Heat insulation assembly and exposure equipment

Abstract

The utility model provides a heat insulation assembly and exposure equipment, and the heat insulation assembly comprises a base which is provided with a temperature adjusting unit and is used for accommodating a silicon wafer to be exposed; the cabinet is detachably connected with the base; a movable heat insulation piece is arranged between the cabinet and the temperature adjusting unit, and the moving direction of the heat insulation piece and the connecting line between the cabinet and the temperature adjusting unit are arranged in an angle mode. According to the configuration, the movable heat insulation piece is arranged between the machine cabinet and the temperature adjusting unit to block heat radiation emitted by the machine cabinet when the exposure equipment works normally, so that the situation that silicon wafers staying on the temperature adjusting unit deform due to the influence of the heat radiation, and consequently the overlay error is increased is avoided; meanwhile, the heat insulation piece is arranged, aluminum foil does not need to be wrapped outside the cabinet any more, and in the subsequent maintenance process, the heat dissipation efficiency of the heat dissipation module of the cabinet does not need to be checked any more, so that the maintenance time is saved, and the productivity and the product yield of the exposure equipment are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a heat insulation component and an exposure device. Background Technology

[0002] Existing exposure equipment typically employs integrated circuit board cabinets, which include power modules, controller units, and communication interfaces. During the operation of the exposure equipment, the circuit board cabinet generates a large amount of heat, leading to heat accumulation. When the silicon wafer is waiting for exposure, it stays on the temperature stabilization unit (TSU). Since the circuit board cabinet is relatively close to the TSU, the heat radiation from the circuit board cabinet affects the temperature control of the TSU. The thermal effect causes deformation of the silicon wafer, thereby increasing overlay errors.

[0003] In existing technology, the circuit board cabinet and the TSU are separated by an acrylic sheet, and the circuit board cabinet is wrapped with heat-insulating aluminum foil. Therefore, in later maintenance, it is necessary to additionally check whether the circuit board cabinet is installed correctly and to test the heat dissipation efficiency of the heat dissipation module. However, the heat-insulating aluminum foil will affect the heat dissipation of the circuit board cabinet, affect the circuit life, and the additional maintenance items will prolong the maintenance time and reduce the production capacity of the exposure equipment.

[0004] Therefore, how to reduce the impact of thermal radiation from the circuit board cabinet on the silicon wafers resting on the TSU has become a technical problem that needs to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a heat insulation component and an exposure device to solve the problem in the prior art where the heat radiation from the circuit board cabinet affects the silicon wafers remaining on the TSU, causing deformation of the silicon wafers and increasing overlay errors.

[0006] To achieve the above objectives, this utility model provides a heat insulation component, comprising:

[0007] The base is equipped with a temperature adjustment unit for holding the silicon wafer awaiting exposure.

[0008] and the cabinet, which is detachably connected to the base;

[0009] A movable heat insulation component is provided between the cabinet and the temperature adjustment unit, and the direction of movement of the heat insulation component is set at an angle to the line connecting the cabinet and the temperature adjustment unit.

[0010] Optionally, the thermal conductivity of the insulation element is 0.001 W / (m·K) to 0.008 W / (m·K).

[0011] Optionally, the heat insulation element is slidably disposed on the base.

[0012] Optionally, the base is provided with a sliding groove, and a sliding member is provided on one side of the heat insulation member that extends into the sliding groove, and the sliding member is slidably disposed in the sliding groove.

[0013] Optionally, the heat insulation element may be partially exposed above the groove.

[0014] Optionally, the heat insulation element extends completely into the groove.

[0015] Optionally, a driving member is provided on the side of the heat insulation member away from the slide groove, and the driving member is used to drive the heat insulation member to slide in the slide groove.

[0016] Optionally, the heat insulation element is detachably connected to the base.

[0017] Optionally, the dimensions of the insulation component are adapted to the dimensions of the cabinet.

[0018] To achieve the above objectives, the present invention also provides an exposure device, comprising: an exposure unit and a heat insulation component as described above;

[0019] The exposure unit has a working state and a maintenance state;

[0020] When the exposure unit is in the working state, the heat insulation component moves between the cabinet and the temperature adjustment unit to achieve heat insulation;

[0021] When the exposure unit is in the maintenance state, the heat insulation component is moved away from the cabinet and the temperature adjustment unit to facilitate the disassembly of the cabinet.

[0022] Compared with existing thermal insulation designs, the thermal insulation components and exposure equipment provided in this application have the following advantages:

[0023] The heat insulation component provided in this application, by setting a movable heat insulation element between the cabinet and the temperature adjustment unit, blocks the heat radiation emitted by the cabinet when the exposure equipment is working normally. This prevents the silicon wafers resting on the temperature adjustment unit from being deformed by heat radiation, thus avoiding an increase in overlay error. At the same time, by setting the heat insulation element, it is no longer necessary to wrap the outside of the cabinet with aluminum foil, so that the circuits inside the cabinet will not heat up due to the aluminum foil wrapping, affecting their service life. Furthermore, during subsequent maintenance, it is no longer necessary to check the heat dissipation efficiency of the cabinet's heat dissipation module, saving maintenance time and thereby improving the production capacity and product yield of the exposure equipment.

[0024] The exposure equipment provided in this application, by setting a movable heat insulation component between the cabinet and the temperature adjustment unit, allows the heat insulation component to move between the cabinet and the temperature adjustment unit when the exposure unit is in operation, thereby isolating the heat radiation emitted by the cabinet; when the exposure unit is in maintenance mode, the heat insulation component is moved away from the cabinet and the temperature adjustment unit to facilitate the disassembly of the cabinet, making it easier to observe and operate the inside of the cabinet, and further improving the practical performance of the heat insulation component. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of existing thermal insulation technologies;

[0026] Figure 2 This is a schematic diagram of the structure of the heat insulation component provided in an embodiment of the present utility model;

[0027] Figure 3 A cross-sectional view of the structure of the first type of heat insulation component provided in this embodiment of the utility model;

[0028] Figure 4 This is a cross-sectional view of the structure of a second type of heat insulation component provided in an embodiment of the present utility model.

[0029] The following are explanations of the reference numerals in the figures:

[0030] 1-Base; 10-Temperature adjustment unit; 11-Slide groove;

[0031] 2-Rack;

[0032] 3-Insulation component; 30-Sliding component; 31-Drive component. Detailed Implementation

[0033] To make the objectives, advantages, and features of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to facilitate and clarify the explanation of the objectives of the embodiments of this utility model. Furthermore, the structures shown in the drawings are often part of the actual structure. In particular, different drawings may emphasize different aspects and sometimes use different scales.

[0034] As used herein, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the term “at least two” is generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. “One end” and “the other end,” as well as “proximal end” and “distal end,” generally refer to two corresponding parts, including not only endpoints. The terms “installed,” “connected,” and “joined” should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Furthermore, as used in this specification, the phrase "one element is disposed on another element" generally only indicates that there is a connection, coupling, cooperation, or transmission relationship between the two elements, and the connection, coupling, cooperation, or transmission between the two elements can be direct or indirect through an intermediate element. It should not be construed as indicating or implying a spatial positional relationship between the two elements, i.e., one element can be located arbitrarily inside, outside, above, below, or to the side of another element, unless otherwise explicitly stated. The terms "above," "below," "top," and "bottom" generally refer to relative positional relationships arranged according to the direction of gravity; the terms "vertical" or "vertical direction" generally refer to the direction of gravity, which is generally perpendicular to the ground; "horizontal" or "horizontal plane direction" generally refers to a direction parallel to the ground. Those skilled in the art can understand the specific meaning of the above terms in this specification according to the specific circumstances.

[0035] The purpose of this invention is to provide a heat insulation component and an exposure device to solve the problem in the prior art where the heat radiation from the circuit board cabinet affects the silicon wafers remaining on the TSU, causing deformation of the silicon wafers and increasing overlay errors.

[0036] As will be understood by those skilled in the art, a circuit board rack is a standardized cabinet used to install electronic control modules, power systems, and auxiliary equipment; it is the physical carrier of the equipment's electrical and control systems. It mainly includes a rack frame, electronic modules, power distribution and cable management modules, and corresponding heat dissipation modules. During equipment operation, the electronic modules and power distribution and cable management modules inevitably generate heat, which needs to be dissipated through the heat dissipation modules to avoid affecting the normal operation of the electronic modules and even the entire equipment.

[0037] The Temperature Stabilization Unit (TSU) is a subsystem used to maintain the temperature stability of critical components inside the exposure equipment. Its main function is to suppress the shrinkage or expansion of materials caused by temperature fluctuations, ensuring process consistency. It mainly consists of a temperature control execution module and a temperature detection module. Through real-time temperature monitoring, it controls the temperature control execution module to adjust the temperature, thereby reducing temperature variations and preventing them from affecting product yield and productivity.

[0038] Please refer to Figure 1 The cabinet 2 and the temperature adjustment unit 10 are usually mounted on a base 1, and are relatively close to each other. Since the cabinet 2 has heat dissipation requirements, and the temperature adjustment unit 10 needs to maintain a stable temperature, heat insulation measures are required between them. In the prior art, acrylic sheets are used for heat insulation, and aluminum foil is wrapped around the outside of the cabinet 2. This not only affects the heat dissipation of the cabinet 2, leading to a decrease in the lifespan of the electronic modules, but also requires additional time and effort to test the heat dissipation efficiency of the cabinet 2's heat dissipation modules during maintenance. Therefore, this embodiment provides a heat insulation component and an exposure device. By adding a movable heat insulation component between the cabinet and the temperature adjustment unit, the heat radiation emitted by the cabinet can be effectively blocked, and the cabinet no longer needs to be wrapped with aluminum foil, further extending the lifespan of the electronic modules inside the cabinet and simplifying the cabinet maintenance process, saving time and effort.

[0039] Please refer to Figures 2 to 4 This utility model provides a heat insulation component, including: a base 1, on which a temperature adjustment unit 10 is provided for housing a silicon wafer awaiting exposure; and a cabinet 2, detachably connected to the base 1; a movable heat insulation component 3 is provided between the cabinet 2 and the temperature adjustment unit 10, the moving direction of the heat insulation component 3 being angled to the line connecting the cabinet 2 and the temperature adjustment unit 10. It should be noted that the line connecting the cabinet 2 and the temperature adjustment unit 10 can be the line connecting their centers (in...). Figure 2 The middle part is line segment A), and the direction of movement of the heat insulation component 3 is as follows: Figure 2 As shown by line B in the diagram, the preferred direction of movement of the heat insulation component 3 is perpendicular to the line connecting the cabinet 2 and the temperature adjustment unit 10, so as to avoid the movement of the heat insulation component 3 from interfering with the cabinet 2 and the temperature adjustment unit 2.

[0040] by Figure 2For example, when a silicon wafer is waiting for exposure, it needs to remain on the temperature adjustment unit 10 to ensure that the wafer is not deformed by the ambient temperature, which would increase the overlay error. To ensure that the silicon wafer remains on the temperature adjustment unit 10 and is not affected by the heat radiation of the cabinet 2, a heat insulation component 3 needs to be installed between the cabinet 2 and the temperature adjustment unit 10. In this embodiment, the heat insulation component 3 is a plate-shaped component made of heat-insulating material. In other embodiments, the heat insulation component 3 can also be made of ordinary material and coated with a heat-insulating film to achieve heat insulation. At the same time, the heat insulation component 3 is movable, and the relative position of the heat insulation component 3 and the cabinet 2 can be adjusted to facilitate the disassembly and observation of the cabinet 2, further improving the practicality of the heat insulation component 3.

[0041] Compared to the existing technology that wraps aluminum foil around the outside of the cabinet 2 to reduce heat radiation, the solution provided in this embodiment, which adds a heat insulation component 3, eliminates the need to wrap aluminum foil around the outside of the cabinet 2. This prevents the circuitry inside the cabinet 2 from overheating due to the aluminum foil wrapping, thus affecting its lifespan. Furthermore, during subsequent maintenance, it is no longer necessary to check the heat dissipation efficiency of the heat dissipation module of the cabinet 2, saving maintenance time and further improving the production capacity and product yield of the exposure equipment.

[0042] In an optional embodiment, since the electronic control module and power system in the cabinet 2 need to be routinely maintained and repaired, the cabinet 2 needs to be detachably connected to the base 1. The specific connection method can be threaded connection, snap-fit ​​connection, hinge, quick connector, etc., and this embodiment does not limit this.

[0043] Preferably, the thermal conductivity of the heat insulation component 3 is 0.001 W / (m·K) to 0.008 W / (m·K). In this embodiment, the heat insulation component 3 is preferably a vacuum insulation panel. As those skilled in the art will understand, a vacuum insulation panel is formed by wrapping a porous core material (such as silicon dioxide or glass fiber) inside a barrier film and then sealing it under vacuum. In other embodiments, the heat insulation component 3 can also be made of multiple layers of insulation material, for example, composed of alternating layers of high-reflectivity films (such as aluminum foil) and low-thermal-conductivity spacers. With this configuration, this embodiment uses an insulation material with a thermal conductivity of 0.001 W / (m·K) to 0.008 W / (m·K) to make the heat insulation component 3, which can significantly improve the heat insulation effect of the heat insulation component 3 and prevent the silicon wafer remaining on the temperature adjustment unit 10 from deforming due to the influence of thermal radiation.

[0044] Please continue to refer to this. Figures 2 to 4The heat insulation component 3 is slidably mounted on the base 1. Furthermore, a groove 11 is provided on the base 1, and a sliding component 30 is provided on the side of the heat insulation component 3 that extends into the groove 11. The sliding component 30 is slidably mounted within the groove 11. In this embodiment, the heat insulation component 3 is slidably mounted on the base 1 through the cooperation of the groove 11 and the sliding component 30. It should be noted that the groove 11 is located on the side of the base 1 near the cabinet 2 and opens in a direction perpendicular to the plane of the temperature adjustment unit 10. The heat insulation component 3 extends into the groove 11 in a direction perpendicular to the temperature adjustment unit 10. Simultaneously, a sliding component 30 (such as a pulley) is provided on the side of the heat insulation component 3 that extends into the groove 11. The sliding component 30 is slidable at the bottom of the groove 11, thereby enabling the heat insulation component 3 to slide within the groove 11. Of course, in other embodiments, the sliding member 30 may also be provided in other parts of the heat insulation member 3, such as the middle part of the heat insulation member 3, and may slide on the side wall of the groove 11. This embodiment does not limit this.

[0045] Please refer to Figure 3 Optionally, the heat insulation component 3 is partially exposed in the slide groove 11. The size of the heat insulation component 3 is slightly larger than the size of the slide groove 11. With this setting, the operator can determine the relative position of the heat insulation component 3 based on the position of the heat insulation component 3 exposed in the slide groove 11, which facilitates real-time adjustment of the relative position of the heat insulation component 3. At the same time, the operator can directly drive the part of the heat insulation component 3 exposed in the slide groove 11 to drive the heat insulation component 3 to move, which is convenient and quick.

[0046] Please refer to Figure 4 In another embodiment, the heat insulation element 3 extends completely into the slide rail 11. The size of the heat insulation element 3 is slightly smaller than the size of the slide rail 11, and the position of the heat insulation element 3 in the slide rail 11 corresponds to and is flush with the installation position of the cabinet 2. With this configuration, the heat insulation element 3 can block the heat radiation path of the cabinet 2 while reducing the size of the heat insulation element 3, thereby further controlling costs.

[0047] In some embodiments of this application, a driving member 31 is provided on the side of the heat insulation member 3 away from the slide groove 11. The driving member 31 is used to drive the heat insulation member 3 to slide in the slide groove 11. It should be noted that the driving member 31 can be a driving handle. The surface of the driving member 31 can be coated with heat insulation material to prevent heat from being transferred to the driving member 31, making it impossible for the operator to drive it directly. At the same time, the driving member 31 can be exposed in the slide groove 11 or located in the slide groove 11. The driving member 31 can also be foldable, for example, it can be a single-axis hinge folding, nested slide rail folding, etc., which can be unfolded when needed for the operator to use; when not needed, it can be folded into a receiving cavity or the surface of the heat insulation member 3 to reduce the space occupation and improve the space utilization rate.

[0048] Optionally, the heat insulation component 3 is detachably connected to the base 1. It should be noted that, to facilitate the loading or unloading of the cabinet 2 for maintenance and repair, the heat insulation component 3 is detachably connected to the base 1. When the cabinet 2 needs to be loaded or unloaded, the heat insulation component 3 can be directly removed from the slide groove 11 to provide sufficient space for the operator to perform the corresponding operations. After the cabinet 2 is installed and needs to be put into normal operation, the heat insulation component 3 is then installed back into the slide groove 11 to achieve heat insulation. The detachable connection of the heat insulation component 3 can be achieved through the aforementioned sliding component 30 and slide groove 11, which will not be elaborated further in this embodiment.

[0049] As an alternative embodiment, the dimensions of the heat insulation component 3 are adapted to the dimensions of the cabinet 2. It should be noted that the dimensions of the heat insulation component 3 need to be adapted to the dimensions of the cabinet 2. The operator can configure the specific dimensions of the heat insulation component 3 according to the specific location of the heat dissipation module in the cabinet 2. It is necessary to ensure that when the heat insulation component 3 is placed in the slide groove 11, the heat insulation component 3 can cover the position of the heat dissipation module in the cabinet 2 to block the heat radiation emitted by the heat dissipation module.

[0050] In another embodiment, the present invention also provides an exposure device, including: an exposure unit and a heat insulation component as described above; the exposure unit has a working state and a maintenance state; when the exposure unit is in the working state, the heat insulation component 3 moves between the cabinet 2 and the temperature adjustment unit 10 to achieve heat insulation; when the exposure unit is in the maintenance state, the heat insulation component 3 is removed from between the cabinet 2 and the temperature adjustment unit 10 to facilitate the disassembly of the cabinet 2. It should be noted that in this embodiment, only an exposure device is used as an example for description, which does not mean that the heat insulation component disclosed in this embodiment can only be used in exposure devices. In other scenarios where heat insulation is required to ensure the stability of the ambient temperature, the above-mentioned heat insulation component can be used, such as deposition processes, ion implantation processes, packaging and testing processes in semiconductor manufacturing, etc. This embodiment does not limit this.

[0051] With this configuration, a movable heat insulation component 3 is installed between the cabinet 2 and the temperature adjustment unit 10. When the exposure unit is in operation, the heat insulation component 3 moves between the cabinet 2 and the temperature adjustment unit 10 to isolate the heat radiation emitted by the cabinet 2. When the exposure unit is under maintenance, the heat insulation component 3 is removed from between the cabinet 2 and the temperature adjustment unit 10 to facilitate the disassembly of the cabinet 2 and the observation and operation of the interior of the cabinet 2, further improving the practical performance of the heat insulation component.

[0052] In summary, in the heat insulation component and exposure equipment provided in this utility model embodiment, the heat insulation component includes: a base, on which a temperature adjustment unit is provided for housing the silicon wafer waiting to be exposed; and a cabinet, which is detachably connected to the base; a movable heat insulation component is provided between the cabinet and the temperature adjustment unit, and the direction of movement of the heat insulation component is set at an angle to the line connecting the cabinet and the temperature adjustment unit.

[0053] This configuration, by placing a movable heat insulation component between the cabinet and the temperature adjustment unit, blocks the heat radiation emitted by the cabinet during normal operation of the exposure equipment. This prevents the silicon wafers resting on the temperature adjustment unit from deforming due to heat radiation, thus avoiding increased overlay errors. At the same time, the heat insulation component eliminates the need to wrap the outside of the cabinet with aluminum foil, preventing the internal circuitry from overheating due to the aluminum foil and affecting its lifespan. Furthermore, it eliminates the need to check the heat dissipation efficiency of the cabinet's heat dissipation module during subsequent maintenance, saving maintenance time and thereby improving the production capacity and product yield of the exposure equipment.

[0054] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A thermal insulation component, characterized in that, include: The base is equipped with a temperature adjustment unit for holding the silicon wafer awaiting exposure. and the cabinet, which is detachably connected to the base; A movable heat insulation component is provided between the cabinet and the temperature adjustment unit, and the direction of movement of the heat insulation component is set at an angle to the line connecting the cabinet and the temperature adjustment unit.

2. The thermal insulation component as described in claim 1, characterized in that, The thermal conductivity of the insulation component is 0.001 W / (m·K) to 0.008 W / (m·K).

3. The thermal insulation component as described in claim 1, characterized in that, The heat insulation element is slidably disposed on the base.

4. The thermal insulation component as described in claim 3, characterized in that, The base is provided with a sliding groove, and a sliding member is provided on one side of the heat insulation member that extends into the sliding groove. The sliding member is slidably disposed in the sliding groove.

5. The thermal insulation component as described in claim 4, characterized in that, The heat insulation component is partially exposed in the groove.

6. The thermal insulation component as described in claim 4, characterized in that, The heat insulation element extends completely into the groove.

7. The thermal insulation component as described in claim 5 or 6, characterized in that, A driving member is provided on the side of the heat insulation member away from the slide groove, and the driving member is used to drive the heat insulation member to slide in the slide groove.

8. The thermal insulation component as claimed in claim 1, characterized in that, The heat insulation element is detachably connected to the base.

9. The thermal insulation component as claimed in claim 1, characterized in that, The dimensions of the thermal insulation component are adapted to the dimensions of the cabinet.

10. An exposure apparatus, characterized in that, include: Exposure unit and heat insulation component as described in any one of claims 1 to 9; The exposure unit has a working state and a maintenance state; When the exposure unit is in the working state, the heat insulation component moves between the cabinet and the temperature adjustment unit to achieve heat insulation; When the exposure unit is in the maintenance state, the heat insulation component is moved away from the cabinet and the temperature adjustment unit to facilitate the disassembly of the cabinet.

Images