Wafer moving device of semiconductor process equipment and process semiconductor equipment

Abstract

The utility model belongs to the technical field of semiconductor processing, and discloses a wafer moving device of semiconductor processing equipment and the semiconductor processing equipment. The wafer moving device comprises a wafer fixing piece and a turnover assembly. The wafer fixing piece is configured to bear and fix a wafer substrate; and the overturning assembly is connected with the wafer fixing piece and is configured to drive the wafer fixing piece and the wafer substrate fixed by the wafer fixing piece to overturn after receiving an overturning instruction, so that the to-be-processed surface of the wafer is horizontally upward or horizontally downward after being overturned. Therefore, when the wafer moving device is used, the to-be-processed surface of the wafer can be overturned by overturning the wafer fixing piece, clamping, carrying and complex path planning do not need to be carried out on the wafer substrate, the other surface of the wafer substrate can be exposed timely, quickly and safely, the whole operation process is simplified, time is saved, and the working efficiency is improved. And meanwhile, the possibility that the wafer substrate is polluted or damaged can be reduced, and the final processing quality and the product yield are effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer moving device and process semiconductor equipment for semiconductor processes. Background Technology

[0002] In semiconductor manufacturing, coating is a critical step that plays a vital role in the final performance of chips. Coating technology can endow wafers with specific optical, electrical, or mechanical properties, such as enhancing their conductivity, insulation, reflectivity, or corrosion resistance, to meet the needs of different types of chips in various complex application scenarios.

[0003] In existing technologies, common wafer moving devices for double-sided wafer coating are primarily designed based on traditional step-by-step operation modes. This structure typically includes a dedicated clamping device for securing the wafer. The wafer is first placed face-up on the clamp, and specific fixing mechanisms, such as vacuum adsorption or mechanical clamping, ensure its stability during the coating process. The coating source then performs precise coating operations on the front side of the wafer according to preset parameters. After front-side coating is complete, the clamping device releases its grip on the wafer, allowing it to move freely. Subsequently, a robotic arm or other flipping component intervenes to remove the wafer from its current position, flips it 180 degrees so the back side is facing up, and then places it back onto the clamp for fixation. Finally, the back side of the wafer is coated.

[0004] However, when the wafer needs to be released and re-secured during the flipping process, this process is not only affected by factors such as mechanical response speed and sensor detection accuracy, but also requires precise planning of the movement trajectory of the robotic arm or flipping assembly to avoid collisions with other parts of the equipment. Furthermore, the wafer's position needs to be readjusted after flipping to ensure it is accurately placed on the fixture. These operations make the entire process cumbersome and time-consuming. In addition, multiple wafer clamping and flipping operations increase the risk of contamination or damage to the wafer surface, potentially affecting the final coating quality and product yield. Utility Model Content

[0005] The purpose of this invention is to provide a wafer moving device and a semiconductor process equipment, which solves the problem that in the prior art, wafer double-sided processing requires the wafer to be gripped and positioned again when flipping the wafer, resulting in a cumbersome and time-consuming flipping process. It also solves the risk that the wafer is easily contaminated or damaged during the flipping process.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, this utility model provides a wafer moving device for semiconductor process equipment, comprising:

[0008] Wafer holders are configured to receive and hold wafer substrates.

[0009] The flipping component, connected to the wafer holder, is configured to, upon receiving a flipping command, drive the wafer holder and the wafer substrate it holds to flip, so that the surface of the wafer substrate to be processed is flipped so that it is horizontally upward or horizontally downward.

[0010] Optionally, the wafer holder has a snap-fit ​​groove on its side; the flipping assembly includes:

[0011] The flipping part is partially engaged in the locking ring groove and slidably connected to the locking ring groove;

[0012] A flipping drive is connected to the flipping part to drive the flipping part to flip.

[0013] Optionally, the flipping part has a protrusion and a fixing block connected to the protrusion. The connection between the protrusion and the fixing block forms recessed areas on both sides, so that the cross-section of the protrusion is trapezoidal and the cross-section of the fixing block is square.

[0014] The shape of the snap-fit ​​groove matches the shape of the protrusion, so that the protrusion can be snapped into the snap-fit ​​groove, and in the snap-fit ​​state, the wafer holder can rotate around the protrusion through the snap-fit ​​groove.

[0015] Optionally, it also includes:

[0016] A rotating component is configured to be drive-connected to the wafer holder to drive the wafer holder and the wafer substrate thereon to rotate.

[0017] Optionally, a driven gear is provided on the outside of the wafer holder;

[0018] The rotating component includes:

[0019] Rotary drive component;

[0020] A drive gear is disposed at the output end of the rotary drive member, and the drive gear can mesh with the driven gear. It is configured to drive the driven gear to rotate the wafer holder and the wafer substrate it is fixed to.

[0021] Optionally, it also includes:

[0022] A translation device, connected to the flipping assembly and / or the rotating assembly, is configured to move the wafer holder and the rotating assembly closer together to form a drive connection or further apart so that the flipping assembly moves the wafer holder and its fixed wafer substrate to flip.

[0023] Optionally, the translation device includes:

[0024] A first translation component is connected to the flipping component, and the first translation component is configured to move the wafer holder closer to or away from the rotating component by moving the flipping component.

[0025] Optionally, the translation device includes:

[0026] A second translation component is connected to the rotation component, and the second translation component is configured to move the rotation component closer to or away from the wafer fixture.

[0027] Optionally, the translation device includes:

[0028] The connecting part is connected at one end to the flipping component or the rotating component;

[0029] The drive screw is threadedly connected to the other end of the connecting part;

[0030] A translational drive unit is connected to the drive screw, and the translational drive unit is configured to drive the drive screw to rotate so as to drive the connecting part to reciprocate along the axial direction of the drive screw.

[0031] Secondly, this utility model also provides a semiconductor manufacturing apparatus, comprising:

[0032] Processing chamber;

[0033] The wafer moving device of the semiconductor process apparatus as described in any of the first aspects, wherein part or all of the wafer moving device is disposed within the processing chamber.

[0034] The beneficial effects of this utility model are:

[0035] Firstly, during wafer substrate processing, the wafer substrate is fixed to a wafer holder with the surface to be processed exposed for corresponding processing operations. When the other side of the wafer substrate needs to be processed, a flip command is generated to activate the flip assembly. The flip assembly rotates the wafer holder and the wafer substrate 180°, exposing the other side of the wafer substrate for corresponding processing operations. These operations can be cleaning and wetting of the wafer substrate surface, or coating of the wafer substrate. Therefore, when using the wafer moving device of this semiconductor process equipment, the surface to be processed of the wafer can be flipped by flipping the wafer holder, eliminating the need for clamping, handling, and complex path planning of the wafer substrate. This allows for timely, rapid, and safe exposure of the other side of the wafer substrate, simplifying the entire operation process, saving time, and reducing the possibility of contamination or damage to the wafer substrate, effectively improving the quality of the final processing and the yield of the product.

[0036] Secondly, when the semiconductor equipment used in this process is used to process wafer substrates, it can directly flip the wafer substrates using the wafer moving device of the semiconductor process equipment. This eliminates the need for clamping and handling of the wafer substrates, effectively simplifying the operation process, saving time, and also effectively avoiding the possibility of contamination or damage to the wafer substrates. This is beneficial to improving the final quality of wafer processing and product yield. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the structure of the wafer fixing component, the flipping component, and the translation device of the wafer moving device of the semiconductor process equipment in this embodiment of the present invention;

[0038] Figure 2 This is a schematic diagram of the structure of the wafer fixing component and the flipping component of the wafer moving device of the semiconductor process equipment in this embodiment of the present invention;

[0039] Figure 3 This is a schematic diagram of the structure of the flipping component of the wafer moving device of the semiconductor process equipment in this embodiment of the present invention;

[0040] Figure 4 This is a schematic diagram of the structure of the wafer fixing component and translation device of the wafer moving device of the semiconductor process equipment in this embodiment of the present invention.

[0041] In the picture:

[0042] 1. Wafer fixing component; 11. Snap-fit ​​ring groove; 13. Driven gear; 2. Flip assembly; 21. Flipping part; 211. Fixing block; 212. Protrusion; 22. Flipping drive component; 3. Rotation assembly; 31. Rotation drive component; 32. Drive gear; 4. Translation device; 41. First translation assembly; 42. Second translation assembly; 43. Translation drive component; 44. Drive screw; 45. Connecting part. Detailed Implementation

[0043] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0044] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0045] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0046] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0047] This utility model discloses a wafer moving device and a semiconductor process equipment.

[0048] Reference Figures 1 to 4 The wafer moving device of the semiconductor process equipment includes a wafer fixing component 1 and a flipping component 2. The wafer fixing component 1 is configured to receive and fix the wafer substrate; the flipping component 2 is connected to the wafer fixing component 1 and is configured to, upon receiving a flipping command, drive the wafer fixing component 1 and the wafer substrate it fixes to flip, so that the surface of the wafer to be processed is flipped so that it is horizontally upward or horizontally downward.

[0049] Specifically, the wafer holder 1 is shape-adapted to the wafer substrate, and it can fix the wafer substrate by means of adsorption or snap-fit. The wafer holder 1 can be mounted in a corresponding cavity via a rotating structure, and it can rotate 180° to rotate the wafer substrate, allowing the surface of the wafer substrate to be processed to undergo different processes, including coating and cleaning, within the cavity. The flipping assembly 2 is connected to one side of the wafer holder 1, and the flipping assembly 2 has a driving element that can receive flipping commands from the control module and start according to the flipping commands to rotate the wafer holder 1 180°. The flipping commands can be manually input by the operator or automatically generated according to the actual wafer substrate processing flow; this invention does not limit this.

[0050] During wafer substrate processing, the wafer substrate is fixed on wafer holder 1 with the surface to be processed exposed for corresponding processing operations. When the other side of the wafer substrate needs to be processed, a flip command is generated to activate flip assembly 2. Flip assembly 2 rotates wafer holder 1 and the wafer substrate 180°, exposing the other side of the wafer substrate for corresponding processing operations. The processing operations can be cleaning and wetting of the wafer substrate surface or coating of the wafer substrate. Therefore, when using the wafer moving device of this semiconductor process equipment, the surface to be processed of the wafer can be flipped by flipping wafer holder 1, eliminating the need for clamping, handling, and complex path planning of the wafer substrate. It can expose the other side of the wafer substrate in a timely, fast, and safe manner, simplifying the entire operation process, saving time, and reducing the possibility of wafer substrate contamination or damage, effectively improving the quality of the final processing and the yield of the product.

[0051] Optionally, the wafer holder 1 has a snap-fit ​​groove 11 on its side; the flip assembly 2 includes a flip part 21 and a flip drive 22. The flip part 21 is partially snapped into the snap-fit ​​groove 11 and slidably connected to the snap-fit ​​groove 11; the flip drive 22 is connected to the flip part 21 to drive the flip part 21 to flip.

[0052] Specifically, the flipping drive component 22 can be a separate component or fixed to the side wall of the corresponding chamber. It can be a motor with a drive shaft on its motor shaft. The flipping part 21 is fixed to the end of the drive shaft away from the motor. The flipping part 21 and the drive shaft can be an integral structure or fixed by welding, bonding, snap-fitting, or screws. The flipping part 21 is block-shaped, corresponding to the snap-fit ​​groove 11, and a portion of the flipping part 21 extends into the snap-fit ​​groove 11. The extended portion can snap-fit ​​and fix with the snap-fit ​​groove 11, forming a sliding fit. This snap-fit ​​fixation ensures that when the surface to be processed is horizontally downward, the flipping part 21 can hold the wafer fixing component 1, ensuring that the wafer fixing component 1 and its fixed wafer substrate will not fall off. It should be understood that the flipping drive component 22 can also use other components, such as an electric cylinder. The connection between the flipping drive component 22 and the flipping part 21 can be designed according to the actual installation space and transmission requirements; this utility model does not impose any limitations.

[0053] To improve the installation stability of the wafer fixture 1, a flipping part 21 can be provided on each of the opposite sides of the wafer fixture 1. A flipping drive 22 is provided for each flipping part 21, and the other flipping part 21 can be rotatably connected to the inner sidewall through a rotating shaft.

[0054] By setting up the flipping part 21 and the flipping drive 22, when it is necessary to flip the wafer fixture 1, the flipping drive 22 is activated, and the flipping drive 22 drives the flipping part 21 to flip. The flipping part 21 squeezes the locking ring groove 11, thereby driving the wafer fixture 1 to flip. When the wafer fixture 1 rotates, the groove sidewall of the locking ring groove 11 slides with the flipping part 21. At the same time, the flipping part 21 remains stationary to ensure that the rotation speed of the wafer fixture 1 during the rotation process can be freely controlled and kept stable.

[0055] Optionally, the flipping part 21 has a protrusion 212 and a fixing block 211 connected to the protrusion 212. The connection between the protrusion 212 and the fixing block 211 forms recessed areas on both sides, so that the cross-section of the protrusion 212 is trapezoidal and the cross-section of the fixing block 211 is square.

[0056] The shape of the snap ring groove 11 matches the shape of the protrusion 212, so that the protrusion 212 can be snapped into the snap ring groove 11. In the snapped state, the wafer holder 1 can rotate around the protrusion 212 through the snap ring groove 11.

[0057] Specifically, the flipping portion 21 extends circumferentially along the wafer fixing member 1. A protrusion 212 is formed on the side of the flipping portion 21 near the wafer fixing member 1. The protrusion 212 has a smaller width on the side near the fixing block 211 and a larger width on the other side, so that its cross-section is trapezoidal. The fixing block 211 has a square cross-section. The sidewalls of the locking ring groove 11 are all inclined to form a trapezoidal cross-section, which fits with the protrusion 212 to form a locking engagement. The sidewall of the protrusion 212 slides in contact with the sidewall of the locking ring groove 11. To reduce friction, a smooth structure such as a lubricating film can be provided on the side of the protrusion 212 or the sidewall of the locking ring groove 11, so that the two will not wear during sliding, and at the same time, the protrusion 212 and the locking ring groove 11 can form a tight fit to prevent the wafer fixing member 1 from shaking.

[0058] By providing a protrusion 212 on the fixing block 211, the protrusion 212 and the snap-fit ​​groove 11 form a snap-fit ​​engagement to achieve smooth snap-fit ​​and fixation of the flipping part 21 with the wafer fixing member 1. The snap-fit ​​groove 11 and the protrusion 212 form a sliding engagement, so that when the wafer fixing member 1 rotates, the snap-fit ​​groove 11 and the protrusion 212 slide relative to each other.

[0059] Optionally, the wafer moving device of the semiconductor process equipment further includes a rotating component 3. The rotating component 3 is configured to be drive-connected to the wafer holder 1 to drive the wafer holder 1 and the wafer substrate thereon to rotate.

[0060] Specifically, the rotating component 3 can be installed either inside or outside the cavity. The rotating component 3 can be driven by a motor and, in conjunction with a gear set or rack and pinion transmission structure, form a transmission connection with the wafer holder 1. To allow sufficient space for the flipping of the wafer holder 1, the rotating component 3 and the wafer holder 1 can be spaced far apart, moving closer together only when a transmission connection is needed. Specifically, the rotating component 3 and the wafer holder 1 can be distributed vertically or horizontally. One of them can be fixed while the other moves vertically, or they can be moved synchronously to move closer or further apart.

[0061] By setting up the rotating component 3, during the processing of the wafer substrate, the rotating component 3 can maintain a transmission connection with the wafer fixing component 1 to drive the wafer fixing component 1 to rotate the wafer substrate. The rotation speed is remotely controlled by a corresponding control module to smoothly complete the corresponding processing operation. In the coating process, to ensure the uniformity of the coating, the wafer substrate needs to be kept in a rotating state to form a uniform film thickness on the surface of the wafer substrate, thus ensuring the uniformity of the coating. In the cleaning process, to ensure the cleaning effect, the wafer substrate needs to be rotated so that impurities can be washed away from the surface of the wafer substrate, ensuring the cleaning effect. Therefore, the rotation of the wafer substrate is an indispensable and important step in the above processes or other processes.

[0062] Optionally, a driven gear 13 is provided on the outside of the wafer holder 1; the rotating assembly 3 includes a rotating drive 31 and a drive gear 32. The drive gear 32 is located at the output end of the rotating drive 31, and the drive gear 32 can mesh with the driven gear 13, and is configured to drive the driven gear 13 to work to drive the wafer holder 1 and the wafer substrate fixed thereto to rotate.

[0063] Specifically, the rotary drive component 31 can be a motor, which is fixed to a corresponding support structure. The motor shaft has a rotating shaft, and a drive gear 32 is provided at the end of the rotating shaft near the wafer fixture 1. A driven gear 13 is externally provided on the wafer fixture 1. The two can be integrated as one piece, or they can be fixedly connected by bonding or welding. The driven gear 13 meshes with the drive gear 32, so that when the rotary drive component 31 drives the drive gear 32 to rotate, it can smoothly drive the wafer fixture 1 to rotate. It should be understood that the rotary drive component 31 can also use a drive component such as an electric cylinder to drive the drive gear 32 to rotate. The specific type of rotary drive component 31 can be selected according to the actual driving requirements, and this utility model does not limit it in this regard.

[0064] Optionally, the wafer moving device of the semiconductor process equipment further includes a translation device 4. The translation device 4 is connected to the flipping component 2 and / or the rotating component 3, and the translation device 4 is configured to move the wafer holder 1 and the rotating component 3 closer to each other to form a transmission connection or move them away from each other so that the flipping component 2 drives the wafer holder 1 and the wafer substrate fixed thereto to flip.

[0065] Specifically, the translation device 4 is fixed below the wafer holder 1. It can be connected to only one of the flipping component 2 or the rotating component 3, while the other is fixed in the cavity. Alternatively, it can be connected to both simultaneously so that both can be translated to move closer to or further away from each other.

[0066] When the wafer holder 1 needs to be rotated, the translation device 4 moves the flipping component 2 and the rotating component 3 closer together, so that the wafer holder 1 and the rotating component 3 form a transmission connection, and the rotating component 3 can then drive the wafer holder 1 to rotate. When the wafer holder 1 needs to be flipped, in order to leave enough space, the translation device 4 moves the flipping component 2 and the rotating component 3 to separate from each other, so that the wafer holder 1 can be detached from the rotating component 3, thereby achieving unobstructed flipping of the wafer holder 1.

[0067] Optionally, the translation device 4 includes a first translation component 41. The first translation component 41 is connected to the flipping component 2 and is configured to move the wafer holder 1 closer to or away from the rotating component 3 by moving the flipping component 2.

[0068] Specifically, the first translation component 41 can use a motor as the driving element and a lead screw as the transmission structure. The flipping component 2 is connected to the lead screw, which drives the flipping component 2 to slide back and forth along the extension direction of the lead screw. In other embodiments, the first translation component 41 can also use a cylinder as the driving element and a chain or similar structure for transmission. This utility model does not limit this to any particular embodiment.

[0069] Optionally, the translation device 4 includes a second translation component 42. The second translation component 42 is connected to the rotation component 3 and is configured to move the rotation component 3 closer to or away from the wafer holder 1.

[0070] Specifically, the second translation component 42 has the same structure as the first translation component 41, and will not be described in detail here. It should be understood that only one of the first translation component 41 and the second translation component 42 can be provided, or both can be provided simultaneously. The specific choice can be made according to the actual installation space, and this utility model does not impose any limitations.

[0071] Optionally, the translation device 4 includes a connecting part 45, a drive screw 44, and a translation drive member 43. One end of the connecting part 45 is connected to the flipping assembly 2 or the rotating assembly 3; the drive screw 44 is threadedly connected to the other end of the connecting part 45; the translation drive member 43 is connected to the drive screw 44, and the translation drive member 43 is configured to drive the drive screw 44 to rotate so as to drive the connecting part 45 to reciprocate along the axial direction of the drive screw 44.

[0072] Specifically, the translation drive 43 is a motor, which is fixed on the side wall of the chamber. The output end of the translation drive 43 is fixedly connected to one end of the drive screw 44. The drive screw 44 extends toward the direction of the rotating component 3 or the wafer fixing component 1. The connecting part 45 is long and extends vertically. Its lower end is threaded to the drive screw 44, and its upper end is fixedly connected to the flipping component 2 or the rotating component 3. The shape of the connecting part 45 can be designed according to the size and weight of the flipping component 2 and the rotating component 3. This utility model does not limit it.

[0073] When it is necessary to separate or move closer to the wafer fixture 1 and the rotating assembly 3, the translation drive 43 is activated. The translation drive 43 drives the drive screw 44 to rotate, which in turn drives the connecting part 45 to slide back and forth, thereby enabling the wafer fixture 1 and the rotating assembly 3 to move closer or further apart from each other.

[0074] This embodiment provides a semiconductor process apparatus, which includes a processing chamber and the aforementioned wafer moving device. All or part of the wafer moving device of the semiconductor process apparatus is disposed within the processing chamber.

[0075] When this semiconductor equipment is used to process wafer substrates, it can directly flip the wafer substrate using the wafer moving device of the semiconductor process equipment. This eliminates the need for clamping and handling of the wafer substrate, effectively simplifying the operation process, saving time, and also effectively avoiding the possibility of contamination or damage to the wafer substrate. This is beneficial to improving the final quality of wafer substrate processing and product yield.

[0076] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer moving device for semiconductor process equipment, characterized in that, include: A wafer holder (1) is configured to receive and hold a wafer substrate; The flipping component (2), connected to the wafer fixing member (1), is configured to, upon receiving a flipping command, drive the wafer fixing member (1) and the wafer substrate it fixes to flip, so that the surface of the wafer substrate to be processed is flipped and then horizontally upward or horizontally downward.

2. The wafer moving device of the semiconductor process equipment according to claim 1, characterized in that, The wafer holder (1) has a snap-fit ​​groove (11) on its side; the flipping assembly (2) includes: The flipping part (21) is partially engaged in the engaging ring groove (11) and slidably connected to the engaging ring groove (11); A flipping drive (22) is connected to the flipping part (21) to drive the flipping part (21) to flip.

3. The wafer moving device of the semiconductor process equipment according to claim 2, characterized in that, The flipping part (21) has a protrusion (212) and a fixing block (211) connected to the protrusion (212). The connection between the protrusion (212) and the fixing block (211) forms recessed areas on both sides, so that the cross-section of the protrusion (212) is trapezoidal and the cross-section of the fixing block (211) is square. The shape of the snap ring groove (11) matches the shape of the protrusion (212), so that the protrusion (212) can be snapped into the snap ring groove (11), and in the snapped state, the wafer fixing member (1) can rotate around the protrusion (212) through the snap ring groove (11).

4. The wafer moving device of the semiconductor process equipment according to claim 1, characterized in that, Also includes: The rotating component (3) is configured to be drive-connected to the wafer fixture (1) to drive the wafer fixture (1) and the wafer substrate thereon to rotate.

5. The wafer moving device of the semiconductor process equipment according to claim 4, characterized in that, The wafer holder (1) is provided with a driven gear (13) on its exterior; The rotating component (3) includes: Rotary drive component (31); A drive gear (32) is disposed at the output end of the rotary drive member (31), and the drive gear (32) is capable of meshing with the driven gear (13) and is configured to drive the driven gear (13) to work so as to drive the wafer fixture (1) and the wafer substrate fixed thereto to rotate.

6. The wafer moving device of the semiconductor process equipment according to claim 4, characterized in that, Also includes: Translation device (4), connected to the flipping assembly and / or the rotating assembly (3), the translation device (4) being configured to move the wafer fixture (1) and the rotating assembly (3) closer to each other to form a drive connection or move them away from each other so that the flipping assembly (2) moves the wafer fixture (1) and the wafer substrate thereon to flip.

7. The wafer moving device of the semiconductor process equipment according to claim 6, characterized in that, The translation device (4) includes: A first translation component (41) is connected to the flip component, and the first translation component (41) is configured to move the wafer holder (1) closer to or away from the rotating component (3) by moving the flip component (2).

8. The wafer moving device of the semiconductor process equipment according to claim 6, characterized in that, The translation device (4) includes: A second translation component (42) is connected to the rotation component (3), and the second translation component (42) is configured to move the rotation component (3) closer to or away from the wafer fixture (1).

9. The wafer moving device of the semiconductor process equipment according to claim 6, characterized in that, The translation device (4) includes: The connecting part (45) is connected at one end to the flipping component (2) or the rotating component (3); The drive screw (44) is threadedly connected to the other end of the connecting part (45); A translation drive (43) is connected to the drive screw (44), and the translation drive (43) is configured to drive the drive screw (44) to rotate so as to drive the connecting part (45) to reciprocate along the axial direction of the drive screw (44).

10. A semiconductor manufacturing apparatus, characterized in that, include: Processing chamber; The wafer moving device of the semiconductor process apparatus as described in any one of claims 1 to 9, wherein part or all of the wafer moving device is disposed within the processing chamber.

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