Double-sided heat dissipation packaging unit

Abstract

The utility model belongs to the technical field of semiconductor devices, and particularly discloses a double-sided heat dissipation packaging unit which comprises a frame body, the frame body is provided with a first pin group and a second pin group, and the frame body is also provided with a chip; the connecting piece is used for connecting the second pin group and the chip; the plastic package body is arranged on the frame, at least one part of the bottom, far away from the chip, of the frame body is exposed out of the plastic package body, and at least one part of the top, far away from the chip, of the connecting piece is exposed out of the plastic package body. According to the utility model, the frame body connected with the chip and one part of the connecting piece are exposed out of the plastic package body, so that the heat dissipation efficiency is improved, the internal environment of the package unit is ensured to be maintained at a stable temperature, the chip works more stably, the service life of the chip is prolonged, and meanwhile, the service life of the chip is prolonged. The pins in the second pin group are all integrally arranged, so that the current-carrying capability of the package can be effectively improved, the use performance of the package is improved, the anti-fatigue capability is stronger, and the service life is longer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device technology, and in particular to a double-sided heat dissipation packaging unit. Background Technology

[0002] In recent years, the new energy vehicle industry has experienced rapid development, a trend that has also strongly driven the synchronous development of the semiconductor field. With the continuous advancement of new energy vehicle technology, the requirements for new semiconductor devices are becoming increasingly stringent. They not only need to be miniaturized and thin, but also capable of withstanding greater current and power, while also having a longer fatigue life. Among the many electronic components in new energy vehicles, the main ones include battery management systems, motor controllers, vehicle controllers, and body controllers. Power chips account for 55% of semiconductor devices. These figures clearly demonstrate that electronic components account for a significant portion of the cost of new energy vehicles, and that these components have a decisive impact on the performance and safety of these vehicles.

[0003] Currently, the main packaging forms for automotive-grade power devices include DFN5*6, DFN3*3, STOLL, and TO-247. Among them, the DFN5*6 package is mainly used in water pump motors, EPS (electronic power steering systems), and brakes. However, to meet customers' future demands for high temperature, high frequency, and high current, the DFN5*6 package urgently needs iteration. Current packaging units have poor heat dissipation, typically achieved by adding heat sinks, but this results in structural redundancy within the package and further increases its size. In view of this, the applicant proposes a double-sided heat dissipation packaging unit. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a double-sided heat dissipation packaging unit to solve the problems of redundant heat dissipation structure and excessive packaging volume in the prior art.

[0005] To achieve the above and other related objectives, this utility model provides a double-sided heat dissipation packaging unit, comprising:

[0006] The frame body is provided with a first pin group and a second pin group, and the frame body is also provided with a chip;

[0007] A connector for connecting a second pin group and a chip;

[0008] A molding compound, wherein the molding compound is disposed on the frame, at least a portion of the frame body away from the bottom of the chip is exposed outside the molding compound, and at least a portion of the connector away from the top of the chip is exposed outside the molding compound;

[0009] The connector has a first connecting part and a second connecting part, the first connecting part being used to connect with the chip, and the second connecting part being used to connect with the second pin group;

[0010] The first connection portion includes a first platform, a second platform, and a third platform, wherein the first platform is used to connect to the chip, and the side of the third platform away from the first platform is exposed outside the molding compound;

[0011] The second pin group includes a plurality of second pins, which are integrally formed, and the second connecting part is used to connect with the second pins.

[0012] Optionally, a first bonding layer is provided between the first platform and the chip, the length and width of the second platform are both greater than the first platform, and the length and width of the third platform are both greater than the second platform.

[0013] Optionally, the width of the first connecting portion is greater than that of the second connecting portion, and the first connecting portion is provided with a clearance opening.

[0014] Optionally, the frame body is provided with pins, the pins are connected to the chip through the clearance, and a connecting line is provided between the pins and the chip.

[0015] Optionally, the pin is provided with a plating layer, and the two ends of the connecting wire are respectively bonded to the plating layer and the chip.

[0016] Optionally, the connector has symmetrical protrusions in the width direction.

[0017] Optionally, the first pin group and the second pin group extend out of the encapsulation body.

[0018] As described above, the double-sided heat dissipation packaging unit proposed in this utility model has the following beneficial effects:

[0019] Compared with the prior art, this utility model, by having both the frame body and connectors connected to the chip protrude through the plastic package, allows the heat generated during chip operation to be discharged from both sides, effectively dissipating heat from the chip, improving heat dissipation efficiency, ensuring that the internal environment of the packaging unit is maintained at a stable temperature, making the chip's operation more stable, and extending the chip's lifespan. Attached Figure Description

[0020] Figure 1 The diagram shown is a schematic diagram of an embodiment of the present utility model;

[0021] Figure 2 The image shown is a side view of the internal structure in one embodiment of the present invention.

[0022] Figure 3 The image shown is an enlarged view of point A in one embodiment of this utility model.

[0023] Figure 4 The diagram shown is a schematic representation of a connector in one embodiment of the present invention;

[0024] Figure 5 This is a front view of an embodiment of the present invention;

[0025] Figure 6 The image shown is a rear view of an embodiment of this utility model.

[0026] Explanation of reference numerals in the attached figures:

[0027] Frame body 1, chip 2, connector 3, first platform 301, second platform 302, third platform 303, second connecting part 304, protrusion 4, clearance opening 5, first pin group 6, second pin group 7, molding compound 8, pin 9, plating 10, connecting wire 11, first solder layer 12, second solder layer 13. Detailed Implementation

[0028] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0029] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components related to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the form, quantity, and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex. The structures, proportions, sizes, etc., shown in the accompanying drawings are only used to complement the content disclosed in the specification for those skilled in the art to understand and read, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in this specification are only for clarity of description and are not intended to limit the scope of implementation of this utility model. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered as within the scope of implementation of this utility model.

[0030] like Figures 1-6 As shown, this utility model proposes a double-sided heat dissipation packaging unit.

[0031] In one exemplary embodiment, the double-sided heat dissipation packaging unit includes:

[0032] The frame body 1 is provided with a first pin group 6 and a second pin group 7, and the frame body 1 is also provided with a chip 2.

[0033] Connector 3, which is used to connect the second pin group 7 and the chip 2;

[0034] A molding compound 8 is disposed on the frame, with at least a portion of the bottom of the frame body 1 away from the chip 2 exposed outside the molding compound 8, and at least a portion of the connector 3 away from the top of the chip 2 exposed outside the molding compound 8.

[0035] In this embodiment, by exposing a portion of the frame body 1 and the connector 3 connected to the chip 2 to the molding compound 8, the heat generated when the chip 2 is working is dissipated from both sides, which can effectively dissipate heat from the chip 2, improve heat dissipation efficiency, ensure that the internal environment of the packaging unit is maintained at a stable temperature, make the chip 2 work more stably, and extend the service life of the chip 2.

[0036] In an exemplary embodiment, the connector 3 has a first connecting portion and a second connecting portion 304, the first connecting portion being used to connect with the chip 2, and the second connecting portion 304 being used to connect with the second pin group 7.

[0037] In this embodiment, the first connecting part and the second connecting part 304 are respectively connected to the chip 2 and the second pin group 7, so as to realize the electrical connection between the chip 2 and the second pin group 7 and realize the corresponding function.

[0038] For example, the first connecting portion includes a first platform 301, a second platform 302, and a third platform 303. The first platform 301 is used to connect to the chip 2, and the side of the third platform 303 away from the first platform 301 is exposed outside the molding compound 8. A first solder layer is provided between the first platform 301 and the chip 2. The length and width of the second platform 302 are both greater than those of the first platform 301, and the length and width of the third platform 303 are both greater than those of the second platform 302. In this embodiment, the connection between the connector 3 and the chip 2 is achieved by providing the first platform 301 and the first solder layer 12 between the first platform 301 and the chip 2. Since the outer side of the third platform 303 needs to be exposed outside the molding compound 8, the greater length and width of the third platform 303 than the second platform 302 increases the area and improves heat dissipation.

[0039] It is worth noting that in this embodiment, the connector 3 uses a copper sheet with high thermal and electrical conductivity, but other thermally conductive materials with the same or higher performance can also be used.

[0040] It should also be noted that in this embodiment, a second solder layer 13 is provided between the chip 2 and the frame body 1, and a third solder layer is provided between the second pin and the second connection part 304 to achieve an effective and stable connection. The materials of the first solder layer 12, the second solder layer 13 and the third solder layer are high-lead solder paste or nano silver, and the solder layer thickness is maintained at 15-45μm after the chip 2 is bonded.

[0041] In an exemplary embodiment, the second pin group 7 includes a plurality of second pins, which are integrally disposed. In this embodiment, there are three second pins, which are integrally formed and fixed on the frame. The second connecting part 304 is used to connect with the second pins.

[0042] In this embodiment, by connecting the second connecting part 304 to multiple second pins simultaneously, compared with the structure in the prior art where the second pin group 7 is an integral piece, the fatigue resistance is stronger and the service life is longer.

[0043] For example, in this embodiment, the second pins are evenly arranged along the width direction of the frame body 1. Correspondingly, the width of the second connecting part 304 needs to be as large as possible to ensure a stable connection between the second pin group 7 and the connector 3.

[0044] In an exemplary embodiment, the width of the first connecting portion is greater than that of the second connecting portion 304, and the first connecting portion is provided with a clearance opening 5.

[0045] In this embodiment, the width of the first connecting part is greater than that of the second connecting part 304, which helps to increase the exposed area of ​​the connector 3, improve the heat dissipation effect, and at the same time increase the welding area with the chip 2, thereby improving the connection strength with the chip 2.

[0046] For example, the frame body 1 is provided with pin 9, which is connected to chip 2 through a clearance port 5, and a connecting line 11 is provided between pin 9 and chip 2. In this embodiment, the clearance port 5 ensures that the gate of chip 2 is connected to pin 9 to achieve the corresponding function.

[0047] For example, pin 9 is provided with a plating layer 10, and a connecting line 11 is disposed between the plating layer 10 and the chip 2. The plating layer 10 enhances the solderability of pin 9 and improves the bonding strength between pin 9 and chip 2, wherein pin 9 and chip 2 are connected by gold wire.

[0048] It should be noted that, in this embodiment, the pins in the first pin group 6 include multiple first pins, which are drain pins, and the pins in the second pin group 7 are source pins. The first pin group 6 and the second pin group 7 are disposed through the encapsulation body 8.

[0049] In an exemplary embodiment, the connector 3 is provided with symmetrical protrusions 4 in the width direction.

[0050] In this embodiment, the protrusion 4 in the width direction of the connector 3 facilitates the positioning of the entire connector 3 during cutting and makes it easier to process.

[0051] In summary, by exposing a portion of the frame body 1 and the connector 3 connected to the chip 2 to the molding compound 8, the present invention can effectively dissipate heat from both sides when the chip 2 is working, thereby improving heat dissipation efficiency, ensuring that the internal environment of the packaging unit is maintained at a stable temperature, making the chip 2 work more stably, and extending the service life of the chip 2.

[0052] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A dual-sided heat dissipating package unit, characterized by, include: The frame body is provided with a first pin group and a second pin group, and the frame body is also provided with a chip; A connector for connecting a second pin group and a chip; A molding compound, wherein the molding compound is disposed on the frame, at least a portion of the frame body away from the bottom of the chip is exposed outside the molding compound, and at least a portion of the connector away from the top of the chip is exposed outside the molding compound; The connector has a first connecting part and a second connecting part, the first connecting part being used to connect with the chip, and the second connecting part being used to connect with the second pin group; The first connection portion includes a first platform, a second platform, and a third platform, wherein the first platform is used to connect to the chip, and the side of the third platform away from the first platform is exposed outside the molding compound; The second pin group includes a plurality of second pins, which are integrally formed, and the second connecting part is used to connect with the second pins.

2. The double-sided heat dissipation packaging unit according to claim 1, characterized in that: A first bonding layer is provided between the first platform and the chip, the length and width of the second platform are both greater than those of the first platform, and the length and width of the third platform are both greater than those of the second platform.

3. The double-sided heat dissipation packaging unit according to claim 1, characterized in that: The width of the first connecting part is greater than that of the second connecting part, and the first connecting part is provided with a clearance opening.

4. The double-sided heat dissipation packaging unit according to claim 3, characterized in that: The frame body is provided with pins, which are connected to the chip through the clearance port, and a connecting line is provided between the pins and the chip.

5. The double-sided heat dissipation packaging unit according to claim 4, characterized in that: The pins are plated, and the two ends of the connecting wire are respectively bonded to the plated layer and the chip.

6. The double-sided heat dissipation packaging unit according to claim 1, characterized in that: The connector has symmetrical protrusions along its width.

7. The double-sided heat dissipation packaging unit according to claim 1, characterized in that: The first pin group and the second pin group extend out of the encapsulation body.

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