High-pressure homogenizing equipment for semiconductor nano finishing agent

Abstract

The utility model relates to the technical field of semiconductor nano finishing agent processing, in particular to high-pressure homogenizing equipment for a semiconductor nano finishing agent, which comprises a homogenizer body, a pre-homogenizing box body assembly is arranged above the homogenizer body, a material conveying pipe is connected between the pre-homogenizing box body assembly and the homogenizer body, and a switch valve is arranged on the material conveying pipe; the pre-homogenizing box body assembly comprises a circular box body and a circular cover plate, the upper plane of the circular cover plate is connected with a feeding hopper, a rotating shaft penetrates through the center of the circular cover plate, the upper end of the rotating shaft is connected with a circumferential driving device, and the outer circle of the lower end of the rotating shaft is sleeved with a spiral conveyor; two stirrer assemblies are symmetrically arranged between the outer side of the spiral conveyor and the inner wall of the circular box body; the stirrer further comprises a revolution driving mechanism and an autorotation driving mechanism; the revolution driving mechanism is suitable for driving the stirrer assembly to circumferentially rotate along the rotating shaft, and the rotation driving mechanism is suitable for driving the stirrer assembly to rotate. The homogenizer is reasonable in structure, and solves the problem of poor homogenizing effect caused by non-uniform distribution of particles in raw materials.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor nano-finishing agent processing technology, and in particular to a high-pressure homogenization device for semiconductor nano-finishing agents. Background Technology

[0002] Semiconductor nanoparticle finishing agents are a class of chemical agents that use semiconductor nanomaterials as the key component and are prepared through specific processes. They are used to perform surface treatment or functional modification on various materials, giving them specific properties. The characteristics of semiconductor nanoparticle finishing agents stem from the unique properties of semiconductor nanomaterials. Due to the small size effect, quantum size effect, and surface effect of nanomaterials, semiconductor nanoparticle finishing agents possess optical, electrical, and catalytic properties different from traditional finishing agents. For example, utilizing the quantum size effect, semiconductor nanoparticles can generate a special photoelectric effect under the influence of light, thus giving the finished material unique optical or electrical properties. The production process of semiconductor nanoparticle finishing agents requires the use of a high-pressure homogenizer to pulverize and homogenize the raw materials. The high-pressure homogenizer homogenizes the material at high speed by pushing it through a very narrow gap. This process typically involves forcing the material through a very narrow slit or pore under high pressure, resulting in high shear force and pressure, thus making the material finer and more uniform.

[0003] Regarding the aforementioned technologies, the inventors discovered that during the homogenization of raw materials for semiconductor nano-finishing agents using a high-pressure homogenizer, particles in the raw materials will settle to the bottom of the chamber before being homogenized. This results in uneven particle distribution upon restarting, leading to poor homogenization and reduced quality of the semiconductor nano-finishing agent. Utility Model Content

[0004] The main technical problem solved by this invention is to provide a high-pressure homogenizing device for semiconductor nano-finishing agents, which solves the problem of poor homogenization effect caused by uneven particle distribution in the raw materials.

[0005] To solve the above-mentioned technical problems, the present invention adopts a technical solution as follows: a high-pressure homogenizing device for semiconductor nano-finishing agents is provided, comprising: a homogenizer body, a pre-homogenizing chamber assembly above the homogenizer body, a conveying pipe connected between the pre-homogenizing chamber assembly and the homogenizer body, and a switching valve on the conveying pipe;

[0006] The pre-homogenizing box assembly includes a circular box and a circular cover plate with an opening at its top. A feed hopper is connected to the upper surface of the circular cover plate, and a rotating shaft passes through the center of the circular cover plate. A circumferential drive device is connected to the upper end of the rotating shaft, and a screw conveyor is fitted on the outer circle of the lower end.

[0007] Two agitator assemblies are symmetrically arranged between the outer side of the spiral conveyor and the inner wall of the circular box, and the spiral drive mechanism and the rotation drive mechanism are also included.

[0008] The revolution drive mechanism is connected to the two agitator assemblies respectively, and is adapted to drive the agitator assemblies to rotate in a circle along the axis. The rotation drive mechanism is connected to the two agitator assemblies respectively, and is adapted to drive the agitator assemblies to rotate on their own axis.

[0009] By adopting the above technical solution, during use, the raw material of the semiconductor nano-finishing agent is fed into the circular box of the pre-homogenizing box assembly through the feed hopper. The operation of the circumferential drive device drives the rotating shaft to rotate, and the rotating shaft drives the screw conveyor to work. The screw conveyor transports the raw material at the bottom of the circular box upward and then flows to all sides. That is, the raw material flows downward between the screw conveyor and the inner wall of the circular box, so that the raw material circulates. At the same time, the rotating shaft drives two agitator assemblies to rotate circumferentially along the rotating shaft through the revolution drive mechanism. The agitator assemblies agitate the raw material. Through the use of the rotation drive mechanism, the rotation drive mechanism drives the agitator assemblies to rotate. That is, the agitator assemblies rotate on their own axis while rotating in the revolution, which enhances the uniformity of particle distribution in the raw material. The agitated raw material enters the homogenizer body through the feed pipe. The homogenizer body crushes and homogenizes the raw material of the semiconductor nano-finishing agent, thereby improving the quality of the semiconductor nano-finishing agent.

[0010] In a preferred embodiment, the present invention can be further configured as follows: the screw conveyor includes a cylinder and screw blades concentrically arranged in its inner cavity, the screw blades being fitted and connected to the lower outer circle of the rotating shaft, and a plurality of support blocks being connected in a ring array at the lower end of the cylinder, the support blocks being connected to the bottom of the inner cavity of the circular box.

[0011] By adopting the above technical solution, the rotating shaft drives the spiral blades to rotate, and the spiral blades spirally transport the raw material at the bottom upward along the inner cavity of the cylinder. Then, the raw material flows from the upper opening of the cylinder to the surrounding area, that is, the raw material circulates in the vertical direction, which improves the uniformity of the stirring of the raw material by the stirring assembly.

[0012] In a preferred embodiment, the present invention can be further configured such that: the stirrer assembly includes a cylinder, a plurality of stirring blades are spaced apart on the outer circumference of the cylinder, and a connecting shaft is connected to the upper end of the cylinder.

[0013] By adopting the above technical solution, the stirring blades on the cylinder stir the raw materials as they rotate along the axis of rotation. Under the action of the self-rotation drive mechanism, the cylinder drives the stirring blades to rotate around the cylinder, which improves the uniformity of stirring the raw materials.

[0014] In a preferred embodiment, the present invention can be further configured as follows: the revolution drive mechanism includes a strip mounting plate disposed above the screw conveyor, the two ends of the strip mounting plate are respectively provided with mounting holes, the mounting holes are fitted onto the outer circle of the connecting shaft and are rotatably connected thereto, the center of the strip mounting plate is provided with a fixing hole, the fixing hole is fitted onto the outer circle of the rotating shaft and the two are fixedly connected.

[0015] By adopting the above technical solution, the rotating shaft drives the strip mounting plate to rotate, and the strip mounting plate drives the cylinder and stirring blades to rotate around the rotating shaft through the connecting shaft. The stirring blades stir the raw materials of the semiconductor nano-finishing agent.

[0016] In a preferred embodiment, the present invention can be further configured such that: the self-rotating drive mechanism includes an internal gear ring and gears respectively fitted onto a connecting shaft, the gears meshing with the internal gear ring, and the internal gear ring fitted onto the inner wall of a circular housing.

[0017] By adopting the above technical solution, during the rotation of the connecting shaft and the gear, the gear meshes with the internal gear ring, causing the connecting shaft to rotate. In other words, the connecting shaft drives the cylinder and the stirring blade to rotate along the axis of the connecting shaft, which improves the uniformity of stirring the raw materials of the semiconductor nano-finishing agent by the stirring blade.

[0018] In a preferred embodiment, the present invention can be further configured such that: one end of the homogenizer body is connected to a discharge pipe, and the bottom of the circular box is connected to a number of legs in a ring array.

[0019] By adopting the above technical solution, after the homogenizer body homogenizes the raw materials of the semiconductor nano-finishing agent, it outputs them through the discharge pipe.

[0020] In summary, this utility model has at least one of the following beneficial technical effects:

[0021] 1. The operation of the circumferential drive device drives the rotating shaft to rotate, which in turn drives the screw conveyor to work. The screw conveyor transports the raw material from the bottom of the circular box upwards and then flows outwards. That is, the raw material flows downwards between the screw conveyor and the inner wall of the circular box, thus creating a circulating flow of raw material. This improves the uniformity of the mixing of the semiconductor nano-finishing agent raw material by the agitator assembly. Furthermore, the screw conveyor also performs corresponding spiral mixing on the semiconductor nano-finishing agent raw material while transporting it.

[0022] 2. The rotating shaft drives the strip mounting plate to rotate. The strip mounting plate drives the cylinder and stirring blades to rotate around the rotating shaft through the connecting shaft. The stirring blades stir the raw materials of the semiconductor nano-finishing agent.

[0023] 3. During the rotation of the connecting shaft and the gear, the gear meshes with the internal gear ring, causing the connecting shaft to rotate. This means that the connecting shaft drives the cylinder and the stirring blades to rotate along the axis of the connecting shaft, which improves the uniformity of the stirring blades on the raw materials of the semiconductor nano-finishing agent, thus improving the quality of the homogenizer body in homogenizing the raw materials of the semiconductor nano-finishing agent. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0025] Figure 1 This is a schematic diagram of a preferred embodiment of a high-pressure homogenizing device for semiconductor nano-finishing agents according to this utility model.

[0026] Figure 2 This is another structural schematic diagram of a high-pressure homogenizing device for a semiconductor nano-finishing agent according to this utility model.

[0027] Figure 3 yes Figure 2 A schematic diagram of the connection between the spiral feeder and the rotating shaft.

[0028] Figure 4 yes Figure 2 A schematic diagram of the structure of the stirrer assembly.

[0029] Figure 5 yes Figure 2 A schematic diagram of the central rotary drive mechanism.

[0030] In the diagram: 1. Homogenizer body; 20. Pre-homogenizing chamber assembly; 3. Conveying pipe; 4. Switch valve; 50. Agitator assembly; 60. Revolution drive mechanism; 70. Rotation drive mechanism; 8. Discharge pipe; 9. Support leg;

[0031] 21. Circular box body; 22. Circular cover plate; 23. Feed hopper; 24. Rotary shaft; 25. Circumferential drive device;

[0032] 26. Screw conveyor;

[0033] 261. Cylinder; 262. Helical blade; 263. Support block;

[0034] 51. Cylinder; 52. Stirring blades; 53. Connecting shaft;

[0035] 61. Strip mounting plate; 62. Mounting holes; 63. Fixing holes;

[0036] 71. Internal gear ring; 72. Gear. Detailed Implementation

[0037] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0038] It should be noted that these figures are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0039] Reference Figures 1-5 This utility model discloses a high-pressure homogenizing device for semiconductor nano-finishing agents, comprising: a homogenizer body 1, a pre-homogenizing chamber assembly 20 above the homogenizer body 1, a discharge pipe 8 connected to one end of the homogenizer body 1, a conveying pipe 3 connected between the pre-homogenizing chamber assembly 20 and the homogenizer body 1, and a switching valve 4 provided on the conveying pipe 3.

[0040] The pre-homogenizing chamber assembly 20 includes a circular chamber 21 and a circular cover plate 22 with an opening at its top. Several legs 9 are connected in a ring array at the bottom of the circular chamber 21. A feed hopper 23 is connected to the upper surface of the cover plate 22. A rotating shaft 24 passes through the center of the cover plate 22. A circumferential drive device 25 is connected to the upper end of the rotating shaft 24, and a screw conveyor 26 is fitted onto the lower outer circumference. The circumferential drive device 25 is a motor, which drives the rotating shaft 24 to rotate. The screw conveyor 26 includes a cylinder 261 and spiral blades 262 concentrically arranged within its inner cavity. The spiral blades 262 are fitted onto the lower outer circumference of the rotating shaft 24. A ring array is connected to several support blocks 263, which are connected to the bottom of the inner cavity of the circular box 21. There are cavities between adjacent support blocks 263 for the flow of semiconductor nano-finishing agent. The rotating shaft 24 drives the spiral blades 262 to rotate. The spiral blades 262 spirally transport the raw material at the bottom along the inner cavity of the cylinder 261 upwards. Then, the raw material flows from the upper opening of the cylinder 261 to the surrounding area. That is, the raw material circulates in the vertical direction, which improves the uniformity of the stirring of the raw material by the stirrer assembly 50. The spiral blades 262 also stir the raw material of the semiconductor nano-finishing agent during spiral transport, which enhances the mixing uniformity of the semiconductor nano-finishing agent.

[0041] Two agitator assemblies 50 are symmetrically arranged between the outer side of the screw conveyor 26 and the inner wall of the circular box 21, and also include a revolution drive mechanism 60 and a rotation drive mechanism 70. The agitator assembly 50 includes a cylinder 51, and a number of agitator blades 52 are connected at intervals on the outer circle of the cylinder 51. The upper end of the cylinder 51 is connected to a connecting shaft 53. When the agitator blades 52 on the cylinder 51 rotate along the rotating shaft 24, the agitator blades 52 agitate the raw materials. Under the action of the rotation drive mechanism 70, the cylinder 51 drives the agitator blades 52 to rotate circumferentially along the cylinder 51, which improves the uniformity of the agitation of the raw materials.

[0042] The revolution drive mechanism 60 is connected to the two agitator assemblies 50 respectively, and is adapted to drive the agitator assemblies 50 to rotate in a circle along the rotating shaft 24. The rotation drive mechanism 70 is connected to the two agitator assemblies 50 respectively, and is adapted to drive the agitator assemblies 50 to rotate on their own axis.

[0043] The revolution drive mechanism 60 includes a strip-shaped mounting plate 61 disposed above the screw conveyor 26. The two ends of the strip-shaped mounting plate 61 are respectively provided with mounting holes 62. The mounting holes 62 are fitted onto the outer circle of the connecting shaft 53 and are rotatably connected to it. The center of the strip-shaped mounting plate 61 is provided with a fixing hole 63. The fixing hole 63 is fitted onto the outer circle of the rotating shaft 24 and the two are fixedly connected. The rotating shaft 24 drives the strip-shaped mounting plate 61 to rotate. The strip-shaped mounting plate 61 drives the cylinder 51 and the stirring blade 52 to rotate circumferentially along the rotating shaft 24 through the connecting shaft 53. The stirring blade 52 stirs the raw materials of the semiconductor nano-finishing agent.

[0044] The self-rotation drive mechanism 70 includes an internal gear ring 71 and gears 72 respectively mounted on the connecting shaft 53. The gears 72 mesh with the internal gear ring 71, which is mounted on the inner wall of the circular housing 21. During the rotation of the gears 72 driven by the connecting shaft 53, the gears 72 mesh with the internal gear ring 71, causing the connecting shaft 53 to rotate. That is, the connecting shaft 53 drives the cylinder 51 and the stirring blade 52 to rotate along the axis of the connecting shaft 53, which improves the uniformity of stirring of the semiconductor nano-finishing agent raw materials by the stirring blade 52.

[0045] The implementation principle of this embodiment is as follows: During use, the raw material of the semiconductor nano-finishing agent is fed into the circular box 21 of the pre-homogenizing box assembly 20 through the feed hopper 23. The circumferential drive device 25 is operated to drive the rotating shaft 24 to rotate. The rotating shaft 24 drives the screw conveyor 26 to work. The screw conveyor 26 transports the raw material at the bottom of the circular box 21 upwards and then flows to the surrounding area. That is, the raw material flows downwards between the screw conveyor 26 and the inner wall of the circular box 21, so that the raw material circulates. At the same time, the rotating shaft 24 is driven by revolution. Mechanism 60 drives two agitator assemblies 50 to rotate around the shaft 24. The agitator assemblies 50 agitate the raw materials. Through the use of the rotation drive mechanism 70, the agitator assemblies 50 rotate on their own axis while revolving around the sun, which enhances the uniformity of particle distribution in the raw materials. The agitated raw materials enter the homogenizer body 1 through the feed pipe 3. The homogenizer body 1 pulverizes and homogenizes the raw materials of the semiconductor nano-finishing agent, thereby improving the quality of the semiconductor nano-finishing agent.

[0046] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made using the content of this utility model specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A high-pressure homogenizing device for semiconductor nano-finishing agents, comprising: The homogenizer body (1) is characterized in that a pre-homogenizing box assembly (20) is provided above the homogenizer body (1), and a conveying pipe (3) is connected between the pre-homogenizing box assembly (20) and the homogenizer body (1), and a switching valve (4) is provided on the conveying pipe (3). The pre-homogenizing box assembly (20) includes a circular box (21) and a circular cover plate (22) with an opening at its top. A feed hopper (23) is connected to the upper surface of the circular cover plate (22). A rotating shaft (24) is passed through the center of the circular cover plate (22). A circumferential drive device (25) is connected to the upper end of the rotating shaft (24), and a screw conveyor (26) is fitted on the outer circle of the lower end. Two agitator assemblies (50) are symmetrically arranged between the outer side of the spiral feeder (26) and the inner wall of the circular box (21), and also include a revolution drive mechanism (60) and a rotation drive mechanism (70); The revolution drive mechanism (60) is connected to the two stirrer assemblies (50) respectively, and is adapted to drive the stirrer assembly (50) to rotate around the shaft (24). The rotation drive mechanism (70) is connected to the two stirrer assemblies (50) respectively, and is adapted to drive the stirrer assembly (50) to rotate.

2. The high-pressure homogenizing equipment for semiconductor nano-finishing agents according to claim 1, characterized in that, The screw conveyor (26) includes a cylinder (261) and helical blades (262) concentrically arranged in its inner cavity. The helical blades (262) are fitted and connected to the lower outer circle of the rotating shaft (24). A number of support blocks (263) are connected in an annular array at the lower end of the cylinder (261). The support blocks (263) are connected to the bottom of the inner cavity of the circular box (21).

3. The high-pressure homogenizing equipment for semiconductor nano-finishing agents according to claim 1, characterized in that, The stirrer assembly (50) includes a cylinder (51), with a plurality of stirring blades (52) spaced apart on the outer circumference of the cylinder (51), and a connecting shaft (53) connected to the upper end of the cylinder (51).

4. The high-pressure homogenizing equipment for semiconductor nano-finishing agents according to claim 3, characterized in that, The revolution drive mechanism (60) includes a strip mounting plate (61) disposed above the screw conveyor (26). The two ends of the strip mounting plate (61) are respectively provided with mounting holes (62). The mounting holes (62) are fitted onto the outer circle of the connecting shaft (53) and are rotatably connected to it. The center of the strip mounting plate (61) is provided with a fixing hole (63). The fixing hole (63) is fitted onto the outer circle of the rotating shaft (24) and the two are fixedly connected.

5. The high-pressure homogenizing equipment for semiconductor nano-finishing agents according to claim 3, characterized in that, The self-rotating drive mechanism (70) includes an internal gear ring (71) and gears (72) respectively mounted on the connecting shaft (53). The gears (72) mesh with the internal gear ring (71), and the internal gear ring (71) is mounted on the inner wall of the circular box (21).

6. The high-pressure homogenizing equipment for semiconductor nano-finishing agents according to claim 1, characterized in that, One end of the homogenizer body (1) is connected to a discharge pipe (8), and the bottom of the circular box (21) is connected to a number of legs (9) in a ring array.

Images