Sonar and receiving module applied to sonar

Abstract

The utility model discloses a sonar and a receiving module applied to the sonar, the receiving module comprises at least two circuit board assemblies which are superposed along the height direction, each circuit board assembly comprises a bottom cover and at least one circuit board, the bottom cover is provided with at least one board slot, and the board slot is provided with at least one circuit board. The circuit board is locked on the bottom cover and accommodated in the board groove, and the bottom cover of the upper circuit board assembly seals the groove opening of the board groove of the bottom cover of the lower circuit board assembly. The heat dissipation boss of the bottom cover of one circuit board assembly located on the upper portion protrudes towards the chip of the circuit board of one circuit board assembly located on the lower portion.

Description

Technical Field

[0001] This utility model relates to a sonar, and more particularly to a sonar and a receiving module applied to the sonar. Background Technology

[0002] Sonar is a core product for ocean exploration. It consists of a receiving compartment and a transmitting compartment. During operation, the transmitting transducer in the transmitting compartment emits sound wave signals with specific frequency, power, and waveform. The receiving transducer in the receiving compartment receives the reflected sound wave signals, which are then processed by the receiving module to detect underwater targets. In Chinese invention patent application CN118604791A, the inventors disclosed a sonar whose receiving compartment consists of a receiving compartment body and a receiving module housed in a receiving cavity within the receiving compartment body. The receiving module includes a bottom cover, a first receiving module circuit board, a first copper tube, a partition, a second receiving module circuit board, a second copper tube, and a top cover. These components are installed together according to a design scheme. The existing receiving module uses a first copper pipe and a second copper pipe to dissipate heat from the chips on the first receiving module circuit board and the chips on the second receiving module circuit board. This not only makes the structure of the receiving module more complex and the assembly cost higher, but also results in a larger overall size of the receiving module because space needs to be reserved for the first copper pipe and the second copper pipe, which is not conducive to the miniaturization of sonar. Utility Model Content

[0003] One object of this invention is to provide a sonar and a receiving module for sonar, wherein the receiving module does not require the use of copper pipes for heat dissipation, and therefore, compared with the receiving modules of the prior art, the receiving module of this invention can have a smaller size and lower cost.

[0004] One object of this invention is to provide a sonar and a receiving module for sonar, wherein the receiving module allows a heat dissipation protrusion of the bottom cover of the upper circuit board assembly to protrude toward the chip of the circuit board of the lower circuit board assembly, and the heat generated by the chip during operation can be quickly dissipated through the bottom cover, thereby eliminating the need for copper pipes for heat dissipation in the receiving module of this invention.

[0005] One objective of this invention is to provide a sonar and a receiving module for sonar, wherein the heat dissipation protrusion of the upper bottom cover can be recessed into the plate groove of the lower bottom cover, so that the heat dissipation protrusion of the upper bottom cover can be closer to the chip of the lower circuit board, thereby improving the heat dissipation effect of the receiving module.

[0006] According to one aspect of the present invention, a receiving module for sonar is provided, comprising at least two circuit board assemblies stacked along a height direction. Each circuit board assembly includes a bottom cover and at least one circuit board. The bottom cover has at least one slot, and the circuit board is locked to the bottom cover and received in the slot. The bottom cover of the upper circuit board assembly closes the slot of the bottom cover of the lower circuit board assembly, and a heat dissipation protrusion of the bottom cover of the upper circuit board assembly protrudes toward the chip of the circuit board of the lower circuit board assembly.

[0007] According to one embodiment of the present invention, the heat dissipation boss of the bottom cover of the upper circuit board assembly extends into the plate groove of the bottom cover of the lower circuit board assembly.

[0008] According to one embodiment of the present invention, the bottom cover has two plate slots, which are arranged side by side along the length of the bottom cover. Correspondingly, the circuit board assembly includes two circuit boards, each of which is respectively housed in a plate slot of the bottom cover.

[0009] According to one embodiment of the present invention, the heat dissipation protrusion of the bottom cover extends along the length direction of the bottom cover, wherein the bottom cover has a relief groove that connects two plate grooves and the relief groove is used to avoid the heat dissipation protrusion of the upper bottom cover.

[0010] According to one embodiment of the present invention, the bottom cover has a notch at each of its opposite ends, and each notch is connected to each of the plate grooves, wherein the opposite ends of the heat dissipation protrusion of the upper bottom cover extend to each of the notches of the lower bottom cover.

[0011] According to one embodiment of the present invention, thermal grease is provided between the heat dissipation protrusion of the bottom cover and the chip of the circuit board.

[0012] According to one embodiment of the present invention, thermal grease is provided between the heat dissipation protrusion of the bottom cover and the chip of the circuit board, and thermal grease is provided between the heat dissipation protrusion of the upper bottom cover and the lower bottom cover.

[0013] According to one embodiment of the present invention, each of the circuit board assemblies has a pin hole at each of its opposite ends of the bottom cover, wherein the receiving module includes two positioning pins, one of which is inserted into the pin hole at one end of the bottom cover, and the other of which is inserted into the pin hole at the other end of the bottom cover.

[0014] According to one embodiment of the present invention, the receiving module includes four circuit board assemblies. The bottom covers of the three upper circuit board assemblies each have at least one screw through hole at each opposite end. The bottom plate of the lowermost circuit board assembly each has at least one threaded hole at each opposite end. The receiving module includes at least two screws. One end of each screw passes through the screw through holes of the bottom covers of the three upper circuit board assemblies in sequence and extends to the threaded hole of the bottom plate of the lowermost circuit board assembly. The screws are screwed onto the bottom covers.

[0015] According to another aspect of the present invention, the present invention further provides a sonar comprising a launch chamber and a receiver chamber, wherein the receiver chamber comprises a receiver housing and a receiver module, the receiver housing having a receiving cavity, the receiver module being housed in the receiving cavity of the receiver housing, the receiver housing being mounted on the launch chamber, wherein the receiver module further comprises at least two circuit board assemblies stacked along the height direction, each circuit board assembly comprising a bottom cover and at least one circuit board, the bottom cover having at least one slot, the circuit board being locked to the bottom cover and housed in the slot, wherein the bottom cover of the upper circuit board assembly closes the slot opening of the bottom cover of the lower circuit board assembly, and a heat dissipation protrusion of the bottom cover of the upper circuit board assembly protrudes toward the chip of the circuit board of the lower circuit board assembly. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of a sonar according to a preferred embodiment of the present invention.

[0017] Figure 2 This is an exploded view of the sonar according to the above-described preferred embodiment of the present invention.

[0018] Figure 3 This is a perspective view of a receiving module of a receiving compartment of the sonar according to the above-described preferred embodiment of the present invention.

[0019] Figure 4 This is a perspective view of the receiving module of the receiving compartment of the sonar according to the above-described preferred embodiment of the present invention.

[0020] Figure 5 This is a three-dimensional cross-sectional view of the receiving module of the receiving cabin of the sonar according to the above-described preferred embodiment of the present invention.

[0021] Figure 6 yes Figure 5A magnified view of a local location.

[0022] Figure 7 This is a cross-sectional view of a position of the receiving module of the receiving compartment of the sonar according to the above-described preferred embodiment of the present invention.

[0023] Figure 8 yes Figure 7 A magnified view of a local location.

[0024] Figure 9 This is a cross-sectional view from a plan view of another position of the receiving module of the receiving compartment of the sonar according to the above-described preferred embodiment of the present invention.

[0025] Figure 10 This is an exploded view of the receiving module of the receiving compartment of the sonar according to the above-described preferred embodiment of the present invention.

[0026] Figure 11 This is an exploded view of the receiving module of the receiving compartment of the sonar according to the above-described preferred embodiment of the present invention.

[0027] Figure 12 This is an exploded view of a circuit board assembly of the receiving module of the sonar receiving cabin according to the above-described preferred embodiment of the present invention.

[0028] Figure 13 This is an exploded view of the circuit board assembly of the receiving module of the sonar receiving cabin according to the above-described preferred embodiment of the present invention. Detailed Implementation

[0029] Before describing any embodiment of this invention in detail, it should be understood that the invention is not limited in its application to the details of the construction and arrangement of the components set forth in the following description or illustrated in the following figures. The invention can have other embodiments and can be practiced or carried out in various ways. Furthermore, it should be understood that the wording and terminology used herein are for descriptive purposes and should not be considered limiting. The use of “comprising,” or “having,” and variations thereof is intended to cover the items set forth below and their equivalents, as well as any additional items. Unless otherwise specified or limited, the terms “installation,” “connection,” “support,” and “linkage,” and variations thereof are used broadly and cover both direct and indirect installation, connection, support, and linking. Moreover, “connection” and “linkage” are not limited to physical or mechanical connections or links.

[0030] Furthermore, firstly, in the disclosure of this utility model, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as a limitation on this utility model. Secondly, the term "a" should be understood as "at least one" or "one or more," that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. The term "a" should not be construed as a limitation on the quantity.

[0031] Refer to the description attached to this utility model. Figures 1 to 13 A preferred embodiment of the sonar according to the present invention will be disclosed and described in the following description, wherein the sonar includes a receiving chamber 10 and a transmitting chamber 20. The receiving chamber 10 includes a receiving body 11 and a receiving module 12. The receiving body 11 has a receiving cavity 111. The receiving module 12 is mounted on the receiving body 11 and housed in the receiving cavity 111. The receiving body 11 is mounted on the transmitting chamber 20, and the transmitting chamber 20 closes the opening of the receiving cavity 111 of the receiving body 11, thereby holding the receiving module 12 in a sealed space. In other words, the receiving module 12 is hidden between the receiving body 11 and the transmitting chamber 20.

[0032] Appendix Figures 3 to 13 The specific structure of the receiving module 12 is shown, wherein the receiving module 12 includes at least two circuit board assemblies 121, which are stacked along the height direction.

[0033] Specifically, each of the circuit board assemblies 121 includes a bottom cover 1211 and at least one circuit board 1212. The bottom cover 1211 has a board groove 12111, and the circuit board 1212 is locked to the bottom cover 1211 in such a way that the circuit board 1212 is received in the board groove 12111. For example, a set of screws can be used to lock the circuit board 1212 to the bottom cover 1211.

[0034] It is understood that at least one side of the circuit board 1212 is fitted with electronic components, such as chips 12121, resistors, capacitors, etc. In this invention, the depth of the slot 12111 of the bottom cover 1211 can be greater than the thickness of the circuit board 1212, so that the circuit board 1212 can be entirely housed within the slot 12111 of the bottom cover 1211. It is worth noting that the number of chips 12121 on the circuit board 1212 is not limited in the sonar of this invention; it is selected according to the actual needs of the receiving module 12. For example, in this specific example of the sonar of this invention, the circuit board 1212 has three chips 12121, which are arranged at intervals.

[0035] Reference Appendix Figure 9 , Figure 10 and Figure 12 The bottom cover 1211 has at least one terminal receiving slot 12112, which is connected to the plate slot 12111. The circuit board 1212 has a wiring terminal 12122, which extends to the terminal receiving slot 12112 of the bottom cover 1211 to facilitate the connection of the receiving module 12 and the receiving transducer of the receiving compartment 10.

[0036] It is understood that, since these circuit board assemblies 121 are stacked along the height direction, in two adjacent circuit board assemblies 121, one circuit board assembly 121 is located below and the other circuit board assembly 121 is located above.

[0037] In this specific example of the sonar of the present invention, the bottom cover 1211 of the upper circuit board assembly 121 closes the slot 12111 of the bottom cover 1211 of the lower circuit board assembly 121, so that the circuit board 1212 of the lower circuit board assembly 121 is hidden between the two stacked bottom covers 1211, and the two bottom covers 1211 cooperate with each other to protect the circuit board 1212.

[0038] It is worth mentioning that the material of the bottom cover 1211 is not limited in this specific example of the sonar of this utility model; for example, in the attached... Figures 1 to 13 In this specific example of the sonar of the present invention shown, the bottom cover 1211 is made of aluminum alloy, thus giving it the characteristics of high strength, light weight, and good heat dissipation. It is understood that in embodiments where the bottom cover 1211 is made of aluminum alloy, the processing technology for the bottom cover 1211 can be milling.

[0039] Reference Appendix Figure 5 , Figures 7 to 10 The bottom cover 1211 of the upper circuit board assembly 121 has at least one heat dissipation protrusion 12113, which protrudes toward the chip 12121 of the circuit board 1212 of the lower circuit board assembly 121. The heat generated by the chip 12121 of the circuit board 1212 during operation can be quickly conducted to the upper bottom cover 1211 through the heat dissipation protrusion 12113, and then quickly dissipated through the upper bottom cover 1211, thereby improving the heat dissipation efficiency of the receiving module 12. Compared with existing sonar technologies, in this specific example of the sonar of this invention, the receiving module 12 does not need to be configured with copper pipes. Instead, the heat dissipation protrusion 12113 is provided on the side of the bottom cover 1211 opposite to the plate groove 12111. This not only reduces the assembly steps and cost of the receiving module 12, but also allows for a more compact structure of the receiving module 12, which is beneficial for miniaturization and weight reduction, and further contributes to the miniaturization and weight reduction of the sonar.

[0040] For example, in the appendix Figures 1 to 13In this specific example of the sonar of the present invention shown, the receiving module 12 includes four circuit board assemblies 121, which, from bottom to top, are a first circuit board assembly 121a, a second circuit board assembly 121b, a third circuit board assembly 121c, and a fourth circuit board assembly 121d. The bottom cover 1211 of the second circuit board assembly 121b is stacked on top of the bottom cover 1211 of the first circuit board assembly 121a, and the circuit board 1212 of the first circuit board assembly 121a is hidden between the bottom cover 1211 of the second circuit board assembly 121b and the bottom cover 1211 of the first circuit board assembly 121a. The heat dissipation protrusion 12113 of the bottom cover 1211 of the second circuit board assembly 121b protrudes toward the chip 12121 of the circuit board 1212 of the first circuit board assembly 121a. The third circuit board assembly 121b... The bottom cover 1211 of 21c is stacked on top of the bottom cover 1211 of the second circuit board assembly 121b, and the circuit board 1212 of the second circuit board assembly 121b is hidden between the bottom cover 1211 of the third circuit board assembly 121c and the bottom cover 1211 of the second circuit board assembly 121b. The heat dissipation boss 12113 of the bottom cover 1211 of the third circuit board assembly 121c protrudes toward the chip 12121 of the circuit board 1212 of the second circuit board assembly 121b. The bottom cover 1211 of the fourth circuit board assembly 121d is stacked on top of the bottom cover 1211 of the third circuit board assembly 121c, and the circuit board 1212 of the third circuit board assembly 121c is hidden between the bottom cover 1211 of the fourth circuit board assembly 121d and the bottom cover 1211 of the third circuit board assembly 121c. The heat dissipation boss 12113 of the bottom cover 1211 of the fourth circuit board assembly 121d protrudes toward the chip 12121 of the circuit board 1212 of the third circuit board assembly 121c.

[0041] In this specific example of the sonar of this utility model, the width of the heat dissipation protrusion 12113 of the bottom cover 1211 of the upper circuit board assembly 121 is greater than the gap between two adjacent chips 12121 of the circuit board 1212 of the lower circuit board assembly 121. Thus, the heat dissipation protrusion 12113 of the bottom cover 1211 of the upper circuit board assembly 121 and the two adjacent chips 12121 of the circuit board 1212 of the lower circuit board assembly 121 have overlapping portions in the height direction, so as to ensure the heat dissipation capability of the receiving module 12.

[0042] Optionally, in other specific examples of the sonar of this utility model, the bottom cover 1211 may also be provided with two or more heat dissipation protrusions 12113.

[0043] Further, the bottom cover 1211 of the first circuit board assembly 121a has at least one threaded hole 121101 at each opposite end; the bottom cover 1211 of the second circuit board assembly 121b, the bottom cover 1211 of the third circuit board assembly 121c, and the bottom cover 1211 of the fourth circuit board assembly 121d each have at least one screw through hole 121102; the threaded hole 121101 of the bottom cover 1211 of the first circuit board assembly 121a, the screw through hole 121102 of the bottom cover 1211 of the second circuit board assembly 121b, the screw through hole 121102 of the bottom cover 1211 of the third circuit board assembly 121c, and the screw through hole 121102 of the bottom cover 1211 of the fourth circuit board assembly 121d... The screw through holes 121102 of the bottom cover 1211 correspond in the height direction. The receiving module 12 further includes at least two screws 122. One end of the screw 122 passes through the screw through holes 121102 of the bottom cover 1211 of the fourth circuit board assembly 121d, the third circuit board assembly 121c, and the second circuit board assembly 121b in sequence, and then extends to the threaded hole 121101 of the bottom cover 1211 of the first circuit board assembly 121a. The screw 122 is screwed into the bottom cover 1211 of the first circuit board assembly 121a, so that the four circuit board assemblies 121 are reliably installed.

[0044] Specifically, the bottom cover 1211 of the first circuit board assembly 121a has two threaded holes 121101 at opposite ends, and the bottom cover 1211 of the second circuit board assembly 121b, the third circuit board assembly 121c, and the fourth circuit board assembly 121d has two screw holes 121102 at opposite ends. In this way, the plurality of screws 122 can reliably install the first circuit board assembly 121a, the second circuit board assembly 121b, the third circuit board assembly 121c, and the fourth circuit board assembly 121d.

[0045] Preferably, the bottom cover 1211 of the first circuit board assembly 121a is further provided with two threaded holes 121101 in the middle. Correspondingly, the bottom cover 1211 of the second circuit board assembly 121b, the third circuit board assembly 121c, and the fourth circuit board assembly 121d is further provided with two screw through holes 121102 in the middle. In this way, the screws 122 can reliably install the first circuit board assembly 121a, the second circuit board assembly 121b, the third circuit board assembly 121c, and the fourth circuit board assembly 121d.

[0046] Preferably, the heat dissipation protrusion 12113 of the bottom cover 1211 of the upper circuit board assembly 121 extends into the board groove 12111 of the bottom cover 1211 of the lower circuit board assembly 121. This allows for a closer distance between the heat dissipation protrusion 12113 of the upper bottom cover 1211 and the chip 12121 of the lower circuit board 1212, even to the point where the heat dissipation protrusion 12113 of the upper bottom cover 1211 can be in contact with the chip 12121 of the lower circuit board 1212. This facilitates rapid heat conduction from the chip 12121 of the lower circuit board 1212 during operation to the upper bottom cover 1211, thereby improving the heat dissipation efficiency of the receiving module 12. Preferably, thermal grease is applied between the heat dissipation protrusion 12113 of the upper bottom cover 1211 and the chip 12121 of the lower circuit board 1212.

[0047] Reference Appendix Figures 10 to 13 Each of the circuit board assemblies 121 includes two circuit boards 1212. Correspondingly, each of the bottom covers 1211 has two slots 12111. The two slots 12111 are arranged side by side along the length of the bottom cover 1211, and each slot 12111 of the bottom cover 1211 houses one circuit board 1212. It is understood that the number of terminal receiving slots 12112 of the bottom cover 1211 is also two, with each terminal receiving slot 12112 corresponding to one of the two slots 12111. Thus, the wiring terminals 12122 of each circuit board 1212 can independently extend to each of the terminal receiving slots 12112 of the bottom cover 1211. Optionally, in other examples of the sonar of this invention, the number of circuit boards 1212 may exceed two, and correspondingly, the number of slots 12111 of the bottom cover 1211 may also exceed two.

[0048] Reference Appendix Figure 5 , Figure 7 , Figures 10 to 13The bottom cover 1211 below has a clearance groove 12114, which is located between two adjacent plate grooves 12111 and connects the two adjacent plate grooves 12111. The heat dissipation protrusion 12113 of the upper bottom cover 1211 extends along the length of the bottom cover 1211, and the clearance groove 12114 of the lower bottom cover 1211 is used to avoid the heat dissipation protrusion 12113 of the upper bottom cover 1211. In this way, the heat dissipation protrusion 12113 of the upper bottom cover 1211 can extend into the plate groove 12111 of the lower bottom cover 1211, so that the distance between the heat dissipation protrusion 12113 of the upper bottom cover 1211 and the chip 12121 of the lower circuit board 1212 can be closer, and even the heat dissipation protrusion 12113 of the upper bottom cover 1211 can fit against the chip 12121 of the lower circuit board 1212. In other words, the heat generated by the chips 12121 of the two circuit boards 1212 of the lower circuit board assembly 121 during operation can be conducted to the heat dissipation protrusion 12113 of the bottom cover 1211 of the upper circuit board assembly 121.

[0049] Furthermore, each of the opposite ends of the bottom cover 1211 has a notch 12115, and each notch 12115 is connected to each of the plate grooves 12111. The opposite ends of the heat dissipation protrusions 12113 of the upper bottom cover 1211 extend to each of the notches 12115 of the lower bottom cover 1211. In this way, the heat conducted to the heat dissipation protrusions 12113 of the upper bottom cover 1211 can be laterally conducted to the lower bottom cover 1211, which helps to improve the heat dissipation capacity of the receiving module 12. Preferably, thermal grease is provided between the heat dissipation protrusions 12113 of the upper bottom cover 1211 and the lower bottom cover 1211.

[0050] Reference Appendix Figure 5 , Figure 6 , Figure 10 and Figure 11Each of the circuit board assemblies 121 has a pin hole 12116 at each opposite end of its bottom cover 1211. The receiving module 12 further includes two positioning pins 123. One positioning pin 123 is inserted into the pin hole 12116 at one end of each of the bottom covers 1211, and the other positioning pin 123 is inserted into the pin hole 12116 at the other end of each of the bottom covers 121. Thus, the two positioning pins 123 can prevent the bottom covers 121 from misaligning. Preferably, the positioning pins 123 are screwed onto the bottom cover 1211 of the first circuit board assembly 121a to prevent the positioning pins 123 from falling out, thereby ensuring that the positioning pins 123 are reliably inserted into the pin holes 12116 of each of the bottom covers 121. That is, the end of the positioning pin 123 has an external thread, and the pin hole 12116 of the bottom cover 1211 of the first circuit board assembly 121a has an internal thread, so that the positioning pin 122 can be screwed onto the bottom cover 1211 of the first circuit board assembly 121a.

[0051] The assembly process of the receiving module 12 of this utility model can be as follows:

[0052] S1, assemble four circuit board assemblies 121. Specifically, lock the circuit board 1212 to the bottom cover 1211 in such a way that the circuit board 1212 is received in the board groove 12111 of the bottom cover 1211 to assemble the circuit board assembly 121. At this time, the wiring terminals 12122 of the circuit board 1212 extend to the terminal receiving groove 12112 of the bottom cover 1211.

[0053] S2, screw one end of each of the two positioning pins 123 into the pin hole 12116 of the bottom cover 1211 of the first circuit board assembly 121a;

[0054] S3, apply thermal grease to the notch 12115 of the bottom cover 1211 of the first circuit board assembly 121a and the chip 12121 of the circuit board 1212. Then, stack the bottom cover 1211 of the second circuit board assembly 121b on top of the bottom cover 1211 of the first circuit board assembly 121a by inserting the positioning pin 123 into the pin hole 12116 of the bottom cover 1211. At this time, on the one hand, the heat dissipation protrusion 1 of the bottom cover 1211 of the second circuit board assembly 121b... 2113 sinks into the slot 12111 of the bottom cover 1211 of the first circuit board assembly 121a, such that the middle part and the opposite ends of the heat dissipation boss 12113 of the upper bottom cover 1211 are respectively located in the clearance groove 12114 and the notch 12115 of the lower bottom cover 1211. On the other hand, the screw through hole 121102 of the bottom cover 1211 of the second circuit board assembly 121b corresponds to the threaded hole 121101 of the bottom cover 1211 of the first circuit board assembly 121a.

[0055] S4, apply thermal grease to the notch 12115 of the bottom cover 1211 of the second circuit board assembly 121b and the chip 12121 of the circuit board 1212. Then, stack the bottom cover 1211 of the third circuit board assembly 121c on top of the bottom cover 1211 of the second circuit board assembly 121b by inserting the positioning pin 123 into the pin hole 12116 of the bottom cover 1211. At this time, on the one hand, the heat dissipation protrusion 12 of the bottom cover 1211 of the third circuit board assembly 121c... 113 sinks into the slot 12111 of the bottom cover 1211 of the second circuit board assembly 121b, such that the middle part and the opposite ends of the heat dissipation boss 12113 of the upper bottom cover 1211 are respectively located in the clearance groove 12114 and the notch 12115 of the lower bottom cover 1211. On the other hand, the screw through hole 121102 of the bottom cover 1211 of the third circuit board assembly 121c corresponds to the screw through hole 121102 of the bottom cover 1211 of the second circuit board assembly 121b.

[0056] S5, apply thermal grease to the notch 12115 of the bottom cover 1211 of the third circuit board assembly 121c and the chip 12121 of the circuit board 1212. Then, stack the bottom cover 1211 of the fourth circuit board assembly 121d on top of the bottom cover 1211 of the third circuit board assembly 121c by inserting the positioning pin 123 into the pin hole 12116 of the bottom cover 1211. At this time, on the one hand, the heat dissipation protrusion 12 of the bottom cover 1211 of the fourth circuit board assembly 121d... 113 sinks into the slot 12111 of the bottom cover 1211 of the third circuit board assembly 121c, such that the middle part and the opposite ends of the heat dissipation protrusion 12113 of the upper bottom cover 1211 are respectively located in the clearance groove 12114 and the notch 12115 of the lower bottom cover 1211. On the other hand, the screw through hole 121102 of the bottom cover 1211 of the fourth circuit board assembly 121d corresponds to the screw through hole 121102 of the bottom cover 1211 of the third circuit board assembly 121c.

[0057] S6, allowing the ends of each screw 122 to sequentially pass through the screw through hole 121102 of the bottom cover 1211 of the fourth circuit board assembly 121d, the screw through hole 121102 of the bottom cover 1211 of the third circuit board assembly 121c, and the screw through hole 121102 of the bottom cover 1211 of the second circuit board assembly 121b, and then extend to the threaded hole 121101 of the bottom cover 1211 of the first circuit board assembly 121a, and be screwed onto the bottom cover 1211 of the first circuit board assembly 121a, thus completing the assembly of the receiving module 12.

[0058] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functions and structural principles of the present invention have been shown and explained in the embodiments. Without departing from the stated principles, the implementation of the present invention may have any variations or modifications.

Claims

1. A receiving module for sonar, characterized in that, The device includes at least two circuit board assemblies stacked along a height direction. Each circuit board assembly includes a bottom cover and at least one circuit board. The bottom cover has at least one slot, and the circuit board is locked to the bottom cover and received in the slot. The bottom cover of the upper circuit board assembly closes the slot of the bottom cover of the lower circuit board assembly, and a heat dissipation protrusion of the bottom cover of the upper circuit board assembly protrudes toward the chip of the circuit board of the lower circuit board assembly.

2. The receiving module according to claim 1, wherein the heat dissipation boss of the bottom cover of the upper circuit board assembly extends into the slot of the bottom cover of the lower circuit board assembly.

3. The receiving module according to claim 2, wherein the bottom cover has two plate slots arranged side by side along the length of the bottom cover, and correspondingly, the circuit board assembly includes two circuit boards, each of which is respectively housed in a plate slot of the bottom cover.

4. The receiving module according to claim 3, wherein the heat dissipation protrusion of the bottom cover extends along the length direction of the bottom cover, wherein the bottom cover has a clearance groove, the clearance groove connecting the two plate slots, the clearance groove being used to avoid the heat dissipation protrusion of the upper bottom cover.

5. The receiving module according to claim 4, wherein each of the opposite ends of the bottom cover has a notch, each notch is connected to each of the plate slots, wherein the opposite ends of the heat dissipation protrusion of the upper bottom cover extend to each of the notches of the lower bottom cover.

6. The receiving module according to any one of claims 1 to 5, wherein thermal grease is provided between the heat dissipation protrusion of the bottom cover and the chip of the circuit board.

7. The receiving module according to claim 5, wherein thermal grease is provided between the heat dissipation protrusion of the bottom cover and the chip of the circuit board, and thermal grease is provided between the heat dissipation protrusion of the upper bottom cover and the lower bottom cover.

8. The receiving module according to any one of claims 1 to 5, wherein each of the circuit board assemblies has a pin hole at opposite ends of the bottom cover, wherein the receiving module includes two positioning pins, one of which is inserted into the pin hole at one end of the bottom cover and the other of which is inserted into the pin hole at the other end of the bottom cover.

9. The receiving module according to any one of claims 1 to 5, wherein the receiving module comprises four circuit board assemblies, the bottom covers of the three upper circuit board assemblies each having at least one screw through hole at opposite ends, and the bottom plate of the bottommost circuit board assembly each having at least one threaded hole at opposite ends, wherein the receiving module comprises at least two screws, one end of each screw extending through the screw through holes of the bottom covers of the three upper circuit board assemblies in sequence to the threaded hole of the bottom plate of the bottommost circuit board assembly, and the screws and the bottom covers are screwed together.

10. A sonar, characterized in that, include: Launch bay; and A receiving compartment, wherein the receiving compartment includes a receiving compartment body and a receiving module according to any one of claims 1 to 9, the receiving compartment body having a receiving cavity, the receiving module being housed in the receiving cavity of the receiving compartment body, and the receiving compartment body being mounted on the launching compartment.

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