Refrigeration type infrared machine core module and thermal imaging equipment

Abstract

The utility model discloses a refrigeration type infrared machine core module and a thermal imaging device. The refrigeration type infrared machine core module comprises a support, a detector body arranged on the support and a refrigerator. The support is provided with a first installation position corresponding to the detector body and a second installation position corresponding to the refrigerating machine, the refrigerating machine and the detector body are arranged on the surface of the support side by side, and the refrigerating machine and the detector body are arranged on the support through the first installation position and the second installation position; the support surrounds the detector body and the refrigerator to form a frame structure, at least one mounting surface is reserved on the outer side of the frame, and a mounting structure is arranged on the mounting surface.

Description

Technical Field

[0001] This utility model relates to the field of infrared technology, and in particular to a cooled infrared core module and thermal imaging equipment. Background Technology

[0002] Cooled infrared camera modules, as core components of high-end optoelectronic detection systems, are widely used in gas detection, UAV reconnaissance, precision guidance, aerial remote sensing, and night vision navigation. By cryogenically cooling the infrared focal plane detector, thermal noise can be effectively suppressed, enabling high-sensitivity, high-resolution infrared imaging. However, limited by traditional cooling mechanisms and insulation structures, existing cooled infrared camera modules are generally large in size, making it difficult to meet the lightweight and integrated development requirements of modern optoelectronic systems. Utility Model Content

[0003] To address the existing technical problems, this application provides a cooled infrared core module and thermal imaging equipment that are smaller and lower in cost than those in the prior art.

[0004] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:

[0005] A cooled infrared core module includes a bracket, a detector body mounted on the bracket, and a cooler. The bracket has a first mounting position corresponding to the detector body and a second mounting position corresponding to the cooler. The cooler and the detector body are arranged side by side on the surface of the bracket and mounted on the bracket through the first mounting position and the second mounting position. The bracket surrounds the detector body and the cooler to form a frame structure. At least one mounting surface is reserved on the outside of the frame, and a mounting structure is provided on the mounting surface.

[0006] Optionally, the bracket includes a bottom wall and a plurality of side walls extending upward from the bottom wall; the first mounting position and the second mounting position are formed on the upper surface of the bottom wall.

[0007] Optionally, the outer side of at least one of the sidewalls is formed as the mounting surface.

[0008] Optionally, the sidewall includes a first sidewall near the head of the detector body, the first sidewall having a plurality of first positioning holes, the plurality of first positioning holes defining a first positioning part for lens assembly.

[0009] Optionally, the sidewall further includes a second sidewall located on the side of the detector body away from the refrigerator. The second sidewall has a plurality of second positioning holes, which define a second positioning portion for lens assembly. A first base is located below the second positioning portion, with a lens mounted at one end and the other end fixedly connected to the second positioning portion; and / or,

[0010] The sidewall also includes a third sidewall opposite to the second sidewall. The third sidewall is provided with a plurality of third positioning holes, which define a third positioning part for lens assembly. A second base is provided below the third positioning part. One end of the second base is provided with a lens, and the other end is fixedly connected to the third positioning part.

[0011] Optionally, the first base and the corresponding supported lens are integrally formed, and / or the second base and the corresponding supported lens are integrally formed; or,

[0012] Both the first base and the second base are independent structures, and are connected to the corresponding lenses by fasteners;

[0013] Optionally, the first mounting position and the second mounting position each include a connecting end connected to the upper surface of the bottom wall and a mounting end opposite to the connecting end. The mounting end of the first mounting position is provided with a first slot corresponding to the detector body, and the mounting end of the second mounting position is provided with a second slot corresponding to the refrigerator.

[0014] Optionally, the cooled infrared module also includes a shutter, and the bracket has a shutter mounting hole on the side wall near the head of the detector body; the shutter can cover the head of the detector body, and the long handle end of the shutter is connected to the shutter mounting hole through a fixing member.

[0015] Optionally, the cooled infrared core module further includes a circuit board assembly, which includes an ADC circuit board, a cooler driver circuit board, and an FPGA circuit board. The ADC circuit board is positioned above the detector body and is electrically connected to the detector body. The cooler driver circuit board is positioned above the cooler and on the same side as the ADC circuit board. The cooler driver circuit board is connected to the cooler via a cable. A preset height difference is formed between the ADC circuit board and the cooler driver circuit board. The FPGA circuit board is installed in the mounting space formed by the preset height difference. The FPGA circuit board is connected to the ADC circuit board via a plug-in connection, and the FPGA circuit board is connected to the cooler driver circuit board via a cable.

[0016] Optionally, the upper surface of the bottom wall is further provided with a plurality of mounting holes, which are arranged protrudingly on both sides of the detector body. The circuit board assembly includes a circuit board bracket above the detector body, which is fixed to the mounting holes on both sides of the detector body and is used to assist in fixing the detector body. The circuit board assembly also includes a refrigerator bracket wrapped around the outside of the refrigerator, which is used to assist in fixing the refrigerator and supporting the refrigerator drive circuit board.

[0017] Optionally, the bracket is also provided with a positioning component for mounting the temperature sensor. The positioning component is located on the bracket near the head of the detector body. The temperature sensor is connected to the FPGA circuit board via a cable.

[0018] Optionally, the cooled infrared core module further includes a detector heat sink, which is mounted on the first mounting position and sleeved on the outer periphery of the rear of the detector body. The detector heat sink includes a plurality of heat sinks arranged in parallel and at intervals; and / or, the contact surface between the detector body and the first mounting position is provided with a thermal pad, and the contact surface between the cooler and the second mounting position is provided with a thermal pad.

[0019] Optionally, the cooled infrared module further includes a user board assembly, which includes a user circuit board and a user circuit board cover. The user circuit board is located on one side of the bracket and is arranged parallel to the detector body and the cooler. The user circuit board cover is located on the side of the user circuit board that is relatively far away from the detector body and the cooler.

[0020] The cooled infrared module provided in the above embodiments adopts an integrated structural design. A bracket is designed to mount the detector body and the cooler. Two independent and parallel mounting positions are provided on the bracket, corresponding to the detector body and the cooler respectively. The first mounting position is for placing the detector body, and the second mounting position is for placing the cooler. This side-by-side arrangement of the detector body and cooler on the bracket fully utilizes the lateral space of the bracket and achieves precise positioning and stable installation of the detector body and cooler. Furthermore, the bracket surrounds the detector body and cooler, forming a frame structure, which provides good protection for the internal components. At least one mounting surface is provided on the outer side of the frame, and this mounting surface is provided with a mounting structure to facilitate the installation and fixation of the module with other devices, meeting the usage requirements of different scenarios.

[0021] A thermal imaging device includes the cooled infrared core module described in any embodiment of this application.

[0022] The thermal imaging equipment provided in the above embodiments belongs to the same concept as the corresponding cooled infrared core module embodiments, and thus has the same technical effect as the corresponding cooled infrared core module embodiments, which will not be repeated here. Attached Figure Description

[0023] Figure 1 This is a schematic diagram showing the detector body and the cooler arranged side by side in a cooled infrared core module according to one embodiment.

[0024] Figure 2 This is a schematic diagram of the structure of a cooled infrared core module in one embodiment.

[0025] Figure 3 for Figure 2 The diagram shows the structure of the cooled infrared core module, with the detector body and the cooler mounted on the support.

[0026] Figure 4 This is a schematic diagram of a cooled infrared core module with a lens mounted in one embodiment.

[0027] Figure 5 This is a schematic diagram of a cooled infrared core module mounting a lens via a first base in one embodiment.

[0028] Figure 6 This is a schematic diagram of a cooled infrared core module with a lens mounted on a second base, as shown in another embodiment.

[0029] Figure 7 for Figure 2 The right view of the cooled infrared core module shown illustrates the distribution of the second positioning holes on the second side wall.

[0030] Figure 8 for Figure 2 The left view of the cooled infrared core module shown illustrates the distribution of the first positioning holes on the first side wall.

[0031] Figure 9 for Figure 2 The diagram shows a front view of a cooled infrared core module, illustrating the distribution of the third positioning hole on the third side wall.

[0032] Figure 10 for Figure 2 The diagram shows the structure of the cooled infrared core module after the bow-shaped plate is installed at the head of the detector body.

[0033] Figure 11 for Figure 2 The diagram shows the structure of the cooled infrared core module after the shutter is installed at the head of the detector body.

[0034] Figure 12 for Figure 2 The diagram shows the structure of the cooled infrared core module after the ADC circuit board and the cooler drive circuit board are installed on the detector body and the cooler, respectively.

[0035] Figure 13 for Figure 12 The diagram shows the structure after further installing the FPGA circuit board based on the structure shown.

[0036] Figure 14 for Figure 13 The diagram shows the structure after a heat sink is installed, based on the structure shown.

[0037] Figure 15 for Figure 12 A schematic diagram of the structure shown from another angle.

[0038] Figure 16 for Figure 2 The diagram shows the structure of the cooled infrared core module after a temperature sensor is installed at the tail of the detector body.

[0039] Figure 17 for Figure 2 The diagram shows the structure of the cooled infrared core module after the circuit board bracket and the cooler bracket are installed on the detector body and the cooler, respectively.

[0040] Figure 18 for Figure 2 The diagram shows a circuit board bracket mounted above the detector body in a cooled infrared core module.

[0041] Figure 19 for Figure 2 The diagram shows the structure of the cooled infrared core module after the detector heat sink is installed at the tail of the detector body.

[0042] Figure 20 for Figure 2 The diagram shows the structure of the cooled infrared module after the user circuit board is installed.

[0043] Component Symbol Explanation

[0044] 10. Bracket 10, Detector body 11, Cooler 12, Circuit board assembly 13, Shutter 14, Mounting hole 101, Positioning component 102, Circuit board bracket 110, First thermal pad 111, Detector heat sink 114, Cooler bracket 120, ADC circuit board 130, Cooler drive circuit board 131, FPGA circuit board 132, Heat sink 133, User circuit board 134, Shutter mounting hole 140, Bottom wall 20, Side wall 21, First side wall 203, Second side wall 201, Third side wall 202, Bow-shaped plate 30, First bow-shaped plate 301, Second bow-shaped plate 302, First positioning hole 33, Second positioning hole 31, Third positioning hole 32, First positioning part 43, Second positioning part 41, Third positioning part 42, Screw 50, First mounting position 51, Second mounting position 52, Temperature sensor 60, Copper pin 61, Copper sleeve 62, Flexible flat cable 63, First base 71, Second base 72. Detailed Implementation

[0045] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the ways in which the invention may be implemented. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0047] In the description of this utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0048] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0049] In the following description, the phrase "some embodiments" refers to a subset of all possible embodiments. It should be noted that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0050] In the following description, the terms "first, second, and third" are used merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, and third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0051] Please see Figures 1 to 3 This is a schematic diagram of a cooled infrared core module provided in an embodiment of this application. The cooled infrared core module includes a bracket 10, a detector body 11 disposed on the bracket 10, and a cooler 12. The bracket 10 is provided with a first mounting position 52 corresponding to the detector body 11 and a second mounting position 52 corresponding to the cooler 12. The cooler 12 and the detector body 11 are arranged side by side on the surface of the bracket 10 and are mounted on the bracket 10 through the first mounting position 51 and the second mounting position 52. The bracket 10 surrounds the detector body 11 and the cooler 12 to form a frame structure. At least one mounting surface is reserved on the outside of the frame, and a mounting structure is provided on the mounting surface.

[0052] In the above embodiments, the cooled infrared core module includes a bracket 10, a detector body 11 mounted on the bracket 10, and a cooler 12. By designing the bracket 10 for mounting the detector body 11 and the cooler 12, two independent and parallel mounting positions are set on the bracket 10, corresponding to the detector body 11 and the cooler 12 respectively. The first mounting position 51 is used to match and support the detector body 11, and the second mounting position 52 is used to match and mount the cooler 12. This layout, which arranges the detector body 11 and the cooler 12 in parallel on the bracket 10, makes full use of the lateral space above the bracket 10 and achieves precise positioning and stable installation of the detector body 11 and the cooler 12. The lateral dimensions of the cooled infrared core module can be controlled within the optimal range. The bracket 10 surrounds the detector body 11 and the cooler 12 to form a frame structure. At least one mounting surface is reserved on the outside of the frame, and a standard mounting structure is provided on the mounting surface. This design provides mechanical protection for internal components through a frame, while also enhancing the assembly compatibility between the module and external devices by reserving mounting surfaces, thus meeting the integration needs of diverse scenarios.

[0053] In some embodiments, please refer to Figure 2 and Figure 3The bracket 10 includes a bottom wall 20 and a plurality of side walls 21 extending upward from the bottom wall 20; a first mounting position 51 and a second mounting position 52 are formed on the upper surface of the bottom wall 20. At least one side wall 21 has its outer side forming the aforementioned mounting surface.

[0054] The bracket 10 comprises a base wall 20 and multiple side walls 21. The upper surface of the base wall 20 has a first mounting position 51 and a second mounting position 52, used for mounting the detector body 11 and the cooler 12, respectively. The outer side of the side walls 21 serves as a reserved mounting surface for subsequent lens assembly. This structural design, through the targeted design of the base wall 20 and side walls 21, enables the bracket 10 to provide basic support and additional assembly functions. It not only meets the installation requirements of the detector body 11 and the cooler 12 but also provides expanded convenience for subsequent assembly of lenses of different sizes when adapting to various application fields. Thus, the cooled infrared core module has higher integration and stronger applicability.

[0055] Please refer to Figures 4 to 6 The sidewall 21 includes a first sidewall 203 near the head of the detector body 11, with a plurality of first positioning holes 33 defining a first positioning portion 43 for lens assembly. The sidewall 21 also includes a second sidewall 201 located on the side of the detector body 11 away from the cooler 12, with a plurality of second positioning holes 31 defining a second positioning portion 41 for lens assembly. A first base 71 is located below the second positioning portion 41, with a lens at one end and the other end fixedly connected to the second positioning portion 41. Alternatively, the sidewall 21 also includes a third sidewall 202 opposite to the second sidewall 201, with a plurality of third positioning holes 32 defining a third positioning portion 42 for lens assembly. A second base 72 is located below the third positioning portion 42, with a lens at one end and the other end fixedly connected to the third positioning portion 42. The first positioning part 41, the second positioning part 42, and the third positioning part 43 have different dimensions.

[0056] The sidewall 21 of the bracket 10 features multiple positioning holes spaced at varying intervals, forming positioning sections that accommodate lenses of different models and sizes. Notably, the different positions and distances between the first positioning hole 33, the second positioning hole 31, and the third positioning hole 32 result in different sizes for the first positioning section 43, the second positioning section 41, and the third positioning section 42, allowing for compatibility with lenses of different specifications. This differentiated design enhances the flexibility and adaptability of the bracket 10 in lens assembly. In practical use, the mounting surface can be selected according to the lens specifications, ensuring the lens and detector body 11 are always on the same optical path. The lens is then connected and fixed to different sidewalls 21 of the bracket 10, meeting diverse assembly requirements. Specifically, when the lens is assembled to the second positioning section 41, a first base 71 is positioned below it. This base facilitates the connection between the lens and the second positioning section 41. The lens is fixed to the second positioning section 41 via the first base 71, which provides support and positioning, ensuring the stability and accuracy of the lens installation. Similarly, when the lens is assembled to the third positioning part 42, a second base 72 is provided below it. This base is used to connect the lens to the third positioning part 42. Specifically, the lens is fixed to the third positioning part 42 by the second base 72. The base plays a supporting and positioning role between the two, ensuring the stability and accuracy of the lens installation.

[0057] It should be noted that the central areas of the first sidewall 203, the second sidewall 201, and the third sidewall 202 may be provided with one or more relatively large hollow areas of different shapes and numbers to facilitate heat dissipation and reduce the weight of the bracket 10. The positioning holes that constitute the first positioning part 43, the second positioning part 41, and the third positioning part 42 may be respectively provided in the edge areas of the corresponding sidewall 21 for lens mounting.

[0058] In some embodiments, the first base 71 is integrally formed with the corresponding lens, and / or the second base 72 is integrally formed with the corresponding lens. In other embodiments, the first base 71 and the second base 72 are independent structures, connected to the corresponding lens via fasteners. The first base 71 and the second base 72 have different dimensions. The structural designs of the first base 71 and the second base 72 can be implemented in different ways. For example, they can be manufactured using an integral forming process with the lens they support; or they can both be independent components, connected and assembled with the corresponding lens via fasteners, and then connected to mounting surfaces provided by different sidewalls 21 on the bracket 21 to mount the lens to different sides of the bracket 21; or there are other implementation methods, which will not be listed here. It should be noted that the first base 71 and the second base 72 have different external dimensions, and this difference in dimensions can be adapted to different mounting scenarios according to actual installation requirements.

[0059] The bracket 10 includes a first mounting position 51 and a second mounting position 52, each comprising a connecting end connected to the upper surface of the bottom wall 20 and a mounting end opposite to the connecting end. The mounting end of the first mounting position 51 has a first slot corresponding to the detector body 11, and the mounting end of the second mounting position 52 has a second slot corresponding to the cooler 12. The presence of slots on the mounting ends of the first and second mounting positions 51 and 52, respectively, connected to the upper surface away from the bottom wall 20, simplifies the installation of the detector body 11 and the cooler 12 on the bracket 10 and enhances the reliability and stability of their installation on the bracket 10. Thus, by forming slots on the first and second mounting positions 51 and 52 that match the detector body 11 and the cooler 12, the detector body 11 and the cooler 12 are positioned and stably installed on the upper surface of the bracket 10, ensuring that their assembly relationship on the bracket 10 is both independent and coordinated.

[0060] It should be noted that the terms "bottom wall 20" and "side wall 21" should be interpreted broadly. They do not necessarily refer to solid walls formed on different sides of the bracket 10; they can also be any other shape that defines the bracket 10 as a whole, forming a rectangular shape. For example, in the bracket 10, numerous hollow areas are formed on the bottom wall 20 and the side wall 21, and the size of the hollow areas on different side walls 21 can vary. The surface between the top surface of this cooling infrared core module and the bottom wall 20 forms the side wall 21. Please refer to [link / reference]. Figure 7 This is a right view of a cooled infrared core module, where the bottom wall 20 has multiple hollowed-out areas, forming a frame-like bottom wall composed of multiple strip support walls. Please refer to [link / reference]. Figure 8 This is a left view of a cooled infrared module, where the first sidewall 201 has eight perforations arranged in an array. Please refer to [link / reference]. Figure 9 The image shows a front view of a cooling infrared core module. The middle part of the second side wall 202 is completely hollowed out to form a support structure mainly consisting of two opposing pillars. Thus, the bottom wall 20 and the side wall 21 are not solid walls, making the bracket 10 a frame structure as a whole.

[0061] In some embodiments, please refer to Figure 10The cooled infrared core module also includes an arc-shaped plate 30, which is sleeved on the outer periphery of the head of the detector body 11. A ring of copper pins 61 is provided on the outer periphery of the head of the detector body 11. A ring of copper sleeves 62 matching the copper pins 61 on the head of the detector body 11 is provided in the central area of ​​the arc-shaped plate 30. The head of the detector body 11 is passed through the central area of ​​the arc-shaped plate 30, and then the copper pins 61 on the head of the detector body 11 are inserted and tightened into the copper sleeves 62 in the central area of ​​the arc-shaped plate 30. The arrangement of the copper pins 61 and copper sleeves 62 between the detector body 11 and the arc-shaped plate 20 can form a preliminary physical connection structure between the detector body 11 and the arc-shaped plate 20. During assembly, it is convenient to form a preliminary positioning, maintain relative position accuracy, and help reduce the possibility of mechanical displacement between the two due to vibration and other factors.

[0062] The bow-shaped plate 30 is composed of a first bow-shaped plate 301 and a second bow-shaped plate 302. The perforations on the separate first bow-shaped plates 301 and 302 precisely match the shape of the head of the detector body 11, allowing for a wrap-around fixation of the detector body 11 from opposite sides. This ensures the detector body 11 maintains a stable posture under conditions such as vibration and temperature changes, and also provides better compatibility with detector bodies 11 of different sizes. Furthermore, the first bow-shaped plate 301 and the second bow-shaped plate 302 are connected by a flexible flat cable 63, forming a rigid-flexible assembly. The connection method of the flexible flat cable 63 allows for slight relative movement of the first bow-shaped plate 301 and the second bow-shaped plate 302 within a certain range, thus providing a certain degree of elastic buffering, absorbing external stress, and protecting the sensitive elements at the head of the detector body 11 from mechanical damage, especially in vibration and impact scenarios.

[0063] In some embodiments, please refer to Figure 11 The cooled infrared core module also includes a shutter 14. The bracket 10 has a shutter mounting hole 140 on the side wall 21 near the head of the detector body 11. The shutter 14 can cover the head of the detector body 11, and the long handle end of the shutter 14 is connected to the shutter mounting hole 140 through a fixing member. The shutter 14 is mounted on the head of the detector body 11 and can be opened relative to the detector body 11 to open the light path, or closed relative to the detector body 11 to block the light path.

[0064] The cooled infrared module also includes a shutter 14. A shutter mounting hole 140 is provided on the side wall 21 of the bracket 10 near the head of the detector body 11 for mounting the shutter 14. The shutter 14 consists of a circular shielding disc and a long handle. The circular shielding disc covers the head of the detector body 11, and the long handle is securely connected to the shutter mounting hole 140 via a fastener. This design allows the shutter 14 to be stably mounted on the head of the detector body 11, thus ensuring reliable installation and use of the shutter 14 on the equipment according to usage requirements and guaranteeing its normal operation.

[0065] Please refer to the following: Figures 12 to 16 The cooled infrared core module also includes a circuit board assembly 13, which includes an ADC circuit board 130, a cooler drive circuit board 131, and an FPGA circuit board 132. The ADC circuit board 130 is positioned above the detector body 11 and is electrically connected to the detector body 11. The cooler drive circuit board 131 is positioned above the cooler 12 and is on the same side as the ADC circuit board 130. The cooler drive circuit board 131 and the cooler 12 are connected by a cable. A preset height difference is formed between the ADC circuit board 130 and the cooler drive circuit board 131. The FPGA circuit board 132 is installed in the installation space corresponding to the preset height difference. The FPGA circuit board 132 and the ADC circuit board 130 are connected by plug-in connection, and the FPGA circuit board 132 and the cooler drive circuit board 131 are connected by a cable.

[0066] In this cooled infrared core module, the circuit board assembly 13 includes an ADC circuit board 130, a cooler drive circuit board 131, and an FPGA circuit board 132. In the design of the circuit board assembly 13, the ADC circuit board 130 is placed above the detector body 11, and an electrical connection is formed between the ADC circuit board 130 and the detector body 11. The cooler drive circuit board 131 is placed above the cooler 12, and the cooler drive circuit board 131 and the cooler 12 are connected by a cable. The cooler drive circuit board 131 and the ADC circuit board 130 are stacked in a staggered manner in a direction perpendicular to the parallel arrangement of the detector body 11 and the cooler 12, forming a certain height difference. The size difference between the detector body 11 and the cooler 12 is used to construct an installation space in the vertical space above the bracket 10, so as to place the FPGA circuit board 132 in the installation space. Specifically, copper pillars are placed through three through holes on the ADC circuit board 130, and the ADC circuit board 130 is connected to the ADC circuit board 130 through a plug-in connector. The two circuit boards are isolated by copper pillars to complete the installation of the FPGA circuit board 132. The FPGA circuit board 132 and the cooler drive circuit board 131 are connected by a cable. Optionally, the cooled infrared core module also includes a heat sink 133, which covers the FPGA circuit board 132 and the cooler drive circuit board 131 and can be secured to the bracket 10 by screws 50. This facilitates electrical connections between the FPGA circuit board 132, the cooler drive circuit board 131, and the ADC circuit board 130, while also allowing for a three-dimensional and hierarchical planning of the circuit board installation space. Within the limited overall volume of the cooled infrared core module, a reasonable layout of the core functional modules is achieved, forming an integrated design structure that improves the performance and usability of the device.

[0067] It should be noted that in the embodiments of this application, in the assembly method of fastening different components with screws, the specific specifications and models of screws 50 can be selected according to actual application requirements, and are not limited to screws of the same specification and model.

[0068] In some embodiments, please refer to Figure 17 and Figure 18 The upper surface of the bottom wall 20 is also provided with a plurality of mounting holes 101, which are arranged protrudingly on both sides of the detector body 11. The circuit board assembly 13 includes a circuit board bracket 110 above the detector body 11. The circuit board bracket 110 is fixed on the mounting holes 101 on both sides of the detector body 11 and is used to assist in fixing the detector body 11. The circuit board assembly 13 also includes a refrigerator bracket 120 wrapped around the outside of the refrigerator 12. The refrigerator bracket 120 is used to assist in fixing the refrigerator 12 and support the refrigerator drive circuit board 131.

[0069] Mounting holes 101 are provided on both sides of the detector body 11 on the bracket 10 to facilitate the subsequent assembly of other components such as the circuit board assembly 13. For example, the circuit board assembly 13 can be installed and fixed to the bracket 10 by connecting it to the mounting holes 101 with fasteners. In this embodiment, the circuit board assembly 13 also includes a circuit board bracket 110 located above the detector body 11. The circuit board bracket 110 is fixed to the mounting holes 101 on both sides of the detector body 11 on the bracket 10 using screws 50. The circuit board bracket 110 is designed to form an arc that better matches the outer periphery of the detector body 11, thereby better assisting in fixing the detector body 11. The circuit board assembly 13 also includes a refrigerator bracket 120 surrounding the refrigerator 12. The refrigerator bracket 120 is fixed to the outside of the refrigerator 12 by screws 50. The refrigerator bracket 120 forms an arc that matches the shape of the refrigerator 12, thereby providing more stable assistance in fixing the refrigerator 12. Furthermore, the refrigerator bracket 120 can support the refrigerator drive circuit board 131 and also serve to assist in heat dissipation of the refrigerator drive circuit board 131.

[0070] Please refer to the following again. Figure 15 and Figure 16 The bracket 10 also has a positioning component 102 for mounting the temperature sensor 60. The positioning component 102 is located on the bracket 10 near the head of the detector body 11. The temperature sensor 60 is connected to the FPGA circuit board 130 via a cable. The bracket 10 of this cooled infrared core module has reserved mounting space that matches the shape and size of the temperature sensor 60, and a positioning component 102 for mounting the temperature sensor 60 is designed. The positioning component 102 is located near the head of the detector body 11. The temperature sensor 60 can be fixed to the positioning component 102 on the bracket 10 by screws 50. After connecting the corresponding signal cable of the temperature sensor 60, the temperature sensor 60 can be fully utilized in the reserved space to achieve a scientific layout.

[0071] In some embodiments, please refer to Figure 19The cooled infrared core module also includes a detector heat sink 114, which is mounted on the first mounting position 51 and sleeved around the outer periphery of the rear of the detector body 11. The detector heat sink 114 includes multiple heat sinks arranged in parallel and at intervals. In the cooled infrared core module, the detector heat sink 114 plays a crucial role in efficiently dissipating the heat generated by the detector body 11 during operation. In an optional example, the detector heat sink 114 includes multiple heat sinks arranged in parallel and at intervals to achieve good heat dissipation. Furthermore, a thermally conductive pad is also installed on the contact surface between the detector heat sink 114 and the detector body 11. For ease of description, the thermally conductive pad between the contact surface of the detector heat sink 114 and the detector body 11 is referred to as the first thermally conductive pad 111, which is used to further improve the heat conduction efficiency.

[0072] Optionally, a thermal pad is provided on the contact surface between the detector body 11 and the first mounting position 51, and a thermal pad is provided on the contact surface between the cooler 12 and the second mounting position 52. For the sake of distinction, the thermal pad between the detector body 11 and the first mounting position 51 is referred to as the second thermal pad, and the thermal pad between the cooler 12 and the second mounting position 52 is referred to as the third thermal pad.

[0073] By installing a second thermal pad at the contact surface between the detector body 11 and the first mounting position 51, good thermal conductivity between the detector body 11 and the bracket 10 can be achieved. The bracket 10 can also assist in the heat dissipation performance of the detector body 11. This heat dissipation design not only achieves targeted heat dissipation of the heat-generating area of ​​the detector body 11, but also constructs an efficient and reliable heat conduction channel through a tight structural fit, ensuring that the detector body 11 operates within a stable temperature range and improving the overall performance and service life of the equipment. Similarly, by installing a third thermal pad at the contact surface between the cooler 12 and the second mounting position 52, good thermal conductivity between the cooler 12 and the bracket 10 can be achieved. The bracket 10 can also assist in the heat dissipation of the cooler 12, thereby improving the heat dissipation performance.

[0074] In some embodiments, please refer to Figure 20 The cooled infrared core module also includes a user board assembly, which includes a user circuit board 134 and a user circuit board cover. The user circuit board 134 is located on one side of the bracket 10 and is arranged parallel to the detector body 11 and the cooler 12. The user circuit board cover is located on the side of the user circuit board 134 that is relatively far away from the detector body 11 and the cooler 12.

[0075] The cooled infrared core module also includes a user board assembly, which includes a user circuit board 134 and a user circuit board cover. The user circuit board 134 is located on the outer side of the lower surface of the bottom wall 20, in a direction parallel to the detector body 11 and the cooler 12. The user circuit board cover plays a protective and stabilizing role. Specifically, the user circuit board cover is fitted to the outer side of the user circuit board 134 and is locked to the bracket 10 by screws 50, ensuring that the user circuit board 134 is not affected by external interference during equipment operation and is stable and reliable.

[0076] In summary, the cooled infrared core module provided in this application embodiment has at least the following characteristics:

[0077] First, it is small in size, light in weight, compact in overall layout, and has high space utilization. The cables connecting the circuit board assembly and various devices can be stored inside the structure, and the circuit boards can be connected with coaxial cables, making the layout flexible and the solution highly compatible.

[0078] Secondly, the design of bracket 10 provides a reserved mounting surface that can accommodate lenses of different shapes and sizes, enabling the cooled infrared core module to be better compatible with more application fields.

[0079] Third, it is equipped with a shutter assembly, which facilitates system integration.

[0080] Fourth, it is highly customizable. The user circuit board is mounted on the outside of the overall structure. The user circuit board and the entire hardware structure of the cooled infrared core module are relatively independent. The hardware interface can be customized according to customer needs, thus making it widely applicable to core modules, optoelectronic pods, equipment and instruments and many other fields.

[0081] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A cooled infrared core module, characterized in that, It includes a support (10), a detector body (11) mounted on the support (10), and a refrigerator (12); The bracket (10) is provided with a first mounting position (51) corresponding to the detector body (11) and a second mounting position (52) corresponding to the refrigerator (12). The refrigerator (12) and the detector body (11) are arranged side by side on the surface of the bracket (10) and are mounted on the bracket (10) through the first mounting position (51) and the second mounting position (52). The bracket (10) surrounds the detector body (11) and the refrigerator (12) to form a frame structure. At least one mounting surface is reserved on the outside of the frame, and a mounting structure is provided on the mounting surface.

2. The cooled infrared core module according to claim 1, characterized in that, The support (10) includes a bottom wall (20) and a plurality of side walls (21) extending upward from the bottom wall (20); The first mounting position (51) and the second mounting position (52) are formed on the upper surface of the bottom wall (20).

3. The cooled infrared core module according to claim 2, characterized in that, At least one of the sidewalls (21) is formed on the outer side as the mounting surface.

4. The cooled infrared core module according to claim 3, characterized in that, The sidewall (21) includes a first sidewall (203) near the head of the detector body (11), and the first sidewall (203) is provided with a plurality of first positioning holes (33), which define a first positioning part (43) for lens assembly.

5. The cooled infrared core module according to claim 4, characterized in that, The sidewall (21) further includes a second sidewall (201) located on the side of the detector body (11) away from the refrigerator (12). The second sidewall (201) has a plurality of second positioning holes (31), which define a second positioning portion (41) for lens assembly. A first base (71) is located below the second positioning portion (41). One end of the first base (71) has a lens, and the other end is fixedly connected to the second positioning portion (41); and / or, The sidewall (21) also includes a third sidewall (202) opposite to the second sidewall (201). The third sidewall (202) is provided with a plurality of third positioning holes (32). The plurality of third positioning holes (32) define a third positioning part (42) for lens assembly. A second base (72) is provided below the third positioning part (42). One end of the second base (72) is provided with a lens, and the other end is fixedly connected to the third positioning part (42).

6. The cooled infrared core module according to claim 5, characterized in that, The first base (71) is integrally formed with the corresponding lens, and / or the second base (72) is integrally formed with the corresponding lens; or, The first base (71) and the second base (72) are both independent structures and are connected to the corresponding lenses by fasteners.

7. The cooled infrared core module according to claim 2, characterized in that, The first mounting position (51) and the second mounting position (52) respectively include a connecting end connected to the upper surface of the bottom wall (20) and a mounting end opposite to the connecting end. The mounting end of the first mounting position (51) is provided with a first slot corresponding to the detector body (11), and the mounting end of the second mounting position (52) is provided with a second slot corresponding to the refrigerator (12).

8. The cooled infrared core module according to claim 2, characterized in that, It also includes a shutter (14), and the bracket (10) has a shutter mounting hole (140) on the side wall (21) near the head of the detector body (11); the shutter (14) can cover the head of the detector body (11), and the long handle end of the shutter (14) is connected to the shutter mounting hole (140) by a fastener.

9. The cooled infrared core module according to claim 2, characterized in that, The cooled infrared core module also includes a circuit board assembly (13), which includes an ADC circuit board (130), a cooler drive circuit board (131), and an FPGA circuit board (132). The ADC circuit board (130) is disposed above the detector body (11) and is electrically connected to the detector body (11). The cooler drive circuit board (131) is disposed above the cooler (12) and is on the same side as the ADC circuit board (130). The cooler drive circuit board (131) is connected to the cooler (12) by a cable. A preset height difference is formed between the ADC circuit board (130) and the cooler drive circuit board (131). The FPGA circuit board (132) is installed in the installation space formed by the preset height difference. The FPGA circuit board (132) is connected to the ADC circuit board (130) by plug-in connection, and the FPGA circuit board (132) is connected to the cooler drive circuit board (131) by a cable.

10. The cooled infrared core module according to claim 9, characterized in that, The upper surface of the bottom wall (20) is also provided with a plurality of mounting holes (101), which are arranged in a protruding manner on both sides of the detector body (11). The circuit board assembly (13) includes a circuit board bracket (110) above the detector body (11). The circuit board bracket (110) is fixed on the mounting holes (101) on both sides of the detector body (11) and is used to assist in fixing the detector body (11). The circuit board assembly (13) also includes a refrigerator bracket (120) surrounding the outside of the refrigerator (12), the refrigerator bracket (120) being used to help fix the refrigerator (12) and support the refrigerator drive circuit board (131).

11. The cooled infrared core module according to claim 9, characterized in that, The bracket (10) is also provided with a positioning component (102) for mounting the temperature sensor (60). The positioning component (102) is located on the bracket (10) near the head of the detector body (11). The temperature sensor (60) is connected to the FPGA circuit board (132) by a cable.

12. The cooled infrared core module according to claim 1, characterized in that, It also includes a detector heat sink (114), which is mounted on the first mounting position (51) and sleeved on the outer periphery of the tail of the detector body (11). The detector heat sink (114) includes a plurality of parallel and spaced heat sinks; and / or, The contact surface between the detector body (11) and the first mounting position (51) is provided with a heat-conducting pad, and the contact surface between the refrigerator (12) and the second mounting position (52) is provided with a heat-conducting pad.

13. The cooled infrared core module according to claim 1, characterized in that, It also includes a user board assembly, which includes a user circuit board (134) and a user circuit board cover (135). The user circuit board (134) is located on one side of the bracket (10) and is arranged parallel to the detector body (11) and the refrigerator (12). The user circuit board cover (135) covers the side of the user circuit board (134) that is relatively far away from the detector body (11) and the refrigerator (12).

14. A thermal imaging device, characterized in that, Includes the cooled infrared core module as described in any one of claims 1-13.

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