, it can obstruct the installation of the driver circuit board below, making it difficult to quickly disassemble and reassemble the driver circuit board when testing the connection. Summary of the Invention

[0004] (a) Technical issues

[0005] The purpose of this invention is to provide an integrated circuit structure for driving packaged power semiconductors, which solves the problem that driving circuit boards are not easy to quickly disassemble and assemble on packaged power semiconductor modules in the prior art.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] An integrated circuit structure for driving a packaged power semiconductor includes a packaged power semiconductor module. The packaged power semiconductor module has at least three terminals and signal pins spaced apart. A driving circuit board is mounted on the upper limit of the packaged power semiconductor module. The driving circuit board has a limiting plate with a limiting notch and a limiting hole. The limiting hole fits onto the insulating portion of one of the terminals, and the limiting notch fits onto the insulating portion of an adjacent terminal. The driving circuit board has a bayonet for connecting to the signal pins. An isolation power board is vertically connected to the driving circuit board via pins. A sampling rigid-flex board and a power copper busbar are connected to one terminal of the packaged power semiconductor module, and the sampling rigid-flex board is electrically connected to the driving circuit board.

[0009] Preferably, the drive circuit board is provided with a limiting plate, the limiting plate is provided with a limiting notch and a limiting hole, the limiting hole is sleeved on the insulating part of one of the terminals, and the limiting notch is attached to the insulating part of the adjacent terminal.

[0010] Preferably, the power copper busbar includes a cylindrical portion and a copper plate fixed on the cylindrical portion, and a fastener is sleeved on the cylindrical portion, passing through the sampling rigid-flexible plate and locked onto the terminal block.

[0011] Preferably, the drive circuit board integrates cable terminals.

[0012] Preferably, the packaged power semiconductor module has clearance notches at its four corners and mounting portions at the bottom of the clearance notches, with mounting holes provided on the mounting portions.

[0013] Preferably, the terminal block includes a square block protruding from the packaged power semiconductor module and a conductive portion embedded in the square block, the conductive portion being in communication with the internal devices of the packaged power semiconductor module; the square block is an insulating portion.

[0014] Preferably, the conductive part has a threaded hole.

[0015] (III) Beneficial Effects

[0016] By integrating at least three terminals and signal pins onto the packaged power semiconductor module, and after the power copper busbar has been installed, when testing the packaged power semiconductor module, the limiting hole on the limiting plate is fitted onto one of the terminals, while the limiting notch is closely fitted onto the adjacent terminal. Simultaneously, it is clipped onto the signal pin, enabling rapid positioning and installation of the entire drive circuit board on the packaged power semiconductor module without disassembling other assembled components. Furthermore, the flexible portion of the sampling rigid-flex board extends from the drive circuit board to the sampling terminal position. Because the drive circuit board is in a limited and fixed state, the flexible portion can naturally droop at the installation position, and can reliably connect even with tolerances, without causing stress on the drive circuit board.

[0017] Ultimately, this allows for convenient and quick assembly and disassembly of the drive circuit board even when it is obscured by the power copper busbar, improving space utilization and testing convenience. Attached Figure Description

[0018] Figure 1 is a first-view perspective three-dimensional structural diagram of an embodiment of the present invention;

[0019] Figure 2 is a second-view perspective three-dimensional structural diagram of an embodiment of the present invention;

[0020] Figure 3 is a schematic diagram of the integrated structure of the driving circuit board, the isolation power board and the sampling rigid-flex board in an embodiment of this utility model.

[0021] Figure 4 is a side view of the structure shown in Figure 3;

[0022] In Figures 1 to 4, the correspondence between component names or lines and the drawing numbers is as follows:

[0023] Packaged power semiconductor module 1, terminal block 2, square block 21, conductive part 22, threaded hole 23, signal pin 3, drive circuit board 4, limit plate 41, limit notch 42, limit hole 43, isolation power board 5, sampling rigid-flex board 6, power copper busbar 7, cylindrical part 71, copper plate 72, cable terminal 8, clearance notch 9, mounting part 10, mounting hole 11. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0025] Referring to Figures 1-4, an embodiment of this utility model proposes an integrated circuit structure for a packaged power semiconductor driver, including a packaged power semiconductor module 1. The packaged power semiconductor module 1 has at least three terminals 2 and signal pins 3 spaced apart. Both the terminals 2 and signal pins 3 protrude upwards. Each terminal 2 includes a square block 21 protruding from the packaged power semiconductor module 1 and a conductive portion 22 embedded within the square block 21. The conductive portion 22 communicates with internal devices of the packaged power semiconductor module 1, and the square block 21 is an insulating portion. The protruding terminals 2 enable a limiting connection to the driver circuit board 4. Specifically, the driver circuit board 4 is mounted on the packaged power semiconductor module 1 for limiting, and the driver circuit board 4 is electrically connected to the signal pins 3. An isolation power board 5 is vertically connected to the driver circuit board 4 via pins. The isolation power board 5 does not require additional fastening connections; it is directly fixed to the driver circuit board 4 via pins, thus forming an integrated circuit. Meanwhile, a sampling rigid-flex plate 6 and a power copper busbar 7 are connected to a terminal 2 of the packaged power semiconductor module 1. The sampling rigid-flex plate 6 is electrically connected to the drive circuit board 4, and the sampling rigid-flex plate 6 is connected to the drive circuit board 4 through pins. The flexible part of the sampling rigid-flex plate 6 extends from the drive circuit board 4 to the sampling terminal 2. Since the drive circuit board 4 is in a limited and fixed state, the flexible part can naturally fall to the installation position, and the flexible part can be used to adapt to the situation with the movement tolerance for reliable connection without causing the drive circuit board 4 to be subjected to force.

[0026] Generally, the power copper busbar 7 and the sampling rigid-flex plate 6 are fixed to the packaged power semiconductor module 1 with fasteners and do not need to be disassembled. The drive circuit board 4 can be quickly installed or removed from the packaged power semiconductor module 1 according to the test signal requirements. Specifically, the drive circuit board 4 is provided with a limiting plate 41, which has a limiting notch 42 and a limiting hole 43. The limiting hole 43 is fitted onto the insulating part of one of the terminals 2, and the limiting notch 42 fits against the insulating part of the adjacent terminal 2. At the same time, the drive circuit board 4 is also provided with a bayonet for connecting to the signal pin 3. Thus, the drive circuit board 4 can be positioned and installed on the packaged power semiconductor module 1 simultaneously through the limiting hole 43, the limiting notch 42, and the bayonet, so as not to be affected by the obstruction of the power copper busbar 7. It can be quickly and stably installed or removed, improving space utilization and facilitating the installation and removal of the drive circuit board 4 according to the signal test requirements.

[0027] The power copper busbar 7 includes a cylindrical part 71 and a copper plate 72 fixed on the cylindrical part 71. The cylindrical part 71 is fitted with a fastener that passes through the sampling rigid-flexible plate 6 and is locked onto the terminal 2. At the same time, a threaded hole 23 is opened on the conductive part 22. The fastener presses the sampling rigid-flexible plate 6 and the cylindrical part 71 onto the conductive part 22, thereby achieving fastening and conductive connection at this location.

[0028] Meanwhile, the drive circuit board 4 integrates a cable terminal 8, and the entire unit can be connected to the outside only by connecting the cable terminal 8.

[0029] The entire module unit is installed and fixed by a power packaged semiconductor module. At the four corners of the packaged power semiconductor module 1, there are clearance notches 9 and mounting parts 10 located at the bottom of the clearance notches 9. Mounting parts 10 are provided with mounting holes 11, through which fasteners are installed. The clearance notches 9 facilitate the operation of tools for locking fasteners.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An integrated circuit structure for driving a packaged power semiconductor, comprising a packaged power semiconductor module (1), wherein the packaged power semiconductor module (1) is provided with at least three terminals (2) and signal pins (3) spaced apart; characterized in that: The packaged power semiconductor module (1) is equipped with a drive circuit board (4) at the upper limit. The drive circuit board (4) is provided with a limiting plate (41). The limiting plate (41) is provided with a limiting notch (42) and a limiting hole (43). The limiting hole (43) is sleeved on the insulating part of one of the terminals (2). The limiting notch (42) is attached to the insulating part of the adjacent terminal (2). The drive circuit board (4) is provided with a bayonet for connecting to the signal pin (3). An isolation power board (5) is vertically connected to the drive circuit board (4) through a pin. A sampling rigid-flex plate (6) and a power copper busbar (7) are connected to one of the terminals (2) of the packaged power semiconductor module (1). The sampling rigid-flex plate (6) is electrically connected to the drive circuit board (4).

2. The integrated circuit structure for driving a packaged power semiconductor according to claim 1, characterized in that: The power copper busbar (7) includes a cylindrical part (71) and a copper plate (72) fixed on the cylindrical part (71). The cylindrical part (71) is fitted with fasteners that pass through the sampling rigid-flexible plate (6) and are locked on the terminal block (2).

3. The integrated circuit structure for driving a packaged power semiconductor according to claim 2, characterized in that: The drive circuit board (4) has integrated cable terminals (8).

4. The integrated circuit structure for driving a packaged power semiconductor according to claim 3, characterized in that: The packaged power semiconductor module (1) has clearance notches (9) at its four corners and mounting portions (10) at the bottom of the clearance notches (9), with mounting holes (11) provided on the mounting portions (10).

5. The integrated circuit structure for driving a packaged power semiconductor according to any one of claims 1-4, characterized in that: The terminal block (2) includes a square block (21) protruding from the packaged power semiconductor module (1) and a conductive part (22) embedded in the square block (21). The conductive part (22) is connected to the internal devices of the packaged power semiconductor module (1). The square block (21) is an insulating part.

6. The integrated circuit structure for driving a packaged power semiconductor according to claim 5, characterized in that: The conductive part (22) has a threaded hole (23).

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