Engine control module circuit board and pressing structure thereof

Abstract

The utility model provides an engine control module circuit board and a lamination structure thereof, the lamination structure comprises a plurality of circuit boards to be laminated, each circuit board to be laminated comprises N-1 circuit board substrates and N steel plates, the N steel plates and the N-1 circuit board substrates are alternately arranged, each circuit board substrate comprises a hydrocarbon core plate, an FR-4 prepreg and an FR-4 core plate, and the hydrocarbon core plate, the FR-4 prepreg and the FR-4 core plate are alternately arranged. The hydrocarbon core plate is arranged on one surface of the FR-4 prepreg, and the FR-4 core plate is arranged on one surface, deviating from the FR-4 core plate, of the FR-4 prepreg. As the FR-4 core board has better rigidity and better thermal performance, and the hydrocarbon core board has the characteristic of low dielectric loss, can be suitable for a high-frequency environment, and can make up for the defects of the FR-4 core board, when the circuit board is manufactured by adopting a mode of mixing the FR-4 core board and the hydrocarbon core board, the problem of larger signal attenuation in the high-frequency environment can be solved, and the circuit board can be applied to the high-frequency environment. And the signal processing capability and the communication stability of the engine control module are ensured.

Description

Technical Field

[0001] This disclosure relates to the field of circuit board manufacturing technology, and in particular to an engine control module circuit board and its pressing structure. Background Technology

[0002] The engine control module (ECM) circuit board plays a crucial role in automobiles. Currently, the circuit board uses FR-4 (Flame Retardant 4) material throughout the entire process. First, an FR-4 core board is obtained, then a pre-stacked sheet is pre-stacked, and the steps are repeated. After the pre-stacking step is completed, copper foil is placed on the surface of the structure for lamination, and finally the outer layer circuitry is formed. FR-4 has good rigidity and good thermal performance, making it suitable for long-term operating environments.

[0003] However, as automotive electronic systems develop towards higher frequencies and higher speeds, FR-4 has certain drawbacks. Specifically, when the material is in a high-frequency environment, it exhibits high dielectric loss (e.g., dielectric loss of 0.02 to 0.025), and when transmitting high-frequency signals, there is significant signal attenuation, which affects the signal processing capability and stability of the engine control system. Utility Model Content

[0004] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide an engine control module circuit board and its pressing structure that effectively ensures signal transmission and structural strength.

[0005] The purpose of this disclosure is achieved through the following technical solution:

[0006] An engine control module circuit board pressing structure includes multiple circuit boards to be pressed. Each circuit board to be pressed includes N-1 circuit board substrates and N steel plates, with the N steel plates and N-1 circuit board substrates alternating, wherein N≥2. Each circuit board substrate includes a hydrocarbon core board, an FR-4 prepreg, and an FR-4 core board. The hydrocarbon core board is disposed on one side of the FR-4 prepreg, and the FR-4 core board is disposed on the side of the FR-4 prepreg facing away from the hydrocarbon core board, so that the FR-4 core board and the hydrocarbon core board are pressed together by the FR-4 prepreg.

[0007] In one embodiment, the FR-4 prepreg includes an FR-4 substrate and a prepreg substrate, with both sides of the FR-4 substrate abutting against the hydrocarbon core board and the prepreg substrate, respectively, and the prepreg substrate also abutting against the FR-4 core board.

[0008] In one embodiment, the engine control module circuit board pressing structure further includes multiple buffers, each of which is disposed between two adjacent circuit boards to be pressed.

[0009] In one embodiment, a buffer is provided between two adjacent steel plates of the circuit boards to be pressed together.

[0010] In one embodiment, the cushioning element is kraft paper.

[0011] In one embodiment, the number of kraft paper sheets is greater than or equal to 5.

[0012] In one embodiment, the thickness of the hydrocarbon core plate is 0.1mm-0.15mm.

[0013] In one embodiment, the thickness of the FR-4 core board is 1.0mm-1.2mm.

[0014] In one embodiment, the thickness of the FR-4 prepreg is 0.1mm-0.11mm.

[0015] An engine control module circuit board includes the engine control module circuit board pressing structure described in any of the above embodiments.

[0016] Compared with the prior art, this disclosure has at least the following advantages:

[0017] The aforementioned engine control module circuit board lamination structure has been changed from using FR-4 core boards throughout the entire process to a hybrid method using both FR-4 and hydrocarbon core boards. Because the FR-4 core board has better rigidity and thermal performance, it exhibits better communication stability in low- and mid-frequency environments. Meanwhile, the hydrocarbon core board has low dielectric loss (typically 0.002–0.004), making it suitable for high-frequency environments. This compensates for the shortcomings of the FR-4 core board, reduces signal delay, and improves data transmission speed. Therefore, when using a hybrid method of FR-4 and hydrocarbon core boards to manufacture the engine control module circuit board, the problem of significant signal attenuation in high-frequency environments can be solved, ensuring the signal processing capability and communication stability of the automotive engine control module. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the press-fit structure of the engine control module circuit board in one embodiment;

[0020] Figure 2 for Figure 1 The diagram shows the structure of the circuit board substrate in the engine control module circuit board lamination structure.

[0021] Figure 3 for Figure 1 A schematic diagram of the circuit board substrate of another embodiment of the engine control module circuit board pressing structure shown.

[0022] Reference numerals: 10, Engine control module circuit board pressing structure; 100, Circuit board to be pressed; 110, Circuit board substrate; 111, Hydrocarbon core board; 112, FR-4 prepreg; 1121, FR-4 substrate; 1122, Prepreg substrate; 113, FR-4 core board; 120, Steel plate; 200, Buffer component. Detailed Implementation

[0023] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0027] Please see Figure 1 and Figure 2This is an embodiment of the engine control module circuit board pressing structure 10 of the present invention, which includes a plurality of circuit boards 100 to be pressed. Each circuit board 100 to be pressed includes N-1 circuit board substrates 110 and N steel plates 120, with the N steel plates 120 and N-1 circuit board substrates 110 alternately arranged, wherein N≥2. Each circuit board substrate 110 includes a hydrocarbon core board 111, an FR-4 prepreg 112 and an FR-4 core board 113. The hydrocarbon core board 111 is disposed on one side of the FR-4 prepreg 112, and the FR-4 core board 113 is disposed on the side of the FR-4 prepreg 112 away from the hydrocarbon core board 111, so that the FR-4 core board 113 and the hydrocarbon core board 111 are pressed together by the FR-4 prepreg 112. Specifically, the FR-4 prepreg 112 is heated by raising the temperature to bond the hydrocarbon core board 111 and the FR-4 core board 113. It can be understood that multiple circuit board substrates 110 and multiple steel plates 120 are alternately arranged, and the specific stacking sequence is "steel plate 120 - circuit board substrate 110 - steel plate 120 - circuit board substrate 110 - steel plate 120 - circuit board substrate 110 - steel plate 120...". For example, when N=3, the circuit board 100 to be laminated includes 2 circuit board substrates 110 and 3 steel plates 120, and the specific stacking sequence is "steel plate 120 - circuit board substrate 110 - steel plate 120 - circuit board substrate 110 - steel plate 120"; as another example, when N=4, the circuit board 100 to be laminated includes 3 circuit board substrates 110 and 4 steel plates 120, and the specific stacking sequence is "steel plate 120 - circuit board substrate 110 - steel plate 120 - circuit board substrate 110 - steel plate 120 - circuit board substrate 110 - steel plate 120".

[0028] In this embodiment, the engine control module circuit board lamination structure 10 is changed from using FR-4 core board 113 throughout to a method that uses a mixture of FR-4 core board 113 and hydrocarbon core board 111. Since FR-4 core board 113 has good rigidity and good thermal performance, it has good communication stability in low and medium frequency environments. On the other hand, hydrocarbon core board 111 has the characteristic of low dielectric loss (dielectric loss is usually 0.002 to 0.004), which is suitable for high frequency environments. This can make up for the shortcomings of FR-4 core board 113, reduce signal delay, and improve data transmission speed. Thus, when the engine control module circuit board is made using a mixture of FR-4 core board 113 and hydrocarbon core board 111, the problem of large signal attenuation in high frequency environments can be solved, ensuring the signal processing capability and communication stability of the automotive engine control module. It is understandable that in high-frequency environments, using FR-4 material throughout will result in signal attenuation and transmission delay. While using hydrocarbon core board 111 throughout can compensate for the signal attenuation problem of FR-4, its mechanical strength is low and it is easily damaged by external forces. When the two are combined, signal transmission stability and communication efficiency can be guaranteed in high-frequency environments, while also taking into account the overall structural strength of the circuit board, ensuring that the automotive engine can operate normally when using the aforementioned circuit board.

[0029] like Figure 3 As shown, in one embodiment, the FR-4 prepreg 112 includes an FR-4 substrate 1121 and a prepreg substrate 1122. Both sides of the FR-4 substrate 1121 abut against the hydrocarbon core board 111 and the prepreg substrate 1122, respectively. The prepreg substrate 1122 also abuts against the FR-4 core board 113. It can be understood that this embodiment represents the structural state of the circuit board substrate 110 before lamination. After the above structure is pre-stacked, the structure and the steel plate 120 are placed together in a hot press for lamination. During lamination, the temperature rises, and the prepreg substrate 1122 melts as the temperature rises, becoming a flowing liquid adhesive that adheres to the FR-4 substrate 1121. The FR-4 substrate 1121 serves as a carrier for the flowing liquid adhesive, allowing the hydrocarbon core board 111 and the prepreg substrate 1122 to bond through this carrier. When multiple circuit board substrates 110 and multiple steel plates 120 are laminationd in a hot press, a circuit board is formed. In this process, the semi-cured substrate 1122 is melted and attached to the FR-4 substrate 1121 to form the aforementioned FR-4 semi-cured sheet 112.

[0030] like Figure 1As shown, in one embodiment, the engine control module circuit board pressing structure 10 further includes multiple buffers 200. Each buffer 200 is disposed between two adjacent circuit boards 100 to be pressed, so that in subsequent pressing steps, the buffer 200 is used to disperse the pressure during pressing and prevent structural deformation or damage to the circuit board substrate 110 due to local stress concentration. Furthermore, a buffer 200 is disposed between the steel plates 120 of two adjacent circuit boards 100 to be pressed, to separate the two adjacent steel plates 120 and prevent interaction between the two steel plates 120. It can also indirectly buffer the circuit board substrate 110 to prevent damage.

[0031] In this embodiment, the buffer 200 is made of kraft paper. Besides providing cushioning during pressing, the kraft paper also prevents surface wear caused by friction between adjacent circuit boards 100 to be pressed. Furthermore, the number of kraft paper sheets is greater than or equal to 5. In a preferred embodiment, the number of kraft paper sheets is 10 to ensure sufficient thickness to buffer and distribute pressure on the pressing module of the hot pressing device, preventing damage to the circuit board substrate 110 and the steel plate 120.

[0032] Of course, in other embodiments, the buffer 200 may also be made of rubber so that the two adjacent circuit boards 100 to be pressed together can act as a buffer during pressing.

[0033] In one embodiment, the thickness of the hydrocarbon core plate 111 is 0.1mm-0.15mm. In this embodiment, the thickness of the hydrocarbon core plate 111 is 0.15mm.

[0034] In one embodiment, the thickness of the FR-4 core board 113 is 1.0mm-1.2mm. In this embodiment, the thickness of the FR-4 core board 113 is 1.2mm.

[0035] In one embodiment, the thickness of the FR-4 prepreg 112 is 0.1 mm to 0.11 mm. In this embodiment, the thickness of the FR-4 prepreg 112 is 0.11 mm.

[0036] This disclosure also provides an engine control module circuit board, including the engine control module circuit board pressing structure 10 of any of the above embodiments.

[0037] Compared with the prior art, this disclosure has at least the following advantages:

[0038] The aforementioned engine control module circuit board lamination structure 10 is changed from using FR-4 core board 113 throughout to a mixed method of using FR-4 core board 113 and hydrocarbon core board 111. Because FR-4 core board 113 has better rigidity and better thermal performance, it has better communication stability in low and medium frequency environments. On the other hand, hydrocarbon core board 111 has the characteristic of low dielectric loss (dielectric loss is usually 0.002~0.004), which is suitable for high frequency environments. It can make up for the shortcomings of FR-4 core board 113, reduce signal delay, and improve data transmission speed. Thus, when the engine control module circuit board is made using a mixed method of FR-4 core board 113 and hydrocarbon core board 111, the problem of large signal attenuation in high frequency environments can be solved, ensuring the signal processing capability and communication stability of the automotive engine control module.

[0039] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A pressing structure for an engine control module circuit board, characterized in that, It includes multiple circuit boards to be pressed together, each of the circuit boards to be pressed together includes N-1 circuit board substrates and N steel plates, the N steel plates and the N-1 circuit board substrates are alternately arranged, wherein N≥2; Each of the circuit board substrates includes a hydrocarbon core board, an FR-4 prepreg, and an FR-4 core board. The hydrocarbon core board is disposed on one side of the FR-4 prepreg, and the FR-4 core board is disposed on the side of the FR-4 prepreg facing away from the hydrocarbon core board, so that the FR-4 core board and the hydrocarbon core board are bonded together by the FR-4 prepreg.

2. The engine control module circuit board pressing structure according to claim 1, characterized in that, The FR-4 prepreg includes an FR-4 substrate and a prepreg substrate. Both sides of the FR-4 substrate abut against the hydrocarbon core board and the prepreg substrate, respectively. The prepreg substrate also abuts against the FR-4 core board.

3. The engine control module circuit board pressing structure according to claim 1, characterized in that, The engine control module circuit board pressing structure also includes multiple buffer components, each of which is disposed between two adjacent circuit boards to be pressed.

4. The engine control module circuit board pressing structure according to claim 3, characterized in that, A buffer is provided between the steel plates of two adjacent circuit boards to be pressed together.

5. The engine control module circuit board pressing structure according to claim 3, characterized in that, The cushioning element is made of kraft paper.

6. The engine control module circuit board pressing structure according to claim 5, characterized in that, The number of kraft paper sheets is greater than or equal to 5.

7. The engine control module circuit board pressing structure according to claim 1, characterized in that, The thickness of the hydrocarbon core board is 0.1mm-0.15mm.

8. The engine control module circuit board pressing structure according to claim 1, characterized in that, The thickness of the FR-4 core board is 1.0mm-1.2mm.

9. The engine control module circuit board pressing structure according to claim 1, characterized in that, The thickness of the FR-4 prepreg is 0.1mm-0.11mm.

10. An engine control module circuit board, characterized in that, Includes the engine control module circuit board pressing structure as described in any one of claims 1-9.

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