Automobile load throwing test circuit based on X86 secondary power supply platform

Abstract

The utility model relates to an automobile load throwing test circuit based on an X86 secondary power supply platform, which comprises an ADC detection module, an MCU and an electronic fuse module, the MCU is also connected with a switch control module, the switch control module is connected with the electronic fuse module, the switch control module comprises an MOS tube Q12 and a resistor R583, the resistor R583 is connected with a resistor R592 and a triode Q28, and the triode Q28 is connected with the MOS tube Q12. The triode Q28 is connected with a resistor R583, the triode Q28 is connected with a resistor R616 and is connected with a grid electrode of the MOS tube Q12, a source electrode of the MOS tube Q12 is connected with a resistor R324 and is connected with the electronic fuse module, and the electronic fuse module is further connected with an overvoltage protection module. And an expensive X86 platform high-power primary DC-DC power supply chip is omitted.

Description

Technical Field

[0001] This utility model relates to the field of automotive test circuits, and more specifically, to an automotive load dump test circuit based on an X86 secondary power supply platform. Background Technology

[0002] With the rapid development of automotive electronics technology, the in-vehicle host platform, which was initially dominated by the ARM platform, has seen a shift in demand in the market due to the rapid improvement in computing power and intelligence. The demand for in-vehicle host platforms based on x86 has begun to emerge. In particular, in the past two years, Intel has launched automotive-grade CPUs and automotive-grade GPUs, making the automotive host market a promising prospect. Correspondingly, in terms of hardware design, the power supply of the x86 platform needs a circuit design solution that can pass automotive EMC tests, especially the ISO7637 test.

[0003] The power supply current of x86 is extremely demanding, and it is a multi-phase power supply with a core current of 66A, a graphics current of 35A, and even the AUX current reaches 19A. Since the standard automotive power supply is 14.4V, especially in the EMC ISO7637-2 load dump test, the continuous voltage reaches even higher than 35V. Currently, chip manufacturers cannot meet the requirements of automotive-grade Class 1 multi-phase power supplies with a current greater than 15A. It is necessary to add a high-power DC-DC regulator to 12V and then input it to the power chip as a Class 2 power supply to meet the experimental requirements. Utility Model Content

[0004] To address the aforementioned shortcomings of existing technologies, an automotive load dump test circuit based on an X86 secondary power supply platform is provided.

[0005] The technical solution adopted by this utility model to solve its technical problem is: an automotive load dump test circuit based on an X86 secondary power supply platform, including an ADC detection module, an MCU, and an electronic fuse module. The ADC detection module is connected to the MCU. The MCU is also connected to a switch control module that controls the switch of the electronic fuse module. The switch control module is connected to the electronic fuse module. The switch control module includes a MOSFET Q12 and a resistor R583 connected to the MCU. The resistor R583 is connected to a resistor R592 and a transistor Q28. The base of the transistor Q28 is connected to the resistor R583. The collector of the transistor Q28 is connected to a resistor R616 and is connected to the gate of the MOSFET Q12. The resistor R616 is connected to an external power supply. The drain of the MOSFET Q12 is grounded. The source of the MOSFET Q12 is connected to a resistor R324 and is connected to the electronic fuse module. The resistor R324 is connected to an external power supply. The electronic fuse module is also connected to an overvoltage protection module for quickly shutting down the electronic fuse module.

[0006] Preferably, the overvoltage protection module includes a transistor Q15 and a diode D19. The base of the transistor Q15 is connected to the anode of the diode D19, the cathode of the diode D19 is connected to a resistor R346 connected to an external power supply, and the collector of the transistor Q15 is connected to an electronic fuse module.

[0007] Preferably, the overvoltage protection module further includes a diode D32, the negative terminal of which is connected to the collector of transistor Q15 and the electronic fuse module, the positive terminal of which is grounded, and the positive terminal of diode D19 is also connected to a resistor array RP1, which is grounded.

[0008] Preferably, the collector of the transistor Q28 is also connected to a capacitor CP8, a diode D20, and a resistor R617, and the capacitor CP8, diode D20, and resistor R617 are all grounded.

[0009] Preferably, the ADC detection module includes a resistor R317 connected to an external power supply. The resistor R317 is connected to a resistor 362 and a capacitor PC267. Both the resistor 362 and the capacitor PC267 are grounded. The resistor R317 is also connected to the MCU.

[0010] Preferably, the resistor R317 is also connected to a diode D27, with the negative terminal of the diode D27 connected to the resistor R317 and the positive terminal of the diode D27 grounded.

[0011] Preferably, transistors Q28 and Q15 are both NPN transistors, and MOSFET Q12 is an N-type MOSFET.

[0012] The beneficial effects of this invention are as follows: When the MCU, in conjunction with the ADC detection module, detects a voltage greater than 16.5V, the experimental device enters standby mode. When the detected voltage is greater than 19.5V, the switch control module controls the electronic fuse module to close, thereby protecting the DC-DC power supply chip. When the detected voltage exceeds 23V, the overvoltage protection module directly and quickly closes the electronic fuse module. Through the MCU, ADC detection module, switch control module, and overvoltage protection module, high-voltage protection is achieved for the DC-IN power supply voltage, strictly limiting the input voltage to within the 23V threshold, ensuring that the X86 core secondary DC-DC power supply is within a safe voltage range. This circuit enables the application of the X86 core secondary DC-DC power supply chip to the primary power supply, eliminating the need for expensive high-power primary DC-DC power supply chips on the X86 platform, thus reducing costs. Attached Figure Description

[0013] Figure 1 This is an overall circuit diagram of an embodiment of the present invention.

[0014] Figure 2 This is a circuit diagram of the switch control module according to an embodiment of the present invention;

[0015] Figure 3 This is a circuit diagram of the overvoltage protection module according to an embodiment of this utility model;

[0016] Figure 4 This is a circuit diagram of the ADC detection module according to an embodiment of the present invention. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model. In addition, the directional terms mentioned in this utility model, such as "up," "down," "front," "back," "left," "right," "inner," and "outer," are only for reference to the directions in the accompanying drawings. The directional terms are used to better and more clearly explain and understand this utility model, and are not intended to indicate or imply the necessary orientation of this utility model. Therefore, they should not be construed as limitations on this utility model.

[0018] Examples of embodiments of this utility model Figures 1 to 4 As shown, an automotive load dump test circuit based on an x86 secondary power supply platform includes an ADC detection module, an MCU, and an electronic fuse module. The ADC detection module is connected to the MCU. The MCU is also connected to a switch control module that controls the switch of the electronic fuse module. The switch control module is connected to the electronic fuse module. The switch control module includes a MOSFET Q12 and a resistor R583 connected to the MCU. Resistor R583 is connected to resistor R592 and transistor Q28. The base of transistor Q28 is connected to resistor R583, and the collector of transistor Q28 is connected to resistor R616. The resistor R616 is connected to the gate of MOSFET Q12, and the drain of MOSFET Q12 is grounded. The source of MOSFET Q12 is connected to resistor R324 and connected to the electronic fuse module. Resistor R324 is connected to the external power supply. The MCU outputs a high or low level to control the conduction and disconnection of transistor Q28, thereby controlling the conduction and disconnection of MOSFET Q12, and then controlling the on / off of the external power supply to realize the switching of the electronic fuse module. The external power supply provides a voltage of 12V. The electronic fuse module is also connected to an overvoltage protection module for fast shutdown of the electronic fuse module.

[0019] When the MCU, in conjunction with the ADC detection module, detects a voltage greater than 16.5V, the experimental unit enters standby mode. When the detected voltage is greater than 19.5V, the switch control module controls the electronic fuse module to shut down, thereby protecting the DC-DC power supply chip. When the detected voltage exceeds 23V, the overvoltage protection module directly and quickly shuts down the electronic fuse module. Through the MCU, ADC detection module, switch control module, and overvoltage protection module, high-voltage protection is achieved for the DC-IN power supply voltage, strictly limiting the input voltage to within the 23V threshold, ensuring that the X86 core secondary DC-DC power supply remains within a safe voltage range. This circuit enables the application of the X86 core secondary DC-DC power supply chip to the primary power supply, eliminating the need for expensive high-power primary DC-DC power supply chips on the X86 platform and reducing costs.

[0020] Further improvements, such as Figure 1 and Figure 3 As shown, the overvoltage protection module includes a transistor Q15 and a diode D19. The base of the transistor Q15 is connected to the anode of the diode D19, and the cathode of the diode D19 is connected to a resistor R346 connected to an external power supply. The collector of the transistor Q15 is connected to an electronic fuse module. When the voltage exceeds 23V, the diode D19 breaks down and conducts, current flows through the resistor R346, the base voltage of the transistor Q15 rises to the conduction threshold, the transistor Q15 saturates and conducts, the enable terminal of the electronic fuse module is pulled low to ground potential, the electronic fuse module turns off, and the power output is cut off, thereby achieving high voltage protection for the DC-IN power supply voltage.

[0021] Further improvements, such as Figure 1 and Figure 3 As shown, the overvoltage protection module also includes a diode D32. The negative terminal of the diode D32 is connected to the collector of the transistor Q15 and the electronic fuse module. The positive terminal of the diode D32 is grounded. The positive terminal of the diode D19 is also connected to a resistor array RP1, which is grounded. The diode D32 is connected in reverse parallel between the enable terminal of the electronic fuse module and ground to absorb voltage spikes and prevent damage to the transistor Q15 or the electronic fuse module.

[0022] Further improvements, such as Figure 1 and Figure 3As shown, the collector of the transistor Q28 is also connected to a capacitor CP8, a diode D20, and a resistor R617. The capacitor CP8, diode D20, and resistor R617 are all grounded. The capacitor CP8 is connected in parallel between the external power supply with a 12V output voltage and ground to filter out high-frequency noise and transient interference, ensuring the stability of the circuit. When the voltage is too high, the diode D20 is broken down and conducts, allowing current to flow to ground through the resistor R617, triggering the protection action.

[0023] Further improvements, such as Figure 1 and Figure 3 As shown, the ADC detection module includes a resistor R317 connected to an external power supply. The resistor R317 is connected to a resistor 362 and a capacitor PC267. Both the resistor 362 and the capacitor PC267 are grounded. The resistor R317 is also connected to the MCU. The resistors R317 and 362 divide the 12V voltage of the external power supply into a 1.2V voltage. The capacitor PC267 suppresses high-frequency noise and ensures stable ADC sampling.

[0024] Further improvements, such as Figure 1 and Figure 3 As shown, the resistor R317 is also connected to the diode D27. The negative terminal of the diode D27 is connected to the resistor R317, and the positive terminal of the diode D27 is grounded. The diode D27 is used to limit the ADC input voltage to no more than 5.1V and protect the pins of the MCU.

[0025] Further improvements, such as Figure 1 and Figure 3 As shown, transistors Q28 and Q15 are both NPN transistors, and MOSFET Q12 is an N-type MOSFET.

[0026] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A vehicle load dump test circuit based on an X86 two-level power supply platform, characterized in that, The system includes an ADC detection module, an MCU, and an electronic fuse module. The ADC detection module is connected to the MCU. The MCU is also connected to a switch control module that controls the switching of the electronic fuse module. The switch control module is connected to the electronic fuse module. The switch control module includes a MOSFET Q12 and a resistor R583 connected to the MCU. Resistor R583 is connected to resistor R592 and transistor Q28. The base of transistor Q28 is connected to resistor R583. The collector of transistor Q28 is connected to resistor R616 and is connected to the gate of MOSFET Q12. Resistor R616 is connected to an external power supply. The drain of MOSFET Q12 is grounded. The source of MOSFET Q12 is connected to resistor R324 and is connected to the electronic fuse module. Resistor R324 is connected to an external power supply. The electronic fuse module is also connected to an overvoltage protection module for fast-closing the electronic fuse module.

2. The automotive load dump test circuit based on an X86 secondary power supply platform according to claim 1, characterized in that, The overvoltage protection module includes a transistor Q15 and a diode D19; the base of the transistor Q15 is connected to the anode of the diode D19; the cathode of the diode D19 is connected to a resistor R346 connected to an external power supply; and the collector of the transistor Q15 is connected to an electronic fuse module.

3. The automotive load dump test circuit based on an X86 secondary power supply platform according to claim 2, characterized in that, The overvoltage protection module also includes a diode D32; the negative terminal of the diode D32 is connected to the collector of the transistor Q15 and the electronic fuse module; the positive terminal of the diode D32 is grounded; the positive terminal of the diode D19 is also connected to a resistor array RP1; the resistor array RP1 is grounded.

4. The automotive load dump test circuit based on an X86 secondary power supply platform according to claim 1, characterized in that, The collector of the transistor Q28 is also connected to a capacitor CP8, a diode D20, and a resistor R617; the capacitor CP8, diode D20, and resistor R617 are all grounded.

5. The automotive load dump test circuit based on an X86 secondary power supply platform according to claim 1, characterized in that, The ADC detection module includes a resistor R317 connected to an external power supply; the resistor R317 is connected to a resistor 362 and a capacitor PC267; both the resistor 362 and the capacitor PC267 are grounded; the resistor R317 is also connected to the MCU.

6. The automotive load dump test circuit based on an X86 secondary power supply platform according to claim 5, characterized in that, The resistor R317 is also connected to a diode D27; the negative terminal of the diode D27 is connected to the resistor R317; the positive terminal of the diode D27 is grounded.

7. The automotive load dump test circuit based on an X86 secondary power supply platform according to claim 2, characterized in that, Both transistors Q28 and Q15 are NPN transistors; the MOSFET Q12 is an N-type MOSFET.

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