Integrated direct-current filter capacitor power module

Abstract

The utility model relates to an integrated direct current filter capacitor power module, which comprises a shell, a capacitor core group, a first polarity terminal, a second polarity terminal, a first insulated gate bipolar transistor (IGBT) busbar, a second IGBT busbar, a first parallel conducting strip, a second parallel conducting strip and epoxy resin, the capacitor core group, the first parallel conducting strip, the second parallel conducting strip, the inner end of the first polarity terminal, the inner end of the second polarity terminal, the inner end of the first IGBT busbar and the inner end of the second IGBT busbar are arranged in the shell through the opening, and the opening is packaged by the epoxy resin. According to the utility model, the capacitor core group, the first polarity terminal, the second polarity terminal, the first IGBT busbar, the second IGBT busbar, the first parallel conducting strip and the second parallel conducting strip are all integrated on the shell, and then are packaged by epoxy resin, so that compared with a conventional filtering device, the integrated filtering device adopts an integrated design, is convenient and easy to install, is short in installation time, and is high in reliability. And the comprehensive cost is reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of filter capacitor power modules, and particularly to an integrated DC filter capacitor power module. Background Technology

[0002] With the increasing demand for low-carbon, energy-saving, and cost-reduction development this year, the application of high-power power supplies in heating, smelting, melting, welding, UPS power supplies, photovoltaic inverters, energy storage, and other applications has gradually increased. Currently, the power output of high-power power supplies has gradually increased from the original 5kW~25kW to 100kW or even over 500kW.

[0003] Capacitors, as indispensable filtering components in circuits, play a crucial role in applications such as induction heating, electron beam welding, and photovoltaic inverters. Because capacitors generate heat under high-frequency ripple current, the industry currently commonly uses direct-current filtering capacitor devices as filtering components, such as... Figure 1 As shown, it includes multiple cylindrical aluminum-shell capacitors 'a' and a composite busbar 'c', with multiple cylindrical aluminum-shell capacitors connected in parallel on the composite busbar 'c'. However, the above-mentioned DC filter device has the following shortcomings: 1. Each cylindrical aluminum-shell capacitor 'a' is installed individually on the composite busbar 'c', and a base plate 'b' needs to be installed at the bottom of the composite busbar. This type of DC filter capacitor device is inconvenient to install, and manual installation is time-consuming. With labor costs increasing year by year, the cost will also gradually increase. 2. In addition, the capacitor components of this type of DC filter capacitor device are difficult to replace, making maintenance inconvenient. 3. Ventilation and heat dissipation are achieved by maintaining a certain distance between adjacent cylindrical aluminum shells, resulting in poor heat dissipation. Therefore, the structure of the existing DC filter capacitor device needs further improvement. Utility Model Content

[0004] The purpose of this invention is to provide an integrated DC filter capacitor power module that is structurally sound, easy to install, and low in cost. This invention meets the application requirements of convenient installation and maintenance, high current carrying capacity, high heat dissipation capacity, low overall cost, and high overall performance.

[0005] The purpose of this utility model is achieved as follows:

[0006] An integrated DC filter capacitor power module includes a housing, a capacitor core assembly, a first polarity terminal, a second polarity terminal, a first IGBT busbar, a second IGBT busbar, a first parallel conductive sheet, a second parallel conductive sheet, and epoxy resin. The housing has an opening through which the capacitor core assembly, the first parallel conductive sheet, the second parallel conductive sheet, the inner ends of the first polarity terminal, the second polarity terminal, the first IGBT busbar, and the second IGBT busbar are inserted into the housing. The opening is encapsulated with epoxy resin. A first parallel conductive sheet is attached to one side of the capacitor core assembly, and a second parallel conductive sheet is attached to the other side of the capacitor core assembly. The capacitor core assembly consists of multiple capacitor cores arranged side by side. A first parallel conductive sheet is connected in parallel to one end of multiple capacitor cores, and a second parallel conductive sheet is connected in parallel to the other end of multiple capacitor cores. The inner ends of the first and second IGBT busbars are connected to the first and second parallel conductive sheets, respectively. The inner ends of the first and second polarity terminals are connected to the first and second parallel conductive sheets, respectively. This invention integrates the capacitor core assembly, the first polarity terminal, the second polarity terminal, the first IGBT busbar, the second IGBT busbar, the first parallel conductive sheet, and the second parallel conductive sheet all onto a housing, which is then encapsulated with epoxy resin. Compared to previous filtering devices, this invention adopts an integrated design, which simplifies the structure, facilitates installation, shortens installation time, and reduces overall cost. This invention does not require an additional composite busbar, reducing the use of composite busbars and reducing labor installation costs.

[0007] The present invention can be further improved in the following ways.

[0008] As a further option, the first IGBT busbar and the second IGBT busbar are set in pairs, with the outer ends of the first IGBT busbar and the outer ends of the second IGBT busbar spaced apart and arranged side by side.

[0009] As a further embodiment, the outer end of the first IGBT busbar is provided with multiple first IGBT polarity terminals, and the outer end of the second IGBT busbar is provided with multiple second IGBT polarity terminals corresponding to the multiple first IGBT polarity terminals, with each first IGBT polarity terminal corresponding to one of the second IGBT polarity terminals.

[0010] As a further embodiment, it includes at least two first IGBT busbars and at least two second IGBT busbars, with the opening being rectangular in shape. The first polarity terminal and the second polarity terminal are located at the first side edge and the second side edge of the opening, respectively. At least one pair of first IGBT busbars and the second IGBT busbars are located at the third side edge of the opening, and at least one pair of first IGBT busbars and the second IGBT busbars are located at the fourth side edge of the opening.

[0011] As a further solution, the first IGBT busbar, the first parallel conductive plate, and the first polarity terminal are integrated into one unit, and the second IGBT busbar, the second parallel conductive plate, and the second polarity terminal are integrated into one unit.

[0012] As a further embodiment, the first IGBT busbar and the second IGBT busbar are vertically disposed in the middle of the opening, and the first polarity terminal and the second polarity terminal are disposed on one side edge of the opening.

[0013] As a further embodiment, the opening is located on the end face with a smaller housing area, and the opening has only one first IGBT busbar and one second IGBT busbar. The first IGBT busbar and the second IGBT busbar are located on the first side edge of the opening, and the first polarity terminal and the second polarity terminal are located on the second side edge of the opening.

[0014] As a further solution, silicone insulating strips are provided around the perimeter of the opening to prevent leakage from the capacitor power module.

[0015] As a further solution, insulating paper is provided between the outer ends of the first IGBT busbar and the outer ends of the second IGBT busbar, and the layer withstand voltage of the insulating paper is ≥4kV AC.

[0016] As a further solution, the outer casing is provided with a heat dissipation structure, which is either integrally set with the outer casing or the heat dissipation structure is attached to the flat surface of the outer casing.

[0017] As a further solution, the heat dissipation structure is a heat dissipation tooth assembly or a heat dissipation fin assembly, with a thickness greater than 10mm, thereby enhancing the heat dissipation capacity of the casing and making it more conducive to heat dissipation.

[0018] As a further solution, the capacitor core assembly, the first parallel conductive sheet, and the second parallel conductive sheet are all wrapped together with an insulating material, such as mica paper, aramid fiber paper, glass fiber, carbon fiber, or heat shrink sleeve, to prevent leakage of the capacitor power module.

[0019] As a further embodiment, the first and second parallel conductive sheets are provided with patterned perforated holes at the positions corresponding to the ends of the capacitor core. The patterned perforated holes are mosaic-shaped, clover-shaped, star-shaped, or rhomboid-shaped.

[0020] As a further solution, the outer walls of two adjacent capacitor cores in the capacitor core group abut each other, thereby making the power module of this utility model compact in structure and small in size.

[0021] The capacitor core is either a flat capacitor core or a cylindrical capacitor core.

[0022] As a further option, the capacitor core is made into a cylindrical or flat shape by a winding process using a metallized thin film. The metallized thin film is made by plasma roughening treatment of PS, PP, EPN, PET, PEN, PPS, PEEK, PEEKK, PI, PTFE, PEI, or PMI, followed by metallization evaporation.

[0023] As a further embodiment, a vapor-deposited metal layer is disposed on the metallized thin film. The vapor-deposited metal layer includes a non-thickened region, a transition region, and a thickened region, with the transition region located between the non-thickened region and the thickened region. The width of the thickened region ranges from 3 to 5 mm, and its sheet resistance ranges from 1 to 4 Ω. The width of the transition region ranges from 6 to 30 mm, and its sheet resistance ranges from 10 to 20 Ω. The sheet resistance of the non-thickened region ranges from 15 to 60 Ω.

[0024] As a further option, the vapor-deposited metal layer is a composite or multilayer material structure of one or more of the following materials: aluminum, copper, zinc, or silver.

[0025] As a further option, the ends of the capacitor core are coated with a metal layer, the material of which is tin-zinc, zinc, aluminum, or a zinc-aluminum alloy.

[0026] As a further option, the two ends of the capacitor core are welded to the first parallel conductive sheet and the second parallel conductive sheet, respectively. The ends of the capacitor core are welded using brazing material, which may be tin-zinc, zinc, aluminum, or silver. The welding method for the ends of the capacitor core is laser welding, electron beam welding, or ferrometallurgical welding.

[0027] The beneficial effects of this utility model are as follows:

[0028] (1) This utility model integrates the capacitor core group, the first polarity terminal, the second polarity terminal, the first IGBT busbar, the second IGBT busbar, the first parallel conductive sheet, and the second parallel conductive sheet all on the shell, and then encapsulates them with epoxy resin. Compared with the previous capacitor filtering device, this utility model adopts an integrated design, which simplifies the structure, makes installation convenient and easy, and shortens the installation time. Moreover, the overall cost of this utility model is reduced. This utility model does not require an additional composite busbar, which reduces the use of composite busbars and reduces labor installation costs.

[0029] (2) The structure of this utility model is compact and the size is small. This utility model adopts a parallel integrated design of flat capacitor core or cylindrical capacitor core, which significantly improves the capacitor duty cycle and reduces the size by half compared with multiple capacitors connected in series and parallel.

[0030] (3) The parasitic inductance of this utility model is smaller. The capacitor core adopts a flat capacitor core design, and the inductance is lower than that of the cylindrical capacitor core. This can reduce the external connection circuit, reduce the parasitic inductance, greatly reduce the volume, and reduce the parasitic inductance, while also reducing the power loss in the circuit.

[0031] (4) The capacitor shell of this utility model dissipates heat through a heat dissipation structure, which has strong heat dissipation capacity and high heat dissipation efficiency.

[0032] (5) The capacitor of this utility model has strong current carrying capacity. Due to the reduction of the overall parasitic inductance of this utility model, the power loss of the entire capacitor is reduced, the heat generation is reduced, and the filtering capacity of the capacitor pool with the same capacitance is enhanced.

[0033] (6) The application site maintenance and replacement of this utility model is convenient and quick. This utility model can meet the needs of customers to replace it themselves at the application site. In the past, the replacement of components of the capacitor filter device was difficult and not convenient for maintenance.

[0034] (7) The IGBT busbar of this utility model is directly installed into the housing, and the thickness of the IGBT busbar can be adjusted and designed according to the current. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of an existing DC filter capacitor device.

[0036] Figure 2 This is a schematic diagram of the integrated DC filter capacitor power module according to Embodiment 1 of this utility model.

[0037] Figure 3 This is a structural schematic diagram of the integrated DC filter capacitor power module of Embodiment 1 of this utility model from another angle.

[0038] Figure 4 This is a top view of the integrated DC filter capacitor power module according to Embodiment 1 of this utility model.

[0039] Figure 5 This is a schematic diagram of the structure of the capacitor cell in Embodiment 1 of this utility model.

[0040] Figure 6 yes Figure 4 Sectional view at point AA.

[0041] Figure 7 yes Figure 4 Sectional view at point BB.

[0042] Figure 8 This is an exploded view of the integrated DC filter capacitor power module according to Embodiment 1 of this utility model.

[0043] Figure 9This is a schematic diagram of the integrated DC filter capacitor power module according to Embodiment 2 of this utility model.

[0044] Figure 10 This is a structural schematic diagram of the integrated DC filter capacitor power module of Embodiment 2 of this utility model from another angle.

[0045] Figure 11 This is a schematic diagram of the integrated DC filter capacitor power module according to Embodiment 3 of this utility model.

[0046] Figure 12 This is a structural schematic diagram of the integrated DC filter capacitor power module from another angle, according to Embodiment 3 of this utility model.

[0047] Figure 13 This is a top view of the integrated DC filter capacitor power module of Embodiment 3 of this utility model.

[0048] Figure 14 yes Figure 13 Sectional view at point CC.

[0049] Figure 15 yes Figure 13 Sectional view at point DD.

[0050] Figure 16 This is an exploded view of the integrated DC filter capacitor power module of Embodiment 3 of this utility model.

[0051] Figure 17 This is a schematic diagram of the integrated DC filter capacitor power module of Embodiment 4 of this utility model.

[0052] Figure 18 This is a structural schematic diagram of the integrated DC filter capacitor power module from another angle, according to Embodiment 4 of this utility model.

[0053] Figure 19 This is a top view of the integrated DC filter capacitor power module of Embodiment 4 of this utility model.

[0054] Figure 20 yes Figure 19 Sectional view at EE.

[0055] Figure 21 yes Figure 19 Sectional view at FF.

[0056] Figure 22 This is an exploded view of the integrated DC filter capacitor power module of Embodiment 4 of this utility model.

[0057] Figure 23 This is a schematic diagram of the integrated DC filter capacitor power module according to Embodiment 5 of this utility model.

[0058] Figure 24 This is a structural schematic diagram of the integrated DC filter capacitor power module of Embodiment 5 of this utility model from another angle.

[0059] Figure 25 This is a left view of the integrated DC filter capacitor power module of Embodiment 5 of this utility model.

[0060] Figure 26 yes Figure 25 Sectional view at EE.

[0061] Figure 27 This is a right view of the integrated DC filter capacitor power module of Embodiment 5 of this utility model.

[0062] Figure 28 yes Figure 27 Sectional view at FF.

[0063] Figure 29 This is an exploded view of the integrated DC filter capacitor power module of Embodiment 5 of this utility model. Detailed Implementation

[0064] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0065] Example 1, as Figures 2 to 8 As shown, an integrated DC filter capacitor power module includes a housing 1, a capacitor core assembly 2, a first polarity terminal 3, a second polarity terminal 4, two first IGBT busbars 5, two second IGBT busbars 6, a first parallel conductive sheet 7, a second parallel conductive sheet 8, and epoxy resin 13. The housing 1 has an opening 11 through which the capacitor core assembly 2, the first parallel conductive sheet 7, the second parallel conductive sheet 8, the inner ends of the first polarity terminal 3, the second polarity terminal 4, the inner ends of the two first IGBT busbars 5, and the inner ends of the two second IGBT busbars 6 are inserted into the housing 1. The opening is encapsulated by epoxy resin 13. 11. The first parallel conductive sheet 7 is attached to one side of the capacitor core group 2, and the second parallel conductive sheet 8 is attached to the other side of the capacitor core group 2. The capacitor core group 2 is composed of multiple capacitor cores 21 arranged side by side. The first parallel conductive sheet 7 is connected in parallel to one end of the multiple capacitor cores 21, and the second parallel conductive sheet 8 is connected in parallel to the other end of the multiple capacitor cores 21. The inner end of the first IGBT busbar 5 and the inner end of the second IGBT busbar 6 are respectively connected to the first parallel conductive sheet 7 and the second parallel conductive sheet 8. The inner end of the first polarity terminal 3 and the inner end of the second polarity terminal 4 are respectively connected to the first parallel conductive sheet 7 and the second parallel conductive sheet 8.

[0066] This is a more specific technical solution of the present invention.

[0067] The outer casing 1 is rectangular, the opening 11 is rectangular, the first polar terminal 3 and the second polar terminal 4 are located on the first side edge and the second side edge of the opening 11, respectively, a pair of first IGBT busbars 5 and second IGBT busbars 6 are located on the third side edge of the opening 11, and another pair of first IGBT busbars 5 and second IGBT busbars 6 are located on the fourth side edge of the opening 11.

[0068] The outer casing 1 is provided with connecting ears 12 for mounting and fixing.

[0069] Silicone insulating strips are provided around the perimeter of opening 11.

[0070] The first IGBT busbar 5 and the second IGBT busbar 6 are arranged in pairs, with the outer ends of the first IGBT busbar 5 and the outer ends of the second IGBT busbar 6 spaced apart and arranged side by side.

[0071] The outer end of the first IGBT busbar 5 is provided with a plurality of first IGBT polarity terminals 51, and the outer end of the second IGBT busbar 6 is provided with a plurality of second IGBT polarity terminals 61 corresponding to the positions of the plurality of first IGBT polarity terminals 51. The first IGBT polarity terminals and the second IGBT polarity terminals correspond one-to-one.

[0072] The first IGBT busbar 5, the first parallel conductive plate 7, and the first polarity terminal 3 are integrated into one unit, and the second IGBT busbar 6, the second parallel conductive plate 8, and the second polarity terminal 4 are integrated into one unit.

[0073] Insulating paper is provided between the outer end of the first IGBT busbar 5 and the outer end of the second IGBT busbar 6, and the layer withstand voltage of the insulating paper is ≥4kV AC.

[0074] The capacitor core assembly 2, the first parallel conductive sheet 7, and the second parallel conductive sheet 8 are together wrapped with insulating material, which is mica paper, aramid fiber paper, glass fiber, carbon fiber, or heat shrink sleeve.

[0075] The first parallel conductive sheet 7 and the second parallel conductive sheet 8 are provided with patterned hollow holes at the positions corresponding to the ends of the capacitor core 21. The patterned hollow holes are mosaic-shaped, clover-shaped, star-shaped, or rhomboid-shaped.

[0076] The outer walls of two adjacent capacitor cores 21 in capacitor core group 2 abut against each other.

[0077] The capacitor core is either a flat capacitor core or a cylindrical capacitor core.

[0078] The capacitor core 21 is made into a cylindrical or flat shape by a winding process using a metallized thin film 22. The metallized thin film 22 is made by plasma roughening treatment of PS, PP, EPN, PET, PEN, PPS, PEEK, PEEKK, PI, PTFE, PEI, or PMI to increase the surface roughness of the metallized thin film 22, followed by metallization vapor deposition.

[0079] A vapor-deposited metal layer 23 is disposed on the metallized thin film 22. The vapor-deposited metal layer 23 includes a non-thickened region 24, a transition region 25, and a thickened region 26. The transition region is located between the non-thickened region and the thickened region. The width of the thickened region 26 is 3-5 mm, and the sheet resistance is 1-4 Ω. The width of the transition region 25 is 6-30 mm, and the sheet resistance is 10-20 Ω. The sheet resistance of the non-thickened region 24 is 15-60 Ω.

[0080] The vapor-deposited metal layer 23 is a composite or multi-layer material structure of one or more of the following materials: aluminum, copper, zinc, or silver.

[0081] The end of capacitor core 21 is coated with a metal layer, the material of which is tin-zinc, zinc, aluminum, or zinc-aluminum alloy.

[0082] The two ends of the capacitor core 21 are respectively welded to the first parallel conductive sheet 7 and the second parallel conductive sheet 8. The ends of the capacitor core 21 are welded with brazing material, which is tin-zinc, zinc, aluminum or silver. The welding method of the ends of the capacitor core 21 is laser welding, electron beam welding or iron welding.

[0083] The working principle of this utility model is as follows:

[0084] This utility model's capacitor power module is connected to a load circuit. Multiple capacitor cores filter the load current. Multiple IGBT modules in the load circuit are installed on the first IGBT polarity terminal and the second IGBT polarity terminal. Multiple capacitor cores 21 generate heat under the action of high-frequency ripple current. The heat is transferred to the heat sink of the outer shell 1. When air passes through the heat dissipation structure, it exchanges heat with the heat dissipation structure and carries away the heat of the heat dissipation structure, thereby dissipating heat for multiple capacitor cores 21, thereby improving the current carrying capacity and filtering power of the capacitor core group 2.

[0085] Example 2, as Figures 9 to 10 As shown, the implementation method of Embodiment 2 is similar to that of Embodiment 1, with the only difference being that: a heat dissipation structure is provided on the outer shell 1, which is integrally formed with the outer shell 1 or is attached to the plane of the outer shell 1. The heat dissipation structure is a heat dissipation tooth assembly 17, but it can also be a heat dissipation fin assembly. The thickness of the heat dissipation tooth assembly 17 or the heat dissipation fin assembly is greater than 10mm.

[0086] Example 3, as Figures 11 to 16 As shown, the implementation method of Embodiment 3 is similar to that of Embodiment 1, with the only difference being that: this embodiment includes four first IGBT busbars 5 and four second IGBT busbars 6. The first polarity terminal 3 and the second polarity terminal 4 are located at the first and second side edges of the opening 11, respectively. Two pairs of first IGBT busbars 5 and second IGBT busbars 6 are located at the third side edge of the opening 11, and two pairs of first IGBT busbars 5 and second IGBT busbars 6 are located at the fourth side edge of the opening 11. The first IGBT busbars 5, the first parallel conductive sheet 7, and the first polarity terminal 3 are not integrally formed, and the second IGBT busbars 6, the second parallel conductive sheet 8, and the second polarity terminal 4 are not integrally formed.

[0087] Example 4, as Figures 17 to 22 As shown, the implementation method of Embodiment 4 is similar to that of Embodiment 1, with the only difference being that: the first IGBT busbar 5 and the second IGBT busbar 6 are vertically disposed in the middle of the opening 11, and the first polarity terminal 3 and the second polarity terminal 4 are disposed on one side edge of the opening 11. The first IGBT busbar 5, the first parallel conductive sheet 7, and the first polarity terminal 3 are not integrally disposed, and the second IGBT busbar 6, the second parallel conductive sheet 8, and the second polarity terminal 4 are not integrally disposed.

[0088] Example 5, as Figures 23 to 29 As shown, the implementation method of Embodiment 5 is similar to that of Embodiment 1, with the only difference being that: the outer casing 1 is rectangular, and the opening 11 is rectangular, located on the smaller end face of the outer casing 1. Only one first IGBT busbar 5 and one second IGBT busbar 6 are located at the opening 11. The first IGBT busbar 5 and the second IGBT busbar 6 are located on the first side edge of the opening 11, and the first polarity terminal 3 and the second polarity terminal 4 are located on the second side edge of the opening 11. The first IGBT busbar 5, the first parallel conductive sheet 7, and the first polarity terminal 3 are not integrally formed, nor are the second IGBT busbar 6, the second parallel conductive sheet 8, and the second polarity terminal 4 integrally formed.

Claims

1. An integrated DC filter capacitor power module, comprising a housing, a capacitor core assembly, a first polarity terminal, a second polarity terminal, a first IGBT busbar, a second IGBT busbar, a first parallel conductive sheet, a second parallel conductive sheet, and epoxy resin. The housing has an opening through which the capacitor core assembly, the first parallel conductive sheet, the second parallel conductive sheet, the inner ends of the first polarity terminal, the second polarity terminal, the first IGBT busbar, and the second IGBT busbar are inserted into the housing. The opening is encapsulated with epoxy resin. A conductive sheet is attached to one side of the capacitor core assembly, and a second parallel conductive sheet is attached to the other side of the capacitor core assembly. The capacitor core assembly is composed of multiple capacitor cores arranged side by side. The first parallel conductive sheet is connected in parallel to one end of the multiple capacitor cores, and the second parallel conductive sheet is connected in parallel to the other end of the multiple capacitor cores. The inner ends of the first IGBT busbar and the second IGBT busbar are respectively connected to the first parallel conductive sheet and the second parallel conductive sheet. The inner ends of the first polarity terminal and the second polarity terminal are respectively connected to the first parallel conductive sheet and the second parallel conductive sheet.

2. The integrated DC filter capacitor power module according to claim 1, characterized in that: The first IGBT busbar and the second IGBT busbar are set in pairs, with the outer ends of the first IGBT busbar and the outer ends of the second IGBT busbar spaced apart and arranged side by side.

3. The integrated DC filter capacitor power module according to claim 1, characterized in that: The outer end of the first IGBT busbar is provided with multiple first IGBT polarity terminals, and the outer end of the second IGBT busbar is provided with multiple second IGBT polarity terminals corresponding to the multiple first IGBT polarity terminals. The first IGBT polarity terminals and the second IGBT polarity terminals correspond one-to-one.

4. The integrated DC filter capacitor power module according to claim 1, characterized in that, The outer casing is equipped with a heat dissipation structure, which is either integrally set with the outer casing or attached to the flat surface of the outer casing. The heat dissipation structure is a heat dissipation tooth assembly or a heat dissipation fin assembly.

5. The integrated DC filter capacitor power module according to claim 1, characterized in that, The capacitor core assembly, the first parallel conductive sheet, and the second parallel conductive sheet are all wrapped together with insulating material, which is mica paper, aramid fiber paper, glass fiber, carbon fiber, or heat shrink sleeve.

6. The integrated DC filter capacitor power module according to claim 1, characterized in that, It includes at least two first IGBT busbars and at least two second IGBT busbars, with an opening in a rectangular shape. The first polarity terminal and the second polarity terminal are located at the first side edge and the second side edge of the opening, respectively. At least one pair of first IGBT busbars and the second IGBT busbars are located at the third side edge of the opening, and at least one pair of first IGBT busbars and the second IGBT busbars are located at the fourth side edge of the opening.

7. The integrated DC filter capacitor power module according to claim 1 or 6, characterized in that, The first IGBT busbar, the first parallel conductive plate, and the first polarity terminal are integrated into one unit, and the second IGBT busbar, the second parallel conductive plate, and the second polarity terminal are integrated into one unit.

8. The integrated DC filter capacitor power module according to claim 1, characterized in that, The first IGBT busbar and the second IGBT busbar are vertically arranged in the middle of the opening, and the first polarity terminal and the second polarity terminal are located on one side edge of the opening.

9. The integrated DC filter capacitor power module according to claim 1, characterized in that, The opening is located on the end face with a smaller housing area. There is only one first IGBT busbar and one second IGBT busbar at the opening. The first IGBT busbar and the second IGBT busbar are located on the first side edge of the opening, and the first polarity terminal and the second polarity terminal are located on the second side edge of the opening.

10. The integrated DC filter capacitor power module according to claim 1, characterized in that the capacitor... The core is made of a metallized thin film, which is prepared into a cylindrical or flat shape through a winding process. The metallized thin film is made of PS, PP, EPN, PET, PEN, PPS, PEEK, PEEKK, PI, PTFE, PEI, or PMI through plasma roughening treatment, followed by metallization evaporation. A evaporated metal layer is formed on the metallized thin film, which includes a non-thickened region, a transition region, and a thickened region. The transition region is located between the non-thickened region and the thickened region. The width of the thickened region ranges from 3-5 mm, and the sheet resistance ranges from 1-4 Ω. The width of the transition region ranges from 6-30 mm, and the sheet resistance ranges from 10-20 Ω. The sheet resistance of the non-thickened region ranges from 15-60 Ω. The evaporated metal layer is a composite or multilayer material structure of one or more of the following materials: aluminum, copper, zinc, or silver.

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