Circuit board splicing device

Abstract

The utility model relates to the technical field of circuit board processing, and discloses a circuit board splicing device, which comprises a placing platform and a discharging guide assembly, and is characterized in that the placing platform is suitable for placing a substrate circuit board; the discharging guide assembly comprises a guide structure, the guide structure is movably arranged above the containing platform, a guide groove is formed in the guide structure, at least part of the structure of the expanded circuit board can penetrate through the guide groove, and the slotting shape of the guide groove is the same as the shape of the at least part of the structure of the expanded circuit board. According to the utility model, the guide structure is arranged, and the guide groove of the guide structure is used for guiding the placement position of the expanded circuit board, so that the splicing precision of the circuit board is improved, and the reject ratio is reduced.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and more specifically to a circuit board splicing device. Background Technology

[0002] With the increasing complexity and integration of electronic products, circuit board splicing and positioning technologies have become particularly important. Traditional single-piece circuit boards can no longer meet the high-performance and multi-functional requirements of modern electronic products. Therefore, splicing technology is used to connect multiple circuit boards with different functions together. However, the spliced ​​circuit boards must maintain stability and reliability during subsequent assembly and use.

[0003] The existing technology still has some shortcomings. These shortcomings are mainly reflected in the problem of inaccurate positioning, which makes it impossible to effectively guarantee the stability and reliability of the circuit board during subsequent assembly and use. Utility Model Content

[0004] In view of this, the present invention provides a circuit board splicing device to solve the problem of mispositioning of circuit boards during the splicing process.

[0005] In a first aspect, the present invention provides a circuit board splicing device, comprising: a placement platform adapted to place a base circuit board; and a feeding guide assembly, the feeding guide assembly comprising a guide structure movably disposed above the placement platform, the guide structure having a guide groove adapted to allow at least a portion of the structure of the circuit board to pass through, the groove shape being the same as the shape of at least a portion of the structure of the circuit board.

[0006] Beneficial effects: By setting up a guide structure, the guide groove of the guide structure guides the placement of the expansion circuit board, thereby improving the accuracy of circuit board splicing and reducing the defect rate.

[0007] In one alternative embodiment, the placement platform includes a platform structure with a positioning groove, the positioning groove being adapted to place a base circuit board.

[0008] Beneficial effects: By placing the base circuit board in the positioning groove, the base circuit board is prevented from shifting, further improving the accuracy and reliability of circuit board splicing.

[0009] In one optional embodiment, the circuit board splicing device further includes magnetic dots and a magnetic attraction structure. The magnetic dots are adapted to be disposed on the base circuit board, and the magnetic attraction structure is disposed in the positioning groove. The magnetic attraction structure is adapted to attract the magnetic dots and abut against them.

[0010] Beneficial effects: By utilizing the properties of magnetic materials, specific magnetic points are set on the circuit board, and the circuit board can be quickly and accurately positioned through a magnetic attraction structure.

[0011] In one optional embodiment, the placement platform further includes a positioning block and a spring. The platform structure has a sliding groove, and the positioning block is slidably disposed in the sliding groove. The two ends of the spring are respectively connected to the positioning block and the groove wall of the sliding groove. The positioning block has a locked state and an unlocked state. In the locked state, the positioning block is adapted to abut against the base circuit board or the expansion circuit board under the action of the spring. In the unlocked state, the spring is compressed, and the positioning block disengages from the base circuit board or the expansion circuit board.

[0012] Beneficial effects: By incorporating springs and utilizing their properties, the positioning block remains in contact with the circuit board in the locked state, preventing the circuit board from shaking and improving the accuracy and reliability of circuit board splicing.

[0013] In one optional embodiment, the placement platform further includes a lifting structure. The platform structure has a through hole along its thickness direction, the through hole communicating with the sliding groove. The lifting structure passes through the through hole and abuts against the positioning block. The lifting structure is movably disposed along the thickness direction of the platform structure. The side of the lifting structure near the positioning block is a guide surface. The guide surface is inclined relative to the thickness direction of the platform structure. The guide surface has a first end and a second end that are opposite to each other. The first end is near the sliding groove and away from the spring, and the second end is away from the sliding groove and near the spring.

[0014] Beneficial effects: The lifting structure can convert the lifting action into the lateral movement of the positioning block, thereby achieving precise positioning of the circuit board and making installation and disassembly convenient.

[0015] In one optional embodiment, the feeding guide assembly further includes a feeding structure and a translation structure, wherein the guide structure is connected to the drive end of the feeding structure, and the feeding structure is slidably disposed on the translation structure.

[0016] Beneficial effects: By setting up a feeding structure and a translation structure, the feeding and translation of the guide structure can be controlled separately, which also facilitates later maintenance and repair.

[0017] In one optional embodiment, the feeding structure includes a feeding cylinder and a feeding slider. The driving end of the feeding cylinder is connected to the guide structure, and the fixed end of the feeding cylinder is connected to the feeding slider. The feeding slider is slidably disposed on the translation structure.

[0018] In one optional embodiment, the circuit board splicing device further includes a pressure bonding assembly, which is movably disposed and adapted to press down the expansion circuit board to splice the expansion circuit board with the base circuit board.

[0019] In one optional embodiment, the circuit board splicing device further includes an electromagnetic induction coil and an electromagnetic induction component. The electromagnetic induction coil is disposed on the base circuit board, and the electromagnetic induction component is disposed corresponding to the electromagnetic induction coil. The electromagnetic induction component is electrically connected to the feeding guide component.

[0020] Beneficial effects: By setting electromagnetic induction coils on the circuit board, the position information of the circuit board is detected by the change of electromagnetic field, and the feeding guide component is adjusted in real time, thereby improving the positioning accuracy and stability of the circuit board splicing.

[0021] In one alternative embodiment, the circuit board splicing device further includes a visual recognition component electrically connected to the feeding guide component, the visual recognition component including a camera, the camera being positioned toward the base circuit board.

[0022] Beneficial effects: Image processing via camera captures the position information of the circuit board in real time, and the feeding guide component is adjusted in real time, improving the positioning accuracy and stability of the circuit board splicing. Attached Figure Description

[0023] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the overall structure of the circuit board splicing device according to an embodiment of the present utility model;

[0025] Figure 2 This is a top view of the placement platform according to an embodiment of the present utility model;

[0026] Figure 3 This is an exploded structural diagram of the placement platform according to an embodiment of the present utility model;

[0027] Figure 4 This is a schematic diagram showing the cooperation between the lifting structure and the positioning block in an embodiment of this utility model;

[0028] Figure 5 This is a schematic diagram of the material feeding guide assembly according to an embodiment of the present utility model.

[0029] Figure 6 for Figure 5 A magnified view of part A in the diagram;

[0030] Figure 7 This is a schematic diagram of the adhesive bonding assembly according to an embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures:

[0032] 10. Placement platform; 11. Platform structure; 111. Positioning groove; 112. Sliding groove; 12. Positioning block; 121. Limiting part; 1211. Limiting groove; 122. Pulley; 13. Spring; 14. Lifting structure; 141. Lifting cylinder; 142. Lifting block; 15. Connecting block; 151. Connecting wall; 152. Connecting slide rail; 20. Material feeding guide assembly; 21. Guide structure; 211. Guide groove; 22. Material feeding structure; 221. Material feeding cylinder; 222. Material feeding slider; 23. Translation structure; 231. Longitudinal translation module; 232. Lateral translation module; 30. Adhesive pressing assembly; 31. Adhesive pressing block; 32. Displacement structure; 321. Downward pressing cylinder; 322. Forward pushing cylinder; 323. Lateral translation module; 40. Base circuit board; 50. Extension circuit board. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0034] The following is combined Figures 1 to 7 The following describes embodiments of the present invention.

[0035] According to an embodiment of the present invention, a circuit board splicing device is provided, comprising: a placement platform 10 and a feeding guide assembly 20; the placement platform 10 is adapted to place a base circuit board 40; the feeding guide assembly 20 includes a guide structure 21, the guide structure 21 is movably disposed above the placement platform 10, the guide structure 21 has a guide groove 211, the guide groove 211 is adapted to allow at least a portion of the structure of the extended circuit board 50 to pass through, and the groove shape of the guide groove 211 is the same as the shape of at least a portion of the structure of the extended circuit board 50.

[0036] The circuit board splicing device of this embodiment uses a guide structure 21 to allow at least a portion of the extended circuit board 50 structure to pass through the guide groove 211. The guide groove 211 of the guide structure 21 guides the placement of the extended circuit board 50 in the vertical direction, making the placement angle and position of the extended circuit board 50 more accurate, thereby improving the accuracy of circuit board splicing and reducing the defect rate.

[0037] Specifically, in this embodiment, the expansion circuit board 50 is an irregularly shaped circuit board.

[0038] Specifically, in this embodiment, the circuit board splicing device also includes a robotic arm (not shown in the figure), which is used to pick up and transfer the base circuit board 40 and the extension circuit board 50.

[0039] It should be noted that, as Figure 6 As shown, in this embodiment, the guide groove 211 is a T-shaped groove, and the expansion circuit board 50 is provided with a T-shaped structure. The guide groove 211 is suitable for the T-shaped structure of the expansion circuit board 50 to pass through. Of course, in other alternative embodiments, the guide groove 211 can also be slotted according to the overall shape of the expansion circuit board 50 to obtain more precise guiding control.

[0040] In one embodiment, such as Figure 1 As shown, the circuit board splicing device also includes a pressure bonding assembly 30, which is movably configured and adapted to press down the extension circuit board 50 to splice the extension circuit board 50 with the base circuit board 40.

[0041] Furthermore, such as Figure 1 and Figure 7 As shown, the adhesive pressing assembly 30 includes an adhesive pressing block 31 and a displacement structure 32. The adhesive pressing block 31 is connected to the drive end of the displacement structure 32, and the adhesive pressing block 31 is adapted to abut against the expansion circuit board 50.

[0042] Specifically, such as Figure 7 As shown, the displacement structure 32 also includes a pressing cylinder 321, a pushing cylinder 322, and a transverse module 323. The pushing cylinder 322 is slidably mounted on the transverse module 323. The pressing cylinder 321 is connected to the driving end of the pushing cylinder 322, and the pressure block 31 is connected to the driving end of the pressing cylinder 321.

[0043] Furthermore, the transverse module 323 is driven by a motor, a synchronous belt and a lead screw, and the forward cylinder 322 is connected to the lead screw of the transverse module 323 through a slider, so as to realize the movement of the transverse module 323 on the transverse module 323.

[0044] It is worth noting that the displacement structure 32 enables multi-directional displacement of the pressure block 31, thereby improving the applicability of the circuit board splicing device.

[0045] In one embodiment, such as Figure 2 and Figure 3 As shown, the placement platform 10 includes a platform structure 11, on which a positioning groove 111 is provided, and the positioning groove 111 is suitable for placing the base circuit board 40.

[0046] It should be noted that the platform structure 11 is designed separately from the feeding guide assembly 20 and the adhesive pressing assembly 30, and the corresponding platform structure 11 can be replaced according to the different shapes of the base circuit board 40.

[0047] It is worth noting that by placing the base circuit board 40 in the positioning groove 111, the base circuit board 40 is prevented from shifting, thereby further improving the accuracy and reliability of the circuit board splicing.

[0048] In one embodiment, the circuit board splicing device further includes magnetic dots and a magnetic attraction structure (not shown in the figure). The magnetic dots are adapted to be disposed on the base circuit board 40, and the magnetic attraction structure is disposed in the positioning groove 111. The magnetic attraction structure is adapted to attract the magnetic dots and abut against the magnetic dots.

[0049] It should be noted that a magnetic attraction structure can also be provided at a predetermined position on the expansion circuit board 50, and magnetic dots can be provided on the expansion circuit board 50.

[0050] Specifically, the magnetic attraction structure generates a magnetic force on the magnetic point, which facilitates the expansion circuit board 50 to quickly approach the base circuit board 40.

[0051] It is worth noting that by utilizing the properties of magnetic materials, specific magnetic points are set on the circuit board, and the circuit board can be quickly and accurately positioned through a magnetic attraction structure.

[0052] In one embodiment, such as Figure 2 and Figure 4 As shown, the placement platform 10 also includes a positioning block 12 and a spring 13. The platform structure 11 has a sliding groove 112. The positioning block 12 is slidably disposed in the sliding groove 112. The two ends of the spring 13 are respectively connected to the positioning block 12 and the groove wall of the sliding groove 112. The positioning block 12 has a locked state and an unlocked state. In the locked state, the positioning block 12 is adapted to abut against the base circuit board 40 or the expansion circuit board 50 under the action of the spring 13. In the unlocked state, the spring 13 is compressed, and the positioning block 12 is disengaged from the base circuit board 40 or the expansion circuit board 50.

[0053] Specifically, there are four positioning blocks 12, with each pair of positioning blocks 12 forming a group, which respectively lock and control the base circuit board 40 and the expansion circuit board 50.

[0054] Specifically, such as Figure 3 and Figure 4As shown, the placement platform 10 also includes a connecting block 15. One side of the connecting block 15 is detachably connected to the wall of the sliding groove 112, and the other side of the connecting block 15 is connected to the spring 13.

[0055] Furthermore, such as Figure 4 As shown, the connecting block 15 includes a connecting wall 151 and a connecting slide rail 152. The connecting wall 151 is connected to the connecting slide rail 152. One side of the connecting wall 151 is detachably connected to the groove wall of the sliding groove 112, and the other side of the connecting wall 151 is connected to the spring 13. The positioning block 12 is slidably disposed on the connecting slide rail 152.

[0056] It should be noted that it is difficult to connect the spring 13 directly to the groove wall of the sliding groove 112, and the replacement of the spring 13 is complicated after it is damaged. Therefore, by setting the connecting block 15, the work of replacing the spring 13 in the future can be reduced.

[0057] It is worth noting that by setting spring 13, the characteristics of spring 13 are utilized to keep the positioning block 12 in contact with the circuit board in the locked state, preventing the circuit board from shaking and improving the accuracy and reliability of circuit board splicing.

[0058] In one embodiment, such as Figure 3 and Figure 4 As shown, the placement platform 10 also includes a lifting structure 14. The platform structure 11 has a through hole along its thickness direction, which communicates with the sliding groove 112. The lifting structure 14 passes through the through hole and abuts against the positioning block 12. The lifting structure 14 is movably positioned along the thickness direction of the platform structure 11. The side of the lifting structure 14 near the positioning block 12 is a guide surface, which is inclined relative to the thickness direction of the platform structure 11. The guide surface has a first end and a second end that are opposite to each other. The first end is positioned near the sliding groove 112 and away from the spring 13, while the second end is positioned away from the sliding groove 112 and near the spring 13. Through the lifting structure 14, the lifting action can be converted into the lateral movement of the positioning block 12, achieving precise positioning of the circuit board and facilitating easy installation and disassembly.

[0059] Specifically, there are two lifting structures 14, which are respectively abutted against two sets of positioning blocks 12 to control the locking of the base circuit board 40 and the expansion circuit board 50.

[0060] Specifically, such as Figure 3 and Figure 4 As shown, the lifting structure 14 includes a lifting cylinder 141 and a lifting block 142. The lifting block 142 is connected to the drive end of the lifting cylinder 141, and the guide surface is disposed at one end of the lifting block 142 near the positioning block 12.

[0061] Furthermore, such as Figure 4As shown, the positioning block 12 includes a limiting part 121 and a pulley 122. The pulley 122 is rotatably disposed on the limiting part 121, and the pulley 122 slides against the guide surface of the lifting block 142.

[0062] Furthermore, a limiting groove 1211 is provided on the limiting part 121, and the limiting groove 1211 abuts against the base circuit board 40 or the expansion circuit board 50 to limit the circuit board.

[0063] It is worth noting that by setting pulley 122, the sliding friction between positioning block 12 and lifting structure 14 is significantly reduced, which is conducive to the rapid response of positioning block 12 and improves service life.

[0064] It should be noted that in other alternative embodiments, the positioning block 12 can be directly slidably abutted against the guide surface, and the positioning block 12 can be driven to move laterally by the up and down movement of the lifting block 142; an inclined surface adapted to the guide surface can also be provided on the positioning block 12 to reduce wear on the positioning block 12 or the lifting block 142.

[0065] In one embodiment, such as Figure 1 and Figure 5 As shown, the feeding guide assembly 20 also includes a feeding structure 22 and a translation structure 23. The guide structure 21 is connected to the drive end of the feeding structure 22, and the feeding structure 22 is slidably disposed on the translation structure 23.

[0066] Specifically, the drive end of the guide structure 21 and the feeding structure 22 are detachably connected so that the guide structure 21 of different shapes can be replaced according to different expansion circuit boards 50.

[0067] It is worth noting that by setting up the feeding structure 22 and the translation structure 23, the feeding and translation of the guide structure 21 can be controlled separately, which also facilitates later maintenance and repair.

[0068] In one embodiment, such as Figure 5 As shown, the feeding structure 22 includes a feeding cylinder 221 and a feeding slider 222. The driving end of the feeding cylinder 221 is connected to the guide structure 21, and the fixed end of the feeding cylinder 221 is connected to the feeding slider 222. The feeding slider 222 is slidably mounted on the translation structure 23.

[0069] In one embodiment, such as Figure 1 and Figure 5 As shown, the translation structure 23 includes a longitudinal translation module 231 and a transverse translation module 232. The feeding slider 222 is slidably disposed on the transverse translation module 232, and the transverse translation module is slidably disposed on the longitudinal translation module 231.

[0070] Specifically, the lateral translation module 232 includes a motor, a synchronous belt, and a lead screw. The two ends of the synchronous belt are respectively fitted onto the motor and the lead screw. The motor drives the synchronous belt to rotate, which in turn drives the lead screw to rotate. The feeding slider 222 is connected to the lead screw of the lateral translation module 232, thus enabling the feeding slider 222 to move on the lateral translation module 232. Similarly, the longitudinal translation module 232 achieves transmission through a motor, synchronous belt, and lead screw. The lateral translation module 232 is connected to the lead screw of the longitudinal translation module 232 through a slider, thus enabling the lateral translation module 232 to move on the longitudinal translation module 232.

[0071] In one embodiment, the circuit board splicing device further includes an electromagnetic induction coil and an electromagnetic induction component. The electromagnetic induction coil is disposed on the base circuit board 40 (not shown in the figure), and the electromagnetic induction component is disposed corresponding to the electromagnetic induction coil. The electromagnetic induction component is electrically connected to the feeding guide component 20.

[0072] Specifically, the electromagnetic induction component obtains the precise position information of the base circuit board 40 by sensing the electromagnetic information of the electromagnetic induction coil on the base circuit board 40, and transmits the information to the feeding guide component 20 through an electrical signal to facilitate the position adjustment of the guide structure 21. Furthermore, the electromagnetic induction component includes a Hall element, which can be positioned above the platform structure 11 and corresponding to the position of the electromagnetic induction coil on the base circuit board 40. The Hall element directly detects the magnetic field strength provided by the electromagnetic induction coil and outputs a voltage signal.

[0073] It should be noted that the electromagnetic induction coil can also be set on the expansion circuit board 50 to collect the position information of the expansion circuit board 50 and transmit the information to the adhesive pressing assembly 30 so that the adhesive pressing assembly 30 can adjust the adhesive pressing position.

[0074] It is worth noting that by setting an electromagnetic induction coil on the circuit board, the position information of the circuit board is detected by the change of electromagnetic field, and the feeding guide component 20 is adjusted in real time, thereby improving the positioning accuracy and stability of the circuit board splicing.

[0075] In one embodiment, the circuit board splicing device further includes a visual recognition component electrically connected to the feeding guide component 20. The visual recognition component includes a camera, which can be positioned above the platform structure 11 and facing the base circuit board 40.

[0076] Specifically, the visual recognition component can also sample images of the expansion circuit board 50.

[0077] Specifically, the camera of the visual recognition component takes a picture of the circuit board, and then through image analysis and processing, transmits the relevant information of the circuit board to the feeding guide component 20 through an electrical signal, so as to adjust the guide groove 211 of the feeding guide component 20 to a more accurate position.

[0078] Of course, the visual recognition component can also transmit image information to the adhesive pressing component 30 so that the adhesive pressing component 30 can adjust the adhesive pressing position.

[0079] It is worth noting that by using a camera for image processing, the position information of the circuit board can be captured in real time, and the feeding guide component 20 can be adjusted in real time to improve the positioning accuracy and stability of the circuit board splicing.

[0080] Using the circuit board splicing device of this embodiment, firstly, the drive ends of all lifting cylinders 141 rise, and the guide surface of the lifting block 142 contacts the pulley 122, causing the positioning block 12 to enter the unlocked state and the spring 13 to be in the compressed state; then, the robot arm places the base circuit board 40 into the positioning groove 111; afterwards, the drive ends of the lifting cylinders 141 responsible for controlling the locking of the base circuit board 40 retract, and the positioning block 12 rebounds under the action of the spring 13 to lock the base circuit board 40, completing the positioning of the base circuit board 40; after that, the feeding guide assembly 20... The guide structure 21 moves to the predetermined position, and the robot precisely places the expansion circuit board 50 onto the base circuit board 40 through the guide groove 211, achieving successful docking. Then, the drive end of the lifting cylinder 141, which controls the locking of the expansion circuit board 50, retracts, and the positioning block 12 rebounds under the action of the spring 13 to lock the expansion circuit board 50, completing the positioning of the expansion circuit board 50. Finally, the adhesive pressing block 31 of the adhesive pressing assembly 30 moves to the predetermined position, and the pressing cylinder 321 presses down, activating the adhesive paper on the back of the expansion circuit board 50, successfully splicing it with the base circuit board 40.

[0081] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the present invention.

Claims

1. A circuit board splicing device, characterized in that, include: A placement platform (10) is provided on which a base circuit board (40) is placed; The material feeding guide assembly (20) includes a guide structure (21), which is movably disposed above the placement platform (10). The guide structure (21) has a guide groove (211) that is adapted to allow at least a portion of the structure of the expansion circuit board (50) to pass through. The groove shape of the guide groove (211) is the same as the shape of at least a portion of the structure of the expansion circuit board (50).

2. The circuit board splicing device according to claim 1, characterized in that, The placement platform (10) includes a platform structure (11), on which a positioning groove (111) is provided, and the positioning groove (111) is suitable for placing a base circuit board (40).

3. The circuit board splicing device according to claim 2, characterized in that, The circuit board splicing device further includes magnetic dots and a magnetic attraction structure. The magnetic dots are adapted to be disposed on the base circuit board (40), and the magnetic attraction structure is disposed in the positioning groove (111). The magnetic attraction structure is adapted to attract the magnetic dots and abut against the magnetic dots.

4. The circuit board splicing device according to claim 2, characterized in that, The placement platform (10) further includes a positioning block (12) and a spring (13). The platform structure (11) has a sliding groove (112). The positioning block (12) is slidably disposed in the sliding groove (112). The two ends of the spring (13) are respectively connected to the positioning block (12) and the groove wall of the sliding groove (112). The positioning block (12) has a locked state and an unlocked state. In the locked state, the positioning block (12) is adapted to abut against the base circuit board (40) or the expansion circuit board (50) under the action of the spring (13). In the unlocked state, the spring (13) is compressed, and the positioning block (12) disengages from the base circuit board (40) or the expansion circuit board (50).

5. The circuit board splicing device according to claim 4, characterized in that, The placement platform (10) further includes a lifting structure (14). The platform structure (11) has a through hole along its thickness direction. The through hole communicates with the sliding groove (112). The lifting structure (14) passes through the through hole and abuts against the positioning block (12). The lifting structure (14) is movably arranged along the thickness direction of the platform structure (11). The side of the lifting structure (14) near the positioning block (12) is a guide surface. The guide surface is inclined relative to the thickness direction of the platform structure (11). The guide surface has a first end and a second end that are opposite to each other. The first end is close to the sliding groove (112) and away from the spring (13). The second end is away from the sliding groove (112) and close to the spring (13).

6. The circuit board splicing device according to any one of claims 1-5, characterized in that, The feeding guide assembly (20) further includes a feeding structure (22) and a translation structure (23). The guide structure (21) is connected to the driving end of the feeding structure (22), and the feeding structure (22) is slidably disposed on the translation structure (23).

7. The circuit board splicing device according to claim 6, characterized in that, The feeding structure (22) includes a feeding cylinder (221) and a feeding slider (222). The driving end of the feeding cylinder (221) is connected to the guide structure (21), and the fixed end of the feeding cylinder (221) is connected to the feeding slider (222). The feeding slider (222) is slidably disposed on the translation structure (23).

8. The circuit board splicing device according to any one of claims 1-5, characterized in that, The circuit board splicing device further includes a pressure bonding assembly (30), which is movably configured and adapted to press down the expansion circuit board (50) to splice the expansion circuit board (50) with the base circuit board (40).

9. The circuit board splicing device according to any one of claims 1-5, characterized in that, The circuit board splicing device also includes an electromagnetic induction coil and an electromagnetic induction component. The electromagnetic induction coil is disposed on the base circuit board (40), and the electromagnetic induction component is disposed corresponding to the electromagnetic induction coil. The electromagnetic induction component is electrically connected to the feeding guide component (20).

10. The circuit board splicing device according to any one of claims 1-5, characterized in that, The circuit board splicing device also includes a visual recognition component, which is electrically connected to the feeding guide component (20). The visual recognition component includes a camera, which is positioned facing the base circuit board (40).

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