Liquid metal packaging structure
By combining a porous frame and an elastic sealing ring, the problems of low heat conduction efficiency and unstable sealing in liquid metal encapsulation structures are solved, achieving efficient heat dissipation and reliable sealing, and preventing liquid metal leakage and short circuits.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN CITY ZHAOKE ELECTRONICS MATERIALS SICENCE TECHUNOLOGY CO LTD
- Filing Date
- 2025-01-13
- Publication Date
- 2026-05-08
AI Technical Summary
Existing liquid metal packaging structures have limitations in terms of efficient heat dissipation and reliable sealing, especially in terms of low heat conduction efficiency and unstable sealing performance, which cannot meet the requirements of efficient heat dissipation and reliable sealing.
The design employs a combination of a porous frame and first and second elastic sealing rings. The frame has holes to allow air to escape and to contain excess liquid metal. The first elastic sealing ring is embedded at the bottom of the annular groove to prevent leakage, and the second elastic sealing ring surrounds the outer perimeter of the frame to ensure a seal. The use of porous materials achieves efficient heat conduction and reliable sealing.
It achieves efficient heat conduction and reliable liquid metal sealing under pressurized conditions, significantly improving heat dissipation efficiency and preventing potential short-circuit risks, ensuring the stability of sealing performance.
Smart Images
Figure CN224218815U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of chip heat dissipation technology, and in particular relates to a liquid metal packaging structure. Background Technology
[0002] In electronic devices, chip heat dissipation is crucial. With the advancement of semiconductor technology, chip integration and power density are constantly increasing, leading to a significant increase in heat generation. Therefore, efficient thermal management solutions are becoming increasingly important for ensuring device performance and reliability. Thermally conductive materials, as key components connecting heat-generating elements (such as chips) and heat sinks (such as copper or aluminum heat sinks, thermally conductive copper pipes, etc.), play an indispensable role in this process. Traditional thermally conductive materials are typically composed of metal oxides mixed with inorganic powders. They possess good insulation properties to prevent short-circuit risks, but their thermal conductivity is limited by the inherent properties of the materials, resulting in insufficient performance in efficient heat dissipation. On the other hand, liquid metals are ideal heat-conducting media due to their high thermal conductivity; however, their conductivity can lead to short-circuit problems, which greatly limits their application.
[0003] To address the potential short-circuit problem caused by liquid metal, various solutions have been proposed in the industry. For example, patent CN216749870U discloses a liquid metal encapsulation structure that uses compressible organic polymer materials (such as silicone or rubber) to restrict the flow of liquid metal. However, in practical applications, this design easily traps air when pressure is applied to the top and bottom of the encapsulation structure, forming a large cavity. Since air is a poor conductor of heat, this leads to a significant increase in overall thermal resistance, thereby drastically reducing heat transfer efficiency. Additionally, Taiwanese patent TWM65102 proposes using a metal frame as a containment body. While this method utilizes the strength and stability of metal, the high rigidity, lack of elasticity and compressibility of metal materials result in poor sealing performance, increasing the risk of containment failure. Therefore, these existing methods face many limitations in practical applications, including but not limited to low heat transfer efficiency and unstable sealing performance, failing to fully meet the requirements for efficient heat dissipation and reliable sealing.
[0004] Therefore, there is an urgent need for a liquid metal packaging structure to address the shortcomings of existing technologies. Utility Model Content
[0005] In view of the above problems, the purpose of this utility model is to provide a liquid metal encapsulation structure that can achieve efficient heat conduction and reliably seal liquid metal even under pressure.
[0006] To achieve the above objectives, this utility model provides a liquid metal packaging structure, including a sealing frame and a heat sink. The sealing frame includes a frame, a first elastic sealing ring, and a second elastic sealing ring. The middle area of the frame has an accommodating area, where the chip is placed. An annular groove is formed between the chip and the frame. The first elastic sealing ring is embedded at the bottom of the annular groove, and the second elastic sealing ring is surrounding the outer periphery of the frame. The heat sink is covered on the end face of the frame and together with the chip, the first elastic sealing ring, and the frame, forms a sealed space for filling liquid metal. The frame includes multiple holes and is compressible.
[0007] Compared to existing technologies, the frame of this invention includes multiple holes, providing a path for air to escape during pressurization and adding extra space to accommodate excess liquid metal, preventing it from overflowing. The frame is also compressible, allowing for slight deformation under pressure, which helps to completely expel internal air and ensures uniform distribution of the liquid metal, reducing the risk of large cavities and achieving efficient heat conduction. However, the inventors of this application discovered in actual testing that although the holes in the frame help absorb and store liquid metal, under pressurized conditions, due to factors such as uneven interfaces, liquid metal may still leak from tiny gaps between the chip and the frame. Based on this, this invention also embeds a first elastic sealing ring at the bottom of the annular groove between the chip and the frame. Under pressure, this sealing ring can tightly fit the bottom of the annular groove, effectively preventing liquid metal from leaking through the gaps between the chip and the frame. Simultaneously, a second elastic sealing ring is arranged around the outer periphery of the frame, ensuring that the outer edge of the frame is completely sealed, further preventing liquid metal leakage from the outer edge of the frame. Therefore, combining the first and second elastic sealing rings ensures that the liquid metal encapsulation structure can effectively seal the liquid metal even under pressure. In summary, the liquid metal encapsulation structure of this invention achieves efficient heat conduction and reliably seals the liquid metal even under pressure.
[0008] Furthermore, the first and second elastic sealing rings of this utility model are each independently made of silicone, epoxy resin, polyurethane, rubber or polyester resin materials.
[0009] Furthermore, the frame of this utility model is made of porous silicone, aerogel, polyurethane foam or glass fiber.
[0010] Furthermore, the height of the first elastic sealing ring of this invention is lower than the height of the chip.
[0011] Furthermore, the height of the first elastic sealing ring of this utility model is 1 / 4 to 3 / 4 of the height of the frame.
[0012] Furthermore, the height of the second elastic sealing ring of this utility model is not lower than the height of the frame.
[0013] Furthermore, the opening ratio of the frame of this utility model is 10-80%.
[0014] Furthermore, the opening ratio of the frame of this utility model is 40-60%.
[0015] Furthermore, the cross-sectional shape of the hole in the frame of this utility model is at least one of the following: circular, elliptical, triangular, and polygonal.
[0016] Furthermore, the height of the frame of this utility model is 0.5 to 5.0 mm. Attached Figure Description
[0017] Fig. 1 This is a cross-sectional view of the liquid metal encapsulation structure of this utility model.
[0018] Fig. 2 This is a top view of the liquid metal encapsulation structure of this utility model after removing the heat sink. Detailed Implementation
[0019] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.
[0020] Please refer to Figs. 1-2 This invention provides a liquid metal encapsulation structure 100, which not only achieves efficient heat conduction but also reliably seals the liquid metal under pressure. Therefore, the liquid metal encapsulation structure 100 of this invention is particularly suitable for heat dissipation of chips such as CPUs and GPUs that require efficient heat management, significantly improving heat dissipation efficiency and preventing potential short-circuit risks. Specifically, the liquid metal packaging structure 100 of this utility model includes a sealing frame 11 and a heat sink 12. The sealing frame 11 includes a frame 111, a first elastic sealing ring 112 and a second elastic sealing ring 113. The middle area of the frame 111 has a receiving area 1112. The chip 13 is placed in the receiving area 1112. An annular groove 114 is formed between the chip 13 and the frame 111. The first elastic sealing ring 112 is embedded in the bottom of the annular groove 114. The second elastic sealing ring 113 is surrounded around the outer periphery of the frame 111. The heat sink 12 is covered on the end face of the frame 111 and together with the chip 13, the first elastic sealing ring 112 and the frame 111, forms a sealed space for filling liquid metal 14.
[0021] The frame 111 includes multiple holes 1111, which provide a path for air to be discharged during pressurization and add extra space to accommodate excess liquid metal 14 and prevent it from overflowing. The frame 111 also has a certain degree of compressibility and can deform slightly when pressure is applied, which helps to completely empty the internal air and ensure that the liquid metal 14 is evenly distributed, reducing the risk of large cavity formation and achieving efficient heat conduction.
[0022] Although the holes 1111 in the frame 111 help absorb and store the liquid metal 14, due to factors such as uneven interface, the liquid metal 14 may still leak from the tiny gap between the chip 13 and the frame 111 under pressure. To solve this problem, this invention places a first elastic sealing ring 112 at the bottom of the annular groove 114 between the chip 13 and the frame 111. Under pressure, the first elastic sealing ring 112 fits tightly against the bottom of the annular groove 114, effectively preventing the liquid metal 14 from leaking through the gap between the chip 13 and the frame 111. At the same time, a second elastic sealing ring 113 is arranged around the outer periphery of the frame 111 to ensure that the outer edge of the frame 111 is completely sealed, preventing the liquid metal 14 from leaking from the outer edge of the frame 111. Therefore, the combined use of the first elastic sealing ring 112 and the second elastic sealing ring 113 ensures that the liquid metal 14 can be reliably sealed even under pressure. Therefore, the liquid metal 14 encapsulation structure 100 of this invention achieves efficient heat conduction and can reliably seal the liquid metal 14.
[0023] Specifically, the heat sink 12 can be made of copper or aluminum heat sink fins, which cover the end face of the frame 111 and together with the chip 13, the first elastic sealing ring 112, and the frame 111 form a sealed space for filling the liquid metal 14. The liquid metal 14 can be, but is not limited to, Sn / In / Ga alloys or Sn / In / Bi alloys. The melting point of Sn / In / Ga alloys is lower than room temperature, and the melting point of Sn / In / Bi alloys is about 50 to 60°C. The appropriate alloy type can be selected according to the operating environment of the electronic device. When the electronic device heats up to above the melting point of the liquid metal 14 during operation, the liquid metal 14 filled in the sealed space changes from solid to liquid. This change is accompanied by an increase in the volume of the liquid metal 14. As the volume of the liquid metal 14 increases, the excess liquid metal 14 will enter the frame 111. Through the capillary effect caused by the multiple pores 1111 in the frame 111, the excess liquid metal 14 is adsorbed in the multiple pores 1111 and solidified. Therefore, the frame 111 can prevent the liquid metal 14 from overflowing to other electrical contacts, thereby preventing potential short circuit problems.
[0024] Specifically, the frame 111 can be made of porous organic materials, such as porous silicone, aerogel, polyurethane foam, or fiberglass materials (e.g., fiberglass cloth, fiberglass wool). The height of the frame 111 can be 0.5–5.0 mm. These materials are electrical insulators, so even with large quantities used, there is no need to worry about short circuits. Furthermore, these materials are characterized by their abundant porous structure and compressibility, allowing the liquid metal 14 encapsulation structure 100 to deform under assembly pressure, reducing its thickness and allowing internal air to escape smoothly through the holes 1111, effectively reducing thermal resistance. Therefore, the frame 111 can effectively adsorb a certain amount of liquid metal 14 through capillary action to improve heat conduction efficiency, while also preventing excessive liquid metal 14 from overflowing, thus avoiding the risk of short circuits in electronic devices.
[0025] It is worth noting that the porosity of the frame 111 directly affects its adsorption of liquid metal 14 and air expulsion. If the porosity is too high, capillary action cannot be effectively formed, thus weakening its ability to adsorb liquid metal 14; conversely, if the porosity is too low, it will limit the storage space of liquid metal 14 and may hinder air expulsion, increasing thermal resistance. Therefore, to ensure optimal performance, the porosity of the frame 111 is set between 10% and 80%, preferably between 40% and 60%. Furthermore, the cross-sectional shape of the holes 1111 is as follows... Fig. 2 The circle shown can also be an ellipse, triangle, or polygon, or a combination thereof. This not only provides a path for air to escape during the pressurization process, but also accommodates excess liquid metal 14 and prevents it from overflowing.
[0026] Specifically, both the first elastic sealing ring 112 and the second elastic sealing ring 113 are elastic structures. The first elastic sealing ring 112 is made of materials such as silicone, epoxy resin, polyurethane, rubber, or polyester resin. The height of the first elastic sealing ring 112 is lower than the height of the chip 13 and is set to 1 / 4 to 3 / 4 of the height of the frame 111. Under pressure, the first elastic sealing ring 112 can tightly fit the bottom of the annular groove 114, effectively preventing liquid metal 14 from leaking through the tiny gap between the chip 13 and the frame 111. The second elastic sealing ring 113 is arranged around the outer periphery of the frame 111 and is also made of materials such as silicone, epoxy resin, polyurethane, rubber, or polyester resin. The height of the second elastic sealing ring 113 is not lower than the height of the frame 111, ensuring that the outer edge of the frame 111 is completely sealed, further preventing liquid metal 14 from leaking from the outer edge of the frame 111.
[0027] In summary, the liquid metal 14 packaging structure 100 of this utility model includes a sealing frame 11 and a heat sink 12. The sealing frame 11 includes a frame 111, a first elastic sealing ring 112 and a second elastic sealing ring 113. The middle area of the frame 111 has a receiving area 1112. The chip 13 is placed in the receiving area 1112. An annular groove 114 is formed between the chip 13 and the frame 111. The first elastic sealing ring 112 is embedded in the bottom of the annular groove 114. The second elastic sealing ring 113 is surrounded around the outer periphery of the frame 111. The heat sink 12 is covered on the end face of the frame 111 and together with the chip 13, the first elastic sealing ring 112 and the frame 111, forms a sealed space for filling the liquid metal 14. The frame 111 not only includes multiple holes 1111, providing a path for air to escape during pressurization and adding extra space to accommodate excess liquid metal 14 and prevent it from overflowing; the frame 111 also has compressibility, allowing it to deform slightly under pressure, which helps to completely expel internal air and ensures uniform distribution of liquid metal 14, reducing the risk of large cavities and achieving efficient heat conduction. Simultaneously, by placing the first elastic sealing ring 112 at the bottom of the annular groove 114 between the chip 13 and the frame 111, under pressurization, the first elastic sealing ring 112 tightly fits the bottom of the annular groove 114, effectively preventing liquid metal 14 from leaking through the gap between the chip 13 and the frame 111; and by arranging the second elastic sealing ring 113 around the outer periphery of the frame 111, the outer edge of the frame 111 is completely sealed, preventing liquid metal 14 from leaking from the outer edge of the frame 111. Therefore, the liquid metal 14 encapsulation structure 100 of this invention achieves efficient heat conduction and reliably seals the liquid metal 14.
[0028] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the scope of the patent application of the present utility model. Therefore, all equivalent technical changes made using the contents of the present utility model specification and drawings are included in the scope of the patent application of the present utility model.
Claims
1. A liquid metal packaging structure for heat dissipation of a chip, characterized in that, The device includes a sealing frame and a heat sink. The sealing frame includes a frame, a first elastic sealing ring, and a second elastic sealing ring. The frame has a receiving area in its middle region. The chip is placed in the receiving area. An annular groove is formed between the chip and the frame. The first elastic sealing ring is embedded in the bottom of the annular groove. The second elastic sealing ring is surrounding the outer periphery of the frame. The heat sink is covered on the end face of the frame and together with the chip, the first elastic sealing ring, and the frame, forms a sealed space for filling liquid metal. The frame includes multiple holes and is compressible.
2. The liquid metal packaging structure as described in claim 1, characterized in that, The first elastic sealing ring and the second elastic sealing ring are each independently made of silicone, epoxy resin, polyurethane, rubber or polyester resin.
3. The liquid metal packaging structure as described in claim 1, characterized in that, The frame is made of porous silicone, aerogel, polyurethane foam, or glass fiber.
4. The liquid metal packaging structure as described in claim 1, characterized in that, The height of the first elastic sealing ring is lower than the height of the chip.
5. The liquid metal packaging structure as described in claim 4, characterized in that, The height of the first elastic sealing ring is 1 / 4 to 3 / 4 of the height of the frame.
6. The liquid metal packaging structure as described in claim 1, characterized in that, The height of the second elastic sealing ring is not lower than the height of the frame.
7. The liquid metal packaging structure as described in claim 1, characterized in that, The aperture ratio of the frame is 10-80%.
8. The liquid metal packaging structure as described in claim 7, characterized in that, The aperture ratio of the frame is 40~60%。 9. The liquid metal packaging structure as described in claim 1, characterized in that, The cross-sectional shape of the holes in the frame is at least one of ellipse or polygon.
10. The liquid metal packaging structure as described in claim 1, characterized in that, The height of the frame is 0.5~5.0mm.