Superconducting PCB with high heat dissipation performance

Abstract

The utility model discloses a superconductive PCB with high heat dissipation performance, which comprises a circuit board, a fan and a fixing strip, a main heat conducting plate and an auxiliary heat conducting plate are arranged on the upper surface and the lower surface of the circuit board, a soaking plate attached to the circuit board is arranged on the lower surface of the main heat conducting plate, a plurality of first fins are arranged on the surface of the main heat conducting plate, and the fan is arranged on the surfaces of the first fins. Steel wires are arranged on the surface of the fan and connected with the main heat conduction plate, and the fixing strips are fixedly connected with the auxiliary heat conduction plate. The heat of the circuit board is conducted to the main heat conduction plate through the heat uniformizing plate, the heat uniformizing plate can evenly distribute the heat to the main heat conduction plate, the heat dissipation effect of the main heat conduction plate can be achieved, the situation that the local temperature of the circuit board is too high is avoided, the fan dissipates the heat of the main heat conduction plate, and the overall heat dissipation efficiency of the circuit board is high. The steel wires achieve installation of the fan and the first fins through the main heat guide plate, the ends of the steel wires are separated from the insertion holes, the steel wires and the fan can be rapidly taken down, dust removal of the fan is facilitated, and dust mingled in the first fins can be conveniently cleaned.

Description

Technical Field

[0001] This utility model relates to the field of PCB circuit board technology, specifically to a high heat dissipation superconducting PCB circuit board. Background Technology

[0002] The circuits and components on a PCB board generate heat during operation. If heat cannot be dissipated in time to keep the PCB board within a certain temperature range, it will affect the performance of the circuits and components on the PCB board.

[0003] To address the aforementioned issues, a solution for a high-heat-dissipation superconducting PCB circuit board (announcement number CN216391502U) is provided. The heat dissipation fan installed on the protective cover effectively absorbs and discharges the heat generated inside the device through the breathable filter plate, while ensuring its internal permeability, facilitating air circulation and heat dissipation, thereby effectively improving the heat dissipation performance of the device.

[0004] However, the above solution, which uses a cooling fan to directly blow heat onto the circuit board, has insufficient uniformity in heat dissipation. The area of ​​the circuit board and components covered is limited. After a period of use, the cooling fan is prone to dust accumulation. Furthermore, the fan is located inside the protective cover, making it inconvenient to clean. Utility Model Content

[0005] The purpose of this invention is to provide a superconducting PCB circuit board with high heat dissipation to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high heat dissipation superconducting PCB circuit board, including a circuit board, wherein a main heat plate and a secondary heat plate are mounted on the upper and lower surfaces of the circuit board, a heat dissipation plate that is attached to the circuit board is provided on the lower surface of the main heat plate, and a plurality of first fins are provided on the surface of the main heat plate. The heat dissipation plate evenly conducts the heat of the circuit board to the main heat plate, giving full play to the heat conduction function of the main heat plate. The main heat plate and the secondary heat plate can dissipate heat from both sides of the circuit board and achieve double-sided protection.

[0007] A fan is placed on the surface of the first fin, and a steel wire is provided on the surface of the fan. The steel wire is connected to the main heating plate. The steel wire is easy to separate from the fan, making it easy to quickly remove the fan for dust cleaning.

[0008] A fixing strip is fixedly connected to the heat-conducting plate, and screws are inserted into the fixing strip for easy installation.

[0009] Furthermore, the circuit board is provided with thermal pads on its upper and lower surfaces. The thermal pads are in contact with the main heat plate and the auxiliary heat plate. The auxiliary heat plate has several second fins on its surface. The thermal pads can fill the gaps, improve the heat conduction efficiency, and avoid the problem of local overheating of the circuit board.

[0010] Furthermore, the fan surface is provided with a strip groove, and the steel wire is inserted into the strip groove to prevent the fan from sliding and improve the stability of the fan installation. The side of the main heating plate is provided with a socket, and the end of the steel wire is bent at ninety degrees and inserted into the socket. The fan can be quickly removed by pulling the steel wire out of the socket.

[0011] Furthermore, several fans are provided, and magnets and iron plates are provided on the sides of the fans. Adjacent fans are spliced ​​together by magnets and iron plates, which can improve the stability of the installation of all fans.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] (1) The heat of the circuit board is conducted to the main heat plate through the heat spreader. The heat spreader can evenly distribute the heat to the main heat plate, which can not only give full play to the heat dissipation function of the main heat plate, but also avoid the local temperature of the circuit board being too high. The fan dissipates heat to the main heat plate, and the overall heat dissipation efficiency of the circuit board is high.

[0014] (2) Thermal pads are arranged on both sides of the circuit board. The thermal pads can fill the gap between the circuit board and the main heat plate and the auxiliary heat plate. The thermal pads can quickly conduct heat to the main heat plate and the auxiliary heat plate to achieve double-sided heat dissipation of the circuit board.

[0015] (3) The steel wire is used to install the fan and the first fin through the main heating plate. The steel wire end is separated from the socket so that the steel wire and the fan can be quickly removed, which is convenient for cleaning the fan and also convenient for cleaning the dust mixed in the first fin. Attached Figure Description

[0016] Figure 1 This is a side view of the present invention;

[0017] Figure 2 This is a schematic diagram showing the disassembled parts of this utility model;

[0018] Figure 3 This is a top view of the present invention;

[0019] Figure 4 This is a schematic diagram showing the separation of the main heating plate and the heat spreader plate in this utility model;

[0020] Figure 5 This is a schematic diagram showing the steel wire and the insertion hole of this utility model being separated.

[0021] In the diagram: 1. Main heating plate; 2. First fin; 3. Steel wire; 4. Fan; 5. Circuit board; 6. Screw; 7. Fixing strip; 8. Secondary heating plate; 9. Strip groove; 10. Thermal pad; 11. Hole; 12. Second fin; 13. Groove; 14. Heat spreader; 15. Magnet; 16. Iron sheet; 17. Fixing foot; 18. Anti-slip pad. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example:

[0024] Please see Figure 1-5 This utility model provides a technical solution: a high heat dissipation superconducting PCB circuit board, including a circuit board 5. The upper and lower surfaces of the circuit board 5 are equipped with a main heat plate 1 and a secondary heat plate 8. The lower surface of the main heat plate 1 is provided with a heat dissipation plate 14 that is attached to the circuit board 5. The heat dissipation plate 14 on the lower surface of the main heat plate 1 is attached to the circuit board 5 with silicone grease, which can quickly and evenly distribute the heat generated by the circuit board 5 to the entire main heat plate 1. The heat dissipation design can avoid local overheating and improve the overall heat dissipation efficiency. The surface of the main heat plate 1 is provided with a plurality of first fins 2. The first fins 2 significantly improve the heat exchange efficiency with the air by increasing the heat dissipation surface area.

[0025] Fan 4 is placed on the surface of the first fin 2. The surface of the fan 4 is provided with steel wire 3. The steel wire 3 is connected to the main heat plate 1. The fan 4 accelerates the airflow to the first fin 2 and quickly cools the first fin 2, thereby achieving active heat dissipation of the circuit board 5. The steel wire 3 can bind the fan 4. The fan 4 can be installed without screws 6, and the fan 4 can be quickly and easily disassembled.

[0026] The fixing strip 7 is fixedly connected to the heat-conducting plate 8. The fixing strip 7 is fitted with screws 6, which can be used to install the fixing strip 7 and fix the circuit board 5.

[0027] In this embodiment, as Figure 2 As shown, the circuit board 5 has thermal pads 10 on its upper and lower surfaces. The thermal pads 10 are in contact with the main heat plate 1 and the auxiliary heat plate 8. The auxiliary heat plate 8 has several second fins 12 on its surface. The thermal pads 10 fill the gaps between the circuit board 5 and the main heat plate 1 and the auxiliary heat plate 8, resulting in high thermal conductivity. The second fins 12 dissipate heat from the auxiliary heat plate 8, thereby achieving heat dissipation on the back of the circuit board 5.

[0028] In this embodiment, as Figure 2 As shown, the surface of the fan 4 is provided with a strip groove 9, and the steel wire 3 is inserted into the strip groove 9 to prevent the fan 4 from sliding and improve the stability of the fan 4 installation.

[0029] In this embodiment, as Figure 5 As shown, the main heating plate 1 has an insertion hole 11 on its side. The end of the steel wire 3 is bent at ninety degrees and inserted into the insertion hole 11. The steel wire 3 is easy to install, thus completing the quick installation of the fan 4.

[0030] In this embodiment, as Figure 4 As shown, the lower surface of the main heat plate 1 is provided with a groove 13, and the heat spreader 14 is placed inside the groove 13 to ensure the flatness of the lower surface of the main heat plate 1 and to better fit with the circuit board 5.

[0031] In this embodiment, as Figure 1 As shown, several fans 4 are provided. Each fan 4 has a magnet 15 and an iron plate 16 on its side. Adjacent fans 4 are spliced ​​together by the magnet 15 and the iron plate 16. When a large number of fans 4 are used, they can be spliced ​​together to make the fans 4 more neat and compact.

[0032] In this embodiment, as Figure 1 As shown, the fixing strip 7 has a fixing foot 17 that slides inside. The fixing foot 17 has an anti-slip pad 18 on its upper side. The anti-slip pad 18 has a protrusion. The fixing foot 17 can be installed using a screw 6. The fixing strip 7 is C-shaped, which makes it easy to install the fixing strip 7 by sliding. The anti-slip pad 18 can prevent the fixing strip 7 from loosening, providing two installation methods for the fixing strip 7.

[0033] Specifically, when the circuit board 5 is powered on and heats up, the heat is conducted to the main heat plate 1 and the auxiliary heat plate 8 through the heat conduction pad 10. The heat spreader 14 on the lower surface of the main heat plate 1 can evenly diffuse the heat to the main heat plate 1, ensuring that the local temperature of the circuit board 5 will not be too high. The second fin 12 passively dissipates heat from the auxiliary heat plate 8.

[0034] When the fan 4 rotates, it blows air onto the first fin 2, which accelerates the heat dissipation efficiency of the first fin 2. Several first fins 2 conduct heat to the main heat plate 1. Together with the fan 4, the circuit board 5 can achieve active heat dissipation, and the entire circuit board 5 is less prone to overheating.

[0035] When the fan 4 needs to be cleaned, the steel wire 3 is flexible and can be bent and deformed. After separating the steel wire 3 from the socket 11, the fan 4 can be removed from the first fin 2, making it convenient to clean the dust from the fan 4. The operation is simple, and the fan 4 no longer blocks the first fin 2. The first fin 2 can also be cleaned, maintaining efficient heat dissipation for the circuit board 5.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A superconducting PCB circuit board with high heat dissipation, characterized in that, include: Circuit board (5), the upper and lower surfaces of the circuit board (5) are equipped with a main heat plate (1) and a secondary heat plate (8), the lower surface of the main heat plate (1) is provided with a heat spreader (14) that is in contact with the circuit board (5), and the surface of the main heat plate (1) is provided with a plurality of first fins (2). A fan (4) is placed on the surface of the first fin (2), and a steel wire (3) is provided on the surface of the fan (4), and the steel wire (3) is connected to the main heating plate (1); A fixing strip (7) is fixedly connected to a heat-conducting plate (8), and a screw (6) is inserted into the fixing strip (7).

2. The high heat dissipation superconducting PCB circuit board according to claim 1, characterized in that: The circuit board (5) has heat-conducting pads (10) on its upper and lower surfaces. The heat-conducting pads (10) are in contact with the main heat plate (1) and the auxiliary heat plate (8). The auxiliary heat plate (8) has several second fins (12) on its surface.

3. The high heat dissipation superconducting PCB circuit board according to claim 1, characterized in that: The fan (4) has a strip groove (9) on its surface, and the steel wire (3) is inserted into the strip groove (9).

4. The high heat dissipation superconducting PCB circuit board according to claim 1, characterized in that: The main heating plate (1) has a socket (11) on its side, and the end of the steel wire (3) is bent at ninety degrees and inserted into the socket (11).

5. A high heat dissipation superconducting PCB circuit board according to claim 1, characterized in that: The lower surface of the main heating plate (1) is provided with a groove (13), and the heat spreader (14) is placed inside the groove (13).

6. A high heat dissipation superconducting PCB circuit board according to claim 1, characterized in that: Several fans (4) are provided. The side of each fan (4) is provided with a magnet (15) and an iron plate (16). Adjacent fans (4) are spliced ​​together by the magnet (15) and the iron plate (16).

7. A high heat dissipation superconducting PCB circuit board according to claim 1, characterized in that: The fixing strip (7) has a fixing foot (17) slidingly connected inside.

8. A high heat dissipation superconducting PCB circuit board according to claim 7, characterized in that: The fixed foot (17) is provided with an anti-slip pad (18) on its upper side, and the anti-slip pad (18) has a protrusion.

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