Heat dissipation assembly, radio frequency power supply device and electronic equipment

Abstract

The utility model provides a heat dissipation assembly, a radio frequency power supply device and electronic equipment, and relates to the technical field of radio frequency. The heat dissipation assembly comprises a main heat dissipation plate and a branch heat dissipation plate. The main heat dissipation plate is provided with a first inner channel. The branch heat dissipation plate is connected with the main heat dissipation plate, and the branch heat dissipation plate is provided with a second inner channel. Wherein the first inner channel and the second inner channel are communicated at the joint of the main heat dissipation plate and the branch heat dissipation plate, and the first inner channel and the second inner channel which are communicated are used for containing cooling liquid, so that the main heat dissipation plate and the branch heat dissipation plate exchange heat with the surrounding environment. According to the invention, the three-dimensional inner channel of the heat dissipation assembly can be realized.

Description

Technical Field

[0001] This application relates to the field of radio frequency technology, and in particular to a heat dissipation component, a radio frequency power supply device, and an electronic device. Background Technology

[0002] Currently, with the development of radio frequency (RF) power supply technology, RF power supply devices are increasingly widely used in various fields. RF power supplies have high power and high heat dissipation requirements. With the continuous increase in heat loss, higher demands are placed on the internal heat dissipation of RF power supplies, especially the need for more effective heat dissipation within a limited space. Existing air-cooled heat dissipation components are insufficient, and liquid-cooled heat dissipation components, often with planar internal channels, also struggle to provide effective heat dissipation within limited space. Therefore, how to provide more effective heat dissipation within limited space, particularly by realizing a three-dimensional internal channel design for liquid-cooled heat dissipation components, has become a problem that needs to be considered. Utility Model Content

[0003] This application provides a heat dissipation component, an RF power supply device, and an electronic device, which can realize a three-dimensional internal channel for the heat dissipation component.

[0004] In a first aspect, a heat dissipation assembly is provided, comprising a main heat sink and branch heat sinks. The main heat sink has a first inner channel. The branch heat sinks are connected to the main heat sink and have a second inner channel. The first inner channel and the second inner channel communicate at the connection between the main heat sink and the branch heat sinks, and the communicating first inner channel and second inner channel are used to contain cooling liquid, thereby enabling heat exchange between the main heat sink and the branch heat sinks and the surrounding environment.

[0005] In one possible implementation, the main heat sink further has a first connecting hole that communicates with the first inner channel. The branch heat sink is correspondingly provided with a first mounting portion, which includes a first mounting hole that communicates with the second inner channel. The first mounting portion is fitted into the first connecting hole, allowing the main heat sink to connect with the branch heat sink. The first mounting hole also communicates with the first inner channel, allowing the first inner channel to communicate with the second inner channel.

[0006] In one possible implementation, the main heat sink further includes a liquid inlet and a liquid outlet, which are located at opposite ends of the first inner channel. The liquid inlet is for the inflow of cooling liquid, and the liquid outlet is for the outflow of cooling liquid, ensuring that the cooling liquid flows at least within the first inner channel.

[0007] In one possible implementation, the first connecting hole includes a first sub-connecting hole and a second sub-connecting hole, both of which communicate with the first inner channel. The first and second sub-connecting holes are located between the inlet and the outlet, and are spaced apart. The first mounting portion includes a first sub-mounting portion and a second sub-mounting portion, each including a first sub-mounting hole and a second sub-mounting hole communicating with the second inner channel. The first sub-mounting portion is fitted inside the first sub-connecting hole, and the second sub-mounting portion is fitted inside the second sub-connecting hole. Both the first and second sub-mounting holes also communicate with the first inner channel. The first and second sub-mounting portions are located at both ends of the second inner channel, allowing cooling liquid to flow in from the inlet, be transported through the communicating first and second inner channels, and then flow out from the outlet.

[0008] In one possible implementation, the first inner channel includes a main channel, a first branch channel, and a second branch channel, both of which are connected to the main channel. The main channel has an inlet and an outlet at its two ends, respectively. Cooling liquid flowing in through the inlet flows out through the main channel and exits through the outlet, forming a first liquid passage. The first branch channel has an inlet and a first sub-connection hole at its two ends, respectively. The second branch channel has an outlet and a second sub-connection hole at its two ends, respectively. Cooling liquid flowing in through the inlet flows out through the first branch channel, the second inner channel, and the second branch channel sequentially, exiting through the outlet, forming a second liquid passage.

[0009] In one possible implementation, the branch heat sink further includes a sealing ring, which is sleeved on the outer periphery of the first mounting portion and is interference-fitted between the first mounting portion and the first connecting hole.

[0010] In one possible implementation, the branch heat sink further has at least one main body connection portion, each main body connection portion being used to connect to the heat-generating body, the main heat sink and the branch heat sink being used to exchange heat with the heat generated by the heat-generating body.

[0011] In one possible implementation, the branch heat sink further has a flow guide for guiding the passing gas.

[0012] Secondly, a radio frequency (RF) power supply device is also provided, comprising a heat dissipation assembly. The heat dissipation assembly includes a main heat sink and branch heat sinks. The main heat sink has a first inner channel. The branch heat sinks are connected to the main heat sink and have second inner channels. The first and second inner channels communicate at the connection between the main heat sink and the branch heat sinks, and the communicating first and second inner channels are used to contain cooling liquid, allowing the main heat sink and the branch heat sinks to exchange heat with the surrounding environment.

[0013] Thirdly, an electronic device is also provided, the electronic device including a radio frequency power supply device. The radio frequency power supply device includes a heat dissipation component.

[0014] The heat dissipation assembly, radio frequency power supply device, and electronic device of this application are configured with a main heat sink having a first inner channel and a branch heat sink having a second inner channel, and the branch heat sink is connected to the main heat sink so that the first inner channel and the second inner channel are connected at the connection between the main heat sink and the branch heat sink, thereby realizing a three-dimensional inner channel of the heat dissipation assembly. Furthermore, by setting the connected first inner channel and the second inner channel to contain cooling liquid, the main heat sink and the branch heat sink can exchange heat with the surrounding environment, providing more effective heat dissipation in a limited space. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0016] Figure 1 This is a schematic diagram of the first state of the heat dissipation component in some embodiments of this application.

[0017] Figure 2 This is a cross-sectional schematic diagram of a heat dissipation component in a first direction in some embodiments of this application.

[0018] Figure 3 This is a schematic diagram of the second state of the heat dissipation component in some embodiments of this application.

[0019] Figure 4 This is a cross-sectional schematic diagram of the heat dissipation component in a second direction in some embodiments of this application.

[0020] Figure 5 for Figure 4 The diagram shows an enlarged view of the heat dissipation component at point A.

[0021] Figure 6 This is a schematic diagram of the first internal water channel of a heat dissipation component in some embodiments of this application.

[0022] Figure 7 This is a schematic diagram illustrating the interaction between the heat dissipation component and the heat-generating body in some embodiments of this application.

[0023] Figure 8 This is another schematic diagram showing the cooperation between the heat dissipation component and the heat-generating body in some embodiments of this application.

[0024] Figure 9 This is a schematic diagram of a heat dissipation component in some embodiments of this application.

[0025] Figure 10 This is a schematic diagram of an electronic device in some embodiments of this application.

[0026] Explanation of reference numerals in the attached drawings: 1. Electronic device; 10. Heat dissipation assembly; 100. Main heat sink; 110. First inner channel; 111. Main channel; 112. First branch channel; 113. Second branch channel; 120. Liquid inlet; 130. Liquid outlet; 140. First connecting hole; 141. First sub-connecting hole; 142. Second sub-connecting hole; 200. Branch heat sink; 210. Second inner channel; 220. First mounting part; 221. First sub-mounting part; 222. Second sub-mounting part; 220a. First mounting hole; 223. First sub-mounting hole; 224. Second sub-mounting hole; 230. Main body connecting part; 231. Locking part; 232. Welding part; 240. Sealing ring; 250. Flow guiding part; 20. Radio frequency power supply device; 30. First heating body; 40. Second heating body; 50. Third heating body. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0028] In the description of the embodiments of this application, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer" and other terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this application and simplifying the description, and do not imply or indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0029] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0031] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or devices.

[0032] Please refer to the following: Figure 1 , Figure 2 , Figure 1 This is a schematic diagram of the first state of the heat dissipation component in some embodiments of this application. Figure 2 This is a cross-sectional schematic diagram of a heat dissipation assembly in a first direction in some embodiments of this application. The first state of the heat dissipation assembly 10 can be the state when the branch heat dissipation plate 200 is connected to the main heat dissipation plate 100, and the first direction can be the length direction of the branch heat dissipation plate 200. For example... Figure 1 , Figure 2 As shown, this application provides a heat dissipation assembly 10, which includes a main heat sink 100 and branch heat sinks 200. The main heat sink 100 has a first inner channel 110. The branch heat sink 200 is connected to the main heat sink 100 and has a second inner channel 210. The first inner channel 110 and the second inner channel 210 communicate at the connection between the main heat sink 100 and the branch heat sink 200, and the communicating first inner channel 110 and second inner channel 210 are used to contain cooling liquid so that the main heat sink 100 and the branch heat sink 200 can exchange heat with the surrounding environment.

[0033] Therefore, the heat dissipation assembly 10 described above in this application, by configuring the main heat dissipation plate 100 to have a first inner channel 110 and the branch heat dissipation plate 200 to have a second inner channel 210, and configuring the branch heat dissipation plate 200 to be connected to the main heat dissipation plate 100, so that the first inner channel 110 and the second inner channel 210 are connected at the connection between the main heat dissipation plate 100 and the branch heat dissipation plate 200, a three-dimensional inner channel of the heat dissipation assembly 10 is realized. Furthermore, by setting the connected first inner channel 110 and the second inner channel 210 to contain cooling liquid, the main heat dissipation plate 100 and the branch heat dissipation plate 200 can exchange heat with the surrounding environment, providing more effective heat dissipation in a limited space.

[0034] Furthermore, the main heat sink 100 and the branch heat sink 200 have low cost, are easy to process and assemble, and save space. By connecting the branch heat sink 200 to the main heat sink 100, the first inner channel 110 and the second inner channel 210 can be connected at the connection between the main heat sink 100 and the branch heat sink 200, which can also realize the complex three-dimensional inner channel inside the heat dissipation component 10.

[0035] In some embodiments, the cooling liquid refers to the liquid used for cooling, which may be water, glycerol-based coolant, or other cooling liquids.

[0036] Please refer to the following: Figure 3 , Figure 3 This is a schematic diagram of the second state of the heat dissipation assembly in some embodiments of this application, wherein the second state of the heat dissipation assembly 10 can be the state when the branch heat dissipation plate 200 is disassembled from the main heat dissipation plate 100. For example... Figure 1 , Figure 2 , Figure 3 As shown, the main heat sink 100 also has a first connecting hole 140, which communicates with the first inner channel 110. The branch heat sink 200 is correspondingly provided with a first mounting part 220, which includes a first mounting hole 220a communicating with the second inner channel 210. The first mounting part 220 is sleeved in the first connecting hole 140 so that the main heat sink 100 and the branch heat sink 200 are connected. The first mounting hole 220a also communicates with the first inner channel 110 so that the first inner channel 110 communicates with the second inner channel 210.

[0037] Therefore, the heat dissipation assembly 10 described above in this application, by configuring the main heat dissipation plate 100 to have a first connection hole 140, the first connection hole 140 communicating with the first inner channel 110, and configuring the branch heat dissipation plate 200 to have a corresponding first mounting part 220, the first mounting part 220 including a first mounting hole 220a communicating with the second inner channel 210, and the first mounting part 220 being sleeved in the first connection hole 140, thereby realizing the connection between the main heat dissipation plate 100 and the branch heat dissipation plate 200, and the first mounting hole 220a also communicating with the first inner channel 110, enabling the first inner channel 110 to communicate with the second inner channel 210, combining the two planar inner channels 110 and 210 into a complex three-dimensional inner channel.

[0038] In some embodiments, to meet user needs, a wind-cooled heat dissipation component 10 is provided, wherein the branch heat dissipation plate 200 is detachably connected to the main heat dissipation plate 100, and the branch heat dissipation plate 200 can be replaced with a wind-cooled heat dissipation plate.

[0039] like Figure 1 , Figure 2 , Figure 3 As shown, the main heat sink 100 also has a liquid inlet 120 and a liquid outlet 130, which are located at both ends of the first inner channel 110. The liquid inlet 120 is used for the inflow of cooling liquid, and the liquid outlet 130 is used for the outflow of cooling liquid, so that the cooling liquid flows at least within the first inner channel 110.

[0040] Therefore, the heat dissipation component 10 described above in this application, by providing an inlet 120 and an outlet 130 at both ends of the first inner channel 110, enables the cooling liquid flowing into the inlet 120 to flow at least within the first inner channel 110 and to flow out through the outlet 130.

[0041] Please refer to the following: Figure 4 , Figure 5 , Figure 4 This is a schematic cross-sectional view of the heat dissipation assembly in a second direction in some embodiments of this application. Figure 5 for Figure 4 The diagram shows an enlarged view of the heat dissipation assembly at point A, where the second direction can be the width direction of the branch heat dissipation plate 200. (See diagram below.) Figures 1-5As shown, the first connecting hole 140 includes a first sub-connecting hole 141 and a second sub-connecting hole 142. Both the first sub-connecting hole 141 and the second sub-connecting hole 142 communicate with the first inner channel 110, and are located between the liquid inlet 120 and the liquid outlet 130, and are spaced apart. The first mounting part 220 includes a first sub-mounting part 221 and a second sub-mounting part 222. The first sub-mounting part 221 and the second sub-mounting part 222 respectively include a first sub-mounting hole 223 and a second sub-mounting hole 224 communicating with the second inner channel 210. The first sub-mounting part 221 is fitted inside the first sub-connecting hole 141, and the second sub-mounting part 222 is fitted inside the second sub-connecting hole 142. The first sub-mounting hole 223 and the second sub-mounting hole 224 also communicate with the first inner channel 110. The first sub-mounting part 221 and the second sub-mounting part 222 are disposed at both ends of the second inner channel 210, so that after the cooling liquid flows in from the inlet 120, it is transported to the outlet 130 through the connected first inner channel 110 and the second inner channel 210 and then flows out.

[0042] Therefore, the heat dissipation assembly 10 described above in this application, by configuring the first connection hole 140 to include a first sub-connection hole 141 and a second sub-connection hole 142 that are both connected to the first inner channel 110, and the first sub-mounting part 221 and the second sub-mounting part 222 respectively including a first sub-mounting hole 223 and a second sub-mounting hole 224 that are connected to the second inner channel 210, and then the first sub-mounting part 221 and the second sub-mounting part 222 are disposed at both ends of the second inner channel 210, so that the cooling liquid flows in from the inlet 120, is transmitted through the connected first inner channel 110 and the second inner channel 210 to the outlet 130 and then flows out, thereby allowing the cooling liquid to flow in the first inner channel 110 and the second inner channel 210.

[0043] Please refer to the following: Figure 6 , Figure 6 This is a schematic diagram of the first internal water channel of a heat dissipation assembly in some embodiments of this application. For example... Figure 1 , Figure 2 , Figure 3 , Figure 6As shown, the first inner channel 110 includes a main channel 111, a first branch channel 112, and a second branch channel 113, both of which are connected to the main channel 111. The main channel 111 has an inlet 120 and an outlet 130 at its two ends. Cooling liquid flowing in through the inlet 120 flows out through the main channel 111 and exits through the outlet 130, forming a first liquid passage. The first branch channel 112 has an inlet 120 and a first sub-connection hole 141 at its two ends, and the second branch channel 113 has an outlet 130 and a second sub-connection hole 142 at its two ends. Cooling liquid flowing in through the inlet 120 flows sequentially through the first branch channel 112, the second inner channel 210, and the second branch channel 113, exiting through the outlet 130, forming a second liquid passage.

[0044] Therefore, the heat dissipation component 10 described above in this application, by setting the first inner channel 110 including the main channel 111, the first branch channel 112 and the second branch channel 113, can provide more comprehensive heat dissipation. The cooling liquid flowing in through the inlet 120 flows out through the main channel 111 and out through the outlet 130 to form a first liquid passage, which mainly exchanges heat with the surrounding environment of the main heat dissipation plate 100. The cooling liquid flowing in through the inlet 120 flows out through the outlet 130 in sequence through the first branch channel 112, the second inner channel 210 and the second branch channel 113 to form a second liquid passage, which mainly exchanges heat with the surrounding environment of the branch heat dissipation plate 200.

[0045] Please participate again. Figure 4 , Figure 5 .like Figures 1-5 As shown, the branch heat sink 200 also includes a sealing ring 240, which is sleeved on the outer periphery of the first mounting part 220 and is interference-fitted between the first mounting part 220 and the first connecting hole 140.

[0046] Therefore, the heat dissipation component 10 described above in this application, by providing a sealing ring 240, can prevent coolant from flowing out from the connection between the branch heat dissipation plate 200 and the main heat dissipation plate 100.

[0047] Please refer to the following: Figure 7 , Figure 7 This is a schematic diagram illustrating the cooperation between the heat dissipation component and the heat-generating body in some embodiments of this application. For example... Figure 3 , Figure 7 As shown, the branch heat sink 200 also has at least one main body connection portion 230, each main body connection portion 230 is used to connect with the heat-generating body, and the main heat sink 100 and the branch heat sink 200 exchange heat with the heat generated by the heat-generating body.

[0048] Therefore, the heat dissipation assembly 10 described above in this application can be connected to the heat-generating body by configuring each main body connection part 230, and the main heat dissipation plate 100 and the branch heat dissipation plate 200 can exchange heat generated by the heat-generating body.

[0049] Please refer to the following: Figure 8 , Figure 8 This is another schematic diagram illustrating the cooperation between the heat dissipation component and the heat-generating body in some embodiments of this application. For example... Figure 3 , Figure 8 As shown, the branch heat sink 200 also has a flow guide 250, which is used to guide the gas passing through.

[0050] Therefore, the heat dissipation component 10 described above in this application, by providing the flow guide 250, can be compatible with both water cooling and air cooling methods to guide the gas passing through the flow guide 250.

[0051] In some embodiments, the flow guide 250 extends toward one side of the principle branch heat sink 200.

[0052] Furthermore, the branch heat sink 200 can be connected to the main heat sink 100 through the airflow guide 250.

[0053] Please refer to it again. Figure 3 .like Figure 3 , Figure 7 , Figure 8 As shown, the heating element may include a first heating element 30, a second heating element 40, and a third heating element 50. Correspondingly, at least one main body connecting portion 230 includes at least one locking portion 231 and at least one welding portion 232. The second heating element 40 is locked to the branch heat sink 200 through the corresponding locking portion 231, and the third heating element 50 is welded to the branch heat sink 200 through each welding portion 232. The first heating element 30 may be disposed on the side of the main heat sink 100 away from the branch heat sink 200.

[0054] In some embodiments, the first heating element 30 can be a functional component, the second heating element 40 can be a power device, and the third heating element 50 can be a printed circuit board.

[0055] The heat dissipation component 10 of this application, through the above structure, can realize a complex three-dimensional internal channel inside the heat dissipation component 10. The cooling liquid in the three-dimensional internal channel circulates, which further increases the heat dissipation effect. Moreover, the heat dissipation component 10 has low cost, is simple to process and assemble, saves space, and provides more effective heat dissipation in a limited space.

[0056] Please see Figure 9 , Figure 9 This is a schematic diagram of a heat dissipation component in some embodiments of this application. For example... Figure 9 As shown, this application also provides a radio frequency power supply device 20, which includes the heat dissipation component 10 in any of the foregoing embodiments.

[0057] Please refer to it again. Figure 1 .like Figure 1 As shown, the heat dissipation assembly 10 includes a main heat sink 100 and branch heat sinks 200. The main heat sink 100 has a first inner channel 110. The branch heat sink 200 is connected to the main heat sink 100 and has a second inner channel 210. The first inner channel 110 and the second inner channel 210 communicate at the connection between the main heat sink 100 and the branch heat sink 200, and the communicating first inner channel 110 and second inner channel 210 are used to contain cooling liquid so that the main heat sink 100 and the branch heat sink 200 can exchange heat with the surrounding environment.

[0058] For a more specific description of the structure of the heat dissipation component 10, please refer to the relevant content of the heat dissipation component 10 in any of the foregoing embodiments, which will not be repeated here.

[0059] In some embodiments, the RF power supply device 20 may further include a heat-generating body, which may include functional components such as RF power amplifier components and impedance matching components. The heat-generating body may also include various power devices and control boards such as printed circuit boards. The heat dissipation component 10 is used to dissipate heat from the heat-generating body.

[0060] The heat dissipation component 10 and the radio frequency power supply device 20 of this application, through the above-described structure, can realize a complex three-dimensional internal channel inside the heat dissipation component 10. The cooling liquid in the three-dimensional internal channel circulates, which further increases the heat dissipation effect. Moreover, the heat dissipation component 10 has a low cost, is simple to process and assemble, saves space, and provides more effective heat dissipation in a limited space.

[0061] Please see Figure 10 , Figure 10 This is a schematic diagram of an electronic device in some embodiments of this application. For example... Figure 10 As shown, this application also provides an electronic device 1, which includes the radio frequency power supply device 20 in any of the foregoing embodiments.

[0062] Please refer to it again. Figure 9 .like Figure 9 As shown, the radio frequency power supply device 20 includes a heat dissipation component 10.

[0063] For a more specific description of the structure of the radio frequency power supply device 20, please refer to the relevant content of the radio frequency power supply device 20 in any of the foregoing embodiments, which will not be repeated here.

[0064] The heat dissipation component 10, the radio frequency power supply device 20, and the electronic device 1 of this application can realize a complex three-dimensional internal channel inside the heat dissipation component 10. The cooling liquid in the three-dimensional internal channel circulates, which further increases the heat dissipation effect. Moreover, the heat dissipation component 10 has low cost, is simple to process and assemble, saves space, and provides more effective heat dissipation in a limited space.

[0065] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation component, characterized in that, include: The main heat sink has a first internal channel; A branch heat sink is connected to the main heat sink, and the branch heat sink has a second inner channel; The first inner channel and the second inner channel are connected at the connection between the main heat sink and the branch heat sink, and the connected first inner channel and the second inner channel are used to contain cooling liquid so that the main heat sink and the branch heat sink can exchange heat with the surrounding environment.

2. The heat dissipation assembly according to claim 1, characterized in that, The main heat sink also has a first connection hole, which communicates with the first inner channel; The branch heat sink is provided with a first mounting part, which includes a first mounting hole that communicates with the second inner channel. The first mounting part is sleeved in the first connecting hole so that the main heat sink is connected to the branch heat sink. The first mounting hole also communicates with the first inner channel so that the first inner channel communicates with the second inner channel.

3. The heat dissipation assembly according to claim 2, characterized in that, The main heat sink also has a liquid inlet and a liquid outlet, which are located at both ends of the first inner channel; The inlet is used for the inflow of cooling liquid, and the outlet is used for the outflow of cooling liquid, so that the cooling liquid flows at least within the first inner channel.

4. The heat dissipation assembly according to claim 3, characterized in that, The first connecting hole includes a first sub-connecting hole and a second sub-connecting hole. Both the first sub-connecting hole and the second sub-connecting hole are connected to the first inner channel. The first sub-connecting hole and the second sub-connecting hole are located between the liquid inlet and the liquid outlet and are spaced apart. The first mounting part includes a first sub-mounting part and a second sub-mounting part. The first sub-mounting part and the second sub-mounting part respectively include a first sub-mounting hole and a second sub-mounting hole that communicate with the second inner channel. The first sub-mounting part is sleeved in the first sub-connecting hole, and the second sub-mounting part is sleeved in the second sub-connecting hole. The first sub-mounting hole and the second sub-mounting hole also communicate with the first inner channel. The first sub-mounting part and the second sub-mounting part are disposed at both ends of the second inner channel, so that after the cooling liquid flows in from the inlet, it is transported to the outlet through the connected first inner channel and the second inner channel and then flows out.

5. The heat dissipation assembly according to claim 4, characterized in that, The first inner passage includes a main passage, a first branch passage, and a second branch passage, both of which are connected to the main passage. The two ends of the main channel are the liquid inlet and the liquid outlet, respectively. Cooling liquid flowing in through the liquid inlet flows out through the main channel and the liquid outlet to form a first liquid passage. The first branch channel has the liquid inlet and the first sub-connection hole at its two ends, respectively. The second branch channel has the liquid outlet and the second sub-connection hole at its two ends, respectively. Cooling liquid flowing in through the liquid inlet flows out through the liquid outlet in sequence through the first branch channel, the second inner channel and the second branch channel to form a second liquid passage.

6. The heat dissipation assembly according to claim 2, characterized in that, The branch heat sink plate also includes a sealing ring, which is sleeved on the outer periphery of the first mounting part and is interference-fitted between the first mounting part and the first connecting hole.

7. The heat dissipation assembly according to claim 1, characterized in that, The branch heat sink also has at least one main body connection part, each main body connection part is used to connect with the heat-generating body, and the main heat sink and the branch heat sink are used to exchange heat with the heat generated by the heat-generating body.

8. The heat dissipation assembly according to claim 1, characterized in that, The branch heat sink also has a flow guide section, which is used to guide the gas passing through.

9. A radio frequency power supply device, characterized in that, Includes the heat dissipation component as described in any one of claims 1-8.

10. An electronic device, characterized in that, Includes the radio frequency power supply device as described in claim 9.

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