Cleaning equipment

Abstract

The utility model discloses cleaning equipment. The cleaning equipment comprises a first cleaning assembly and a second cleaning assembly. The first cleaning assembly comprises a cleaning mechanism and a driving part, the cleaning mechanism is used for cleaning the wafer, and the driving part is used for driving the cleaning mechanism to move. The second cleaning assembly comprises a cleaning tank and a spray-washing part, the spray-washing part is used for cleaning the cleaning mechanism, and at least part of the spray-washing part is located in the cleaning tank; the driving piece can drive the cleaning mechanism to be located at the cleaning position, and when the cleaning mechanism is located at the cleaning position, at least part of the cleaning mechanism is located in the cleaning tank. Through the above arrangement, the cleaning mechanism cleans the wafer, and when the cleaning mechanism cannot effectively clean the wafer, the driving member drives the cleaning mechanism into the cleaning tank, so that the spray cleaning member cleans the cleaning mechanism, thereby removing pollutants on the cleaning mechanism, and improving the wafer cleaning effect of the cleaning mechanism.

Description

Technical Field

[0001] This application relates to the field of wafer fabrication equipment technology, and in particular to a cleaning device. Background Technology

[0002] Wafer cleaning is a crucial step in wafer production. Current wafer cleaning equipment typically uses sponge brushes in conjunction with various cleaning agents to remove contaminants from the wafer surface. However, after prolonged use, these sponge brushes accumulate contaminants, reducing the effectiveness of the wafer cleaning process.

[0003] Therefore, how to remove contaminants from the sponge brush head to improve the wafer cleaning effect of the cleaning equipment is a technical problem that urgently needs to be solved in this field. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, the purpose of this application is to provide a cleaning device that can improve the wafer cleaning effect.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A cleaning apparatus for cleaning wafers includes a first cleaning component and a second cleaning component. The first cleaning component includes a cleaning mechanism and a drive unit. The cleaning mechanism is used to clean the wafer, and the drive unit drives the cleaning mechanism to move. The second cleaning component includes a cleaning tank and a spray component. The spray component is used to clean the cleaning mechanism, and the spray component is at least partially located within the cleaning tank. The drive unit is capable of driving the cleaning mechanism to a cleaning position, whereby the cleaning mechanism is at least partially located within the cleaning tank.

[0007] Furthermore, the second cleaning component includes a cover plate, which is movably connected to the cleaning tank; the cover plate includes a closed position for closing the cleaning tank and a waiting position for opening the cleaning tank. When the cover plate is in the waiting position, the driving component drives the cleaning mechanism to the cleaning position, and when the cover plate is in the closed position, the spray cleaning component cleans the cleaning mechanism.

[0008] Furthermore, the second cleaning assembly includes a swing element that drives the cover plate to move, and the swing element is connected to the cover plate.

[0009] Furthermore, the second cleaning component includes a turbidimeter connected to the cleaning tank for detecting the cleaning fluid discharged from the cleaning tank.

[0010] Furthermore, the cleaning mechanism includes an upper cleaning component and a lower cleaning component, and the first cleaning assembly includes a support component. Both the upper and lower cleaning components are rotatably connected to the support component, and a cleaning gap for cleaning the wafer is formed between the upper and lower cleaning components.

[0011] Furthermore, there are two spray cleaning components, which respectively clean the upper cleaning component and the lower cleaning component. The second cleaning assembly also includes a separator that divides the cleaning tank into a first cleaning space and a second cleaning space. The two spray cleaning components are located in the first cleaning space and the second cleaning space, respectively. When the cleaning mechanism is in the cleaning position, the upper cleaning component is located in the first cleaning space and the lower cleaning component is located in the second cleaning space.

[0012] Furthermore, the first cleaning component includes a lifting component and a rotating component, both of which are mounted on a support member. There are two lifting components, which drive the upper and lower cleaning components to rise and fall respectively. There are also two rotating components, which drive the upper and lower cleaning components to rotate respectively.

[0013] Furthermore, the cleaning equipment includes a base, a second cleaning component, and a drive unit, all of which are mounted on the base. The drive unit is connected to a support and drives the support unit to move.

[0014] Furthermore, the cleaning equipment also includes a shield, which is mounted on a base and has a receiving space inside, where both the first cleaning component and the second cleaning component are located.

[0015] Furthermore, the cleaning equipment includes a support assembly for supporting the wafer. The support assembly includes a first support member, a second support member, and a plurality of rotating members. At least one of the first and second support members has a degree of freedom of movement, such that the distance between the first and second support members is adjustable. A support space for supporting the wafer is formed between the first and second support members. The plurality of rotating members are rotatably connected to the first and second support members. The rotating members have a degree of rotational freedom and can contact the wafer and drive the wafer to rotate. A driving member can drive the cleaning mechanism to a working position. When the cleaning mechanism is in the working position, the cleaning mechanism is located between the first and second support members, and the driving member can drive the cleaning mechanism to swing.

[0016] The aforementioned cleaning equipment cleans the wafers through a cleaning mechanism. When the cleaning mechanism cannot effectively clean the wafers, the drive unit drives the cleaning mechanism to the second cleaning component for cleaning, thereby removing contaminants from the cleaning mechanism and improving the cleaning effect during wafer cleaning. Attached Figure Description

[0017] Figure 1 This is a structural diagram of the cleaning equipment provided in an embodiment of this application.

[0018] Figure 2 This is a structural diagram of the first cleaning component provided in an embodiment of this application.

[0019] Figure 3 This is a structural diagram of the second cleaning component provided in an embodiment of this application.

[0020] Figure 4 This is a structural diagram of the shield provided in an embodiment of this application.

[0021] Explanation of reference numerals in the attached drawings: 100, cleaning equipment; 11, first cleaning component; 111, cleaning mechanism; 1111, upper cleaning component; 1112, lower cleaning component; 1113, cleaning gap; 112, driving component; 113, supporting component; 114, lifting component; 115, rotating component; 12, second cleaning component; 121, cleaning tank; 1211, first cleaning space; 1212, second cleaning space; 122, spraying component; 123, cover plate; 124, swinging component; 125, turbidimeter; 126, partition component; 13, base; 14, shield; 141, sealing plate. Detailed Implementation

[0022] To enable those skilled in the art to better understand the present application, the technical solutions in specific embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0023] It should be noted that the terms "first," "second," and similar terms used in this application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. "A plurality" or "several" indicates at least two. Unless otherwise stated, terms such as "front," "back," "left," "right," "lower," and / or "upper" are for illustrative purposes only and are not limited to a location or spatial orientation. Terms such as "comprising" or "including" indicate that the elements or objects preceding "comprising" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0024] The singular forms “a,” “the,” and “the” used in this application specification and appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0025] like Figure 1As shown, this application provides a cleaning apparatus 100 for cleaning wafers. The cleaning apparatus 100 includes a first cleaning component 11 and a second cleaning component 12. The first cleaning component 11 cleans the wafer, and the second cleaning component 12 cleans the first cleaning component 11, thereby removing contaminants from the first cleaning component 11 and improving the cleaning effect of the cleaning apparatus 100 when cleaning wafers.

[0026] To clearly illustrate the technical solution of this application, the following are also defined: Figure 1 The terms front, back, left, right, up, and down are shown to indicate the front, back, left, right, up, and down of the cleaning equipment 100.

[0027] Specifically, the first cleaning assembly 11 includes a cleaning mechanism 111 and a drive unit 112. The cleaning mechanism 111 is used to clean the wafer, and the drive unit 112 drives the cleaning mechanism 111 to move. The second cleaning assembly 12 includes a cleaning tank 121 and a spray cleaner 122. The spray cleaner 122 is used to clean the cleaning mechanism 111, and the spray cleaner 122 is at least partially located in the cleaning tank 121.

[0028] More specifically, the drive unit 112 can drive the cleaning mechanism 111 to the cleaning position. When the cleaning mechanism 111 is in the cleaning position, it is at least partially located within the cleaning tank 121. With this configuration, when there is excessive contaminant on the cleaning mechanism 111 and the cleaning mechanism 111 cannot effectively clean the wafer, the drive unit 112 drives the cleaning mechanism 111 into the cleaning tank 121, allowing the spray cleaning unit 122 to remove contaminants from the cleaning mechanism 111, thereby improving the cleaning effect of the cleaning mechanism 111 on the wafer. Simultaneously, the spray cleaning unit 122 cleans the cleaning mechanism 111 within the cleaning tank 121, reducing the splashing of cleaning fluid during cleaning, thus reducing contamination of surrounding components by the cleaning mechanism 111 during the cleaning process.

[0029] like Figure 2 As shown, in one embodiment, the second cleaning assembly 12 includes a cover plate 123, which is movably connected to the cleaning tank 121. The cover plate 123 includes a closed position that closes the cleaning tank 121 and a waiting position that opens the cleaning tank 121.

[0030] For example, when the cover plate 123 is in the waiting position, the drive member 112 drives the cleaning mechanism 111 to the cleaning position. With the above configuration, when the cover plate 123 is in the waiting position, the cleaning tank 121 has a notch, so that the drive member 112 can drive the cleaning mechanism 111 from the notch into the cleaning tank 121 to wait for cleaning.

[0031] For example, when the cover plate 123 is in the closed position, the spray cleaning component 122 cleans the cleaning mechanism 111. With the above configuration, when the cover plate 123 is in the closed position, the cleaning tank 121 is closed, thereby preventing the cleaning liquid from splashing out of the cleaning tank 121 when the cleaning mechanism 111 is cleaning in the cleaning tank 121, so as to avoid the cleaning liquid from polluting the surrounding environment.

[0032] In one embodiment, the second cleaning assembly 12 includes a swing member 124 connected to a cover plate 123, which can drive the cover plate 123 to move. With this configuration, the position of the cover plate 123 can be adjusted according to whether the cleaning mechanism 111 needs to enter the cleaning tank 121 for cleaning, thereby facilitating the normal operation of the second cleaning assembly 12.

[0033] For example, the connection between the cover plate 123 and the cleaning tank 121 can be a hinge connection, which facilitates the swing member 124 to drive the cover plate 123 to move to the waiting position or the closed position.

[0034] It should be noted that this application does not restrict the connection method between the swing member 124 and the cover plate 123, as long as the swing member 124 can drive the cover plate 123 to move.

[0035] like Figure 2 and Figure 3 As shown, in one embodiment, the second cleaning component 12 includes a turbidimeter 125 connected to the cleaning tank 121. The turbidimeter 125 is used to detect the cleaning fluid discharged from the cleaning tank 121. Since the cleaning tank 121 contains the cleaning fluid after the spray cleaning component 122 cleans the cleaning mechanism 111, the turbidimeter 125 can detect the turbidity of the cleaning fluid through the above-mentioned setup, thereby determining whether the first cleaning component 11 is clean. If the turbidity of the cleaning fluid detected by the turbidimeter 125 is greater than the standard value, it is determined that the cleaning mechanism 111 has not been cleaned. The second cleaning component 12 repeats the cleaning of the cleaning mechanism 111 until the turbidity of the cleaning fluid detected is less than the standard value. If the turbidity of the cleaning fluid detected by the turbidimeter 125 is less than the standard value, the drive component 112 is activated to drive the cleaning mechanism 111 away from the cleaning tank 121, thereby improving the accuracy of the spray cleaning component 122 in cleaning the cleaning mechanism 111 and improving the cleaning effect of the cleaning mechanism 111 on the wafer.

[0036] like Figure 4As shown, in one embodiment, the first cleaning assembly 11 includes a support member 113. The cleaning mechanism 111 includes an upper cleaning member 1111 and a lower cleaning member 1112. Both the upper cleaning member 1111 and the lower cleaning member 1112 are rotatably connected to the support member 113, and a cleaning gap 1113 for cleaning the wafer is formed between the upper cleaning member 1111 and the lower cleaning member 1112. With this arrangement, the wafer is placed in the cleaning gap 1113 for cleaning. In this application, the lower cleaning member 1112 is located below the upper cleaning member 1111, allowing both the upper and lower sides of the wafer to be cleaned, thereby improving the cleaning effect of the cleaning equipment 100 on the wafer.

[0037] For example, in this application, the upper cleaning component 1111 and the lower cleaning component 1112 can be cleaning sponges.

[0038] It should be noted that this application does not impose any restrictions on the actual materials of the upper cleaning component 1111 and the lower cleaning component 1112, as long as they meet the requirements for normal wafer cleaning.

[0039] like Figure 2 As shown, in one embodiment, two spray cleaning elements 122 are provided, which respectively clean the upper cleaning element 1111 and the lower cleaning element 1112. With the above arrangement, when the cleaning mechanism 111 performs cleaning, both the upper cleaning element 1111 and the lower cleaning element 1112 are cleaned by corresponding spray cleaning elements 122, so that the spray cleaning elements 122 can thoroughly clean the upper cleaning element 1111 and the lower cleaning element 1112, thereby reducing the content of contaminants in the upper cleaning element 1111 and the lower cleaning element 1112 after cleaning, and thus improving the wafer cleaning effect of the cleaning mechanism 111.

[0040] In this embodiment, the second cleaning assembly 12 further includes a separator 126, which divides the cleaning tank 121 into a first cleaning space 1211 and a second cleaning space 1212, with two spray cleaning elements 122 located in the first cleaning space 1211 and the second cleaning space 1212, respectively. Specifically, when the cleaning mechanism 111 is in the cleaning position, the upper cleaning element 1111 is located in the first cleaning space 1211, and the lower cleaning element 1112 is located in the second cleaning space 1212.

[0041] With the above configuration, the upper cleaning component 1111 and the lower cleaning component 1112 have independent and separate spaces within the cleaning tank 121 for cleaning. This ensures that the cleaning fluid generated during the cleaning process by the spray washing component 122 will not cause secondary pollution to the upper cleaning component 1111 or the lower cleaning component 1112, thereby improving the efficiency of the spray washing component 122 in cleaning the cleaning mechanism 111. Furthermore, if only the upper cleaning component 1111 or the lower cleaning component 1112 needs to be cleaned, the corresponding spray washing component 122 can be activated for cleaning, thereby reducing the cleaning cost of the cleaning mechanism 111 and improving the cleaning efficiency of the second cleaning component 12 in cleaning the cleaning mechanism 111.

[0042] like Figure 4 As shown, in one embodiment, the first cleaning assembly 11 includes a lifting member 114 and a rotating member 115. Both the lifting member 114 and the rotating member 115 are mounted on the support member 113. Two lifting members 114 are provided, and the two lifting members 114 respectively drive the upper cleaning member 1111 and the lower cleaning member 1112 to move up and down. With the above configuration, when cleaning the wafer, the upper cleaning member 1111 or the lower cleaning member 1112 makes full contact with the wafer surface under the control of the lifting member 114, thereby improving the cleaning effect of the upper cleaning member 1111 or the lower cleaning member 1112 on the wafer.

[0043] For example, in this application, each lifting component 114 may include a micro-electric cylinder, a guide rail, and a slider. The micro-electric cylinder is connected to the slider, and the slider is disposed on the guide rail. The upper cleaning component 1111 and the lower cleaning component 1112 are both disposed on the corresponding slider. With the above configuration, the micro-electric cylinder can control the slider to move on the guide rail, thereby driving the upper cleaning component 1111 or the lower cleaning component 1112 to move up and down, thus causing the upper cleaning component 1111 and the lower cleaning component 1112 to contact the wafer surface, thereby achieving cleaning of the wafer by the upper cleaning component 1111 and the lower cleaning component 1112. In this application, the movement of the upper cleaning component 1111 and the lower cleaning component 1112 is controlled by the micro-electric cylinder through lifting and lowering movement.

[0044] It should be noted that this application does not impose any restrictions on the specific structure and movement method of the lifting component 114, as long as the normal operation of the upper cleaning component 1111 and the lower cleaning component 1112 is met.

[0045] Specifically, two rotating components 115 are provided, which respectively drive the upper cleaning component 1111 and the lower cleaning component 1112 to rotate. Through this arrangement, the upper cleaning component 1111 or the lower cleaning component 1112 rotates under the control of the corresponding rotating component 115, allowing the upper cleaning component 1111 or the lower cleaning component 1112 to thoroughly clean the wafer surface, thereby improving the cleaning effect of the cleaning mechanism 111 on the wafer.

[0046] For example, in this application, the rotating component 115 can be a stepper motor, and both the upper cleaning component 1111 and the lower cleaning component 1112 are connected to a stepper motor. The upper cleaning component 1111 and the lower cleaning component 1112 are rotated by the stepper motor, thereby cleaning the wafer.

[0047] It should be noted that this application does not limit the specific structure of the rotating part 115, as long as the normal operation of the upper cleaning part 1111 and the lower cleaning part 1112 is met.

[0048] like Figure 1 and Figure 3 As shown, in one embodiment, the cleaning device 100 includes a base 13, a second cleaning component 12, and a drive member 112, all mounted on the base 13. The drive member 112 is connected to a support member 113 and drives the support member 113 to move. With this configuration, the drive member 112 moves the support member 113, allowing the cleaning mechanism 111 connected to the support member 113 to move to the second cleaning component 12 for cleaning, thereby removing contaminants from the cleaning mechanism 111.

[0049] For example, the driving component 112 may include a servo motor and a reducer. The servo motor controls the cleaning mechanism 111 to move into the cleaning tank 121, allowing the spraying component 122 to clean the upper cleaning component 1111 and the lower cleaning component 1112. Furthermore, the reducer can improve the movement accuracy of the servo motor, thereby improving the precision of the servo motor in controlling the upper cleaning component 1111 or the lower cleaning component 1112 to move into the cleaning tank 121, thus avoiding interference between the upper cleaning component 1111 or the lower cleaning component 1112 and the cleaning tank 121. In this application, the servo motor controls the movement of the upper cleaning component 1111 and the lower cleaning component 1112 in a rotational manner.

[0050] It should be noted that this application does not limit the specific structure and movement method of the driving component 112, as long as it can drive the cleaning mechanism 111 to move into the cleaning tank 121.

[0051] In one embodiment, the cleaning device 100 also includes a shield 14, which is mounted on the base 13 and has a receiving space inside. The first cleaning component 11 and the second cleaning component 12 are both located in the receiving space.

[0052] With the above settings, when the first cleaning component 11 cleans the wafer or moves to the second cleaning component 12 to remove contaminants, both the first cleaning component 11 and the second cleaning component 12 are in the enclosed space of the shield 14, so that the contaminants splashed out by the first cleaning component 11 or the second cleaning component 12 during operation will not pollute the external environment, thereby improving the cleanliness of the cleaning equipment 100 during operation.

[0053] Meanwhile, the shield 14 can also prevent the external environment from interfering with the operation of the first cleaning component 11 or the second cleaning component 12, thereby improving the stability of the cleaning equipment 100. In this application, the shield 14 has an opening on its side, and a sealing plate 141 is provided at the opening. The sealing plate 141 can be disassembled to facilitate maintenance of the first cleaning component 11 and the second cleaning component 12 inside the shield 14.

[0054] like Figure 1 As shown, in one embodiment, the cleaning device 100 includes a support assembly 15, wherein the support assembly 15 includes a first support member 151, a second support member 152, and a plurality of rotating members 153, and the support assembly 15 is used to support a wafer. At least one of the first support member 151 and the second support member 152 has a degree of freedom of movement, so that the distance between the first support member 151 and the second support member 152 is adjustable, and a support space for supporting the wafer is formed between the first support member 151 and the second support member 152.

[0055] By setting the wafer within the support space as described above, its position can be fixed, preventing it from detaching from the support assembly 15 during cleaning and thus improving the stability of the cleaning equipment 100. Simultaneously, the distance between the first support member 151 and the second support member 152 is adjustable, allowing for adjustment of the support space size. This enables the first support member 151 and the second support member 152 to hold wafers of different sizes, thereby improving the adaptability of the cleaning equipment 100.

[0056] For example, at least one of the first support member 151 and the second support member 152 is connected to a driving device, which can be a micro-cylinder. The micro-cylinder drives the first support member 151 and the second support member 152 to move, thereby adjusting the distance between the first support member 151 and the second support member 152, so that the first support member 151 and the second support member 152 can clamp wafers of different sizes, thereby improving the adaptability of the cleaning equipment 100.

[0057] It should be noted that this application does not impose any restrictions on the structure of the drive device, as long as it can drive the first support member 151 and the second support member 152 to move.

[0058] Specifically, multiple rotating components 153 are rotatably connected to the first support 151 and the second support 152. The rotating components 153 have rotational freedom and can contact the wafer and drive the wafer to rotate.

[0059] With the above configuration, the wafer can rotate under the drive of the rotating component 153 during cleaning by the cleaning mechanism 111, thereby increasing the cleaning area of ​​the cleaning mechanism 111 and improving its cleaning effect. Simultaneously, the wafer's rotation during cleaning by the cleaning mechanism 111 prevents the cleaning mechanism 111 from continuously cleaning the same position on the wafer, thus avoiding excessive local stress concentration and preventing damage to the wafer during the cleaning process.

[0060] More specifically, the driving member 112 can drive the cleaning mechanism 111 to the working position. When the cleaning mechanism 111 is in the working position, it is located between the first support member 151 and the second support member 152, and the driving member 112 can drive the cleaning mechanism 111 to swing. Through this arrangement, the cleaning mechanism 111 can clean both the center and edge areas of the wafer during the wafer cleaning process, thereby increasing the coverage area of ​​the cleaning mechanism 111 when cleaning the wafer and improving the cleaning effect of the cleaning equipment 100 when cleaning the wafer.

[0061] In this application, the cleaning equipment 100 also includes a rinsing component 16, which is at least disposed on one side of the cleaning mechanism 111. When the cleaning mechanism 111 is cleaning the wafer, the rinsing component 16 sprays cleaning fluid onto the wafer, thereby assisting the cleaning mechanism 111 in cleaning the wafer and improving the cleaning effect of the cleaning equipment 100 on the wafer.

[0062] In actual operation: After starting the cleaning equipment 100, the wafer is placed between the first support 151 and the second support 152, ensuring that the height of the wafer is consistent with the height of the first and second support 151 and the second support 152. Then, the micro-cylinder is activated to drive the first and second support 151 and the second support 152 to move, causing the rotating component 153 on the first and second support 151 and the second support 152 to contact the wafer. The feedback force on the first and second support 151 and the second support 152 is detected until the feedback force reaches a set threshold, at which point the micro-cylinder stops moving. After the micro-cylinder stops moving, it locks to fix the first and second support 151 and the second support 152 in their current positions. After the micro-cylinder locks, the rotating component 153 is activated to rotate the wafer.

[0063] Then, the lifting component 114 controls the upper cleaning component 1111 and the lower cleaning component 1112 to rise and fall, so that the wafer is in the cleaning gap 1113. Then, the rotating component 115 drives the upper cleaning component 1111 and the lower cleaning component 1112 to rotate. After contacting the wafer, the upper cleaning component 1111 and the lower cleaning component 1112 swing under the control of the driving component 112 to clean the wafer. When there are too many contaminants on the upper cleaning component 1111 or the lower cleaning component 1112, and the upper cleaning component 1111 or the lower cleaning component 1112 cannot effectively clean the wafer, the swing component 124 controls the cover plate 123 to move to the waiting position, the driving component 112 controls the upper cleaning component 1111 to move to the first cleaning space 1211, and controls the lower cleaning component 1112 to move to the second cleaning space 1212. Then, the swing component 124 controls the cover plate 123 to move to the closed position.

[0064] The spray unit 122 in the first cleaning space 1211 is activated again to clean the upper cleaning unit 1111 once, and / or the spray unit 122 in the second cleaning space 1212 is activated to clean the lower cleaning unit 1112 once. After a single cleaning is completed, the turbidimeter 125 detects the cleaning fluid flowing out of the cleaning tank 121 and generates a detection result. If the turbidity of the cleaning fluid detected by the turbidimeter 125 is less than the standard value, it is determined that the upper cleaning unit 1111 and / or the lower cleaning unit 1112 have completed cleaning. The swing unit 124 controls the cover plate 123 to move to the waiting position, and the drive unit 112 controls the upper cleaning unit 1111 to leave the first cleaning space 1211 and controls the lower cleaning unit 1112 to leave the second cleaning space 1212. After the upper cleaning unit 1111 and the lower cleaning unit 1112 have completed cleaning, the wafer cleaning operation continues.

[0065] If the turbidity of the cleaning fluid detected by the turbidimeter 125 is greater than the standard value, it is determined that the contaminants on the upper cleaning component 1111 and / or the lower cleaning component 1112 have not been cleaned. Then, the spraying component 122 in the first cleaning space 1211 is controlled to clean the upper cleaning component 1111 once, and / or the spraying component 122 in the second cleaning space 1212 is started to clean the lower cleaning component 1112 once. The above steps are repeated until the turbidity of the cleaning fluid detected by the turbidimeter 125 is less than the standard value, and then the cleaning is stopped.

[0066] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A cleaning apparatus (100) for cleaning wafers, characterized in that, The cleaning equipment (100) includes: The first cleaning assembly (11) includes a cleaning mechanism (111) for cleaning wafers and a driving member (112) for driving the cleaning mechanism (111) to move. The second cleaning assembly (12) includes a cleaning tank (121) and a spraying element (122) for cleaning the cleaning mechanism (111), the spraying element (122) being at least partially located within the cleaning tank (121); The drive unit (112) can drive the cleaning mechanism (111) to the cleaning position. When the cleaning mechanism (111) is in the cleaning position, the cleaning mechanism (111) is at least partially located in the cleaning tank (121).

2. The cleaning equipment (100) according to claim 1, characterized in that, The second cleaning assembly (12) includes a cover plate (123) which is movably connected to the cleaning tank (121); The cover plate (123) includes a closed position that closes the cleaning tank (121) and a waiting position that opens the cleaning tank (121). When the cover plate (123) is in the waiting position, the driving member (112) drives the cleaning mechanism (111) to the cleaning position. When the cover plate (123) is in the closed position, the spraying member (122) cleans the cleaning mechanism (111).

3. The cleaning equipment (100) according to claim 2, characterized in that, The second cleaning assembly (12) includes a swing member (124) that drives the cover plate (123) to move, the swing member (124) being connected to the cover plate (123).

4. The cleaning equipment (100) according to any one of claims 1 to 3, characterized in that, The second cleaning component (12) includes a turbidimeter (125) connected to the cleaning tank (121) for detecting the cleaning liquid discharged from the cleaning tank (121).

5. The cleaning equipment (100) according to any one of claims 1 to 3, characterized in that, The cleaning mechanism (111) includes an upper cleaning component (1111) and a lower cleaning component (1112). The first cleaning assembly (11) includes a support component (113). The upper cleaning component (1111) and the lower cleaning component (1112) are rotatably connected to the support component (113). A cleaning gap (1113) for cleaning wafers is formed between the upper cleaning component (1111) and the lower cleaning component (1112).

6. The cleaning equipment (100) according to claim 5, characterized in that, There are two spray cleaning components (122), and the two spray cleaning components (122) respectively clean the upper cleaning component (1111) and the lower cleaning component (1112); The second cleaning assembly (12) further includes a separator (126) that divides the cleaning tank (121) into a first cleaning space (1211) and a second cleaning space (1212). The two spray cleaning components (122) are located in the first cleaning space (1211) and the second cleaning space (1212) respectively. When the cleaning mechanism (111) is in the cleaning position, the upper cleaning component (1111) is located in the first cleaning space (1211) and the lower cleaning component (1112) is located in the second cleaning space (1212).

7. The cleaning equipment (100) according to claim 5, characterized in that, The first cleaning assembly (11) includes a lifting component (114) and a rotating component (115). Both the lifting component (114) and the rotating component (115) are mounted on the support component (113). There are two lifting components (114), which drive the upper cleaning component (1111) and the lower cleaning component (1112) to move up and down respectively. There are two rotating components (115), which drive the upper cleaning component (1111) and the lower cleaning component (1112) to rotate respectively.

8. The cleaning equipment (100) according to claim 5, characterized in that, The cleaning device (100) includes a base (13), the second cleaning component (12) and the drive component (112) are both mounted on the base (13), and the drive component (112) is connected to the support component (113) and drives the support component (113) to move.

9. The cleaning equipment (100) according to claim 8, characterized in that, The cleaning device (100) further includes a shield (14) which is mounted on the base (13) and has a receiving space inside. The first cleaning component (11) and the second cleaning component (12) are both located in the receiving space.

10. The cleaning equipment (100) according to any one of claims 1 to 3, characterized in that, The cleaning equipment (100) includes a support assembly (15) for supporting a wafer. The support assembly (15) includes a first support member (151) and a second support member (152). At least one of the first support member (151) and the second support member (152) has a degree of freedom of movement, such that the distance between the first support member (151) and the second support member (152) is adjustable. A support space for supporting the wafer is formed between the first support member (151) and the second support member (152). The support assembly (15) further includes a plurality of rotating parts (153) rotatably connected to the first support (151) and the second support (152). The rotating parts (153) have rotational freedom and can contact the wafer and drive the wafer to rotate. The drive member (112) can drive the cleaning mechanism (111) to the working position. When the cleaning mechanism (111) is in the working position, the cleaning mechanism (111) is located between the first support member and the second support member, and the drive member (112) can drive the cleaning mechanism (111) to swing.

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