Testing device
By designing the adapter module and the driver module, the problem of drive circuit damage under extreme operating conditions of the test equipment was solved, and quick connection and troubleshooting of the driver module were realized, thereby improving the stability and efficiency of the test equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN YUANLICHUANG TECH CO LTD
- Filing Date
- 2025-05-13
- Publication Date
- 2026-05-05
AI Technical Summary
Existing testing equipment is prone to damage to the drive circuit under extreme operating conditions, making troubleshooting and replacement difficult.
The design employs an adapter module and a driver module, which, through the insertion and connection of gold fingers and gold finger connectors, enables quick connection and disconnection of the driver module and the adapter module, facilitating troubleshooting and replacement.
It improves the connection stability and durability of the drive module, simplifies the circuit layout, reduces electromagnetic interference, and improves testing efficiency and signal transmission quality.
Smart Images

Figure CN224203248U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor testing equipment technology, specifically a testing device. Background Technology
[0002] During the manufacturing process of power modules, testing equipment is required to test various performance parameters. Power modules often fail during extreme operating condition testing due to exceeding their limits, leading to damage to components in the drive circuit, or short circuits and open circuits. Because the drive circuit of the testing equipment is integrated on the same circuit board, troubleshooting and replacement are inconvenient when a drive circuit open circuit occurs. Utility Model Content
[0003] Therefore, it is necessary to provide a testing device that can facilitate troubleshooting and replacement of drive circuits to address the above problems.
[0004] A testing apparatus, comprising:
[0005] The feeding assembly is used to grip the power module to be tested and move it to the testing station; and
[0006] The test assembly includes a motion frame and an adapter module and a drive module mounted on the motion frame. The adapter module has a probe and a gold finger connector, and the drive module has gold fingers. The drive module is connected to the gold finger connector through the gold fingers.
[0007] The motion frame can be controlled to move the adapter module closer to or away from the test station, so that the adapter module can be connected to or disconnected from the power module located at the test station through the probe.
[0008] In some embodiments, the drive module includes a first drive module integrating an upper bridge arm drive circuit and a second drive module integrating a lower bridge arm drive circuit. Both the first drive module and the second drive module have a gold finger. The adapter module is provided with a gold finger connector that corresponds one-to-one with the first drive module and the second drive module.
[0009] The first driving module and the second driving module are respectively connected to the corresponding gold finger connector through their respective gold fingers.
[0010] In some embodiments, the drive modules are configured as three groups, each group including a first drive module and a second drive module.
[0011] In some embodiments, the test assembly further includes a control module and a wiring harness. The control module is mounted on the motion frame and has a first connection port, the drive module has a second connection port, one end of the wiring harness is plugged into the first connection port, and the other end of the wiring harness is plugged into the second connection port.
[0012] In some embodiments, the harness is a PWM harness.
[0013] In some embodiments, the test assembly further includes a magnetic ring fitted onto the wire harness.
[0014] In some embodiments, the adapter module includes an adapter circuit board mounted on the motion frame, the adapter circuit board having the probe on the side facing the power module located at the test station, and the adapter circuit board having the gold finger connector on the side facing away from the power module located at the test station.
[0015] In some embodiments, the adapter module further includes a reinforcing plate fixedly connected to the motion frame, and the adapter circuit board fixedly connected to the side of the reinforcing plate away from the power module, with the side of the adapter circuit board having the probe facing the reinforcing plate.
[0016] The reinforcing plate has positioning holes for the probe to pass through.
[0017] In some embodiments, the feeding assembly includes a conveying mechanism and a carrying mechanism mounted on the conveying mechanism. The conveying mechanism is used to drive the carrying mechanism to move along a first direction to the test station, and the carrying mechanism is used to grip the power module.
[0018] The support mechanism located at the test station is opposite to the adapter module in a second direction, and the first direction intersects the second direction; the motion frame can be moved controllably along the second direction and synchronously drive the adapter module closer to or away from the test station, so that the adapter module can be connected or disconnected from the power module located at the test station through the probe.
[0019] In some embodiments, multiple carrier mechanisms are provided, and the multiple carrier mechanisms are arranged in parallel and spaced apart from the conveying mechanism. The conveying mechanism is used to drive each carrier mechanism to pass through the test station in sequence.
[0020] In actual use, the aforementioned testing device first picks up the power module to be tested from the feeding assembly and moves it to the testing station. Then, the motion frame is controlled to move towards the power module at the testing station until the probe on the adapter module connects with the power module. At this point, the drive module, adapter module, and power module are connected. The drive module transmits signals to the adapter module, which then transmits signals to the power module, thereby achieving the effect of controlling the power module to perform testing.
[0021] Thus, the test component adopts a method that includes an adapter module and a driver module, and the driver module and the adapter module are connected by the plugging and mating of the gold fingers and the gold finger connector. This allows the driver module to be easily and quickly plugged into or removed from the adapter module, thereby facilitating the troubleshooting and replacement of the driver module. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the test device in one embodiment of this application;
[0023] Figure 2 for Figure 1 The diagram shows the structure of the adapter module and drive module of the test device.
[0024] Figure 3 for Figure 1 A schematic diagram of the adapter module and drive module of the test device shown from another perspective;
[0025] Figure 4 for Figure 1 The diagram shows the structure of the control module of the test device. Detailed Implementation
[0026] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0027] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0029] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0030] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0031] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0032] Please see Figures 1 to 4 As shown, this application provides a testing apparatus, including a feeding assembly 10 and a testing assembly 20. The feeding assembly 10 is used to grip the power module A to be tested and move the gripped power module A to the testing station. The testing assembly 20 includes a motion frame 21 and an adapter module 23 and a drive module 24 mounted on the motion frame 21. The adapter module 23 has probes 233 and gold finger connectors. The drive module 24 has gold fingers, and the drive module 24 is inserted into the gold finger connector of the adapter module 23 through the gold fingers. The motion frame 21 can controllably move the adapter module 23 closer to or further away from the testing station, so that the probes 233 of the adapter module 23 can connect or disconnect from the power module A located at the testing station.
[0033] In actual use, the aforementioned testing device first picks up the power module A to be tested from the feeding assembly 10 and moves it to the testing station. Then, the motion frame 21 is controlled to move towards the power module A at the testing station until the probe 233 on the adapter module 23 connects with the power module A at the testing station. At this time, the drive module 24, the adapter module 23, and the power module A are connected. The drive module 24 transmits signals to the adapter module 23, and the adapter module 23 then transmits signals to the power module A, thereby achieving the effect of controlling the power module A to perform testing.
[0034] Thus, the test component 20 adopts a configuration including an adapter module 23 and a driver module 24, and the driver module 24 is connected to the adapter module 23 by the insertion and connection of the gold fingers and the gold finger connector. This allows the driver module 24 to be easily and quickly plugged into or removed from the adapter module 23, thereby facilitating the troubleshooting and replacement of the driver module 24.
[0035] It should be noted that the contact area between the gold fingers and the gold finger connector is small, and the metal contacts are not easily contaminated or oxidized. They have better resistance to oxidation, corrosion, and wear. They are not prone to loosening or breakage under frequent plugging and unplugging or long-term use. They have high connection stability and durability, which helps to improve the service life of the adapter module 23 and the drive module 24, and also helps to improve the working efficiency and signal transmission quality of the device.
[0036] It should also be noted that testing materials of different specifications often requires different driving voltages and on / off resistance values. In this application, the driving module 24 is connected to the gold finger connector on the adapter module 23 via gold fingers. The installation and removal of the driving module 24 are simple and quick, which facilitates the adjustment of the voltage and on / off resistance value of the driving module 24, making the driving module 24 more compatible and saving testing time and costs.
[0037] In the embodiments of this application, the drive module 24 includes a first drive module 241 integrating an upper bridge arm drive circuit and a second drive module 243 integrating a lower bridge arm drive circuit. Both the first drive module 241 and the second drive module 243 have a gold finger. The adapter module 23 is provided with gold finger connectors corresponding one-to-one with the first drive module 241 and the second drive module 243. The first drive module 241 and the second drive module 243 respectively connect and cooperate with their respective gold fingers through the corresponding gold finger connectors. Thus, by integrating the upper bridge arm drive circuit and the lower bridge arm drive circuit of the drive circuit into the first drive module 241 and the second drive module 243 respectively, it is easier to locate the fault and replace the first drive module 241 or the second drive module 243 during testing. Furthermore, it allows the first drive module 241 and the second drive module 243 to use circuit boards with smaller board sizes, saving space and resulting in shorter drive loops, which helps reduce external electromagnetic interference. The switching speed of the power module A is also faster, the switching time is shorter, and the switching losses are reduced.
[0038] In a specific embodiment, the drive modules 24 are configured as three groups, each group of drive modules 24 including a first drive module 241 and a second drive module 243. The three groups of drive modules 24 correspond to the three-phase drive circuits, and the upper bridge arm drive circuit and the lower bridge arm drive circuit of each phase drive circuit are integrated into the first drive module 241 and the second drive module 243 of the corresponding group of drive modules 24.
[0039] In a specific embodiment, the test component 20 further includes a control module 27 and a wiring harness. The control module 27 is mounted on the motion frame 21 and has a first connection port 271. The drive module 24 has a second connection port. One end of the wiring harness is plugged into the first connection port 271, and the other end is plugged into the second connection port, thereby connecting the drive module 24 to the control module 27 via the wiring harness. Due to limited space for the control module 27 and the drive module 24, and to avoid mutual interference, in this embodiment, the control module 27 and the drive module 24 are arranged separately and connected using a wiring harness. This optimizes the spatial layout and prevents mutual interference between the control module 27 and the drive module 24 due to close proximity. Optionally, the wiring harness can be a PWM (Pulse Width Modulation) wiring harness.
[0040] Furthermore, the test assembly 20 also includes a magnetic ring fitted onto the wire harness, which can effectively prevent external factors from interfering with the signal transmission between the drive module 24 and the control module 27.
[0041] In the embodiments of this application, the adapter module 23 includes an adapter circuit board 231 mounted on the motion frame 21. The adapter circuit board 231 has probes 233 on the side facing the power module A at the test station. The adapter circuit board 231 has the aforementioned gold finger connector on the side facing away from the power module A at the test station. Thus, when the feeding assembly 10 moves the power module A to the test station, the drive module 24 is inserted into the gold finger connector on the side of the adapter circuit board 231 facing away from the power module A via gold fingers. The probes 233 are located on the side of the adapter circuit board 231 facing the power module A, so that when the motion frame 21 moves towards the power module A, it can cause the probes 233 on the adapter circuit board 231 to press against the power module A, thus connecting the adapter circuit board 231 to the power module A via the probes 233. After the test is completed, the motion frame 21 moves away from the power module A and resets, causing the probes 233 on the adapter circuit board 231 to separate from the power module A.
[0042] Furthermore, the adapter module 23 also includes a reinforcing plate 232, which is fixedly connected to the motion frame 21. The aforementioned adapter circuit board 231 is fixedly connected to the side of the reinforcing plate 232 facing away from the power module A located at the test station, and the side of the adapter circuit board 231 with the probe 233 faces the reinforcing plate 232. The reinforcing plate 232 has multiple positioning holes for the probe 233 to pass through. In this way, on the one hand, the adapter circuit board 231 is reinforced by the reinforcing plate 232, greatly reducing the risk of deformation or damage to the adapter circuit board 231; on the other hand, the multiple positioning holes on the reinforcing plate 232 are used to position each probe 233, thereby avoiding the phenomenon of positional displacement or breakage of the probe 233 after repeated use, ensuring that the probe 233 can accurately press against the power module A, and greatly extending the service life of the probe 233.
[0043] In embodiments of this application, the feeding assembly 10 includes a conveying mechanism and a carrying mechanism 11 mounted on the conveying mechanism. The conveying mechanism drives the carrying mechanism 11 to move along a first direction X1 to the test station. The carrying mechanism 11 is used to grip the power module A. The carrying mechanism 11 and the adapter module 23 located at the test station are opposite each other in a second direction X2, where the first direction X1 intersects the second direction X2. The motion frame 21 can be controllably moved along the second direction X2, and synchronously drives the adapter module 23 to move closer to or away from the test station, so that the adapter module 23 can be connected to or disconnected from the power module A located at the test station via the probe 233. Thus, in actual use, firstly, the power module A to be tested is placed on the carrier mechanism 11 and clamped and fixed by the carrier mechanism 11; then, the conveying mechanism transports the carrier mechanism 11 along the first direction X1 until it reaches the test station; then, the motion frame 21 moves along the second direction X2 towards the power module A located at the test station until the probe 233 on the adapter circuit board 231 is pressed onto the power module A, that is, the adapter circuit board 231 is connected to the power module A through the probe 233. At this time, the power module A is tested under the action of the drive module 24. After the test is completed, the motion frame 21 moves away from the power module A located at the test station along the second direction X2 and resets, so that the probe 233 is separated from the power module A. Then, the conveying mechanism continues to transport the carrier mechanism 11 downstream along the first direction X1, so that the carrier mechanism 11 carries the power module A that has completed the test away from the test station.
[0044] Preferably, the first direction X1 is perpendicular to the second direction X2. Specifically... Figure 1 In the embodiment shown, the first direction X1 is the front-back direction, and the second direction X2 is the up-down direction.
[0045] Furthermore, multiple carrier mechanisms 11 are configured, all of which are installed parallel to each other on the conveying mechanism, and each carrier mechanism 11 is used to grip the power module A. The conveying mechanism is used to drive each carrier mechanism 11 to pass through the test station in sequence, so that the power modules A on each carrier mechanism 11 pass through the test station in sequence for testing, thereby realizing the testing of batch power modules A and greatly improving the testing efficiency.
[0046] It should be noted that the conveying mechanism can be a belt conveyor, or other types of conveyor, as long as it can sequentially transport each carrier mechanism 11 to the testing station; no limitation is made here. The structure of the carrier mechanism 11 is also not limited here, as long as it can clamp the power module A.
[0047] Furthermore, the test assembly 20 also includes a lifting cylinder, the drive end of which is connected to the motion frame 21, enabling the lifting cylinder to drive the motion frame 21 to reciprocate along the second direction X2. Of course, in other embodiments, other linear drive modules 24 can also be used to drive the motion frame 21 to reciprocate along the second direction X2, as long as the probes 233 on the adapter circuit board 231 can be connected or disconnected from the power module A located at the test station, which is not limited here.
[0048] Furthermore, the test assembly 20 also includes a capacitor. This capacitor is mounted on the motion frame 21 to move along the second direction X2 with the motion frame 21. The capacitor has a capacitor busbar, through which it can be connected to the power module A located at the test station.
[0049] When power module A at the test station needs to be tested, the motion frame 21 moves along the second direction X2 towards power module A at the test station until the probe 233 on the adapter circuit board 231 is pressed against power module A at the test station. Simultaneously, the motion frame 21 also presses the capacitor busbar on the capacitor against power module A at the test station, thus connecting the adapter circuit board 231 to power module A via the probe 233, and connecting the capacitor to power module A via the capacitor busbar. At this time, the host computer can supply power to the control module 27 and the capacitor. Signals are transmitted between the control module 27 and the drive module 24 via a wiring harness, between the drive module 24 and the adapter module 23 via gold fingers and gold finger connectors, and between the adapter module 23 and power module A via the probe 233, thereby enabling the testing of power module A.
[0050] After the power module A at the test station completes the test, the motion frame 21 moves away from the power module A at the test station along the second direction X2 and resets, thereby causing the probe 233 on the adapter circuit board 231 to separate from the power module A, and at the same time causing the copper busbar on the capacitor to also separate from the power module A.
[0051] It should be noted that the capacitor is not limited to moving along the second direction X2 with the moving frame 21 to achieve connection or disconnection with the power module A. In other embodiments, the capacitor may also be driven by a cylinder to move along the second direction X2 to achieve connection or disconnection with the power module A, which is not limited here.
[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0053] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A testing device, characterized in that, include: The feeding assembly (10) is used to pick up the power module (A) to be tested and move it to the test station; and The test component (20) includes a motion frame (21) and an adapter module (23) and a drive module (24) mounted on the motion frame (21). The adapter module (23) has a probe (233) and a gold finger connector. The drive module (24) has a gold finger and is connected to the gold finger connector through the gold finger. The motion frame (21) can controllably move the adapter module (23) closer to or further away from the test station, so that the adapter module (23) can be connected or disconnected from the power module (A) located at the test station through the probe (233).
2. The testing apparatus according to claim 1, characterized in that, The drive module (24) includes a first drive module (241) integrating an upper bridge arm drive circuit and a second drive module (243) integrating a lower bridge arm drive circuit. Both the first drive module (241) and the second drive module (243) have a gold finger. The adapter module (23) is provided with a gold finger connector that corresponds one-to-one with the first drive module (241) and the second drive module (243). The first driving module (241) and the second driving module (243) are respectively connected to the corresponding gold finger connector through their respective gold fingers.
3. The testing apparatus according to claim 2, characterized in that, The drive module (24) is configured in three groups, each group of the drive module (24) including a first drive module (241) and a second drive module (243).
4. The testing apparatus according to claim 1, characterized in that, The test component (20) also includes a control module (27) and a wiring harness. The control module (27) is mounted on the motion frame (21) and has a first connection port (271). The drive module (24) has a second connection port. One end of the wiring harness is plugged into the first connection port (271), and the other end of the wiring harness is plugged into the second connection port.
5. The testing apparatus according to claim 4, characterized in that, The wiring harness is a PWM wiring harness.
6. The testing apparatus according to claim 4, characterized in that, The test assembly (20) also includes a magnetic ring fitted onto the wire harness.
7. The testing apparatus according to claim 1, characterized in that, The adapter module (23) includes an adapter circuit board (231) mounted on the motion frame (21). The adapter circuit board (231) has the probe (233) on the side facing the power module (A) located at the test station, and the adapter circuit board (231) has the gold finger connector on the side away from the power module (A) located at the test station.
8. The testing apparatus according to claim 7, characterized in that, The adapter module (23) further includes a reinforcing plate (232), which is fixedly connected to the motion frame (21). The adapter circuit board (231) is fixedly connected to the side of the reinforcing plate (232) away from the power module (A), and the side of the adapter circuit board (231) with the probe (233) is arranged facing the reinforcing plate (232). The reinforcing plate (232) has a positioning hole for the probe (233) to pass through.
9. The testing apparatus according to claim 1, characterized in that, The feeding assembly (10) includes a conveying mechanism and a carrying mechanism (11) mounted on the conveying mechanism. The conveying mechanism is used to drive the carrying mechanism (11) to move along a first direction (X1) to the test station. The carrying mechanism (11) is used to clamp the power module (A). The support mechanism (11) located at the test station is opposite to the adapter module (23) in the second direction (X2), and the first direction (X1) intersects with the second direction (X2); the motion frame (21) can be controlled to move along the second direction (X2) and synchronously drive the adapter module (23) to move closer to or away from the test station, so that the adapter module (23) can be connected or separated from the power module (A) located at the test station through the probe (233).
10. The testing apparatus according to claim 9, characterized in that, The carrying mechanism (11) is configured as a plurality of them, and the plurality of carrying mechanisms (11) are arranged in parallel and spaced apart on the conveying mechanism. The conveying mechanism is used to drive each of the carrying mechanisms (11) to pass through the test station in sequence.