Integrated circuit packaging, sorting and loading device

Abstract

The utility model discloses an integrated circuit packaging material picking and loading device, and relates to the technical field of integrated circuit packaging. The automatic feeding device comprises a workbench, one side of the top of the workbench is fixedly connected with a feeding mechanism, the rear end of the workbench is fixedly connected with a clamping mechanism, the other side of the workbench is fixedly connected with a receiving mechanism, and the feeding mechanism comprises a first air cylinder. The material trays are placed above the rotating frame, the stepping motor drives the gear to transmit and drive the rotating frame to rotate, the material trays completing material receiving can be transferred out in a rotating mode, meanwhile, the empty trays on the rotating frame on the other side are rotated to the material receiving portion, rapid switching of the material receiving trays is achieved, the material receiving efficiency is greatly improved, the equipment waiting time is shortened, and the material receiving efficiency is improved. Efficient and automatic operation of the whole process from feeding, clamping to material receiving is achieved in cooperation with the clamping mechanism, and the production requirements of the integrated circuit packaging industry for base film chip processing and rapid material receiving can be effectively met.

Description

Technical Field

[0001] This utility model belongs to the field of integrated circuit packaging technology, and in particular relates to an integrated circuit packaging picking and traying device. Background Technology

[0002] With the rapid development of electronic information technology, integrated circuits, as the core components of modern electronic devices, have a crucial impact on product quality and production efficiency due to the efficiency and precision of their packaging process. In the integrated circuit packaging process, picking and traying is an indispensable and important step.

[0003] Traditional manual picking and loading methods are not only inefficient and unable to meet the needs of large-scale production, but also prone to operational errors, which can damage integrated circuit components and affect product quality. At the same time, existing picking and loading equipment is unable to quickly pick up chips attached to the base film, often resulting in chip damage or inefficiency due to improper picking methods. Most equipment does not have the function of rotating the receiving device, and cannot achieve rapid switching between loaded and empty trays, making the receiving process cumbersome and affecting the overall production rhythm.

[0004] To address these issues, we provide an integrated circuit packaging picking and palletizing device. Utility Model Content

[0005] The purpose of this invention is to provide an integrated circuit packaging picking and traying device. Through the cooperation of the feeding mechanism, the clamping mechanism and the receiving mechanism, it solves the problem that the existing manual picking and traying method is difficult to meet the needs of large-scale production, and the existing picking and traying equipment is difficult to quickly pick up chips pasted on the base film.

[0006] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution.

[0007] This utility model relates to an integrated circuit packaging picking and palletizing device, comprising a worktable, a feeding mechanism fixedly connected to one side of the top of the worktable, a clamping mechanism fixedly connected to the rear end of the worktable, and a receiving mechanism fixedly connected to the other side of the worktable. The feeding mechanism includes a first cylinder, the bottom of which is fixedly connected to the worktable, and a feeding platform fixedly connected to one side of the first cylinder. The top of the feeding platform has a mounting groove, and vacuum suction cups are provided at the four corners of the inner cavity of the mounting groove. A recess is provided on one side of the top of the feeding platform, and a vacuum generator is fixedly connected to the inner cavity of the recess. The vacuum generator has one side connected to a vacuum suction cup via a conduit. The depth of the mounting groove is adapted to the thickness of the base film chip. Suction cup mounting holes are opened at the four corners of its inner cavity. The vacuum suction cup is embedded in the mounting hole and its adsorption surface is flush with the bottom surface of the mounting groove to ensure flat adsorption of the base film chip. The air inlet of the vacuum generator is connected to each vacuum suction cup via a flexible conduit. The feeding table is driven by the first cylinder to move linearly along the slide, which can transport the base film chip to the clamping station. The matching design of the mounting groove and the base film chip, combined with the vacuum suction cups distributed at the four corners, can achieve stable positioning and adsorption of the base film chip.

[0008] The present invention is further configured such that the gripping mechanism includes a rotary motor, one side of which is fixedly connected to the worktable, and the output end of the rotary motor is fixedly connected to a mounting base. A second cylinder is fixedly connected to one side of the top of the mounting base, and a drive motor is fixedly connected to the bottom of the second cylinder. A connecting arm is fixedly connected to the output end of the drive motor, and an adsorption plate is fixedly connected to one side of the connecting arm. The rotary motor enables 360° rotation, allowing the adsorption plate to flexibly switch between the feeding mechanism and the receiving mechanism, significantly improving the operating range. The second cylinder drives the adsorption plate to perform vertical lifting and lowering movements to ensure accurate chip gripping. The drive motor drives the connecting arm to rotate, adjusting the chip placement angle to meet different packaging requirements. The adsorption plate uses a vacuum adsorption principle to avoid damage to the chip caused by mechanical gripping, thereby improving the yield rate.

[0009] The present invention is further configured such that the receiving mechanism includes a housing, one side of which is fixedly connected to a worktable, a stepper motor is fixedly connected to the surface of the housing, a first gear is fixedly connected to the output end of the stepper motor, a rotating frame is provided through the inner cavity of the housing, a second gear is fixedly connected to the front end of the rotating frame, the second gear meshes with the first gear, and receiving platforms are movably connected to both sides of the rotating frame via rotating shafts. The stepper motor drives the rotating frame to rotate through gear transmission, realizing the alternating operation of the two receiving platforms. When one receiving platform is performing a tray loading operation, the other side can simultaneously perform empty tray replacement or full tray removal, greatly reducing waiting time. The receiving platform is movably connected to the rotating frame via rotating shafts, and the angle can be finely adjusted to adapt to the placement position of the adsorption tray, improving the tray loading accuracy.

[0010] The present invention is further configured such that support columns are fixedly connected to the four corners of the bottom of the workbench, and the support columns are symmetrically arranged. The support columns provide a stable support structure for the device. The symmetrical distribution design ensures that the workbench is subjected to uniform force, avoiding displacement or tilting caused by vibration or external force, thereby ensuring the stability and accuracy of the feeding, clamping and receiving processes.

[0011] The present invention is further configured such that a sliding groove is provided on one side of the top of the workbench, and the bottom of the feeding table is slidably connected to the sliding groove. The sliding groove is slidably connected to the bottom of the feeding table, which provides precise linear motion guidance for the feeding table and reduces lateral offset during the feeding process.

[0012] The present invention is further configured such that positioning holes are provided at the four corners of the top of the groove, the positioning holes are symmetrically arranged, and the positioning holes are connected to the outer cover plate, thereby sealing the groove and ensuring the protection of the vacuum generator.

[0013] The present invention is further configured such that each side of the rotating frame is provided with a movable shaft, one side of which is fixedly connected to the rotating frame. The movable shaft can install the rotating frame, and the rotating frame can always maintain a parallel state through the action of gravity, thus ensuring the stability of the rotating frame.

[0014] The present invention has the following beneficial effects.

[0015] 1. This utility model places the material tray above the rotating frame, and the stepper motor drives the gear transmission to rotate the rotating frame. The material tray that has been received can be rotated and moved out, while the empty tray on the other side of the rotating frame is rotated to the receiving position. This realizes the rapid switching of receiving trays, which greatly improves the receiving efficiency and reduces the equipment waiting time. Combined with the clamping mechanism, it realizes the efficient and automated operation of the whole process from feeding, clamping to receiving, which can effectively meet the production requirements of the integrated circuit packaging industry for base film chip processing and rapid receiving.

[0016] 2. This utility model, through the cooperation of a vacuum suction cup and a vacuum generator, can firmly fix the chip with the base film inside the mounting groove by vacuum adsorption, effectively preventing the chip from shifting or falling off during the feeding process, ensuring that the clamping mechanism can pick up the material quickly and stably, and greatly improving the material picking efficiency and accuracy. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0018] Figure 1 This is a perspective view of an integrated circuit packaging picking and traying device.

[0019] Figure 2 This is a perspective view of the feeding mechanism in an integrated circuit packaging picking and palletizing device.

[0020] Figure 3 This is a perspective view of the receiving mechanism in an integrated circuit packaging picking and palletizing device.

[0021] Figure 4 This is a rear perspective view of an integrated circuit packaging picking and traying device.

[0022] Figure 5 This is a perspective view of the gripping mechanism in an integrated circuit packaging picking and palletizing device.

[0023] In the attached diagram: 1. Workbench; 2. Feeding mechanism; 21. First cylinder; 22. Feeding platform; 23. Mounting slot; 24. Vacuum suction cup; 25. Groove; 26. Vacuum generator; 3. Clamping mechanism; 31. Rotary motor; 32. Mounting base; 33. Second cylinder; 34. Drive motor; 35. Connecting arm; 36. Adsorption plate; 4. Receiving mechanism; 41. Outer shell; 42. Stepper motor; 43. First gear; 44. Rotating frame; 45. Second gear; 46. Receiving platform; 5. Support column; 6. Slide groove; 7. Positioning hole. Detailed Implementation

[0024] The technical solutions of the present utility model will be described below with reference to the accompanying drawings. The described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0025] Example 1

[0026] Please see Figure 1-5 This utility model is an integrated circuit packaging picking and traying device, including a workbench 1. A feeding mechanism 2 is fixedly connected to one side of the top of the workbench 1, a clamping mechanism 3 is fixedly connected to the rear end of the workbench 1, and a receiving mechanism 4 is fixedly connected to the other side of the workbench 1. The feeding mechanism 2 includes a first cylinder 21. The bottom of the first cylinder 21 is fixedly connected to the workbench 1. A feeding platform 22 is fixedly connected to one side of the first cylinder 21. An installation groove 23 is opened on the top of the feeding platform 22. Vacuum suction cups 24 are opened at the four corners of the inner cavity of the installation groove 23. A groove 25 is opened on one side of the top of the feeding platform 22. A vacuum generator 26 is fixedly connected to the inner cavity of the groove 25. One side of the vacuum generator 26 is connected to the vacuum suction cup 24 through a conduit.

[0027] Specifically: the depth of the mounting groove 23 is adapted to the thickness of the base film chip, and suction cup mounting holes are opened at the four corners of its inner cavity. Vacuum suction cups 24 are embedded in the mounting holes and their adsorption surfaces are flush with the bottom surface of the mounting groove 23 to ensure flat adsorption of the base film chip. The air inlet of the vacuum generator 26 is connected to each vacuum suction cup 24 through a flexible conduit. The first cylinder 21 drives the feeding table 22 to move linearly along the slide 6, which can transport the base film chip to the clamping station. The adaptation design of the mounting groove 23 and the base film chip, combined with the vacuum suction cups 24 distributed at the four corners, can achieve stable positioning and adsorption of the base film chip.

[0028] Example 2

[0029] Please see Figure 1-5 Based on Embodiment 1, the clamping mechanism 3 includes a rotary motor 31, one side of which is fixedly connected to the worktable 1. A mounting base 32 is fixedly connected to the output end of the rotary motor 31. A second cylinder 33 is fixedly connected to one side of the top of the mounting base 32. A drive motor 34 is fixedly connected to the bottom of the second cylinder 33. A connecting arm 35 is fixedly connected to the output end of the drive motor 34. An adsorption plate 36 is fixedly connected to one side of the connecting arm 35. The receiving mechanism 4 includes a housing 41, one side of which is fixedly connected to the worktable 1. A stepper motor 42 is fixedly connected to the surface of the housing 41. A second cylinder 33 is fixedly connected to the output end of the stepper motor 42. A gear 43 is provided. A rotating frame 44 is provided through the inner cavity of the outer shell 41. A second gear 45 is fixedly connected to the front end of the rotating frame 44. The second gear 45 meshes with the first gear 43. A receiving platform 46 is movably connected to both sides of the rotating frame 44 through a rotating shaft. A support column 5 is fixedly connected to the four corners of the bottom of the workbench 1. The support columns 5 are symmetrically arranged. A sliding groove 6 is provided on one side of the top of the workbench 1. The bottom of the feeding platform 22 is slidably connected to the sliding groove 6. A positioning hole 7 is provided at the four corners of the top of the groove 25. The positioning holes 7 are symmetrically arranged. A movable shaft is provided on both sides of the rotating frame 44. One side of the movable shaft is fixedly connected to the rotating frame 44.

[0030] Specifically: A rotary motor 31 enables 360° rotation, allowing the adsorption plate 36 to flexibly switch between the feeding mechanism 2 and the receiving mechanism 4, significantly expanding the operating range. A second cylinder 33 drives the adsorption plate 36 to perform vertical lifting motion, ensuring precise chip gripping. A drive motor 34 rotates the connecting arm 35, adjusting the chip placement angle to meet different packaging requirements. The adsorption plate 36 uses a vacuum adsorption principle, avoiding damage to the chips from mechanical gripping and improving yield. A stepper motor 42 drives the rotating frame 44 to rotate via gear transmission, enabling alternating operation of the dual receiving platforms 46. While one receiving platform 46 is loading trays, the other side can simultaneously perform empty tray replacement or full tray removal, significantly reducing waiting time. The receiving platform 46 is movably connected to the rotating frame 44 via a rotating shaft. The angle can be finely adjusted to adapt to the placement position of the adsorption plate 36, improving the loading accuracy. The support column 5 provides a stable support structure for the device. The symmetrical distribution design ensures that the worktable 1 is subjected to uniform force, avoiding displacement or tilting caused by vibration or external force, thereby ensuring the stability and accuracy of the feeding, clamping and receiving processes. The slide 6 is slidably connected to the bottom of the feeding table 22, providing precise linear motion guidance for the feeding table 22 and reducing lateral offset during the feeding process. The positioning hole 7 is connected to the outer cover plate, which seals the groove 25 to ensure the protection of the vacuum generator 26. The movable shaft can install the rotating frame 44. The rotating frame 44 can always maintain a parallel state through gravity, ensuring the stability of the rotating frame 44.

[0031] The working principle of this utility model is as follows: the first cylinder 21 drives the feeding table 22 to move linearly along the slide groove 6 of the worktable 1, and transports the base film chip placed in the mounting groove 23 to the clamping station. The depth of the mounting groove 23 is adapted to the thickness of the chip. The vacuum generator 26 draws air from the four corner vacuum suction cups 24 through the flexible conduit, generating negative pressure to flatten and adsorb the chip in the mounting groove 23.

[0032] The rotary motor 31 drives the adsorption plate 36 to rotate above the feeding station. The second cylinder 33 drives the adsorption plate 36 to descend and contact the chip. After picking up the chip through vacuum adsorption, it rises. The rotary motor 31 drives the adsorption plate 36 to turn to the receiving mechanism 4. The drive motor 34 adjusts the chip placement angle through the connecting arm 35. After reaching the receiving station, the second cylinder 33 descends to the specified height, the adsorption plate 36 releases the vacuum, and places the chip in the tray on the receiving platform 46.

[0033] The stepper motor 42 drives the rotating frame 44 to rotate through the transmission of the first gear 43 and the second gear 45, so that the two receiving platforms 46 are alternately in the receiving position. When one receiving platform 46 receives the chip, the other side can be filled with a full tray or filled with an empty tray. The rotating frame 44 is installed through a movable shaft and uses gravity to keep it in a horizontal state, ensuring the stability of the receiving process.

[0034] The preferred embodiments of the present utility model disclosed above are only used to help illustrate the present utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the present utility model to the specific implementation methods described. The present specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the present utility model, so that those skilled in the art can better understand and utilize the present utility model.

Claims

1. An integrated circuit packaging picking and traying device, comprising a worktable (1), characterized in that: A feeding mechanism (2) is fixedly connected to one side of the top of the workbench (1), a clamping mechanism (3) is fixedly connected to the rear end of the workbench (1), and a receiving mechanism (4) is fixedly connected to the other side of the workbench (1). The feeding mechanism (2) includes a first cylinder (21), the bottom of which is fixedly connected to the worktable (1), and a feeding platform (22) is fixedly connected to one side of the first cylinder (21). The top of the feeding platform (22) is provided with an installation groove (23), and vacuum suction cups (24) are provided at the four corners of the inner cavity of the installation groove (23). A groove (25) is provided on one side of the top of the feeding platform (22), and a vacuum generator (26) is fixedly connected to the inner cavity of the groove (25). One side of the vacuum generator (26) is connected to the vacuum suction cup (24) through a conduit.

2. The integrated circuit packaging picking and palletizing device according to claim 1, characterized in that: The clamping mechanism (3) includes a rotary motor (31), one side of which is fixedly connected to the worktable (1). The output end of the rotary motor (31) is fixedly connected to a mounting base (32). A second cylinder (33) is fixedly connected to one side of the top of the mounting base (32). A drive motor (34) is fixedly connected to the bottom of the second cylinder (33). A connecting arm (35) is fixedly connected to the output end of the drive motor (34). An adsorption plate (36) is fixedly connected to one side of the connecting arm (35).

3. The integrated circuit packaging picking and palletizing device according to claim 1, characterized in that: The receiving mechanism (4) includes a housing (41), one side of which is fixedly connected to the workbench (1). A stepper motor (42) is fixedly connected to the surface of the housing (41). A first gear (43) is fixedly connected to the output end of the stepper motor (42). A rotating frame (44) is provided through the inner cavity of the housing (41). A second gear (45) is fixedly connected to the front end of the rotating frame (44). The second gear (45) meshes with the first gear (43). A receiving platform (46) is movably connected to both sides of the rotating frame (44) through a rotating shaft.

4. The integrated circuit packaging picking and palletizing device according to claim 1, characterized in that: The four corners of the bottom of the workbench (1) are fixedly connected to support columns (5), and the support columns (5) are arranged symmetrically.

5. The integrated circuit packaging picking and palletizing device according to claim 1, characterized in that: A chute (6) is provided on one side of the top of the workbench (1), and the bottom of the feeding table (22) is slidably connected to the chute (6).

6. The integrated circuit packaging picking and palletizing device according to claim 1, characterized in that: The four corners of the top of the groove (25) are provided with positioning holes (7), and the positioning holes (7) are symmetrically arranged.

7. The integrated circuit packaging picking and traying device according to claim 3, characterized in that: Both sides of the rotating frame (44) are provided with movable shafts, and one side of the movable shaft is fixedly connected to the rotating frame (44).

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