Power module packaging structure
By designing an interleaved bent terminal structure in the power module packaging structure, the parasitic inductance problem caused by the terminals not being able to fit tightly on the outside of the housing is solved, thereby reducing inductance and improving the module's anti-interference and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LIONSGATE MICROELECTRONICS (WENLING) CO LTD
- Filing Date
- 2025-05-19
- Publication Date
- 2026-05-05
AI Technical Summary
In existing power module packaging structures, the input and output terminals cannot remain tightly attached after leaving the housing, resulting in a large amount of parasitic inductance, which affects the module's reliability and anti-interference capability.
Design a power module packaging structure in which a first power terminal and a second power terminal are staggered inside the frame, including staggered bending structures and pins, to ensure that the internal connection terminals overlap and are staggered inside the frame, thereby canceling the induced magnetic field and reducing parasitic inductance.
The staggered terminal structure reduces the parasitic inductance of the power module, improving its anti-interference capability and reliability.
Smart Images
Figure CN224205647U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and more specifically, to a power module packaging structure. Background Technology
[0002] When packaging power modules, the design focus of the power module packaging structure is to improve the reliability of the power module, reduce voltage spikes and electromagnetic interference during switching, and suppress the generation of parasitic inductance at the power module terminals.
[0003] An effective suppression method is to keep the input and output terminals as close as possible to each other so that the magnetic fields they generate cancel each other out. In existing power module packaging structures, although the input and output terminals embedded inside the housing can be as close as possible while ensuring sufficient insulation, once separated from the housing, the input and output terminals between the housing and the power module do not remain in close contact, resulting in a large amount of parasitic inductance and affecting the overall reliability of the power module.
[0004] Therefore, how to reduce the parasitic inductance of power module terminals is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0005] The purpose of this application is to provide a power module packaging structure to reduce the parasitic inductance of the power module terminals, thereby improving the anti-interference capability and reliability of the power module product.
[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:
[0007] This application provides a power module packaging structure, including: a frame, a base plate, a first power terminal and a second power terminal; the frame and the base plate are connected to form an inner cavity for accommodating the power module, one end of the first power terminal and the second power terminal are both used to connect to the power module inside the frame, and the other end of the first power terminal and the second power terminal both pass through the frame and protrude outside the frame.
[0008] The first power terminal includes a first inner connection terminal and a first outer connection terminal connected together, and the second power terminal includes a second inner connection terminal and a second outer connection terminal connected together; both the first inner connection terminal and the second inner connection terminal are exposed inside the frame to connect with the power module, and both the first outer connection terminal and the second outer connection terminal are exposed outside the frame.
[0009] The first inner connection end includes a first horizontal part connected to each other and a plurality of bent first branch structures; the second inner connection end includes a second horizontal part connected to each other and a plurality of bent second branch structures; the first horizontal part is located above the second horizontal part; a portion of the first horizontal part and a portion of the second inner connection end have a projection overlap area on the horizontal projection plane; the plurality of first branch structures and the plurality of second branch structures are staggered.
[0010] Furthermore, the first branch structure includes a first bending structure and a first pin, and the second branch structure includes a second bending structure and a second pin;
[0011] One end of the first bending structure and the second bending structure are respectively connected to the first horizontal part and the second horizontal part, and the other end of the first bending structure and the second bending structure are respectively connected to one end of the first pin and the second pin. The other end of the first pin and the second pin are both used to connect to the power module.
[0012] The first horizontal section, the second horizontal section, the plurality of first pins and the plurality of second pins are parallel to each other, and the plurality of first pins and the plurality of second pins are all located on the same horizontal plane.
[0013] Furthermore, multiple first pins are located on a first horizontal line, multiple second pins are located on a second horizontal line, and the first and second horizontal lines do not overlap. The projections of the first and second pins on the vertical projection plane do not overlap completely or partially overlap.
[0014] Furthermore, the bending arc of the first bending structure is greater than that of the second bending structure, and multiple first pins and multiple second pins are all located on the third horizontal straight line, with the projections of the first pins and the second pins on the vertical projection plane completely overlapping.
[0015] Furthermore, each second branch structure is exposed in the gap between two adjacent first branch structures.
[0016] Furthermore, the gap width between two adjacent first branch structures is greater than the width of the second branch structure, and the gap width between two adjacent second branch structures is greater than the width of the first branch structure.
[0017] Furthermore, multiple first branch structures and multiple second branch structures are interspersed in pairs, arranged in a staggered manner.
[0018] Furthermore, the vertical distance between the first horizontal part and the second horizontal part is 0.5-2mm.
[0019] Furthermore, the first external connection end and the second external connection end are vertically connected to the first internal connection end and the second internal connection end, respectively; or, the first external connection end and the second external connection end are horizontally connected to the first internal connection end and the second internal connection end, respectively.
[0020] Furthermore, the first power terminal is a high-voltage input terminal, and the second power terminal is a low-voltage output terminal.
[0021] Compared with the prior art, this application has the following advantages:
[0022] This application provides a power module packaging structure, including: a frame, a base plate, a first power terminal, and a second power terminal. The frame and base plate are connected to form an inner cavity for accommodating the power module. One end of each of the first and second power terminals is used to connect to the power module inside the frame, and the other ends of both the first and second power terminals penetrate the frame and protrude outside the frame. The first power terminal includes a first inner connection end and a first outer connection end connected together, and the second power terminal includes a second inner connection end and a second outer connection end connected together. Both the first and second inner connection ends protrude inside the frame for connection to the power module, and both the first and second outer connection ends protrude outside the frame. The first inner connection end includes a first horizontal portion connected together and multiple bent first branch structures, and the second inner connection end includes a second horizontal portion connected together and multiple bent second branch structures.
[0023] The first horizontal section is located above the second horizontal section. A portion of the first horizontal section and a portion of the second inner connection end (i.e., a portion of the second horizontal section and a portion of the second branch structure) have a projection overlap area on the horizontal projection plane. Multiple first branch structures and multiple second branch structures are interleaved. Because the first and second inner connection ends exposed inside the frame remain overlapping, and the multiple first branch structures and multiple second branch structures are interleaved, the first and second inner connection ends can cancel each other out the induced magnetic field, reducing the parasitic inductance of the power module terminals, thereby reducing the energy loss of the power module product and improving its anti-interference capability. Attached Figure Description
[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0025] Figure 1 A top view of the existing power module packaging structure;
[0026] Figure 2 A top view of a power module packaging structure provided in an embodiment of this application;
[0027] Figure 3 This is one of the structural schematic diagrams of a first power terminal and a second power terminal provided in the embodiments of this application;
[0028] Figure 4 One of the top views of a first power terminal and a second power terminal provided in an embodiment of this application;
[0029] Figure 5 One of the side views of a first power terminal and a second power terminal provided for embodiments of this application;
[0030] Figure 6 This is a second schematic diagram of the structure of a first power terminal and a second power terminal provided in an embodiment of this application;
[0031] Figure 7 A second top view of a first power terminal and a second power terminal provided for embodiments of this application;
[0032] Figure 8 This is a second side view of a first power terminal and a second power terminal provided in an embodiment of this application.
[0033] Icons: 10 - Power module package structure; 100 - Frame; 200 - Base plate; 300 - First power terminal; 310 - First inner connection terminal; 311 - First horizontal section; 312 - First branch structure; 3121 - First bending structure; 3122 - First pin; 320 - First outer connection terminal; 400 - Second power terminal; 410 - Second inner connection terminal; 411 - Second horizontal section; 412 - Second branch structure; 4121 - Second bending structure; 4122 - Second pin; 420 - Second outer connection terminal; 20 - Power module; 30 - Housing; 41 - Outer input terminal; 42 - Inner input terminal; 51 - Outer output terminal; 52 - Inner output terminal; L1 - First horizontal line; L2 - Second horizontal line; L3 - Third horizontal line. Detailed Implementation
[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0035] In the description of this application, it should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. The term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.
[0036] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0037] As described in the background section, existing power module packaging structures, such as Figure 1 As shown. After entering from the outer input terminal 41, the current is guided to the inner side of the housing 30 through the input terminal embedded in the housing 30, and then guided to the ceramic substrate in the power module 20 (wherein the power module 20 includes a ceramic substrate and a power chip disposed on the ceramic substrate) through the inner input terminal 42. After being switched by the power chip on the ceramic substrate, the current is guided from the ceramic substrate to the inner output terminal 52, and finally guided to the outer output terminal 51 through the output terminal embedded in the housing 30.
[0038] There are two main connection methods between the inner input terminal 42 and the inner output terminal 52 and the ceramic substrate: one method is that the inner input terminal 42 and the inner output terminal 52 form two parallel planes, which are connected to the ceramic substrate by metal wires. The other method is that the inner input terminal 42 and the inner output terminal 52 form two parallel downward-folded structures, which are directly bonded to the ceramic substrate. However, neither of these connection methods can ensure a tight fit between the inner input terminal 42 and the inner output terminal 52, resulting in a large amount of parasitic inductance in the entire power module terminals, thus affecting the reliability of the power module 20.
[0039] Therefore, how to reduce the parasitic inductance of power module terminals is a technical problem that urgently needs to be solved by those skilled in the art.
[0040] To resolve the above technical issues, please refer to Figure 2 This application provides a power module packaging structure 10, which includes a frame 100, a base plate 200, a first power terminal 300, and a second power terminal 400.
[0041] Optionally, the first power terminal 300 is a high-voltage input terminal, and the second power terminal 400 is a low-voltage output terminal. Furthermore, both the first power terminal 300 and the second power terminal 400 are made of copper, and the frame 100 is made of insulating material.
[0042] The frame 100 is connected to the base plate 200 to form an inner cavity for accommodating the power module 20. One end of the first power terminal 300 and the second power terminal 400 are both used to connect to the power module 20 inside the frame 100, and the other end of the first power terminal 300 and the second power terminal 400 both pass through the frame 100 and protrude to the outside of the frame 100.
[0043] The first power terminal 300 includes a first inner connection terminal 310 and a first outer connection terminal 320 connected together, and the second power terminal 400 includes a second inner connection terminal 410 and a second outer connection terminal 420 connected together. The first inner connection terminal 310 and the second inner connection terminal 410 are both exposed inside the frame 100 for connection to the power module 20, and the first outer connection terminal 320 and the second outer connection terminal 420 are both exposed outside the frame 100 for connection to an external power source.
[0044] Optionally, the first external connection end 320 and the second external connection end 420 are vertically connected to the first internal connection end 310 and the second internal connection end 410, respectively; or, the first external connection end 320 and the second external connection end 420 are horizontally connected to the first internal connection end 310 and the second internal connection end 410, respectively.
[0045] The first inner connecting end 310 includes a connected first horizontal portion 311 and a plurality of bent first branch structures 312, and the second inner connecting end 410 includes a connected second horizontal portion 411 and a plurality of bent second branch structures 412. The first horizontal portion 311 is located above the second horizontal portion 411. A portion of the first horizontal portion 311 and a portion of the second inner connecting end 410 (i.e., a portion of the second horizontal portion 411 and a portion of the second branch structures 412) have a projection overlap area on the horizontal projection plane (equivalent to the top view plane), and the plurality of first branch structures 312 and the plurality of second branch structures 412 are staggered.
[0046] Based on the above design, since the first inner connection end 310 and the second inner connection end 410 exposed inside the frame 100 remain in an overlapping state, and the multiple first branch structures 312 and the multiple second branch structures 412 are staggered, the first inner connection end 310 and the second inner connection end 410 can cancel each other out the induced magnetic field, reduce the parasitic inductance of the power module terminals (i.e., the first power terminal 300 and the second power terminal 400), thereby reducing the energy loss of the power module product and improving the anti-interference capability.
[0047] Further, please refer to Figure 3 The first branch structure 312 includes a first bending structure 3121 and a first pin 3122, and the second branch structure 412 includes a second bending structure 4121 and a second pin 4122.
[0048] One end of the first bending structure 3121 and the second bending structure 4121 is connected to the first horizontal part 311 and the second horizontal part 411, respectively. The other end of the first bending structure 3121 and the second bending structure 4121 is connected to one end of the first pin 3122 and the second pin 4122, respectively. The other end of the first pin 3122 and the second pin 4122 are both used to connect to the power module 20.
[0049] The first horizontal portion 311, the second horizontal portion 411, the plurality of first pins 3122, and the plurality of second pins 4122 are parallel to each other. The first horizontal portion 311 is located above the second horizontal portion 411, and the plurality of first pins 3122 and the plurality of second pins 4122 are all located below the second horizontal portion 411. Optionally, the vertical distance between the first horizontal portion 311 and the second horizontal portion 411 is 0.5-2 mm.
[0050] Furthermore, the multiple first pins 3122 and the multiple second pins 4122 are all located on the same horizontal plane. Optionally, the multiple first pins 3122 and the multiple second pins 4122 have the same volume and shape, and the multiple first bending structures 3121 and the multiple second bending structures 4121 are all smooth arc-shaped structures.
[0051] In one optional embodiment, a plurality of first pins 3122 are located on a first horizontal line L1, and a plurality of second pins 4122 are located on a second horizontal line L2. The first horizontal line L1 and the second horizontal line L2 are parallel and on the same horizontal plane, and the first horizontal line L1 and the second horizontal line L2 do not coincide. The overlap state of the plurality of first pins 3122 and the plurality of second pins 4122 on the vertical projection plane (equivalent to the side view plane) can be adjusted by adjusting the distance between the first horizontal line L1 and the second horizontal line L2; that is, the projections of the first pins 3122 and the second pins 4122 on the vertical projection plane can partially overlap or not overlap at all.
[0052] For example, when the distance between the first horizontal line L1 and the second horizontal line L2 is small, the projected portions of multiple first pins 3122 and second pins 4122 on the vertical projection plane overlap. See also, for another example... Figures 3 to 5 When the distance between the first horizontal line L1 and the second horizontal line L2 is large, the projections of the first pin 3122 and the second pin 4122 on the vertical projection plane do not overlap at all (e.g. Figure 5 (As shown).
[0053] Depend on Figure 4 and Figure 5 As can be seen, when the distance between the first horizontal straight line L1 and the second horizontal straight line L2 is large, the first inner connecting end 310 and the second inner connecting end 410 only have the overlap of the first horizontal part 311 of the sheet structure and the second inner connecting end 410 (i.e., the second horizontal part 411 and the second bent structure 4121) on the horizontal projection plane, and the first pin 3122 and the second pin 4122 do not overlap on the vertical projection plane.
[0054] To further reduce the parasitic inductance of the power module terminals, please refer to [link / reference needed]. Figures 6 to 8 In another optional embodiment, the bending radius of the first bending structure 3121 is greater than that of the second bending structure 4121, and the plurality of first pins 3122 and the plurality of second pins 4122 are all located on the third horizontal straight line L3, and the projections of the first pins 3122 and the second pins 4122 on the vertical projection plane completely overlap (e.g., Figure 8 (As shown).
[0055] Depend on Figure 7 and Figure 8 As can be seen, when multiple first pins 3122 and multiple second pins 4122 are all located on the third horizontal straight line L3, the first inner connection terminal 310 and the second inner connection terminal 410, in addition to the overlap of the first horizontal portion 311 of the sheet structure and the second inner connection terminal 410 (i.e., the second horizontal portion 411 and the second bent structure 4121) on the horizontal projection plane, also include the overlap of multiple first pins 3122 and multiple second pins 4122 of the branch structure on the vertical projection plane, which increases the overlap area and further reduces the parasitic inductance.
[0056] As an alternative implementation method, please refer again. Figure 6 In this embodiment, each second branch structure 412 is exposed at the gap between two adjacent first branch structures 312. The width of the gap between two adjacent first branch structures 312 is greater than the width of the second branch structure 412, and the width of the gap between two adjacent second branch structures 412 is greater than the width of the first branch structure 312.
[0057] As another alternative implementation, the plurality of first branch structures 312 and the plurality of second branch structures 412 are staggered in a pair-by-pair arrangement.
[0058] In summary, this application provides a power module packaging structure, including: a frame, a base plate, a first power terminal, and a second power terminal. The frame and base plate are connected to form an inner cavity for accommodating the power module. One end of each of the first and second power terminals is used to connect to the power module inside the frame, and the other ends of both the first and second power terminals penetrate the frame and protrude outside the frame. The first power terminal includes a first inner connection end and a first outer connection end connected together, and the second power terminal includes a second inner connection end and a second outer connection end connected together. Both the first and second inner connection ends protrude inside the frame for connection to the power module, and both the first and second outer connection ends protrude outside the frame. The first inner connection end includes a first horizontal portion connected together and multiple bent first branch structures, and the second inner connection end includes a second horizontal portion connected together and multiple bent second branch structures. The first horizontal portion is located above the second horizontal portion, and a portion of the first horizontal portion and a portion of the second inner connection end (i.e., a portion of the second horizontal portion and a portion of the second branch structures) have a projection overlap area on a horizontal projection plane. The multiple first branch structures and multiple second branch structures are staggered.
[0059] Since the first and second inner connecting parts exposed inside the frame still remain in an overlapping state, that is, the first horizontal part of the sheet structure overlaps with the second inner connecting end on the horizontal projection plane, and the multiple first pins and multiple second pins of the branch structure overlap on the vertical projection plane, the first power terminal and the second power terminal can cancel each other out the induced magnetic field, reduce parasitic inductance, thereby reducing the energy loss of the power module product and improving the anti-interference capability.
[0060] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
[0061] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A power module packaging structure, characterized in that, include: The system comprises a frame, a base plate, a first power terminal, and a second power terminal; the frame and the base plate are connected to form an inner cavity for accommodating a power module; one end of each of the first and second power terminals is used to connect to the power module inside the frame; and the other end of each of the first and second power terminals passes through the frame and protrudes outside the frame. The first power terminal includes a first inner connection terminal and a first outer connection terminal connected together, and the second power terminal includes a second inner connection terminal and a second outer connection terminal connected together; the first inner connection terminal and the second inner connection terminal are both exposed on the inner side of the frame to connect with the power module, and the first outer connection terminal and the second outer connection terminal are both exposed on the outer side of the frame. The first inner connection end includes a first horizontal portion connected to each other and a plurality of bent first branch structures; the second inner connection end includes a second horizontal portion connected to each other and a plurality of bent second branch structures; the first horizontal portion is located above the second horizontal portion; a portion of the first horizontal portion and a portion of the second inner connection end have a projection overlap area on the horizontal projection plane; the plurality of first branch structures and the plurality of second branch structures are staggered.
2. The power module packaging structure according to claim 1, characterized in that, The first branch structure includes a first bending structure and a first pin, and the second branch structure includes a second bending structure and a second pin; One end of the first bending structure and the second bending structure are respectively connected to the first horizontal part and the second horizontal part, and the other end of the first bending structure and the second bending structure are respectively connected to one end of the first pin and the second pin. The other end of the first pin and the second pin are both used to connect to the power module. The first horizontal portion, the second horizontal portion, the plurality of first pins and the plurality of second pins are parallel to each other, and the plurality of first pins and the plurality of second pins are all located on the same horizontal plane.
3. The power module packaging structure according to claim 2, characterized in that, Multiple first pins are located on a first horizontal line, multiple second pins are located on a second horizontal line, and the first horizontal line and the second horizontal line do not coincide. The projections of the first pins and the second pins on the vertical projection plane do not overlap completely or partially overlap.
4. The power module packaging structure according to claim 2, characterized in that, The bending radius of the first bending structure is greater than that of the second bending structure, and the plurality of first pins and the plurality of second pins are all located on the third horizontal straight line, and the projections of the first pins and the second pins on the vertical projection plane completely overlap.
5. The power module packaging structure according to claim 1, characterized in that, Each of the second branch structures is exposed in the gap between two adjacent first branch structures.
6. The power module packaging structure according to claim 5, characterized in that, The gap width between two adjacent first branch structures is greater than the width of the second branch structure, and the gap width between two adjacent second branch structures is greater than the width of the first branch structure.
7. The power module packaging structure according to claim 1, characterized in that, Multiple first branch structures and multiple second branch structures are staggered in pairs, arranged in a group.
8. The power module packaging structure according to claim 1, characterized in that, The vertical distance between the first horizontal part and the second horizontal part is 0.5-2mm.
9. The power module packaging structure according to claim 1, characterized in that, The first external connection terminal and the second external connection terminal are respectively perpendicularly connected to the first internal connection terminal and the second internal connection terminal; or, The first external connection terminal and the second external connection terminal are horizontally connected to the first internal connection terminal and the second internal connection terminal, respectively.
10. The power module packaging structure according to claim 1, characterized in that, The first power terminal is a high-voltage input terminal, and the second power terminal is a low-voltage output terminal.