LED support

Abstract

The utility model relates to the technical field of LEDs, and discloses an LED support which comprises a support assembly and a bonding pad assembly embedded in the support assembly and used for bearing a chip set, the bonding pad assembly comprises a first bonding pad and a third bonding pad which are used for bearing the chip set, and the first bonding pad and the third bonding pad are embedded in the support assembly. The second bonding pad and the fourth bonding pad are arranged on the two adjacent sides of the first bonding pad and the third bonding pad respectively, and the first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad are annularly arranged in a surrounding mode and located on the same horizontal plane. The first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad are symmetrically arranged up and down and left and right, so that the stress after the bonding pads are heated is uniformly released, and the stress release can be understood to be implemented based on the same horizontal direction; and the condition that a traditional metal bonding pad generates different stresses along the extension direction of a height difference after being heated due to the height difference, so that a welding spot on an operation chip is broken is avoided.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to an LED bracket. Background Technology

[0002] Light-emitting diodes, or LEDs for short, are made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), and nitrogen (N). When electrons and holes recombine, they emit visible light, which is why they can be used to make LEDs. In circuits and instruments, they are used as indicator lights or to form text or number displays. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. Due to their chemical properties, they are further divided into organic light-emitting diodes (OLEDs) and inorganic light-emitting diodes (LEDs). LEDs have many advantages such as high luminous efficiency, long lifespan, energy saving, and environmental friendliness, and are increasingly widely used in many fields, such as indoor lighting, outdoor lighting, and backlighting.

[0003] Conventional LED RGB LED beads are typically arranged vertically or horizontally, with a metal pad at the bottom. The red light has a top and bottom P / N pole structure connected by conductive adhesive, with a height of 130-150um. The green and blue chips have P / N poles on their surface, which are bonded and fixed with insulating adhesive.

[0004] Currently, LED brackets are typically fixed to the plastic shell using adhesive. However, during thermal shock tests or tunnel oven runs, adhesive stress and the inherent fragility of the LED bracket structure can cause breakage at point D of the solder joint. Point D refers to the junction of the bracket's second solder joint and the gold wire. This location is crucial in the LED chip packaging process, and breakage at point D can lead to LED failure. Utility Model Content

[0005] Therefore, the purpose of this utility model is to provide an LED bracket that aims to solve the problem of LED solder joint fracture failure caused by stress in the existing technology.

[0006] An embodiment of this utility model provides an LED bracket, including a bracket assembly and a pad assembly embedded in the bracket assembly for supporting a chipset.

[0007] The support assembly includes an inner lead frame for separating the pad assembly;

[0008] The pad assembly includes a first pad and a third pad for carrying the chipset, and a second pad and a fourth pad respectively disposed on the adjacent sides of the first pad and the third pad;

[0009] The first pad, the second pad, the third pad, and the fourth pad are arranged in a ring and are located at the same level. The first pad and the third pad are arranged at an oblique angle to each other, and the second pad and the fourth pad are arranged at an oblique angle to each other.

[0010] The above-described symmetrical arrangement of the first, second, third, and fourth pads allows for uniform stress release after heating. This stress release is achieved on a horizontal plane, preventing the stress on the chip from breaking due to uneven stress along the height difference caused by traditional metal pads. This improves the protection of the chip's solder joints and solves the current problem of LED solder joint failure caused by stress.

[0011] In addition, the LED bracket proposed according to the embodiments of this utility model may also have the following additional technical features:

[0012] Furthermore, the chipset includes a first chip, a second chip, and a third chip arranged in parallel.

[0013] Furthermore, the first chip is supported by the first pad, and the second chip and the third chip are supported by the third pad.

[0014] Furthermore, the support assembly also includes a fixing frame and a fixing platform disposed on the side of the lead frame away from the fixing frame, the lead frame being disposed between the fixing frame and the fixing platform.

[0015] Furthermore, the lead frame divides the space within the fixture into at least four slots for accommodating at least a portion of the pad assembly, and at least four second mounting slots for accommodating at least a portion of the pad assembly are provided at the perimeter between the lead frame and the fixture, and at least four first mounting slots for accommodating a portion of the pad assembly are provided at the perimeter of the fixture away from the lead frame.

[0016] Furthermore, the first pad, the second pad, the third pad, and the fourth pad all adopt a three-section structure design consisting of a head section, a middle section, and a tail section. The head section is embedded in the solder groove separated by the lead frame within the fixing frame, the middle section is snapped into the second assembly groove, and the tail section is fastened into the first assembly groove.

[0017] Furthermore, the head segments of the first pad and the third pad are both larger than the head segments of the second pad and the fourth pad, and the head segment of the first pad extends toward the second pad and the fourth pad respectively, and the extended portion is adapted to the edge of the diagonally arranged third pad.

[0018] Furthermore, the second pad is the negative electrode of the third chip, the fourth pad is the negative electrode of the first chip, and the first pad is the common positive electrode of the first chip, the second chip, and the third chip. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of an LED bracket proposed in an embodiment of this utility model;

[0020] Figure 2 This is a schematic diagram of one side of the support assembly in an LED bracket according to an embodiment of the present utility model.

[0021] Figure 3 This is a schematic diagram of the other side of the support assembly in an LED bracket according to an embodiment of the present utility model;

[0022] Figure 4 This is a top view of an LED bracket proposed in an embodiment of the present utility model;

[0023] Figure 5 This is a partial structural diagram of the pad assembly in an LED bracket proposed in an embodiment of the present invention.

[0024] Explanation of key component symbols:

[0025]

[0026] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0027] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0028] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] Please see Figures 1 to 5 The image shows an LED bracket in an embodiment of the present invention, including a bracket assembly 1 and a pad assembly 2 embedded in the bracket assembly 1 for supporting a chip assembly. The bracket assembly 1 includes a lead frame 12 on the inner side for separating the pad assembly 2. The pad assembly 2 includes a first pad 21 and a third pad 23 for supporting the chip assembly, and a second pad 22 and a fourth pad 24 respectively disposed on the adjacent sides of the first pad 21 and the third pad 23. The first pad 21, the second pad 22, the third pad 23 and the fourth pad 24 are arranged in a ring, and the first pad 21 and the third pad 23 are arranged at an oblique angle to each other, and the second pad 22 and the fourth pad 24 are arranged at an oblique angle to each other.

[0031] Furthermore, the chipset includes a first chip 3, a second chip 4, and a third chip 5 arranged in parallel. The first chip 3 is supported by a first pad 21, and the second chip 4 and the third chip 5 are supported by a third pad 23. The first chip 3 is a red chip, while the second chip 4 and the third chip 5 are a green chip and a blue chip, respectively. The support assembly 1 also includes a mounting frame 11 and a mounting platform 13 disposed on the side of the lead frame 12 away from the mounting frame 11. The lead frame 12 is disposed between the mounting frame 11 and the mounting platform 13. The lead frame 12 divides the space inside the mounting frame 11 into at least four solder grooves 14 for accommodating at least a portion of the pad assembly 2. At least four solder grooves 14 for accommodating at least a portion of the pad assembly 2 are provided at the perimeter between the lead frame 12 and the mounting frame 11. The second mounting slot 16 of the pad assembly 2 and the fixing platform 13 have at least four first mounting slots 15 for accommodating part of the pad assembly 2 on the side away from the lead frame 12. The first pad 21, the second pad 22, the third pad 23 and the fourth pad 24 all adopt a three-section structure design of head section, middle section and tail section. The head section is embedded in the solder groove 14 separated by the lead frame in the fixing frame 11, the middle section is snapped into the second mounting slot 16, and the tail section is snapped into the first mounting slot 15. The head sections of the first pad 21 and the third pad 23 are larger than the head sections of the second pad 22 and the fourth pad 24. The head section of the first pad 21 extends towards the second pad 22 and the fourth pad 24 respectively, and the extended part is adapted to the edge of the diagonally arranged third pad 23.

[0032] In specific implementation, the bracket assembly 1 and the pad assembly 2 are first assembled. The operator sequentially places the four pads into the mounting bracket 11 in an enclosing manner. Then, a lead frame 12 and a mounting platform 13 are installed on the side of the mounting bracket 11 where the pad assembly 2 is inserted. The mounting bracket 11, lead frame 12, and mounting platform 13 can be glued together using insulating adhesive. During the gluing process, the four pads need to be separated; that is, the lead frame 12 divides the four solder grooves 14 within the mounting bracket 11 into four corresponding pad heads, which are then glued together using adhesive. Provided that the four pad ends are parallel to the lead frame 12, the middle section of the pad can be located at the second assembly groove 16, and the tail end is located in the first assembly groove 15 and is fastened to the first assembly groove 15. It can be understood that the middle and tail bends of the pad can form a tenon-and-mortise-like fastening structure with the second assembly groove 16 and the first assembly groove 15 respectively, to ensure the stable connection between the bracket assembly 1 and the pad assembly 2. In addition, in some optional embodiments, the bracket assembly 1 can also be formed on the surface of the pad assembly 2 by injection molding or casting to ensure that the bracket assembly 1 can better fit with the pad assembly 2.

[0033] In addition, in some optional embodiments, an insulating pad is provided between the pad assembly 2 and the lead frame 12. The insulating pad is usually provided between the pad assembly 2 (metal pad) and the lead frame 12 to serve as isolation and insulation. The insulating pad can be provided on the upper part or around the pad assembly 2 to ensure that the current does not flow through unexpected paths, thereby preventing short circuits and migration. In addition, 0.1mm wide insulating water trenches can be provided between the first pad 21, the second pad 22, the third pad 23 and the fourth pad 24 and the insulating pad to facilitate the drainage of water vapor.

[0034] Furthermore, operators can install chipsets on pad assembly 2 using a vertical or horizontal arrangement, according to the RGB LED bead assembly requirements. Specifically, the first chip 3 is fixed to the head of the first pad 21 with adhesive, and then the second chip 4 and the third chip 5 are fixed to the third pad 23 in a parallel manner with the first chip 3. The LED encapsulation operation is performed by gold wire bonding, with the second pad 22 serving as the negative electrode of the third chip 5, the fourth pad 24 as the negative electrode of the first chip 3, and the first pad 21 serving as the common positive electrode for the first chip 3, the second chip 4, and the third chip 5. During the process, the four pads are arranged symmetrically in all directions, allowing the stress on the pads to be released evenly after heating. This stress release is based on the same horizontal direction, avoiding the situation where different stresses are generated along the height difference direction after heating due to the height difference of traditional metal pads, which could lead to the breakage of the solder joints on the chip. During the process, the stress of the second pad 2 and the fourth pad 24 is protected by the first pad 21 and the third pad 23, respectively, thus achieving stress release protection. This further protects the solder joints on the negative terminals of the two pads and improves the product's shock resistance in reliability testing.

[0035] In summary, by symmetrically arranging the first pad 21, the second pad 22, the third pad 23, and the fourth pad 24 vertically and horizontally, the stress on the pads after heating is uniformly released. This stress release is based on the same horizontal direction, avoiding the situation where different stresses are generated along the height difference direction after heating due to the height difference of traditional metal pads, which can lead to the breakage of the solder joints on the chip. This improves the protection of the chip solder joints and solves the current problem of LED solder joint failure caused by stress.

[0036] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0037] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An LED bracket, characterized in that, Includes a support assembly and a pad assembly embedded within the support assembly for carrying the chipset; The support assembly includes an inner lead frame for separating the pad assembly; The pad assembly includes a first pad and a third pad for carrying the chipset, and a second pad and a fourth pad respectively disposed on the adjacent sides of the first pad and the third pad; The first pad, the second pad, the third pad, and the fourth pad are arranged in a ring and are located at the same level. The first pad and the third pad are arranged at an oblique angle to each other, and the second pad and the fourth pad are arranged at an oblique angle to each other.

2. The LED bracket according to claim 1, characterized in that, The chipset includes a first chip, a second chip, and a third chip arranged in parallel.

3. The LED bracket according to claim 2, characterized in that, The first chip is supported by the first pad, and the second chip and the third chip are supported by the third pad.

4. The LED bracket according to claim 3, characterized in that, The support assembly also includes a fixing frame and a fixing platform disposed on the side of the lead frame away from the fixing frame, the lead frame being disposed between the fixing frame and the fixing platform.

5. The LED bracket according to claim 4, characterized in that, The lead frame divides the space within the fixture into at least four slots for accommodating at least a portion of the pad assembly. At least four second mounting slots for accommodating at least a portion of the pad assembly are provided at the perimeter between the lead frame and the fixture. At least four first mounting slots for accommodating a portion of the pad assembly are provided at the perimeter of the fixture away from the lead frame.

6. The LED bracket according to claim 5, characterized in that, The first pad, the second pad, the third pad, and the fourth pad all adopt a three-section structure design consisting of a head section, a middle section, and a tail section. The head section is embedded in the solder groove separated by the lead frame within the fixing frame, the middle section is snapped into the second assembly groove, and the tail section is fastened into the first assembly groove.

7. The LED bracket according to claim 6, characterized in that, The head segments of the first pad and the third pad are both larger than the head segments of the second pad and the fourth pad, and the head segment of the first pad extends toward the second pad and the fourth pad respectively, and the extended portion is adapted to the edge of the diagonally arranged third pad.

8. The LED bracket according to claim 7, characterized in that, The second pad is the negative electrode of the third chip, the fourth pad is the negative electrode of the first chip, and the first pad is the common positive electrode of the first chip, the second chip, and the third chip.

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