Loudspeaker attaching device

By using the guide structure and positioning column design of the speaker bonding device, the deviation problem of the shock-absorbing pad during the bonding process is solved, achieving precise bonding and efficient operation, improving production efficiency and reducing costs.

CN224205252UActive Publication Date: 2026-05-05GANZHOU SHENGTONG ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GANZHOU SHENGTONG ELECTRONICS CO LTD
Filing Date
2025-05-29
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

The existing vibration damping pads for loudspeakers are prone to deviation during the pasting process, leading to operational difficulties, increased labor hours and production costs, and affecting production quality and efficiency.

Method used

A speaker bonding device was designed, comprising a jig, a guide structure, and a positioning post. The guide structure is used to accurately align the speaker hole, and the spring and connecting post are used to fix the shock-absorbing pad to achieve precise bonding.

Benefits of technology

It achieves precise alignment and secure fit of the shock-absorbing pads, which can be completed by a single person, reducing workload, improving production efficiency and reducing costs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224205252U_ABST
    Figure CN224205252U_ABST
Patent Text Reader

Abstract

The utility model discloses a loudspeaker attaching device which comprises a jig, a mounting port is arranged on the jig, a loudspeaker is detachably mounted in the mounting port, a damping cushion is arranged on the periphery of the top of the mounting port, and a guide structure is arranged on the top of the jig. By using the device, the damping cushion pad can be fixed on the jig and is not easy to shift and loosen; when the tool is used, back gummed paper of the damping cushion pad is torn off, a mounting hole site in the loudspeaker is inserted into a positioning column on the tool, then the tool is pressed forcibly, the damping cushion pad can be accurately aligned with the hole site of the loudspeaker and can be well bonded to the back face of the loudspeaker, rapid operation can be achieved through a single person, the workload is reduced, and benefits are increased.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of loudspeaker technology, specifically to a loudspeaker bonding device. Background Technology

[0002] In the manufacturing process of loudspeakers, in order to reduce resonance and achieve a good sealing effect, a shock-absorbing pad is usually attached to the mounting surface of the loudspeaker.

[0003] However, most existing shock-absorbing pads are glued on with adhesive backing. Due to the soft nature of the pads themselves, in actual operation, when the operator peels off the adhesive backing, the pads are prone to sticking together before they are accurately attached to the back of the speaker mounting plate. This can even lead to misalignment with the speaker holes or concentricity deviations. This not only makes it extremely difficult for employees to operate the pads and reduces their convenience, but also significantly increases labor hours and production costs. In addition, it also affects the production quality and efficiency of the speakers. Utility Model Content

[0004] The main objective of this invention is to provide a speaker bonding device to solve the aforementioned technical problems.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a speaker mounting device, including a fixture, the fixture having an installation port, a speaker being detachably mounted in the installation port, a shock-absorbing buffer pad being provided on the top outer periphery of the installation port, and a guide structure being provided on the top of the fixture.

[0006] Based on the above scheme and as a preferred embodiment of the above scheme: the guide structure includes a connecting block, the top of the connecting block is provided with a positioning post, and the bottom of the connecting block is provided with a connecting post.

[0007] Based on the above scheme and as a preferred embodiment of the above scheme: the fixture is provided with a support plate, the support plate is provided with several mounting slots, the mounting slots are provided with spring members, one end of the spring members is fixedly connected to the bottom wall of the mounting slot, and the other end is fixedly connected to the connecting column.

[0008] Based on the above scheme and as a preferred embodiment of the above scheme: the shock-absorbing buffer pad is provided with several openings, and the top of the positioning post extends upward through the openings.

[0009] Based on the above solution and as a preferred embodiment of the above solution: the speaker housing is provided with mounting holes that match the positioning posts.

[0010] The beneficial effects of this utility model are as follows: By using this device, the shock-absorbing buffer pad can be fixed on the fixture, and it is not easy to shift or loosen; when using it, peel off the adhesive paper on the back of the shock-absorbing buffer pad, insert the mounting hole on the speaker into the positioning post on the fixture, and then press it firmly. The shock-absorbing buffer pad can accurately align with the speaker hole and adhere well to the back of the speaker. A single person can operate it quickly, reducing workload and increasing efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0012] Figure 2 This is a perspective view of the fixture in this utility model;

[0013] Figure 3 This is a cross-sectional view of the present invention. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. However, the specific implementation methods and embodiments described below are for illustrative purposes only and are not intended to limit the present invention.

[0015] See attached diagram. Figures 1 to 3 The speaker bonding device in this embodiment includes a fixture 1, which has an installation port 10. A speaker 2 is detachably installed in the installation port 10. A shock-absorbing buffer pad 3 is provided on the outer periphery of the top of the installation port 10. A guide structure is provided on the top of the fixture 1.

[0016] In the above scheme, the guide structure includes a connecting block 4, with a positioning post 40 at the top and a connecting post 41 at the bottom.

[0017] In the above scheme, the fixture 1 is provided with a support plate 5, and a number of mounting slots are opened on the support plate 5. A spring member 42 is provided in the mounting slot. One end of the spring member 42 is fixedly connected to the bottom wall of the mounting slot, and the other end is fixedly connected to the connecting post 41. The spring member 42 is wrapped around the outer periphery of the connecting post 41.

[0018] In the above scheme, the shock-absorbing buffer pad 3 is provided with several openings, and the top of the positioning post 40 extends upward through the openings.

[0019] In the above scheme, the housing of the speaker 2 is provided with mounting holes that match the positioning post 40.

[0020] Working principle: This device can fix the shock-absorbing pad 3 on the fixture 1, and it is not easy to shift or loosen. When using it, peel off the adhesive paper on the back of the shock-absorbing pad 3, insert the mounting hole on the speaker 2 into the positioning post 40 on the fixture 1, and then press it down firmly.

[0021] Because some speakers 2 have protruding structures on their back surfaces, when pressure is applied, the spring 42 is pressed down, and the connecting post 41 moves downward, causing the connecting post 41 to be pressed into the mounting groove. The main purpose of the lowering of the connecting post 41 is to create space for the protruding structures on the back surfaces of the speakers 2, so that the shock-absorbing pad 3 and the back surface of the speakers 2 can fit together completely. With the use of this device, the shock-absorbing pad 3 can be accurately aligned with the speaker holes and can be well adhered to the back surface of the speakers 2. It can be operated quickly by a single person, reducing workload and increasing efficiency.

[0022] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Therefore, all equivalent changes made to the structure, shape, and principle of the present utility model should be covered within the scope of protection of the present utility model.

Claims

1. A speaker horn bonding device, characterized in that: The fixture (1) includes a mounting port (10) on which a speaker (2) is detachably mounted. A shock-absorbing buffer pad (3) is provided on the outer periphery of the top of the mounting port (10). A guide structure is provided on the top of the fixture (1).

2. The speaker bonding device according to claim 1, characterized in that: The guide structure includes a connecting block (4), with a positioning post (40) at the top and a connecting post (41) at the bottom.

3. A speaker bonding device according to claim 2, characterized in that: The fixture (1) is provided with a support plate (5), and a plurality of mounting slots are provided on the support plate (5). A spring (42) is provided in the mounting slot. One end of the spring (42) is fixedly connected to the bottom wall of the mounting slot, and the other end is fixedly connected to the connecting column (41).

4. A speaker bonding device according to claim 3, characterized in that: The shock-absorbing buffer pad (3) has several openings, and the top of the positioning post (40) extends upward through the openings.

5. A speaker bonding device according to claim 4, characterized in that: The speaker (2) has mounting holes on its housing that match the positioning post (40).