Diode module chip packaging device
By rotating the knob to drive the rotating column and bevel gear system, combined with the design of the threaded rod and snap-fit block, the problem of unstable positioning and operational complexity of traditional diode module chip packaging devices when facing substrates of different sizes is solved, achieving high packaging accuracy and production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GOODWORK ELECTRONICS CO LTD
- Filing Date
- 2025-05-21
- Publication Date
- 2026-05-05
AI Technical Summary
Traditional diode module chip packaging devices require adjustment or replacement when faced with substrates of different sizes, resulting in low production efficiency and increased operational complexity.
By rotating the knob, the rotating column and bevel gear system are driven to move the bidirectional threaded rod and the washer. Combined with the engagement of the screw ring and the locking block with the groove, flexible positioning of substrates of different sizes can be achieved. At the same time, the screw, threaded slider, electric telescopic rod and suction head are used to grasp and place the chip, and automatic conveying is achieved through the cooperation of the conveyor belt and servo motor.
It achieves stable positioning of substrates of different sizes, improves packaging accuracy and production efficiency, reduces operational complexity, and increases production efficiency.
Smart Images

Figure CN224205665U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging device technology, and in particular to a diode module chip packaging device. Background Technology
[0002] As is well known, a diode module chip is an integrated circuit unit with specific functions made of semiconductor materials (mainly silicon, but some also use germanium or silicon carbide). It integrates one or more diodes and related auxiliary circuits. The packaging device encapsulates the chip and the substrate together to protect the internal components from the influence of the external environment, such as dust and moisture, while providing an interface for external connection to facilitate the installation and use of the module.
[0003] Traditional diode module chip packaging devices are usually designed with fixed size and structure. When faced with substrates of different sizes, the packaging device needs to be adjusted or replaced, which increases downtime and operational complexity in the production process and reduces production efficiency. Therefore, technological improvements are urgently needed. Utility Model Content
[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a diode module chip packaging device. In use, rotating the knob drives the rotating column to rotate, simultaneously driving the active and driven bevel gears to rotate, which in turn drives the bidirectional threaded rod to rotate, causing the two side gaskets to move in opposite directions. This allows for flexible handling of substrates of different sizes. Rotating the screw ring drives the rotating ring to move laterally, causing it to move along with the rotating ring, thus abutting the locking block against the locking groove and limiting the rotation of the rotating column. Conversely, external forces cause it to rotate, improving the stability of substrate positioning.
[0005] To achieve the above objectives, the present invention provides the following technical solution:
[0006] A diode module chip packaging device includes a worktable. Storage slots are formed on both sides of the upper surface of the worktable. Bidirectional threaded rods are rotatably connected to both sides of the inner wall of each storage slot. A driven bevel gear is fixedly connected to the middle of the bidirectional threaded rod. A rotating column is rotatably connected to the front end of the inner wall of the storage slot. A driving bevel gear is fixedly connected to the rear end of the rotating column. The front end of each rotating column extends through the worktable to the outside of the worktable and is fixedly connected to a knob. An external thread is formed on the front end of the outer wall of the rotating column. A threaded ring is threaded to the outer wall of the external thread. A rotating ring is rotatably connected to the rear end of the threaded ring. Multiple snap-fit blocks are fixedly connected to the rear end of the outer wall of the rotating ring. Threaded sleeve blocks are fitted on both sides of the bidirectional threaded rod. A washer is fixedly connected to the upper end of each threaded sleeve block.
[0007] A mounting groove is provided in the middle of the top surface of the workbench. A screw is rotatably connected to the inner wall of the rear end of the mounting groove. A threaded slider is threaded to the rear end of the screw. An electric telescopic rod is fixedly connected to the lower end of the threaded slider. A suction head is fixedly connected to the output end of the electric telescopic rod. An air pump is fixedly connected to the lower part of one side of the outer wall of the threaded slider. A bellows is fixedly connected to the suction end of the air pump. A suction pipe is fixedly connected to the lower end of the bellows. One side of the suction pipe is connected to the suction head.
[0008] Compared with existing diode module chip packaging devices, this diode module chip packaging device, through the cooperation of a screw, threaded slider, electric telescopic rod and suction head, can grasp and place diode module chips. The air pump and suction pipe work together with the suction head to ensure that the chip is firmly grasped and improve the packaging accuracy. The conveyor belt and chip slot, together with a servo motor, can automatically transport the chip, improve production efficiency, and has high practical performance.
[0009] Furthermore, a base plate is placed in the middle of the upper surface of the workbench, and a PLC control panel is provided on one side of the outer wall of the front end of the workbench.
[0010] The above technical solution allows for easy control of the switching of servo motor 1, servo motor 2, electric telescopic rod, and air pump via a PLC control panel.
[0011] Furthermore, rotating rods are rotatably connected to both sides of the inner wall at the rear end of the workbench, and a conveyor belt is sleeved on the outer wall of the rotating rods. Multiple chip slots are opened on the outer wall of the conveyor belt.
[0012] The above technical solution facilitates chip placement through the chip slot.
[0013] Furthermore, a placement groove is provided on one side of the inner wall of the rear end of the workbench, and a servo motor is fixedly connected to the front end of the inner wall of the placement groove. The output end of the servo motor is fixedly connected to the outer wall of the front end of the rotating rod on one side.
[0014] The above technical solution allows the servo motor to drive the rotating rod to rotate, which in turn drives the conveyor belt to move.
[0015] Furthermore, a protective shell is fixedly connected to the upper end of the middle of the outer wall of the front end of the workbench, and a servo motor II is fixedly connected to the front end of the inner wall of the protective shell. The output end of the servo motor II is fixedly connected to the outer wall of the front end of the screw.
[0016] The above technical solution allows the servo motor to easily drive the screw to rotate.
[0017] Furthermore, support legs are fixedly connected to the four corners of the lower surface of the workbench;
[0018] The above technical solution uses supporting legs to improve overall stability.
[0019] Furthermore, the driving bevel gear and the driven bevel gear mesh with each other;
[0020] The above technical solution facilitates the rotation of the bidirectional threaded rod by meshing the active bevel gear and the driven bevel gear.
[0021] Furthermore, multiple snap-fit slots are provided at the edge of the middle part of the outer wall at the front end of the workbench, and the snap-fit block engages with the snap-fit slots.
[0022] The above technical solution facilitates locking of the rotating column by engaging the locking block with the locking slot.
[0023] This utility model has the following beneficial effects:
[0024] 1. The diode module chip packaging device proposed in this utility model, compared with the existing diode module chip packaging devices, when in use, drives the rotating column to rotate by rotating the knob, which in turn drives the active bevel gear and the driven bevel gear to rotate, thereby driving the bidirectional threaded rod to rotate, which in turn drives the two side pads to move in opposite directions. It can flexibly cope with substrates of different sizes. By rotating the screw ring, the rotating ring moves laterally, which in turn drives the rotating ring to move together, thereby causing the locking block to abut against the locking groove, which can limit the rotation of the rotating column. In contrast, external force causes it to rotate, improving the stability of substrate positioning.
[0025] 2. The diode module chip packaging device proposed in this utility model, compared with the existing diode module chip packaging devices, can grasp and place diode module chips by means of a screw, a threaded slider, an electric telescopic rod and a suction head. The air pump and the suction pipe work together with the suction head to ensure that the chip is firmly grasped and improve the packaging accuracy. The conveyor belt and the chip slot are combined with a servo motor to automatically transport the chip, improve production efficiency and have high practical performance. Attached Figure Description
[0026] Figure 1 This is an isometric view of a diode module chip packaging device proposed in this utility model;
[0027] Figure 2 This is a cross-sectional view of a diode module chip packaging device proposed in this utility model;
[0028] Figure 3 for Figure 2 Enlarged view of point A in the middle;
[0029] Figure 4This is a cross-sectional view of the storage slot in a diode module chip packaging device proposed in this utility model.
[0030] Figure 5 for Figure 4 Enlarged view of point B in the middle;
[0031] Figure 6 for Figure 4 Enlarged view of point C in the middle.
[0032] Legend:
[0033] 1. Workbench; 11. Base plate; 12. PLC control panel; 13. Rotating rod; 14. Placement slot; 15. Servo motor one; 16. Conveyor belt; 17. Chip slot; 18. Protective shell; 19. Support leg; 2. Storage slot; 21. Bidirectional threaded rod; 22. Driven bevel gear; 23. Driving bevel gear; 24. Rotating column; 25. External thread; 26. Knob; 27. Threaded ring; 28. Rotating ring; 29. Snap-fit block; 210. Threaded sleeve block; 211. Washer; 212. Snap-fit slot; 3. Mounting slot; 31. Screw; 32. Servo motor two; 33. Threaded slider; 34. Air pump; 35. Bellows; 36. Suction pipe; 37. Suction head. Detailed Implementation
[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0035] Reference Figure 1-6 An embodiment of this utility model provides a diode module chip packaging device, including a workbench 1. Storage slots 2 are provided on both sides of the upper surface of the workbench 1. Bidirectional threaded rods 21 are rotatably connected to both sides of the inner wall of the storage slots 2. A driven bevel gear 22 is fixedly connected to the middle of the body of the bidirectional threaded rods 21. A rotating column 24 is rotatably connected to the front end of the inner wall of the storage slots 2. A driving bevel gear 23 is fixedly connected to the rear end of the rotating column 24. The front end of the rotating column 24 passes through the workbench 1 to the outside of the workbench 1 and is fixedly connected to a knob 26. An external thread 25 is provided on the front end of the outer wall of the rotating column 24. A screw ring 27 is threadedly connected to the outer wall of the external thread 25. A rotating ring 28 is rotatably connected to the rear end of the screw ring 27. A plurality of snap-fit blocks 29 are fixedly connected to the rear end of the outer wall of the rotating ring 28. Threaded sleeve blocks 210 are sleeved on both sides of the body of the bidirectional threaded rods 21. A gasket 211 is fixedly connected to the upper end of each threaded sleeve block 210.
[0036] A mounting groove 3 is provided in the middle of the top surface of the workbench 1. A screw 31 is rotatably connected to the inner wall of the rear end of the mounting groove 3. A threaded slider 33 is threadedly connected to the rear end of the screw 31. An electric telescopic rod is fixedly connected to the lower end of the threaded slider 33. A suction head 37 is fixedly connected to the output end of the electric telescopic rod. An air pump 34 is fixedly connected to the lower part of one side of the outer wall of the threaded slider 33. A bellows 35 is fixedly connected to the suction end of the air pump 34. A suction pipe 36 is fixedly connected to the lower end of the bellows 35. One side of the suction pipe 36 is connected to the suction head 37.
[0037] Compared with existing diode module chip packaging devices, this diode module chip packaging device, when in use, can grip and place diode module chips through the cooperation of screw 31, threaded slider 33, electric telescopic rod and suction head 37. Air pump 34 and suction pipe 36 work together with suction head 37 to ensure that the chip is firmly gripped and improve packaging accuracy. Conveyor belt 16 and chip slot 17, together with servo motor 15, can automatically transport chips, improve production efficiency, and have high practical performance.
[0038] A base plate 11 is placed in the middle of the upper surface of the workbench 1, and a PLC control panel 12 is provided on one side of the outer wall of the front end of the workbench 1.
[0039] The PLC control panel 12 is electrically connected to servo motor 15, servo motor 2, electric telescopic rod, and air pump 34, which facilitates the control of their switching.
[0040] Rotating rods 13 are rotatably connected to both sides of the inner wall of the rear end of the workbench 1. A conveyor belt 16 is sleeved on the outer wall of the rotating rods 13. Multiple chip slots 17 are opened on the outer wall of the conveyor belt 16.
[0041] Chip slot 17 facilitates chip placement.
[0042] A placement slot 14 is provided on one side of the inner wall of the rear end of the workbench 1. A servo motor 15 is fixedly connected to the front end of the inner wall of the placement slot 14. The output end of the servo motor 15 is fixedly connected to the outer wall of the front end of the rotating rod 13 on one side.
[0043] The servo motor 15 facilitates the rotation of the rotating rod 13, which in turn drives the conveyor belt 16 to move.
[0044] A protective shell 18 is fixedly connected to the upper part of the middle of the outer wall of the front end of the workbench 1. A servo motor 32 is fixedly connected to the front end of the inner wall of the protective shell 18. The output end of the servo motor 32 is fixedly connected to the outer wall of the front end of the screw 31.
[0045] The servo motor 32 facilitates the rotation of the screw 31.
[0046] Support legs 19 are fixedly connected to the four corners of the lower surface of the workbench 1;
[0047] The support leg 19 helps to improve overall stability.
[0048] The driving bevel gear 23 meshes with the driven bevel gear 22;
[0049] The active bevel gear 23 meshes with the driven bevel gear 22, which facilitates the rotation of the bidirectional threaded rod 21.
[0050] Multiple snap-fit slots 212 are provided at the edge of the middle part of the front outer wall of the workbench 1, and the snap-fit block 29 engages with the snap-fit slot 212.
[0051] The locking of the rotating column 24 is facilitated by the engagement of the locking block 29 with the locking slot 212.
[0052] Working principle: During use, the knob 26 drives the rotating column 24 to drive the bevel gear set and the bidirectional threaded rod 21, so that the two side pads 211 adaptively clamp the substrates 11 of different sizes and lock the position through the screw ring 27. At the same time, the servo motor 22 drives the screw 31 to move the threaded slider 33 and the electric telescopic rod. With the help of the air pump 34, the chip is adsorbed and automatically fed by the conveyor belt 16, realizing the rapid positioning of the substrate 11 and the encapsulation of the chip.
[0053] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A diode module chip packaging device, comprising a worktable (1), characterized in that: Storage slots (2) are provided on both sides of the upper surface of the workbench (1). A bidirectional threaded rod (21) is rotatably connected to both sides of the inner wall of each storage slot (2). A driven bevel gear (22) is fixedly connected to the middle of the bidirectional threaded rod (21). A rotating column (24) is rotatably connected to the front end of the inner wall of the storage slot (2). A driving bevel gear (23) is fixedly connected to the rear end of the rotating column (24). The front end of the rotating column (24) penetrates the workbench (1) to the outside of the workbench (1). A knob (26) is fixedly connected. The front end of the outer wall of the rotating column (24) is provided with an external thread (25). The outer wall of the external thread (25) is threaded with a threaded ring (27). The rear end of the threaded ring (27) is rotatably connected with a rotating ring (28). The rear end of the outer wall of the rotating ring (28) is fixedly connected with multiple snap-fit blocks (29). Both sides of the body of the bidirectional threaded rod (21) are fitted with threaded sleeve blocks (210). The upper end of each threaded sleeve block (210) is fixedly connected with a washer (211). The workbench (1) has an installation groove (3) in the middle of its top surface. A screw (31) is rotatably connected to the inner wall of the rear end of the installation groove (3). A threaded slider (33) is threaded to the rear end of the screw (31). An electric telescopic rod is fixedly connected to the lower end of the threaded slider (33). A suction head (37) is fixedly connected to the output end of the electric telescopic rod. An air pump (34) is fixedly connected to the lower part of one side of the outer wall of the threaded slider (33). A corrugated pipe (35) is fixedly connected to the suction end of the air pump (34). A suction pipe (36) is fixedly connected to the lower end of the corrugated pipe (35). One side of the suction pipe (36) is connected to the suction head (37).
2. The diode module chip packaging device according to claim 1, characterized in that: A base plate (11) is placed in the middle of the upper surface of the workbench (1), and a PLC control panel (12) is provided on one side of the outer wall of the front end of the workbench (1).
3. The diode module chip packaging device according to claim 1, characterized in that: Rotating rods (13) are rotatably connected to both sides of the inner wall of the rear end of the workbench (1). A conveyor belt (16) is sleeved on the outer wall of the rotating rod (13), and multiple chip slots (17) are opened on the outer wall of the conveyor belt (16).
4. The diode module chip packaging device according to claim 1, characterized in that: A placement slot (14) is provided on one side of the inner wall of the rear end of the workbench (1). A servo motor (15) is fixedly connected to the front end of the inner wall of the placement slot (14). The output end of the servo motor (15) is fixedly connected to the outer wall of the front end of the rotating rod (13) on one side.
5. A diode module chip packaging device according to claim 1, characterized in that: A protective shell (18) is fixedly connected to the upper end of the middle of the outer wall of the front end of the workbench (1). A servo motor (32) is fixedly connected to the front end of the inner wall of the protective shell (18). The output end of the servo motor (32) is fixedly connected to the outer wall of the front end of the screw (31).
6. The diode module chip packaging device according to claim 1, characterized in that: Support legs (19) are fixedly connected to the four corners of the lower surface of the workbench (1).
7. A diode module chip packaging device according to claim 1, characterized in that: The driving bevel gear (23) meshes with the driven bevel gear (22).
8. A diode module chip packaging device according to claim 1, characterized in that: Multiple snap-fit slots (212) are provided at the edge of the middle part of the front outer wall of the workbench (1), and the snap-fit block (29) engages with the snap-fit slots (212).