Water-cooling case assembling structure
By using detachable support columns and uprights, combined with multi-layer radiator brackets and through-hole design, the problem of poor structural flexibility and insufficient heat dissipation adaptability of water-cooled chassis is solved, achieving stability and efficient heat dissipation to meet diverse installation needs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHIJIAZHUANG SUYAN CHAOKU TECHNOLOGY CO LTD
- Filing Date
- 2025-08-07
- Publication Date
- 2026-05-05
AI Technical Summary
Existing water-cooled chassis have poor structural flexibility and insufficient heat dissipation and hardware compatibility, resulting in conflicts between the radiator and other hardware positions, obstructed airflow, and difficulty in meeting diverse PC assembly needs.
It adopts a detachable support column and upright plate structure, provides a dedicated radiator installation position, and combines a multi-layer radiator bracket and through hole design to optimize the heat dissipation airflow. It is equipped with a multi-functional bracket to adapt to different hardware needs, and realizes a three-dimensional heat dissipation layout and zoned cable management.
It improves the structural stability and heat dissipation efficiency of the chassis, avoids conflicts between the radiator and hardware positions, ensures unobstructed airflow, meets diverse PC assembly needs, and adapts to the heat dissipation requirements of high-performance hardware.
Smart Images

Figure CN224203648U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of computer hardware, and in particular to a water-cooled chassis assembly structure. Background Technology
[0002] With the rapid improvement of computer hardware performance, especially the continuous increase in power consumption and heat generation of high-end CPUs and graphics cards, air cooling can no longer meet their heat dissipation needs.
[0003] Liquid cooling systems, with their high heat exchange efficiency and good heat dissipation uniformity, have gradually become the mainstream choice for high-performance PCs and are widely used in gaming PCs, workstations, and other scenarios. Most existing liquid-cooled chassis use a fixed frame design, with relatively fixed radiator mounting positions and hardware interface layouts. However, these chassis have significant drawbacks; for example, in some chassis, the radiator's mounting position conflicts with other hardware, obstructing airflow.
[0004] Regarding the aforementioned technologies, the applicant believes that they suffer from poor structural flexibility, insufficient heat dissipation and hardware compatibility, making it difficult to meet diverse installation needs. Utility Model Content
[0005] To address the aforementioned technical problems, this application provides a water-cooled chassis assembly structure.
[0006] This application provides a water-cooled chassis assembly structure, which adopts the following technical solution:
[0007] A water-cooled chassis assembly structure includes a base plate, two sets of support columns, and an upright plate. One end of each set of support columns is detachably connected to the upright plate, and the other end of each set of support columns is fixedly connected to both ends of the base plate. The connection between the upright plate and the support columns is on the lower side of the upright plate. A first radiator bracket is provided on the lower side of the upright plate. Two sets of through holes for mounting components are provided in the middle of the upright plate. The two sets of through holes are arranged vertically on the upright plate. Pipe holes and cable routing holes are respectively provided on one side of the upright plate of the two sets of through holes.
[0008] By adopting the above technical solution, one end of each of the two sets of support columns is fixed to the base plate, while the other end is detachably connected to the upright plate. This not only ensures the stability of the overall structure but also breaks through the limitations of traditional fixed frames, facilitating the disassembly and maintenance of the upright plate. It solves the problem of inconvenient operation caused by the rigid structure of existing chassis. One end of each of the two sets of support columns is fixed to the base plate, and the first radiator bracket on the lower side of the upright plate provides a dedicated installation position for the water cooling system, avoiding the radiator competing for space with other hardware. The two sets of through holes arranged vertically in the middle of the upright plate can accommodate the installation requirements of different components. Together with the pipe routing holes and cable routing holes on one side, the water cooling pipes and cables can be organized separately to prevent pipe bending and cable tangling, ensuring smooth heat dissipation airflow. This effectively improves the defects of existing chassis where the radiator and hardware positions conflict and airflow is obstructed, better meeting diverse installation needs.
[0009] Preferably, a second radiator bracket is provided on the front end of the upright plate, and a first switch device and a restart device are also provided on the upright plate at the installation location of the second radiator bracket. A memory cooling fan bracket is provided on the upright plate on the upper side of the second radiator bracket.
[0010] By adopting the above technical solution, the newly added second radiator bracket at the front of the stand and the first radiator bracket on the lower side form a three-dimensional heat dissipation layout that can accommodate radiators or chassis fans of different specifications, greatly improving the heat dissipation coverage. This is especially suitable for the heat dissipation needs of high-performance hardware. The memory cooling fan bracket on the upper side of the second radiator bracket is specifically designed for memory modules, allowing fans to be directly installed for directional heat dissipation of the memory. As a high-frequency operating component, memory is prone to performance fluctuations due to high temperatures. This design fills the blind spot of traditional chassis memory heat dissipation, ensuring stable memory operation, and is especially suitable for multi-channel memory or high-frequency memory usage scenarios.
[0011] Preferably, a third radiator support is provided on the upper side of the upright plate, and a cable management hole is provided on the upright plate near the top of the single set of through holes at the lower part of the third radiator support. A first wire organizing device is provided on the cable management hole, and a second wire organizing device and a second switch device are provided on the upright plate on one side of the third radiator support.
[0012] By adopting the above technical solution, the third radiator bracket, together with the first radiator bracket below and the second radiator bracket at the front, forms a three-dimensional heat dissipation system. This system can address the heat dissipation needs of high-heat components such as the CPU, graphics card, and motherboard chipset. For example, the top radiator targets the CPU, the bottom radiator assists the graphics card, and a chassis fan can be installed on the second radiator bracket at the front to enhance the overall airflow. The multi-radiator layout can significantly improve heat dissipation efficiency, easily handling high-load scenarios such as overclocking, large-scale games, and video rendering, and preventing hardware from throttling due to high temperatures. The cable management holes are located near the top of the through holes, and the first cable management device installed in the cable management holes can fix the cable routing and prevent loosening. The second cable management device on one side of the third radiator bracket can organize the radiator power cables, top component cables, etc., to achieve zoned cable management. The second switch device and the first switch device at the front form a dual control system, which can be set with different functions to meet personalized operation needs.
[0013] Preferably, a graphics card bracket and a motherboard baffle are provided on the rear end of the stand plate. The graphics card bracket is detachably connected to the lower part of the rear end of the stand plate, and the motherboard baffle is detachably connected to the upper part of the stand plate of the graphics card bracket.
[0014] By adopting the above technical solution, high-end graphics cards, due to their large size and weight, are prone to sagging when secured solely by the PCIe slot. Long-term use may lead to slot deformation, poor contact, or motherboard PCB bending. The graphics card bracket is detachably connected to the lower rear of the stand, directly supporting the rear of the graphics card. By distributing weight through two-point fixation between the slot and the bracket, it prevents damage from uneven stress, extending the lifespan of the hardware. The motherboard I / O shield, located above the graphics card bracket, ensures precise alignment of the rear motherboard interfaces. It forms a physical barrier to prevent dust, liquids, or foreign objects from entering the interfaces and provides support when plugging and unplugging cables, reducing solder joint detachment caused by external pulling and ensuring the long-term stability of the motherboard interfaces.
[0015] Preferably, the lower part of the graphics card bracket is provided with a vertical insertion bracket, which is detachably connected to the graphics card bracket.
[0016] By adopting the above technical solutions, when traditional graphics cards are installed horizontally, the direction of the fan or the layout of the interface may be limited by the width of the chassis. However, the vertical bracket can convert the graphics card into a vertical installation, which can be adapted to more scenarios. When the center of gravity of the vertically installed graphics card is shifted, it is easy to wobble if it is only supported by the PCIe extension cable or a single fixed point. The vertical bracket and the upper graphics card bracket form a support, which can distribute the weight of the graphics card when it is installed vertically, and avoid excessive force on the PCIe extension cable interface, which may lead to poor contact, or damage to the components of the graphics card itself due to shaking.
[0017] Preferably, a power supply bracket is provided on one side of the upright plate of the graphics card bracket, and the power supply bracket is located on the back of the upright plate.
[0018] By adopting the above technical solution, one end of the power supply bracket is installed on the upright plate on one side of the graphics card bracket, and the main body of the power supply bracket is located on the back of the upright plate. The power supply bracket is used to install the power supply, so that the power supply and the core components such as the graphics card, radiator, and motherboard on the front of the upright plate form a front-to-back layered layout, avoiding the compression of the power supply and the front components in the horizontal space.
[0019] Preferably, a multi-functional bracket is provided on the back of the vertical plate at the lower part of the third radiator bracket, and the multi-functional bracket is detachably connected to the vertical plate.
[0020] By adopting the above technical solutions, the multi-functional bracket can install different types of expansion components according to user needs. It can be set as a hard drive bracket to solve the problem of insufficient hard drive installation positions in the main body of the chassis. It is especially suitable for workstation scenarios that require large-capacity storage. Alternatively, the radiator of the CPU water cooling radiator can be set on the multi-functional bracket, and auxiliary cooling fans can be added to enhance airflow circulation and improve heat dissipation efficiency in conjunction with multiple radiators.
[0021] Preferably, a hard drive bracket is provided on the back of one side of the vertical plate of the second radiator bracket. The hard drive bracket is detachably connected to the vertical plate and is located at the lower part of the multi-functional bracket.
[0022] By adopting the above technical solution, the back of the stand has already achieved the upper expansion function through the multi-functional bracket, and the hard drive bracket is placed below it, forming a vertical layered structure of the multi-functional bracket and the hard drive bracket. This makes full use of the unused area on the back of the stand from below the third radiator bracket to above the power supply bracket, and avoids competing for space with the core components such as the radiator and graphics card on the front.
[0023] In summary, this application includes at least one of the following beneficial technical effects:
[0024] Two sets of support columns are fixed at one end to the base plate. The first radiator bracket on the lower side of the upright plate provides a dedicated installation position for the water cooling system, avoiding the radiator competing for space with other hardware. The two sets of through holes arranged vertically in the middle of the upright plate can accommodate the installation requirements of different components. Together with the pipe routing holes and cable routing holes on one side, the water cooling pipes and cables can be organized separately to prevent pipe bending and cable tangling, ensuring smooth heat dissipation airflow. This effectively improves the defects of existing chassis where the radiator and hardware positions conflict and the airflow is obstructed, better meeting diverse assembly needs.
[0025] The third radiator bracket, together with the first radiator bracket below and the second radiator bracket at the front, forms a three-dimensional cooling system. This system can address the cooling needs of high-heat components such as the CPU, graphics card, and motherboard chipset. For example, the top radiator targets the CPU, the bottom radiator assists the graphics card, and a case fan can be installed on the second radiator bracket at the front to enhance the overall airflow. The multi-radiator layout significantly improves cooling efficiency, easily handling high-load scenarios such as overclocking, demanding games, and video rendering, preventing hardware from throttling due to high temperatures. The cable management holes are located near the top of the through-holes. The first cable management device installed in the cable management holes can fix the cable routing and prevent loosening. The second cable management device on one side of the third radiator bracket can organize the radiator power cables, top component cables, etc., achieving zoned cable management. The second switch device and the first switch device at the front form a dual control system, which can be set with different functions to meet personalized operation needs. Attached Figure Description
[0026] Figure 1 This is a schematic diagram of the overall structure in the embodiment.
[0027] Figure 2 This is a schematic diagram of the structure of the back of the upright plate in the embodiment.
[0028] Explanation of reference numerals in the attached diagram: 1. Base plate; 2. Support column; 3. Vertical plate; 31. Through hole; 32. Pipe hole; 33. Cable routing hole; 34. Graphics card bracket; 341. Vertical insertion bracket; 35. Motherboard bracket; 36. Multi-functional bracket; 37. Hard drive bracket; 38. Cable management hole; 381. First cable management device; 39. Second cable management device; 4. First radiator bracket; 41. Second radiator bracket; 42. Third radiator bracket; 5. First switch device; 51. Second switch device; 52. Reset device; 6. Memory cooling fan bracket; 7. Power supply bracket. Detailed Implementation
[0029] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.
[0030] This application discloses a water-cooled chassis assembly structure. (Refer to...) Figure 1 and Figure 2The system includes a base plate 1, two sets of support columns 2, and a vertical plate 3. One end of each set of support columns 2 is bolted to the vertical plate 3, and the other end is fixedly connected to both ends of the base plate 1. A first radiator bracket 4 is provided on the lower side of the vertical plate 3. The first radiator bracket 4 is detachably connected to the vertical plate 3 and is used to install a graphics card cooling radiator or a case fan. The middle of the vertical plate 3 has two sets of through holes 31 for installing a motherboard or components. The two sets of through holes 31 are arranged longitudinally on the vertical plate 3. A pipe routing hole 32 is provided on the vertical plate 3 on the side of the upper through hole 31, and a cable routing hole is provided on the vertical plate 3 on the side of the lower through hole 31. 33. A second radiator bracket 41 is provided on the front end of the upright plate 3. The second radiator bracket 41 is detachably connected to the upright plate 3. The second radiator bracket 41 is used to install CPU cooling radiators, graphics card cooling radiators, or case fans. A first switch device 5 and a restart device 52 are also provided on the front end of the upright plate 3 at the location of the second radiator bracket 41. The first switch device 5 and the restart device 52 are detachably connected to the upright plate 3. A memory cooling fan bracket 6 is provided on the upright plate 3 above the second radiator bracket 41. The memory cooling fan bracket 6 is detachably connected to the upright plate 3. The memory cooling fan bracket 6 is used to directly mount the memory components to the cooling fan.
[0031] A third radiator bracket 42 is provided on the upper side of the upright plate 3. The third radiator bracket 42 is detachably connected to the upright plate 3. A CPU cooling radiator or a case fan can be installed on the third radiator bracket 42. A three-dimensional heat dissipation system is formed by the first radiator bracket 4, the second radiator bracket 41, and the third radiator bracket 42, so that the case airflow can be adjusted according to actual use. A cable management hole 38 is provided on the upright plate 3 below the third radiator bracket 42. A first cable management device 381 is provided on the cable management hole 38. The first cable management device 381 is detachably connected to the upright plate 3. A second cable management device 39 and a second switch device 51 are provided on the upright plate 3 on one side of the third radiator bracket 42. The second cable management device 39 and the second switch device 51 are detachably connected to the upright plate 3. The first cable management device 381 and the second cable management device 39 are used to fix the cable routing from the power supply to the motherboard.
[0032] A graphics card bracket 34 and a motherboard bracket 35 are provided on the rear end of the stand plate 3. The graphics card bracket 34 is bolted to the front of the stand plate 3. The motherboard bracket 35 is installed on the stand plate 3 above the graphics card bracket 34 and bolted to the stand plate 3. The graphics card bracket 34 is used to install graphics cards and prevent the PCIe interface of the motherboard for installing graphics cards and the edge connector of graphics cards from being damaged due to the weight of the graphics cards themselves. A vertical insertion bracket 341 is provided at the lower part of the graphics card bracket 34. The vertical insertion bracket 341 is bolted to the graphics card bracket 34. The graphics card can be installed on the vertical insertion bracket 341 through a PCIe extension cable.
[0033] Reference Figure 2 A power supply bracket 7 is provided on one side of the upright plate 3 at the mounting location of the graphics card bracket 34. One end of the power supply bracket 7 is detachably connected to the upright plate 3 and is used to install the power supply. The other end of the power supply bracket 7 is located on the back of the upright plate 3. A multi-functional bracket 36 is provided on the upper side of the back of the upright plate 3. The multi-functional bracket 36 is connected to the upright plate 3 by bolts. The multi-functional bracket 36 can be used to install hard drives, CPU cooling disks, or case fans. A hard drive bracket 37 for installing hard drives is provided on the back of the upright plate 3 on one side of the second radiator bracket 41. The hard drive bracket 37 is located on the upright plate 3 below the multi-functional bracket 36 and is bolted to the upright plate 3.
[0034] The working principle of the water-cooled chassis assembly structure in this application is as follows: The base plate 1 is connected to the upright plate 3 through two sets of support columns 2 to form a stable three-dimensional frame. The upright plate 3 serves as the core load-bearing surface, providing an installation reference for various hardware components. The motherboard is fixed through two sets of longitudinal through holes 31 in the middle of the upright plate 3 to ensure that its position corresponds with other components. The graphics card is installed horizontally through the graphics card bracket 34 on the front to avoid damage to the PCIe interface due to the weight of the graphics card. At the same time, it can be installed vertically through the vertical bracket 341 with the PCIe extension cable to improve compatibility and space utilization. The power supply is fixed through the power supply bracket 7 on the back of the upright plate 3. Its position design takes into account the rationality of the routing of power cables to the motherboard. The hard drive can be installed in layers through the hard drive bracket 37 and the multi-functional bracket 36 on the back of the upright plate 3. The multi-functional bracket 36 is compatible with the installation of radiators and fans. The motherboard bracket 35 protects the motherboard interface from dust and ensures safety. The first radiator bracket 4 on the lower side of the upright plate 3, the second radiator bracket 41 at the front, the third radiator bracket 42 on the upper side, and the multi-functional bracket 36 on the back can be used to install the CPU. Cooling radiators, graphics card cooling radiators, or case fans create a three-dimensional airflow channel within the case. The memory cooling fan bracket 6 directly provides targeted cooling for the memory components. By adjusting the installation position of the cooling radiator or case fan, efficient air circulation can be achieved. The cable management holes 38, pipe routing holes 32, and cable routing holes 33 on the stand plate 3 provide cable passages for power cables, data cables, and cooling pipes. The first cable management device 381 and the second cable management device 39 respectively fix the cable routing from the power supply to the motherboard, preventing cable tangling. At the same time, the cable management holes 38 keep the cables close to the back or side of the stand plate 3. The first switch device 5 and the reset device 52 at the front of the stand plate 3, as well as the second switch device 51 at the top, enable convenient start / stop and function adjustment of the hardware.
[0035] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A water-cooled chassis assembly structure, characterized in that: It includes a base plate (1), two sets of support columns (2) and a vertical plate (3). One end of the two sets of support columns (2) is detachably connected to the vertical plate (3), and the other end of the two sets of support columns (2) is fixedly connected to both ends of the base plate (1). The connection between the vertical plate (3) and the support columns (2) is the lower side of the vertical plate (3). A first cold air bracket (4) is provided on the lower side of the vertical plate (3). Two sets of through holes (31) for installing components are provided in the middle of the vertical plate (3). The two sets of through holes (31) are arranged vertically on the vertical plate (3). Pipe holes (32) and wiring holes (33) are respectively provided on one side of the vertical plate (3) of the two sets of through holes (31).
2. The water-cooled chassis assembly structure according to claim 1, characterized in that: A second radiator bracket (41) is provided on the front end of the upright plate (3). A first switch device (5) and a restart device (52) are also provided on the upright plate (3) where the second radiator bracket (41) is installed. A memory cooling fan bracket (6) is provided on the upright plate (3) on the upper side of the second radiator bracket (41).
3. According to claim 1, a water-cooled chassis assembly structure is provided on the upper side of the upright plate (3), a third radiator bracket (42) is provided on the upright plate (3) near the top of the single set of through holes (31) at the lower part of the third radiator bracket (42), a cable management hole (38) is provided on the upright plate (3), a first wire management device (381) is provided on the cable management hole (38), and a second wire management device (39) and a second switch device (51) are provided on the upright plate (3) on one side of the third radiator bracket (42).
4. The water-cooled chassis assembly structure according to claim 1, characterized in that: The rear end of the stand plate (3) is provided with a graphics card bracket (34) and a motherboard baffle (35). The graphics card bracket (34) is detachably connected to the lower part of the rear end of the stand plate (3), and the motherboard baffle (35) is detachably connected to the stand plate (3) on the upper part of the graphics card bracket (34).
5. The water-cooled chassis assembly structure according to claim 4, characterized in that: The lower part of the graphics card bracket (34) is provided with a vertical insertion bracket (341), which is detachably connected to the graphics card bracket (34).
6. The water-cooled chassis assembly structure according to claim 4, characterized in that: A power supply bracket (7) is provided on the upright plate (3) on one side of the graphics card bracket (34), and the power supply bracket (7) is located on the back of the upright plate (3).
7. The water-cooled chassis assembly structure according to claim 3, characterized in that: A multi-functional bracket (36) is provided on the back of the vertical plate (3) at the lower part of the third radiator bracket (42), and the multi-functional bracket (36) is detachably connected to the vertical plate (3).
8. The water-cooled chassis assembly structure according to claim 2, characterized in that: A hard drive bracket (37) is provided on the back of the side plate (3) of the second radiator bracket (41). The hard drive bracket (37) is detachably connected to the side plate (3). The hard drive bracket (37) is located at the lower part of the multi-functional bracket (36).