Heat insulation device for hot plate module for heating wafer
By setting a double-layer heat insulation structure on the hot plate module, including a front heat insulation component and a rear heat insulation component, the problem of poor heat insulation of a single door panel structure is solved, and effective heat insulation of the high-temperature hot plate is achieved, improving the comfort of the working environment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HEFEI KAIYUE SEMICON TECH CO LTD
- Filing Date
- 2025-03-14
- Publication Date
- 2026-05-05
AI Technical Summary
The existing single-door structure of the hot plate module is insufficient to meet the heat insulation requirements of the high-temperature hot plate, resulting in excessively high temperatures in the area surrounding the equipment and affecting the comfort of the staff.
The system employs a double-layer insulation structure, including a front insulation component and a rear insulation component. An insulation layer is formed by installing insulation boards and perforated plates on the door panel frame. Combined with a buffer layer and heat dissipation holes, it blocks heat and improves the insulation effect.
It effectively insulates heat inside the equipment, reduces the temperature around the equipment, improves the heat insulation performance of the high-temperature hot plate, and ensures the comfort of the staff.
Smart Images
Figure CN224205568U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a heat insulation device for a hot plate module for heating wafers. Background Technology
[0002] During wafer processing, a hot plate is needed to heat the wafer. During the heating process, the temperature around the hot plate is high. Especially with the current technological trend of gradually increasing the operating temperature of the hot plate, the temperature around the hot plate is further increased, resulting in more heat being released from the equipment, which affects the comfort of workers who are close to the equipment.
[0003] To address the above issues and isolate heat from the inside and outside of the equipment, a door-like structure that can be opened and closed is currently installed around the hot plate module, called a hot plate side door. However, the existing hot plate side door has a single-panel structure, which is insufficient to meet the heat insulation requirements of the high-temperature hot plate. Utility Model Content
[0004] To address the technical problems existing in the background art, this utility model proposes a heat insulation device for a hot plate module for heating wafers.
[0005] This utility model proposes a heat insulation device for a hot plate module for heating wafers, comprising:
[0006] The door panel frame is provided with at least one side of which is rotatably mounted on the equipment via a rotating component;
[0007] The heat insulation structure includes a front heat insulation component and a rear heat insulation component respectively installed on the front and rear sides of the door panel frame, and a heat insulation layer is formed between the front heat insulation component and the rear heat insulation component.
[0008] Preferably, the front heat insulation assembly includes a mounting plate I, a heat insulation plate I, and a perforated plate I. The heat insulation plate I and the perforated plate I are sequentially mounted on the mounting plate I from the inside to the outside. The mounting plate I is mounted on the front side of the door panel frame, and a buffer layer I is formed between the heat insulation plate I and the perforated plate I. The rear heat insulation assembly includes a mounting plate II, a heat insulation plate II, and a perforated plate II. The heat insulation plate II and the perforated plate II are respectively mounted on the front and rear sides of the mounting plate II. The mounting plate II is mounted on the rear side of the door panel frame, and a buffer layer II is formed between the heat insulation plate II and the perforated plate II. The heat insulation layer is formed between the heat insulation plate I and the heat insulation plate II.
[0009] Preferably, both the perforated plate I and the perforated plate II have multiple heat dissipation holes.
[0010] Preferably, there are two door panel frames, and the sides of the two door panel frames are rotatably connected by a pivot.
[0011] Preferably, a handle is also installed on the front center of the door panel frame away from the rotating component, and by pulling the handle, the two door panel frames can be folded back and forth along the pivot.
[0012] Preferably, the door panel frame is provided with a locking structure, which can lock or unlock with the equipment.
[0013] Preferably, the locking structure includes a locking pin installed on the door panel frame and extending along the height direction of the door panel frame. Both ends of the locking pin are provided as telescopic heads. When the telescopic heads at both ends are extended, they can be inserted into the sockets opened on the device to lock, and when they are retracted, they disengage from the sockets to release the lock.
[0014] Preferably, it also includes a switch that can control the telescopic head to extend or retract.
[0015] Preferably, both the heat insulation plate I and the heat insulation plate II are made of heat insulation material.
[0016] Preferably, the rotating component is a hinge.
[0017] In summary, this utility model has the following beneficial effects: by installing a front heat insulation component and a rear heat insulation component on the door panel frame, a heat insulation layer is formed between the front heat insulation component and the rear heat insulation component. The heat insulation layer blocks heat and keeps the heat inside the equipment. In this way, compared with the heat insulation of a single door panel structure, the heat insulation effect is improved and the heat insulation needs of high temperature hot plate are met.
[0018] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0019] Figure 1 This is a structural diagram of the heat insulation device according to an embodiment of the present utility model;
[0020] Figure 2 This is a partial exploded view of the heat insulation device according to an embodiment of the present invention;
[0021] Figure 3 This is a partial schematic diagram of the bottom structure of the heat insulation device according to an embodiment of the present invention.
[0022] In the picture:
[0023] 1. Door panel frame; 2. Hinges; 3. Front insulation assembly; 31. Mounting plate I; 32. Insulation plate I; 33. Perforated plate I; 34. Buffer layer I; 4. Rear insulation assembly; 41. Mounting plate II; 42. Insulation plate II; 43. Perforated plate II; 44. Buffer layer II; 5. Insulation layer; 6. Ventilation holes; 7. Shaft; 8. Handle; 9. Locking post; 10. Switch. Detailed Implementation
[0024] The embodiments of this utility model are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar symbols denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0025] like Figure 1-3 As shown in this embodiment, a heat insulation device for a hot plate module for heating wafers includes:
[0026] The door panel frame 1 is provided with at least one side of which is rotatably mounted on the equipment via a rotating component;
[0027] Specifically, the rotating component is set as hinge 2.
[0028] The heat insulation structure includes a front heat insulation component 3 and a rear heat insulation component 4 respectively installed on the front and rear sides of the door panel frame 1, with a heat insulation layer 5 formed between the front heat insulation component 3 and the rear heat insulation component 4.
[0029] Thus, by installing a front heat insulation component 3 and a rear heat insulation component 4 on the door panel frame 1, a heat insulation layer 5 is formed between the front heat insulation component 4 and the rear heat insulation component 4. The heat insulation layer 5 blocks heat and keeps the heat inside the equipment. In this way, compared with the heat insulation of a single door panel structure, the heat insulation effect is improved and the heat insulation needs of high temperature hot plate are met.
[0030] Furthermore, such as Figure 2 and Figure 3 As shown, the front heat insulation component 3 includes a mounting plate I 31, a heat insulation plate I 32, and a perforated plate I 33. The heat insulation plate I 32 and the perforated plate I 33 are installed on the mounting plate I 31 from the inside out. The mounting plate I 31 is installed on the front side of the door frame 1, and a buffer layer I 34 is formed between the heat insulation plate I 32 and the perforated plate I 33. The rear heat insulation component 4 includes a mounting plate II 41, a heat insulation plate II 42, and a perforated plate II 43. The heat insulation plate II 42 and the perforated plate II 43 are installed on the front and rear sides of the mounting plate II 41, respectively. The mounting plate II 41 is installed on the rear side of the door frame 1, and a buffer layer II 44 is formed between the heat insulation plate II 42 and the perforated plate II 43. A heat insulation layer 5 is formed between the heat insulation plate I 32 and the heat insulation plate II 42. Specifically, multiple heat dissipation holes 6 are provided on both the perforated plate I 33 and the perforated plate II 43, and the multiple heat dissipation holes 6 are evenly distributed.
[0031] The generated heat enters the buffer layer II44 through the perforated plate II43, and is then blocked by the heat insulation layer 5 formed between the heat insulation plate I32 and the heat insulation plate II42, so that most of the heat is isolated inside the equipment; a small portion of the heat is dissipated in the buffer layer I34. At this time, the outside air enters the buffer layer I34 through the perforated plate I33 to cool the dissipated heat, thereby stabilizing the ambient temperature outside the perforated plate I33, meeting the heat insulation requirements, avoiding the impact on the external environment, and ensuring the comfort of the staff working close to the equipment.
[0032] In this embodiment, as Figure 1 As shown, there are two door panel frames 1, and the sides of the two door panel frames 1 are rotatably connected by a pivot 7.
[0033] Furthermore, a handle 8 is installed on the front center of the door panel frame 1, which is away from the rotating part. By pulling the handle 8 forward, the two door panel frames 1 can be folded together along the pivot 7 to open the heat insulation device. Pushing the handle 8 backward will cause the two door panel frames 1 to unfold and close the heat insulation device.
[0034] The door frame 1 is equipped with a locking structure that can lock or unlock the equipment.
[0035] Specifically, the locking structure includes a locking pin 9 installed on the door frame 1 and extending along the height direction of the door frame 1. Both ends of the locking pin 9 are provided as telescopic heads. When the telescopic heads at both ends are extended, they can be inserted into the sockets opened on the equipment to lock. When they are retracted, they disengage from the sockets to release the lock.
[0036] Furthermore, it also includes a switch 10 that controls the extension or retraction of the telescopic head. It should be noted that the specific structure of the switch and the control structure between the switch 10 and the telescopic head can be found in existing technology, and will not be repeated here.
[0037] It should be noted that both the heat insulation plate I 32 and the heat insulation plate II 42 in this embodiment are made of heat insulation material. For specific heat insulation materials, please refer to the existing technology. This article will not repeat the details.
[0038] It should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0040] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0041] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0042] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A heat insulation device for a hot plate module for heating wafers, characterized in that, include: The door panel frame is provided with at least one side of which is rotatably mounted on the equipment via a rotating component; The thermal insulation structure includes a front thermal insulation component and a rear thermal insulation component respectively installed on the front and rear sides of the door panel frame, with a thermal insulation layer formed between the front thermal insulation component and the rear thermal insulation component; The front heat insulation assembly includes a mounting plate I, a heat insulation plate I, and a perforated plate I. The heat insulation plate I and the perforated plate I are installed on the mounting plate I from the inside out. The mounting plate I is installed on the front side of the door panel frame, and a buffer layer I is formed between the heat insulation plate I and the perforated plate I. The rear heat insulation assembly includes a mounting plate II, a heat insulation plate II, and a perforated plate II. The heat insulation plate II and the perforated plate II are respectively installed on the front and rear sides of the mounting plate II. The mounting plate II is installed on the rear side of the door panel frame, and a buffer layer II is formed between the heat insulation plate II and the perforated plate II. The heat insulation layer is formed between the heat insulation plate I and the heat insulation plate II.
2. The heat insulation device for a hot plate module for heating wafers according to claim 1, characterized in that, Both the perforated plate I and the perforated plate II have multiple heat dissipation holes.
3. The heat insulation device for a hot plate module for heating wafers according to claim 2, characterized in that, The door panel frame is provided in two parts, and the sides of the two door panel frames are rotatably connected by a pivot.
4. The heat insulation device for a hot plate module for heating wafers according to claim 3, characterized in that, A handle is also installed on the front center of the door panel frame away from the rotating component. By pulling the handle, the two door panel frames can be folded back and forth along the pivot.
5. The heat insulation device for a hot plate module for heating wafers according to claim 4, characterized in that, The door panel frame is equipped with a locking structure, which can lock or unlock the equipment.
6. The heat insulation device for a hot plate module for heating wafers according to claim 5, characterized in that, The locking structure includes a locking pin installed on the door panel frame and extending along the height direction of the door panel frame. Both ends of the locking pin are provided with telescopic heads. When the telescopic heads at both ends are extended, they can be inserted into the sockets opened on the device to lock. When they are retracted, they disengage from the sockets to release the lock.
7. The heat insulation device for a hot plate module for heating wafers according to claim 6, characterized in that, It also includes a switch that controls the telescopic head to extend or retract.
8. The heat insulation device for a hot plate module for heating wafers according to claim 1, characterized in that, Both the heat insulation board I and the heat insulation board II are made of heat insulation material.
9. The heat insulation device for a hot plate module for heating wafers according to claim 1, characterized in that, The rotating component is a hinge.