Liquid cooling heat dissipation module and electronic expansion device with liquid cooling heat dissipation module

Abstract

A liquid cooling heat dissipation module is used for solving the problem that an existing liquid cooling heat dissipation module is poor in heat dissipation efficiency. Comprising a shell, the shell is provided with a first flow channel and a second flow channel, a first heat conduction part is aligned to the first flow channel, a second heat conduction part is aligned to the second flow channel, and the first flow channel is communicated with the second flow channel; and the heat dissipation assembly is provided with a first heat dissipation piece which is in thermal contact with the first heat conduction part and a second heat dissipation piece which is in thermal contact with the second heat conduction part, and the first heat dissipation piece and the second heat dissipation piece form non-contact. The utility model further provides an electronic expansion device with the liquid cooling heat dissipation module. Therefore, the heat dissipation efficiency can be improved.

Description

Technical Field

[0001] This utility model relates to a heat dissipation module, and more particularly to a liquid-cooled heat dissipation module that helps electronic devices maintain an appropriate operating temperature. It also relates to an electronic expansion device incorporating this liquid-cooled heat dissipation module. Background Technology

[0002] Modern technology products are becoming increasingly sophisticated and operate at significantly higher speeds. Consequently, the heat generated by chips and other heat sources during operation is considerable, especially for chips performing AI calculations, which are more prone to high-efficiency operation and thus generate large amounts of heat instantly. Therefore, the heat generated by chips and other heat sources is typically channeled into liquid cooling modules for better heat dissipation. However, for high-power electronic heat-generating components, existing liquid cooling modules are located inside the electronic device, excessively occupying internal space and being obstructed by other components within the device. This limits the heat dissipation effect of existing liquid cooling modules, resulting in poor heat dissipation efficiency.

[0003] In view of this, existing liquid cooling modules do indeed need to be improved. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this invention is to provide a liquid cooling heat dissipation module and an electronic expansion device incorporating the liquid cooling heat dissipation module, which can improve heat dissipation efficiency.

[0005] The directional terms or similar terms used throughout this utility model, such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc., are mainly for reference to the directions in the accompanying drawings. Each directional term or similar term is only used to assist in explaining and understanding the various embodiments of this utility model and is not intended to limit this utility model.

[0006] The use of the quantifiers “a” or “an” for the elements and components described throughout this utility model is merely for convenience and to provide the general meaning of the scope of this utility model; in this utility model, it should be interpreted as including one or at least one, and a single concept also includes multiple cases, unless it clearly means otherwise.

[0007] The terms “first,” “second,” … and “Nth” used throughout this utility model are mainly used to distinguish different elements or features (such as elements, directions, or steps), and do not indicate the maximum or minimum number of these elements or features possessed by a corresponding subject or method, nor do they limit the order of priority.

[0008] The terms "combination," "integration," or "assembly" used throughout this utility model mainly include those that allow for separation without damaging the components after connection, or those that make the components inseparable after connection. Those skilled in the art can choose the appropriate term based on the material of the components to be connected or the assembly requirements.

[0009] The liquid cooling heat dissipation module of this utility model includes: a housing having a first flow channel and a second flow channel, a first heat conduction part located in the first flow channel, a second heat conduction part located in the second flow channel, the first flow channel communicating with the second flow channel; and a heat dissipation assembly having a first heat dissipation element in thermal contact with the first heat conduction part, the heat dissipation assembly having a second heat dissipation element in thermal contact with the second heat conduction part, the first heat dissipation element and the second heat dissipation element forming a non-contact relationship.

[0010] Therefore, in the liquid cooling heat dissipation module of this utility model, the first flow channel is aligned with the first heat conduction part, and the second flow channel is aligned with the second heat conduction part. The working liquid can flow through the first flow channel and the second flow channel in sequence, so that the heat energy of the working liquid is transferred to the heat dissipation component by the first heat conduction part and the second heat conduction part respectively. This forms a pre-cooling of the working liquid before rapid cooling, so that the working liquid can achieve better heat dissipation efficiency through two-stage heat dissipation.

[0011] The first flow channel has a liquid inlet and a first connecting end, and the second flow channel has a second connecting end and a liquid outlet, with the second connecting end connected to the first connecting end. This allows the working fluid to pass sequentially through the first and second flow channels.

[0012] The second flow channel has a cross-section with a width dimension and a thickness dimension perpendicular to each other, with the width dimension being greater than the thickness dimension. This allows the working fluid to have a larger contact area with the inner wall of the second flow channel.

[0013] The first heat sink is a fin. Thus, the first heat sink can cool the working fluid within the first flow channel.

[0014] The second heat sink has a uniform cooling chip that is integrated with the second heat conduction portion. Thus, the second heat sink can cool the working fluid within the second flow channel.

[0015] The second heat sink has a fin that makes thermal contact with the cooling chip. In this way, the fin can effectively dissipate the heat energy from the cooling chip.

[0016] This invention further includes at least one cooling fan, the airflow path of which is located on the heat dissipation component. Thus, the airflow from the at least one cooling fan can effectively remove heat from the heat dissipation component.

[0017] The system includes at least one cooling fan, but actually two fans, with their airflow paths aligned with the first and second heat sinks, respectively. This allows the two cooling fans to remove heat from the first and second heat sinks, thus improving the heat dissipation efficiency of the liquid cooling module.

[0018] An electronic expansion device includes: a body having a liquid inlet and a liquid outlet; and a liquid cooling module as described above, wherein a first flow channel is connected to the liquid inlet and a second flow channel is connected to the liquid outlet. Thus, by incorporating the liquid cooling module, the electronic expansion device, when used as a power supply, hub, video box, or wireless signal transmitter, can further be used to dissipate heat from electronic devices such as laptops and desktop computers, thereby improving heat dissipation efficiency.

[0019] The main body includes a pump that drives a working fluid to flow through the first and second flow channels. This allows the working fluid to circulate and dissipate heat from the electronic device. Attached Figure Description

[0020] Figure 1 : An exploded perspective view of a preferred embodiment of the present invention;

[0021] Figure 2 : Front view of a preferred embodiment of the present invention;

[0022] Figure 3 :along Figure 2 AA-line cross-section;

[0023] Figure 4 :along Figure 2 BB line cross-section;

[0024] Figure 5 The liquid-cooled heat dissipation module of this utility model has two cooling fans (see diagram).

[0025] Figure 6 : A schematic diagram of the electronic expansion device of this utility model connected to an electronic device;

[0026] Figure 7 : Schematic diagram of the electronic expansion device of this utility model connecting multiple electronic devices.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1: Shell

[0029] 1a: First heat conduction section

[0030] 1b: Second heat conduction section

[0031] 11: First Stream

[0032] 11a: Liquid inlet

[0033] 11b: First connection end

[0034] 12: Second flow channel

[0035] 12a: Second connection end

[0036] 12b: Liquid outlet

[0037] 13: Through-hole

[0038] 2: Heat dissipation components

[0039] 21: First heat sink

[0040] 22: Second heat sink

[0041] 23: Cooling wafer

[0042] 24: Fins

[0043] M: Liquid cooling heat dissipation module

[0044] L: Working fluid

[0045] T1, T2: Pipe fittings

[0046] D1: Width dimension

[0047] D2: Thickness dimension

[0048] F: Cooling fan

[0049] F1: Air Inlet

[0050] F2: Air vent

[0051] H: Electronic expansion device

[0052] H1: Ontology

[0053] H2: Liquid inlet port

[0054] H3: Liquid outlet

[0055] H4: Pump

[0056] S: Liquid cooling unit

[0057] E: Electronic device. Detailed Implementation

[0058] To make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments of this utility model are described below in detail with reference to the accompanying drawings; in addition, those symbols that are marked with the same symbols in different drawings are considered to be the same and their descriptions will be omitted.

[0059] Please refer to Figure 1 As shown, it is a preferred embodiment of the liquid cooling heat dissipation module M of the present invention, including a housing 1 and a heat dissipation component 2, which is combined with the housing 1.

[0060] Please refer to Figure 1 , Figure 3 As shown, the housing 1 can be made of, for example, copper, aluminum, titanium, stainless steel, or other thermally conductive materials. The housing 1 can be integrally formed, or it can be formed by, for example, joining two plates together. In this embodiment, the housing 1 can be generally thin-plate shaped, which facilitates the thinning of the liquid cooling module M. The housing 1 has a first flow channel 11, and one end of the first flow channel 11 can be formed with a liquid inlet 11a on the surface of the housing 1. The liquid inlet 11a can be used to allow a working fluid L to enter the first flow channel 11. The working fluid L can flow through heat sources such as processors, display chips, or memory, thereby giving the working fluid L heat energy. The working fluid L can be fed into the first flow channel 11 through, for example, a pipe T1.

[0061] The first flow channel 11 may have a first connecting end 11b, through which the working fluid L can flow from the inlet 11a to the first connecting end 11b. The length of the first flow channel 11 can be extended by forming several straight channels and several curved channels in the portion between the inlet 11a and the first connecting end 11b, so that the working fluid L can have a better residence time in the first flow channel 11, thereby allowing the heat energy absorbed by the heat source in the working fluid L to be conducted to the housing 1. In this embodiment, the housing 1 has a first heat conduction part 1a, which may be located on a surface of the housing 1 and is located in the first flow channel 11, so that the heat energy of the working fluid L can be transferred to the first heat conduction part 1a.

[0062] Please refer to Figure 1 , Figure 3 , Figure 4As shown, the housing 1 has a second flow channel 12, which has a second connecting end 12a. The second connecting end 12a is connected to the first connecting end 11b of the first flow channel 11, so that the working fluid L can enter the second flow channel 12 from the first flow channel 11. The other end of the second flow channel 12 has an outlet 12b, which can be connected to a pipe T2 to deliver the working fluid L. The cross-section of the second flow channel 12 can have a width dimension D1 and a thickness dimension D2 perpendicular to each other, where the width dimension D1 is greater than the thickness dimension D2. In this way, the working fluid L can have a large contact area with the inner wall surface of the second flow channel 12. In addition, the length of the second flow channel 12 can also be extended by forming several straight channels and several curved channels in the section between the second connecting end 12a and the outlet 12b (e.g., Figure 4 As shown), so that the working fluid L can have a longer residence time in the second flow channel 12. In this embodiment, the housing 1 has a second heat conduction part 1b, which can be located on a surface of the housing 1 and is located in the second flow channel 12, so that the heat energy of the working fluid L can be transferred to the second heat conduction part 1b.

[0063] The heat dissipation assembly 2 has a first heat dissipation element 21, which can be made of a metal material with high thermal conductivity. The first heat dissipation element 21 can make thermal contact with the first heat conduction part 1a of the housing 1, so that the heat energy of the working liquid L in the first flow channel 11 can be transferred to the first heat dissipation element 21. For example, the first heat dissipation element 21 can be in thermal contact with the first heat conduction part 1a of the housing 1 through a medium such as thermal paste or thermal pad. In this embodiment, the first heat dissipation element 21 can be a fin. The first heat dissipation element 21 (e.g., a fin) is combined with the first heat conduction part 1a so that the heat energy of the working liquid L in the first flow channel 11 can be directly transferred to the first heat dissipation element 21 and dissipated, thereby giving the heat dissipation assembly 2 better heat dissipation efficiency.

[0064] The heat dissipation assembly 2 has a second heat dissipation element 22, which can make thermal contact with the second heat conduction portion 1b of the housing 1, allowing the heat energy of the working fluid L in the second flow channel 12 to be transferred to the second heat dissipation element 22. For example, the second heat dissipation element 22 can make thermal contact with the second heat conduction portion 1b of the housing 1 through a medium such as thermal paste or thermal pad. Preferably, there is a gap between the second heat dissipation element 22 and the first heat dissipation element 21, that is, the second heat dissipation element 22 does not make contact with the first heat dissipation element 21, or more specifically, the second heat dissipation element 22 does not make physical contact with the first heat dissipation element 21. In this way, the heat energy absorbed by the first heat dissipation element 21 can be prevented from being transferred to the second heat dissipation element 22, thus avoiding poor heat dissipation effect of the second heat dissipation element 22. In this embodiment, the second heat sink 22 may have a cooling wafer 23. The cooling wafer 23 can be energized by passing an electric current, thereby forming opposing high-temperature and low-temperature surfaces. The low-temperature surface of the cooling wafer 23 can contact the second heat conduction portion 1b, while the high-temperature surface of the cooling wafer 23 is used to conduct heat energy. This is well understood by those skilled in the art and will not be elaborated upon here. Thus, the cooling wafer 23 can absorb the heat energy from the second heat conduction portion 1b through its low-temperature surface and dissipate it through its high-temperature surface. In this embodiment, the cooling wafer 23 is combined with the second heat conduction portion 1b so that the heat energy of the working liquid L in the second flow channel 12 can be directly transferred to the cooling wafer 23. Preferably, the second heat sink 22 may have a fin 24, which thermally contacts the high-temperature surface of the cooling wafer 23, allowing the heat energy of the cooling wafer 23 to be dissipated through the fin 24.

[0065] Please continue reading. Figure 1 , Figure 3 , Figure 5 As shown, the liquid cooling module M may further include at least one cooling fan F, and the airflow path of the at least one cooling fan F may be located on the heat dissipation component 2. For example, when the cooling fan F introduces or exhausts airflow through an air vent (e.g., an air inlet or an air outlet), the heat dissipation component 2 may be adjacent to the air vent, so that the heat energy of the heat dissipation component 2 can be further carried away by the airflow of the at least one cooling fan F.

[0066] In this embodiment, the at least one cooling fan F can be integrated into the housing 1. The at least one cooling fan F can be a centrifugal fan, and it has an air inlet F1 and an air outlet F2. The air inlet F1 is aligned with a through hole 13 located in the housing 1, and the air outlet F2 is aligned with the first heat sink 21. Preferably, the airflow channels of the first heat sink 21 (e.g., fins) and the airflow channels of the fins 24 of the second heat sink 22 can simultaneously align with the airflow direction of the air outlet F2. The airflow exiting the air outlet F2 can pass through the airflow channels of the first heat sink 21 and the airflow channels of the fins 24 of the second heat sink 22, allowing the at least one cooling fan F to simultaneously remove heat energy from both the first heat sink 21 and the fins 24. In another embodiment, there can be two cooling fans F, and the airflow paths of the two cooling fans F can respectively align with the airflow channels of the first heat sink 21 and the airflow channels of the fins 24 of the second heat sink 22 (e.g., fins). Figure 5 As shown), the two cooling fans F can respectively remove the heat energy from the fins 24 of the first heat sink 21 and the second heat sink 22, thereby improving the heat dissipation efficiency.

[0067] Therefore, after absorbing the heat generated by the electronic device, the working fluid L can be introduced into the first flow channel 11 through the inlet 11a. Within the first flow channel 11, the working fluid L conducts some of the heat through the first heat conduction section 1a to form the first stage of heat dissipation. Then, the working fluid L enters the second flow channel 12 and continues to conduct heat through the second heat conduction section 1b within the second flow channel 12 to form the second stage of heat dissipation. Finally, the working fluid L flows back to the electronic device through the outlet 12b. In this way, the working fluid L can achieve two-stage heat dissipation through the liquid cooling module M, thereby achieving better heat dissipation efficiency.

[0068] Please continue reading. Figure 6 , Figure 7As shown, more specifically, the liquid cooling heat dissipation module M of this utility model can be located in an electronic expansion device H. The electronic expansion device H can be, for example, a power supply, a hub, a video box, or a wireless signal transmitter. The electronic expansion device H can have a body H1, and the body H1 has a liquid inlet H2. The liquid inlet H2 is connected to the liquid inlet 11a of the first flow channel 11. The housing H1 can have a liquid outlet H3, and the liquid outlet H3 is connected to the liquid outlet 12b of the second flow channel 12. The electronic expansion device H can have, for example, a pump H4, which can be used to drive the working liquid L to flow in the first flow channel 11 and the second flow channel 12. In this embodiment, the pump H4 can be connected to the liquid outlet H3. Thus, the liquid inlet H2 and liquid outlet H3 of the electronic expansion device H can be connected to the liquid cooling unit S inside an electronic device E via the two pipes T1 and T2, respectively. The electronic device E can be a laptop computer, and the liquid cooling unit S can be in thermal contact with the heat source of the electronic device E. In this way, the working fluid L can circulate between the liquid cooling unit S and the liquid cooling heat dissipation module M of the electronic expansion device H, thereby dissipating heat from the heat source of the electronic device E.

[0069] Alternatively, the electronic expansion device H may have several liquid-cooled heat dissipation modules M (such as...) Figure 7 Each of the several liquid cooling modules M can be connected to an electronic device E (e.g., a laptop or a desktop computer). Thus, the electronic expansion device H can be used to cool several electronic devices E. Furthermore, since the electronic device E cools itself by directing the working fluid L to the electronic expansion device H, the number of heat dissipation components (e.g., pumps, fans, fins, or conduits) for the working fluid L can be reduced within the electronic device E, thereby saving internal space and contributing to a thinner and lighter design.

[0070] In summary, the liquid cooling module of this invention, through the alignment of the first flow channel with the first heat conduction part and the second flow channel with the second heat conduction part, allows the working fluid to flow sequentially through the first and second flow channels. This allows the heat energy of the working fluid to be transferred to the heat dissipation component via the first and second heat conduction parts, respectively, thus pre-cooling the working fluid before rapid cooling. This two-stage heat dissipation achieves better heat dissipation efficiency. Furthermore, the electronic expansion device of this invention, by incorporating this liquid cooling module, can further dissipate heat from electronic devices such as laptops and desktop computers when used as a power supply, hub, video box, or wireless signal transmitter, thereby improving heat dissipation efficiency.

[0071] Although the present invention has been disclosed using the above preferred embodiments, it is not intended to limit the present invention. Any modifications and alterations made by those skilled in the art to the above embodiments without departing from the spirit and scope of the present invention shall still fall within the technical scope protected by the present invention. Therefore, the protection scope of the present invention shall include all changes within the meaning and equivalent scope of the appended claims. Furthermore, when the above embodiments can be combined, the present invention includes any combination of embodiments.

Claims

1. A liquid-cooled heat dissipation module, characterized in that, include: A housing having a first flow channel and a second flow channel, a first heat conduction portion located in the first flow channel, a second heat conduction portion located in the second flow channel, the first flow channel communicating with the second flow channel; and A heat dissipation assembly has a first heat sink in thermal contact with a first heat conduction portion, and a second heat sink in thermal contact with a second heat conduction portion, wherein the first heat sink and the second heat sink are in non-contact.

2. The liquid-cooled heat dissipation module as described in claim 1, characterized in that, The first flow channel has a liquid inlet and a first connection end, and the second flow channel has a second connection end and a liquid outlet, with the second connection end connected to the first connection end.

3. The liquid-cooled heat dissipation module as described in claim 1, characterized in that, The cross-section of the second flow channel has a width dimension and a thickness dimension in a phase-perpendicular direction, with the width dimension being greater than the thickness dimension.

4. The liquid cooling heat dissipation module as described in claim 1, characterized in that, The first heat sink is a fin.

5. The liquid-cooled heat dissipation module as described in claim 1, characterized in that, The second heat sink has a cooling chip that is combined with the second heat conduction portion.

6. The liquid-cooled heat dissipation module as described in claim 5, characterized in that, The second heat sink has a fin that makes thermal contact with the cooling wafer.

7. The liquid cooling heat dissipation module as described in any one of claims 1 to 6, characterized in that, It also includes at least one cooling fan, the airflow path of which is located on the heat dissipation component.

8. The liquid-cooled heat dissipation module as described in claim 7, characterized in that, The at least one cooling fan is two, and the airflow paths of the two cooling fans are respectively located on the first heat sink and the second heat sink.

9. An electronic expansion device, characterized in that, include: A body having a liquid inlet and a liquid outlet; and A liquid cooling heat dissipation module as described in any one of claims 1 to 8, wherein the first flow channel is connected to the liquid inlet interface and the second flow channel is connected to the liquid outlet interface.

10. The electronic expansion device as claimed in claim 9, characterized in that, The body has a pump that drives a working fluid to flow in the first flow channel and the second flow channel.

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