Wafer centering CCD dynamic compensation mechanism for double-sided exposure machine

Abstract

The utility model belongs to the field of exposure machines, and particularly relates to a CCD (charge coupled device) dynamic compensation mechanism for wafer centering of a double-sided exposure machine, which comprises a bottom plate, a vertical plate is fixedly connected to the edge of the top of the bottom plate, a horizontal adjusting assembly is rotationally connected to one side of the vertical plate, a moving platform is fixedly connected to the surface of the horizontal adjusting assembly, and an angle adjusting assembly is fixedly connected to the top of the moving platform. Through the structural design of the horizontal adjusting assembly, after a customized voice coil motor A is electrified, a transmission rod A directly rotates in a permanent magnetic field through an electrified coil, intermediate transmission parts such as a gear and a screw rod are not needed, mechanical gaps and inertial delay are avoided, the transmission rod A drives a threaded rod to rotate while rotating, and a threaded cylinder is pushed to move by rotating a thread, so that the transmission rod A is driven to rotate. Therefore, the positions of the moving platform, the upper structure of the moving platform and the wafer are changed, so that the CCD dynamic compensation mechanism can quickly respond and adjust the position of the wafer, and the exposure efficiency of the wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of exposure machines, specifically a CCD dynamic compensation mechanism for wafer alignment in a double-sided exposure machine. Background Technology

[0002] An exposure machine is a key piece of equipment used in photolithography processes, widely applied in semiconductor manufacturing, printed circuit board production, flat panel display manufacturing, microelectromechanical systems (MEMS), 3D printing, and biochips. Its core function is to precisely transfer patterns from a mask onto a substrate coated with photoresist using optical or electron beam technology, thereby forming microstructures. The wafer alignment CCD dynamic compensation mechanism in a double-sided exposure machine is a crucial component for high-precision alignment in semiconductor manufacturing, primarily used to address wafer positional deviations during double-sided photolithography.

[0003] In the existing technology, the existing CCD dynamic compensation mechanism can adjust the angle and position of the wafer, so that the CCD camera can be aligned with the mark on the wafer to determine whether the wafer position is accurate before exposure. However, the existing CCD dynamic compensation mechanism is not convenient for quickly responding to adjust the wafer position according to the relative position of the wafer mark and the camera, which reduces the wafer exposure efficiency. At the same time, after adjusting the wafer position, the wafer angle may change again due to equipment shaking or vibration generated by the equipment itself. The existing CCD dynamic compensation mechanism is not convenient for fixing the angle after the wafer angle is adjusted, which reduces the accuracy of the CCD dynamic compensation mechanism. Utility Model Content

[0004] To overcome the shortcomings of existing technologies and solve the problems that existing CCD dynamic compensation mechanisms are not convenient for quickly adjusting the wafer position and for fixing the angle after the wafer angle has been adjusted, this utility model proposes a CCD dynamic compensation mechanism for wafer alignment in a double-sided exposure machine.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: The present utility model provides a CCD dynamic compensation mechanism for wafer alignment in a double-sided exposure machine, including a base plate; a vertical plate is fixedly connected to the top edge of the base plate, a horizontal adjustment component is rotatably connected to one side of the vertical plate, a moving platform is fixedly connected to the surface of the horizontal adjustment component, and an angle adjustment component is fixedly connected to the top of the moving platform.

[0006] The horizontal adjustment assembly includes a threaded rod rotatably connected to one side of the vertical plate, a threaded cylinder threadedly connected to the surface of the threaded rod, a movable platform fixedly connected to the surface of the threaded cylinder, a transmission rod A fixedly connected to one end of the threaded rod, a vertical plate penetrating the surface of the transmission rod A, and a splined connection of one end of the transmission rod A to the output end of the voice coil motor A.

[0007] The angle adjustment assembly includes a base block fixedly connected to the top of the mobile platform, a rack plate slidably connected to the top of the base block, a gear shaft meshing with the surface of the rack plate, a rotating plate fixedly connected to the top of the gear shaft, a B transmission rod fixedly connected to one end of the rack plate, and a splined connection of one end of the B transmission rod to the output end of the B voice coil motor.

[0008] Preferably, a support plate is fixedly connected to the bottom of the A voice coil motor, and a base plate is fixedly connected to one end of the support plate.

[0009] Preferably, a protrusion is fixedly connected to one end of the B voice coil motor, and a base block is fixedly connected to the bottom of the B voice coil motor.

[0010] Preferably, connecting plates are fixedly connected to both sides of the base block, and connecting bolts are fixedly connected to the surface of the connecting plates in a linear array. A moving platform is threadedly connected to the surface of the connecting bolts.

[0011] Preferably, a limiting rod is connected through one side of the mobile platform, and vertical plates are fixedly connected to both ends of the limiting rod.

[0012] Preferably, a chuck is fixedly connected to the top of the rotating plate, and the top of the chuck is provided with a ring array of clamping claws for centering and holding.

[0013] The advantages of this utility model are:

[0014] 1. This utility model, through the structural design of the horizontal adjustment component, arranges the coil or magnetic circuit of the voice coil motor around the axis, and generates rotational torque by energizing multiple coils in segments. After the A voice coil motor is energized, the A transmission rod rotates directly in the permanent magnetic field through the energized coil, eliminating the need for intermediate transmission components such as gears and screws, thus avoiding mechanical backlash and inertial delay. While the A transmission rod rotates, it drives the threaded rod to rotate, and pushes the threaded cylinder to move through the rotating thread, thereby changing the position of the moving platform and its upper structure relative to the wafer. This allows the CCD dynamic compensation mechanism to quickly respond and adjust the wafer position, improving the wafer exposure efficiency.

[0015] 2. This utility model, through the structural design of the angle adjustment component, connects the customized B voice coil motor to the power supply. When the power is on, the B transmission rod drives the rack plate to rotate. At the same time, the rack plate slides along the groove on the top of the base block. The gear shaft meshing with the rack plate drives the rotating plate to produce an angular offset. After the angle adjustment is completed, the power supply to the B voice coil motor is disconnected, causing the brake built into the B voice coil motor to lock the B transmission rod, fixing the rack plate. The gear shaft is fixed at multiple angles by the rack set on the rack plate, enabling the CCD dynamic compensation mechanism to fix the angle after the wafer angle is adjusted, thus improving the accuracy of using the CCD dynamic compensation mechanism. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the disassembled structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the horizontal adjustment component structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the angle adjustment component of this utility model.

[0021] In the diagram: 1. Base plate; 2. Vertical plate; 3. Horizontal adjustment assembly; 301. Threaded rod; 302. Threaded cylinder; 303. A transmission rod; 304. A voice coil motor; 4. Moving platform; 5. Angle adjustment assembly; 501. Base block; 502. Rack plate; 503. Gear shaft; 504. B transmission rod; 505. B voice coil motor; 506. Rotating plate; 6. Support plate; 7. Protrusion; 8. Connecting piece; 9. Connecting bolt; 10. Limiting rod; 11. Chuck; 12. Claw. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0023] Please see Figures 1-4 As shown, a CCD dynamic compensation mechanism for wafer alignment in a double-sided exposure machine includes a base plate 1; a vertical plate 2 is fixedly connected to the top edge of the base plate 1, a horizontal adjustment component 3 is rotatably connected to one side of the vertical plate 2, a moving platform 4 is fixedly connected to the surface of the horizontal adjustment component 3, and an angle adjustment component 5 is fixedly connected to the top of the moving platform 4.

[0024] The horizontal adjustment assembly 3 includes a threaded rod 301 rotatably connected to one side of the vertical plate 2. A threaded cylinder 302 is threadedly connected to the surface of the threaded rod 301. A movable platform 4 is fixedly connected to the surface of the threaded cylinder 302. A transmission rod 303 is fixedly connected to one end of the threaded rod 301. The vertical plate 2 is connected through the surface of the transmission rod 303. One end of the transmission rod 303 is splinedly connected to the output end of the voice coil motor 304.

[0025] The angle adjustment assembly 5 includes a base block 501 fixedly connected to the top of the mobile platform 4. A rack plate 502 is slidably connected to the top of the base block 501. A gear shaft 503 is meshed with the surface of the rack plate 502. A rotating plate 506 is fixedly connected to the top of the gear shaft 503. A B transmission rod 504 is fixedly connected to one end of the rack plate 502. One end of the B transmission rod 504 is splinedly connected to the output end of the B voice coil motor 505.

[0026] During operation, the horizontal adjustment component 3 utilizes a structural design where the voice coil motor's coils or magnetic circuits are arranged around the axis. Multi-coil segmented energization generates rotational torque, energizing the A voice coil motor 304. This causes the A transmission rod 303 to rotate directly in the permanent magnetic field via the energized coils, eliminating the need for intermediate transmission components like gears and screws, thus avoiding mechanical backlash and inertial delay. Simultaneously, the rotation of the A transmission rod 303 drives the threaded rod 301 to rotate, which in turn moves the threaded cylinder 302, thereby altering the position of the moving platform 4 and its upper structure relative to the wafer. This allows the CCD dynamic compensation mechanism to quickly adjust the wafer position, improving wafer exposure efficiency. The angle adjustment component 5 also utilizes a structural design... When the customized B voice coil motor 505 is connected to the power supply, the B transmission rod 504 drives the rack plate 502 to rotate. At the same time, the rack plate 502 slides along the groove on the top of the base block 501. The gear shaft 503, which meshes with the rack plate 502, drives the rotating plate 506 to produce an angular offset. After the angle adjustment is completed, the power supply to the B voice coil motor 505 is disconnected, causing the brake built into the B voice coil motor 505 to lock the B transmission rod 504, fixing the rack plate 502. The rack on the rack plate 502 fixes the gear shaft 503 at multiple angles, enabling the CCD dynamic compensation mechanism to fix the angle after the wafer angle adjustment is completed, thus improving the accuracy of using the CCD dynamic compensation mechanism.

[0027] Furthermore, a support plate 6 is fixedly connected to the bottom of the A voice coil motor 304, and a base plate 1 is fixedly connected to one end of the support plate 6;

[0028] During operation, the A voice coil motor 304 can be fixed and supported by the support plate 6.

[0029] Furthermore, a protrusion 7 is fixedly connected to one end of the B voice coil motor 505, and a bottom block 501 is fixedly connected to the bottom of the B voice coil motor 505.

[0030] During operation, the position of the B voice coil motor 505 can be fixed through the connection between the protrusion 7, the bottom block 501, and the B voice coil motor 505.

[0031] Furthermore, connecting plates 8 are fixedly connected to both sides of the bottom block 501, and connecting bolts 9 are fixedly connected to the surface of the connecting plates 8 in a linear array. The moving platform 4 is threadedly connected to the surface of the connecting bolts 9.

[0032] During operation, the connection bolt 9 facilitates the removal or installation of the compensation mechanism.

[0033] Furthermore, a limit rod 10 is connected through one side of the mobile platform 4, and vertical plates 2 are fixedly connected to both ends of the limit rod 10.

[0034] During operation, the setting of the limit rod 10 improves the stability of the moving platform 4 when sliding, thereby improving the accuracy of the compensation mechanism.

[0035] Furthermore, a chuck 11 is fixedly connected to the top of the rotating plate 506, and the top of the chuck 11 is provided with a ring array of chuck claws 12 for centering and clamping.

[0036] During operation, the chuck 11 is connected to an external drive structure through the configuration of the chuck 11 and the jaws 12. The transmission mechanism inside the chuck 11 can simultaneously drive the jaws 12 to slide and retract inward to center and clamp the wafer through a four-point contact method.

[0037] Working principle: When using this dynamic compensation mechanism, the chuck 11 is connected to the external drive structure, so that the jaws 12 are centered and clamped. A high-resolution CCD camera captures the alignment marks on the wafer and provides real-time feedback of position information. The position information of the marks on the wafer is compared to generate an error signal, which controls the dynamic compensation mechanism to adjust the wafer position. When there is a planar error, after the A voice coil motor 304 is energized, the coil or magnetic circuit of the voice coil motor is arranged around the axis. By energizing multiple coils in segments, a rotational torque is generated, which causes the A transmission rod 303 to rotate directly in the permanent magnetic field through the energized coil. There is no need for intermediate transmission components such as gears and screws, avoiding mechanical backlash and inertial delay. While the A transmission rod 303 rotates, it drives the threaded rod. Rotation 301 drives the threaded cylinder 302 to move via the rotating thread, thereby changing the position of the moving platform 4 and its upper structure relative to the wafer. When there is an angular error, the customized B voice coil motor 505 is energized, and the B transmission rod 504 drives the rack plate 502 to rotate. At the same time, the rack plate 502 slides along the groove on the top of the bottom block 501. The gear shaft 503, which meshes with the rack plate 502, drives the rotating plate 506 to produce an angular offset, changing the angle between the rotating plate 506 and the wafer. After the angle adjustment is completed, the energization of the B voice coil motor 505 is disconnected, causing the brake built into the B voice coil motor 505 to lock the B transmission rod 504, fixing the rack plate 502. The gear shaft 503 is fixed at multiple angles by the rack set on the rack plate 502.

[0038] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, or similar improvements made within the theoretical and principle content of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A dynamic compensation mechanism for CCD alignment in a double-sided exposure machine, characterized in that: Includes a base plate (1); a vertical plate (2) is fixedly connected to the top edge of the base plate (1), a horizontal adjustment component (3) is rotatably connected to one side of the vertical plate (2), a moving platform (4) is fixedly connected to the surface of the horizontal adjustment component (3), and an angle adjustment component (5) is fixedly connected to the top of the moving platform (4). The horizontal adjustment assembly (3) includes a threaded rod (301) rotatably connected to one side of the vertical plate (2). A threaded cylinder (302) is threadedly connected to the surface of the threaded rod (301). A moving platform (4) is fixedly connected to the surface of the threaded cylinder (302). A transmission rod (303) is fixedly connected to one end of the threaded rod (301). The vertical plate (2) is connected through the surface of the transmission rod (303). One end of the transmission rod (303) is splinedly connected to the output end of the voice coil motor (304). The angle adjustment assembly (5) includes a base block (501) fixedly connected to the top of the mobile platform (4). A rack plate (502) is slidably connected to the top of the base block (501). A gear shaft (503) is meshed with the surface of the rack plate (502). A rotating plate (506) is fixedly connected to the top of the gear shaft (503). A B transmission rod (504) is fixedly connected to one end of the rack plate (502). One end of the B transmission rod (504) is splinedly connected to the output end of the B voice coil motor (505).

2. The CCD dynamic compensation mechanism for wafer alignment in a double-sided exposure machine according to claim 1, characterized in that: The bottom of the A voice coil motor (304) is fixedly connected to a support plate (6), and one end of the support plate (6) is fixedly connected to a base plate (1).

3. The CCD dynamic compensation mechanism for wafer alignment in a double-sided exposure machine according to claim 1, characterized in that: One end of the B voice coil motor (505) is fixedly connected to a protrusion (7), and the bottom of the B voice coil motor (505) is fixedly connected to a bottom block (501).

4. The CCD dynamic compensation mechanism for wafer alignment in a double-sided exposure machine according to claim 1, characterized in that: Connecting plates (8) are fixedly connected to both sides of the base block (501). Connecting bolts (9) are fixedly connected to the surface of the connecting plates (8) in a linear array. A moving platform (4) is threadedly connected to the surface of the connecting bolts (9).

5. A CCD dynamic compensation mechanism for wafer alignment in a double-sided exposure machine according to claim 4, characterized in that: A limiting rod (10) is connected through one side of the mobile platform (4), and vertical plates (2) are fixedly connected to both ends of the limiting rod (10).

6. A CCD dynamic compensation mechanism for wafer alignment in a double-sided exposure machine according to claim 5, characterized in that: The top of the rotating plate (506) is fixedly connected to a chuck (11), and the top of the chuck (11) is provided with a ring array of chuck claws (12) for centering and clamping.

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